System and method for producing bubble free liquids for nanometer scale semiconductor processing

A bubble-free, liquid technology used in nanotechnology for materials and surface science, chemical instruments and methods, separation methods, etc., which can solve problems such as adverse effects that affect liquid handling performance

Inactive Publication Date: 2009-09-09
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Bubbles created within the liquid can adversely affect the performance of the liquid treatment if they are larger than the features and devices being processed by the liquid

Method used

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  • System and method for producing bubble free liquids for nanometer scale semiconductor processing
  • System and method for producing bubble free liquids for nanometer scale semiconductor processing
  • System and method for producing bubble free liquids for nanometer scale semiconductor processing

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Embodiment Construction

[0028] A number of exemplary embodiments for providing substantially bubble-free liquids, as may be used in semiconductor processing, will now be described. It will be apparent to one skilled in the art that the present invention may be practiced without some or all of the specific details described herein.

[0029] Semiconductor manufacturing applies liquids and liquid films to semiconductor substrates many times as part of this production process. The performance (eg, utility, speed, etc.) of many processes involving the application of liquids and liquid films to semiconductor substrates (ie, liquid processing) can be improved if the liquids used are substantially free of bubbles.

[0030] Stirring or aerating the liquid as the liquid is being transported can result in air bubbles in the liquid. The liquid may also include dissolved gases. The dissolved gas can form bubbles in the liquid.

[0031] figure 1 is a block diagram of a system 100 for providing a substantially ...

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PUM

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Abstract

The present invention discloses a system for producing bubble free liquid includes a continuous liquid source and a de-bubbling chamber. The de-bubbling chamber includes an outlet and an inlet. The inlet coupled to an outlet of the continuous liquid source by a supply pipe. The de-bubbling chamber also includes at least one port in a sidewall of the de-bubbling chamber. The at least one port being at least a length L from the inlet of the de-bubbling chamber. A method for producing bubble free liquid is also described.

Description

technical field [0001] The present invention relates generally to fluid treatment, and more particularly to methods and systems for removing air bubbles from fluids. Background technique [0002] Semiconductor manufacturing processes include processes in which many semiconductors are immersed in liquids. For example, liquid etching treatment, cleaning treatment, rinsing treatment, photolithography treatment, or plating treatment. Features (features, structures) and devices continue to shrink in size. If air bubbles are created within the liquid that are larger than the features and devices being processed by the liquid, the air bubbles can adversely affect the performance of the liquid treatment. For example, if a gas bubble has a diameter of 10 microns and forms on the surface of the semiconductor, and the semiconductor has devices and features formed thereon that are 0.25 microns or smaller, then the gas bubble will surround a plurality of devices and features that are 0...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): B01D19/00
CPCB01D19/0068B01D19/0042B01D19/00B82Y30/00
Inventor卡尔·伍兹杰弗里·J·法伯
OwnerLAM RES CORP