A thermally conductive adhesive composition for cable temperature measurement and its application method
A temperature measurement, thermally conductive adhesive technology, used in adhesive types, adhesive additives, ester copolymer adhesives, etc., can solve the problems of small contact area, decreased sensitivity, long temperature measurement response time, etc. Large temperature contact area, increased sensitivity, good thermal insulation effect
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[0033] The preparation method of acrylate resin solution is:
[0034] First put 1 / 3~1 / 2 organic solvent into the reaction kettle, and raise the temperature to 85±2°C, while controlling the stirring speed at 100~700rpm, and then completely dissolve each acrylic acid monomer and initiator in the remaining organic solvent , and then drop it into the reactor at a rate of 2 to 6 seconds per drop. After the drop is completed, keep it warm for 3 to 6 hours, stop the reaction, and discharge it at room temperature;
[0035] The organic solvent among the present invention is preferably one or more in ethyl acetate, butyl acetate, acetone, butanone, xylene.
[0036] The heat-conducting inner glue is prepared by fully stirring 70-100 parts of acrylate resin solution, 20-50 parts of heat-conducting powder and 1-15 parts of additives, wherein the average particle size of the heat-conducting powder is not greater than 6 microns;
[0037] The sealing and heat-insulating outer glue is prepare...
Embodiment 1
[0042] Prepare the Acrylate Resin Solution
[0043] Put 1 / 3 of the organic solvent into the reaction kettle according to the following proportions by weight, and raise the temperature to 85±2°C, while controlling the stirring speed to 100rpm, and then completely dissolve each acrylic acid monomer and initiator in the remaining organic solvent , and then drop it into the reaction kettle at a rate of 2 to 6 seconds per drop. After the dropwise addition, keep it warm for 3 hours, stop the reaction, and discharge it at room temperature:
[0044]
[0045]
Embodiment 1-1
[0048] a. Preparation of thermal inner glue
[0049] Fully stir 70 parts of acrylate resin solution, 20 parts of silver powder and 1 part of coupling agent KH550 evenly;
[0050] b. Preparation of sealing and heat insulating outer glue
[0051] Mix 70 parts of acrylate resin solution, 30 parts of nano-scale ATO and 1 part of curing agent melamine fully and evenly.
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