Resin sealing mold and method for manufacturing resin molded portion of electronic component

A technology for resin sealing and electronic components, which is used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as voids in resin molding parts.

CN107081879BActive Publication Date: 2020-05-15DAIICHI SEIKO CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Publication Date
2020-05-15

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Abstract

The invention provides a resin sealing mold, the mold can effective exhaust air to outside from the molten resin-injected cavity, and a deburring machine is well used to remove the burr of an intermediate product. In the resin sealing mold, the cavity (60) is formed through the lower side cavity (25) arranged in a lower side cavity block and the upper side cavity (35) arranged in an upper side cavity block (33). A dam block (27) is arranged on the upper surface (23a) of the lower side cavity block along the opening edge of the lower side cavity (35), the dam block (27) is configurated in an un-abutted way with the upper surface of a lead frame when the lead frame is clamped, an exhaust port (36) is arranged on the lower surface (33a) of the upper side cavity block (33), is separated with the upper side cavity (35) and is communicated with the outside. The height of the dam block (27) is less than the thickness of the lead frame (40). When the lead frame is clamped, the exhaust port (36) and the dam block (27) are partly overlapped.
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Description

technical field

[0001] The present invention relates to a resin sealing mold and a method of manufacturing a resin molded portion of an electronic component using the resin sealing mold. Background technique

[0002] Generally, there is known a resin sealing device that uses multi-station molding to resin-encapsulate electronic components mounted on a lead frame (for example, discrete semiconductor elements with a single function) to manufacture resin molded parts of electronic components. When using a resin sealing device to manufacture a resin molded part of an electronic component, first, the lead frame is clamped by the upper mold and the lower mold that constitute the resin sealing mold. Next, the inner cavity formed between the upper mold and the lower mold is filled with the molten resin, and then pressurized and solidified, thereby manufacturing an electronic component positioned in the inner cavity in the lead frame. Intermediate products of the resin molding depar...

Examples

Embodiment Construction

[0080] Hereinafter, a resin sealing mold according to an embodiment of the present invention will be described with reference to the drawings. In the following description, terms indicating specific directions (such as "up", "down", etc.) are used as needed, but these are used for easy understanding of the present invention, and are not intended to limit the scope of the present invention.

[0081] (resin sealing device 100)

[0082] Such as figure 1 As shown, the resin sealing device 100 is mounted on the lead frame 40 in a multi-station forming pair (refer to Figure 5 to Figure 8 ) on the electronic components are resin-sealed, thereby manufacturing the resin molding part 50 of the electronic components (encapsulation part, refer to Figure 10 to Figure 12 ). Electronic components are, for example, discrete semiconductor components of single-function components.

[0083] The resin sealing device 100 includes a base 10 , a lower fixed platen 11 fixed on the base 10 , fo...