Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed Circuit Boards and Electronics

A technology of printed circuit boards and electroplating layers, which is applied to printed circuits, printed circuits, printed circuit components, etc., can solve the problems of large line impedance and difficult control of line impedance, and achieve the goal of reducing impedance and improving impedance consistency Effect

Active Publication Date: 2019-12-31
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current production method of the circuit of the printed circuit board is generally realized by exposure and etching. Since the contact amount and contact time with the etching solution are different during etching, the cross-section of the etched circuit has a trapezoidal structure, and the upper surface of the circuit The width is smaller than the width of the lower surface of the line, and the impedance of the line is large, making it difficult to control the line impedance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed Circuit Boards and Electronics
  • Printed Circuit Boards and Electronics
  • Printed Circuit Boards and Electronics

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0037] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a printed circuit board and an electronic device. The printed circuit board comprises a signal line, a first ground wire and first dielectric layer, wherein the signal line comprises a first surface and a second surface that are arranged opposite to each other, the first surface is adjacent to the first dielectric layer, the signal line and the first ground wire are positioned on the same layer in an adjacent manner, and a maximum interval between the signal line and the first ground wire is twice or more than twice as much as second wire width of the second surface. Via the printed circuit board and the electronic device, impedance consistency can be improved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and electronic equipment. Background technique [0002] The current production method of the circuit of the printed circuit board is generally realized by exposure and etching. Since the contact amount and contact time with the etching solution are different during etching, the cross-section of the etched circuit has a trapezoidal structure, and the upper surface of the circuit The width is smaller than the width of the lower surface of the line, and the impedance of the line is large, making it difficult to control the impedance of the line. Contents of the invention [0003] Embodiments of the present invention provide a printed circuit board and electronic equipment, which can improve impedance consistency. [0004] In a first aspect, an embodiment of the present invention provides a printed circuit board, including a signal line, a fi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/025H05K2201/093
Inventor 陈艳
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com