Component placement machine and attachment

A technology for mounting devices and connectors, applied in the direction of electrical components, electrical components, etc., can solve the problems of increasing the number of ball members, raising the cost of large-scale vibration damping mechanisms, etc., and achieve the effect of reducing adsorption errors

Active Publication Date: 2017-12-29
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the above-mentioned conventional structure, the ball member presses the inner wall surface of the insertion hole in point contact with the inner wall surface, and in order to sufficiently exhibit the vibration damping function, it is necessary to increase the spring constant of the spring biasing the ball member. , or increasing the number of ball members
Therefore, there is a problem that the vibration damping mechanism may increase in size and cost.

Method used

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  • Component placement machine and attachment
  • Component placement machine and attachment
  • Component placement machine and attachment

Examples

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Embodiment Construction

[0027] Embodiments of the present disclosure will be described below with reference to the drawings. figure 1 The illustrated component mounting apparatus 1 is an apparatus for mounting components 3 on a substrate 2 , and includes a substrate conveying unit 12 and a component mounting unit 13 on a base 11 . A feeder base 14 is coupled to the base 11 . A plurality of tape feeders 15 are mounted to the feeder base 14 . Here, for convenience of description, the left-right direction of the component mounting apparatus 1 viewed from the operator OP is referred to as the X-axis direction (see figure 2 ), let the front-back direction be the Y-axis direction. Let the up-down direction be the Z-axis direction.

[0028] exist figure 1 Among them, the substrate transfer unit 12 includes a pair of conveyors 12 a extending in the X-axis direction on the base 11 . The substrate conveying unit 12 supports both ends of the substrate 2 in the Y-axis direction from below by a pair of conv...

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Abstract

A component placement machine which picks up a component supplied by a tape feeder and installs the component on a board, includes a block part that includes a fitting hole to which a protrusion extending to a rear side from the tape feeder is fitted and a connection member that is provided in the block part, and connects the protrusion to the block part by elastically pressing a side surface of the protrusion fitted to the fitting hole.

Description

technical field [0001] The present disclosure relates to a component mounting device and the like that pick up a component supplied by a tape feeder with a mounting head and mount the component on a substrate. Background technique [0002] The component mounting device picks up a component supplied by the component supply device using a mounting head and mounts the component on a substrate. As one type of component supply device included in such a component mounting device, there is known a tape feeder that pitch-feeds a carrier tape using a sprocket to supply components to a component supply port. The tape feeder is mounted on the feeder base (feeder base) of the component mounting device, but when it receives the excitation force generated when the assembly head moves, it vibrates in the width direction (lateral direction) with low rigidity. If it is too large, it may cause a pickup error when the assembly head picks up the part. [0003] In response to such a situation,...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K13/04
CPCH05K13/0417H05K13/0408
Inventor小林广纪桧作雅史古田升前田刚
OwnerPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD