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Micro light emitting diode substrate and preparation method thereof and display device

A technology of micro-light-emitting diodes and substrates, which can be used in electrical components, electrical solid-state devices, circuits, etc., and can solve the problems of low yield and low efficiency.

Inactive Publication Date: 2018-09-14
ELEC TECH PHOTOELECTRIC TECH DALIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on the above, it is necessary to address the problems of low efficiency and low yield in the transfer process of micro-light-emitting diodes, and provide a micro-light-emitting diode substrate, a preparation method thereof, and a display device

Method used

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  • Micro light emitting diode substrate and preparation method thereof and display device
  • Micro light emitting diode substrate and preparation method thereof and display device
  • Micro light emitting diode substrate and preparation method thereof and display device

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Embodiment Construction

[0055] In order to make the purpose, technical solution and advantages of the present application clearer, the micro-light-emitting diode substrate of the present application, its preparation method, and display device will be further described in detail through the following examples and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.

[0056] The micro light-emitting diode substrate, its manufacturing method, and display device according to the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0057] The application provides a method for preparing a micro-light emitting diode substrate, which includes the following steps:

[0058] S110, providing a first growth substrate 10, the first growth substrate 10 has a first growth surface 110, and the first gro...

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Abstract

The invention provides a micro light emitting diode substrate and a preparation method thereof and a display device. The preparation method comprises the steps that 1, a first growth substrate is provided, wherein the first growth substrate is provided with a first growth surface, and the first growth surface is provided with first color micro light emitting diode units; 2, a receiving substrate is provided, wherein the receiving substrate is provided with a receiving surface, and a plurality of receiving bonding pads are arranged on the receiving surface at intervals; 3, the first growth substrate is attached to the receiving substrate, so that the first color micro light emitting diode units at the transferring position are attached to the receiving bonding pads respectively; 4, the first color micro light emitting diode units are fixed to the receiving surface through the receiving bonding pads; 5, the first growth substrate and the first color micro light emitting diode units are stripped, and the receiving substrate to which the first color micro light emitting diode units are fixed is obtained.

Description

technical field [0001] The present application relates to a micro light emitting diode used for display, in particular to a micro light emitting diode substrate, a preparation method thereof, and a display device. Background technique [0002] Micro LEDs (Micro LEDs) refer to micro-sized LED arrays integrated on a substrate with high density. At present, micro-LED technology has begun to develop, and the industry is expecting high-quality micro-LED products to enter the market. High-quality micro-LED products will have a profound impact on traditional display products such as LCD / OLED already on the market. [0003] How to transfer the micro light-emitting diodes from the original growth substrate to the receiving substrate is a difficulty in the manufacture of display devices. In the existing micro-light-emitting diode manufacturing technology, the micro-light-emitting diodes are first transferred from the growth substrate to a transitional temporary substrate, and then t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/15H01L33/00
CPCH01L27/156H01L33/0095H01L25/0753H01L33/0093
Inventor 桑永昌陈顺利赵明海
Owner ELEC TECH PHOTOELECTRIC TECH DALIAN
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