Heating device for electric boiler

A heating device, electric boiler technology, applied in water heaters, fluid heaters, lighting and heating equipment, etc., can solve the problems of reducing the accuracy of water outlet temperature, long prelude time, low heating efficiency, etc., to solve the problem of local temperature The effect of deviation, overall consistency improvement, and heating efficiency improvement

Pending Publication Date: 2018-12-07
JIANGSU INST OF ECONOMIC & TRADE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In electronic boilers, semiconductor heaters are usually used to heat the water to a specified temperature. The existing semiconductor heaters usually use ceramic heating bodies at both ends of the heating water pipe, and the ceramic heating body conducts heat transfer to the heating water pipe to raise the temperature, thereby It enables the heating water pipe to heat up the water in the heating water pipe. The patent application number is 2016211836882, which discloses "a ceramic semiconductor heating chip used in a high-speed electronic boiler", which is the technical solution adopted, but the heating of this technical structure way, because the ceramic heating body only provides heat energy from both ends of the heating water pipe, and the heat energy is slowly transferred from both ends to the middle area of ​​the heating water pipe, so that it takes a long time for the heating water pipe to reach a certain temperature as a whole. As a result, the heating efficiency of the semiconductor heater for water is low, and it takes a long time to wait for the first water outlet. In addition, due to factors such as the loss of heat energy during the transfer process, the overall temperature consistency of the heating water pipe is poor. For the temperature rise of hot water There are obvious local deviations in the effect, which makes it difficult for the final temperature sensor to accurately measure the real temperature of the hot water, thereby reducing the accuracy of the outlet water temperature and affecting the overall use effect of the electronic boiler

Method used

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  • Heating device for electric boiler
  • Heating device for electric boiler
  • Heating device for electric boiler

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Embodiment Construction

[0017] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

[0018] Such as Figure 1 ~ Figure 3 As shown, the present invention provides a high-power water-passing module heating device for an electric boiler, comprising a heating box 1 and a water inlet 13 and a water outlet 14 arranged on the heating box 1, and the bottom surface of the heating box 1 is provided with A cuboid heating plate 3, the two ends of the cuboid heating plate 3 are respectively fixed on the inner wall of the heating box 1, a water passage 15 is formed be...

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Abstract

The invention discloses a high power water passing module heating device for an electric boiler. The heating device comprises a heating box and a water inlet and a water outlet formed in the heating box. A cuboid heating plate is arranged on the bottom surface in the heating box, two ends of the cuboid heating plate are separately fixed to the inner wall of the heating box, and a water passing channel is formed between the heating box and the cuboid heating plate. Compared with the prior art, the original two-end heating mode is replaced by conduction heating and liquid heating, so that waterin the water passing channel can be heated all around simultaneously. The water heating efficiency is improved greatly, and integral consistence of increasing the water temperature is improved obviously. The problem that the consistence of water outlet temperature is poor as the local temperature is deviated in the original two-end heating mode is solved, so that the using effect of the electric boiler is improved.

Description

technical field [0001] The invention relates to the technical field of electric boilers, in particular to a high-power water-passing module heating device for electric boilers. Background technique [0002] In electronic boilers, semiconductor heaters are usually used to heat the water to a specified temperature. The existing semiconductor heaters usually use ceramic heating bodies at both ends of the heating water pipe, and the ceramic heating body conducts heat transfer to the heating water pipe to raise the temperature, thereby It enables the heating water pipe to heat up the water in the heating water pipe. The patent application number is 2016211836882, which discloses "a ceramic semiconductor heating chip used in a high-speed electronic boiler", which is the technical solution adopted, but the heating of this technical structure way, because the ceramic heating body only provides heat energy from both ends of the heating water pipe, and the heat energy is slowly transf...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): F24H1/10F24H9/18F24H9/20
CPCF24H1/102F24H9/1818F24H9/2028
Inventor成珊珊
OwnerJIANGSU INST OF ECONOMIC & TRADE TECH