Mainboard upper cover of electronic equipment, manufacturing method of mainboard upper cover and electronic equipment

Abstract

The invention discloses a mainboard upper cover, a manufacturing method thereof and electronic equipment, the mainboard upper cover is provided with a decoration part and a sound outlet part connectedto one side of the decoration part, and the sound outlet part comprises a plurality of sound outlet holes. The manufacturing method of the mainboard upper cover comprises the following steps: firstly, providing a forming mold of the mainboard upper cover, wherein the forming mold is provided with the decorative part and the structure of the sound part; and injecting plastic into the forming mold.Another manufacturing method comprises the following steps: firstly, providing a structural body with the decorative part and the sound part; the structural body is arranged in a forming mold of themain board upper cover; and plastic is injected into the forming mold, and the plastic is formed by carrying out secondary rubber coating forming on the structure body. According to the invention, theexisting receiver decorative cover is integrated with the mainboard upper cover, so that the assembling process of the electronic equipment is reduced, the reliability risk during assembling is avoided, and the sound volume of the electronic equipment is increased.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a main board upper cover of an electronic equipment, a manufacturing method thereof and the electronic equipment. Background technique [0002] Consumers' pursuit of products is becoming more and more extreme, and the demand for sound effects of electronic devices (especially mobile phones) is getting higher and higher. We hope that the space design of the sound cavity channel will be large enough. The contradiction is that the pursuit of a full screen requires The exposed structural member area should be kept as small as possible. [0003] At present, electronic equipment is assembled with a receiver decorative cover on the decorative part and the sound output part of the main board cover. The receiver decorative cover is installed on the main board cover through assembly, which makes the assembly process of electronic equipment complicated and prone to reliability ...

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a main board cover of an electronic device, its manufacturing method, and the electronic device, which solve the problem that the decorative cover of the receiver is assembled on the electronic device in the current assembly method, the assembly process of the electronic device is complicated, and the risk of reliability between the assembly is prone to occur.

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