Semiconductor material cutting device

A cutting device and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of being unable to cope with internal and external vibration and external environment changes, irregular loading or unloading of semiconductor strips, etc., to ensure The effect of mechanism precision, accurate loading and unloading

Pending Publication Date: 2019-06-04
HANMI SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0013] However, prior art 2 does not use pins and pin insertion holes, so when the semiconductor strip is unloaded from the strip picker after the position correction is completed, it cannot cope with external environmental changes such as vibrations inside and outside the equipment and changes over time.
Therefore, there is a problem that the semiconductor strip is irregularly loaded or unloaded by the strip picker in the case of aggravated changes in the external environment.

Method used

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  • Semiconductor material cutting device
  • Semiconductor material cutting device
  • Semiconductor material cutting device

Examples

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Embodiment Construction

[0086] The following merely illustrates the principles of the invention. Therefore, although not explicitly described or illustrated in this specification, those skilled in the art can realize the principle of the present invention and invent various devices included in the concept and scope of the invention. In addition, it should be understood that all conditional terms and examples listed in this specification are only used to understand the concept of the invention in principle, and are not limited to these specifically listed examples and states.

[0087] The above objects, features, and advantages will be clarified by the following detailed description related to the accompanying drawings, so that those skilled in the art to which the present invention pertains can easily implement the technical idea of ​​the invention.

[0088] Embodiments described in the present invention will be described with reference to cross-sectional views and / or perspective views that are ideal...

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PUM

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Abstract

The invention relates to a semiconductor material cutting device for cutting a semiconductor strip into individual semiconductor packages. The present invention in particular relates to a semiconductor material cutting device with improved accuracy which is capable of automatically determining whether to elevate an interlock pin to correct positional error of a semiconductor strip as required whenthe semiconductor strip is picked up from a loading part by a strip picker or unloaded to a chuck table by the strip picker.

Description

technical field [0001] The present invention relates to a semiconductor material cutting device for cutting semiconductor strips into individual semiconductor packages. Background technique [0002] The semiconductor material cutting device is a device that cuts the packaged semiconductor strips into individual semiconductor packages. [0003] In addition to the simple function of cutting the semiconductor strip, this semiconductor material cutting device also provides the function of performing a series of processes as follows: After performing the cutting, cleaning and drying processes on the semiconductor strip, inspecting the upper surface and the surface of the cut semiconductor package. The lower surface is used to sort semiconductor packages with manufacturing defects. [0004] As a patent of such a semiconductor material cutting device, what is described in the prior art (hereinafter referred to as "conventional art 1") of Korean Registered Patent No. 10-1303103 is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/304H01L21/68H01L21/687
CPCH01L21/67092H01L21/67712H01L21/67242
Inventor 林栽瑛
Owner HANMI SEMICON CO LTD
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