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Display module and preparation method thereof, and display panel

A technology for display modules and substrates, applied in the field of display screens, can solve the problems of increasing the contact area between conductive particles and metal layers, poor conductive effect of conductive adhesive layer, etc., and achieve the effect of ensuring good contact

Active Publication Date: 2019-11-19
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the embodiments of the present invention are dedicated to providing a display module and a manufacturing method thereof, by filling the via holes on the dielectric layer to ensure that the conductive particles in the conductive adhesive layer can be well bonded d

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  • Display module and preparation method thereof, and display panel
  • Display module and preparation method thereof, and display panel
  • Display module and preparation method thereof, and display panel

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] In addition, in the exemplary embodiments, since the same reference numerals denote the same components with the same structure or the same steps of the same method, if one embodiment is exemplarily described, only the same elements as those already described will be described in other exemplary embodiments. Different structures or methods of the embodiments are described.

[0021] Throughout the specification and claims, when one element ...

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Abstract

The invention provides a display module and a preparation method thereof, and a display panel. The connection between a first metal layer and a second metal layer can be realized by filling through holes in a dielectric layer arranged between the first metal layer and the second metal layer with a metal layer; and through the filling of the through holes, the insufficient degree of compression ofconductive particles caused by the entering of the conductive particles in a first conductive adhesive layer between the first metal layer and the dielectric layer and a second conductive adhesive layer between the second metal layer and the dielectric layer to the through holes during bonding can be avoided, so that good contact between the conductive particles can be guaranteed, the contact areas between the conductive particles and the first metal layer and the second metal layer can be increased, and therefore, the conductivity between the conductive particles and the first metal layer andthe second metal layer can be enhanced.

Description

technical field [0001] The invention relates to the field of display screens, in particular to a display module, a preparation method thereof, and a display panel. Background technique [0002] With the development of display screens, the era of ubiquitous screens is gradually integrated into life. People's demand for screen display and use effects continues to increase. The resolution of display screens is getting higher and higher. The design and development of high PPI products are becoming more and more important. , high-resolution display is one of the important frontier directions in display technology. [0003] However, the higher the PPI of the display screen, the denser the wiring at the output end of the integrated circuit chip, resulting in more via holes for the output pins of the integrated circuit chip to be changed. The conductive particles in the via hole will enter the via hole, resulting in a reduction in the compression of the conductive particles at the ...

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Application Information

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IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/124H01L27/1259
Inventor 陈建军张灵佳
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD