Antenna package and image display device including the same

Abstract

The present invention relates to an antenna package and an image display device including the antenna package. The antenna package according to one embodiment of the present invention includes: an antenna device; a first printed circuit board, the first printed circuit board is electrically connected to the antenna device; and a second printed circuit board, the ductility of the second printed circuit board is less than the ductility of the first printed circuit board and is integrated with the first printed circuit board. Through the combination of the first printed circuit board and the second printed circuit board, the antenna signal path can be shortened to improve the connection reliability and signal transmission efficiency.

Description

[0001] Cross-reference to related applications and claiming priority

[0002] This application claims the priority of Korean Patent Application No. 10-10-2020-0001756 filed on January 7, 2019, in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to an antenna package and an image display device including the antenna package. More particularly, the present invention relates to an antenna package including an antenna pattern and a driving integrated circuit and an image display device including the antenna package. Background Art

[0004] With the development of information technology, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are combined with display devices in the form of, for example, smart phones. In this case, an antenna may be combined with the display device to provide a communication function.

[0005] As mobile communication technology has been rapidly developed, an antenna capable of high frequency or ultra high frequency communication is required in a display device.

[0006] However, as the driving frequency of the antenna increases, signal loss may be easily caused. In addition, as the length of the signal transmission path increases, the signal loss may become greater.

[0007] In addition, when an intermediate circuit structure such as a flexible printed circuit board (FPCB) is used to electrically connect a driving integrated circuit chip for controlling antenna radiation / feeding and an antenna to each other, additional signal loss may be caused.

[0008] In addition to the FPCB, a circuit board may be added to mount a driving integrated circuit chip. In this case, a signal path between the antenna and the driving integrated circuit chip may be additionally increased, so that signal loss may be further increased.

[0009] Furthermore, as the image display device becomes thinner and the display area becomes larger, the space in which the antenna can be included can be reduced.

[0010] For example, Korean Patent Application Publication No. 10-2003-0095557 discloses an antenna structure embedded in a portable terminal. However, there is a need for an antenna design that can achieve high frequency or ultra-high frequency driving while preventing signal loss within a limited space. Summary of the invention

[0011] According to an aspect of the present invention, an antenna package is provided having improved operational reliability and signal transfer efficiency.

[0012] According to an aspect of the present invention, there is provided an image display device including an antenna package having improved operational reliability and signal transfer efficiency.

[0013] The above aspects of the present invention will be achieved through one or more of the following features or configurations:

[0014] (1) An antenna package includes: an antenna device; a first printed circuit board, the first printed circuit board is electrically connected to the antenna device; and a second printed circuit board, the ductility of the second printed circuit board is smaller than the ductility of the first printed circuit board and is integrated with the first printed circuit board.

[0015] (2) The antenna package according to (1) above, wherein the first printed circuit board is a flexible printed circuit board, and the second printed circuit board is a rigid printed circuit board.

[0016] (3) The antenna package according to (1) above, wherein the first printed circuit board includes a core layer and an antenna circuit wiring layer formed on the core layer, and the second printed circuit board includes insulating layers and internal wiring layers stacked alternately and repeatedly.

[0017] (4) The antenna package according to (3) above, wherein the first printed circuit board is inserted into the second printed circuit board as an intermediate layer of the second printed circuit board.

[0018] (5) The antenna package according to (4) above, wherein an outermost insulating layer of the insulating layer of the second printed circuit board is stacked on the first printed circuit board.

[0019] (6) The antenna package according to (5) above, further comprising a driver integrated circuit (IC) chip disposed on the outermost insulating layer.

[0020] (7) According to the antenna package described in (6) above, it also includes: a first through-hole structure, which electrically connects the driver IC chip and the antenna circuit wiring layer of the first printed circuit board; and a second through-hole structure, which electrically connects the driver IC chip and at least one of the internal wiring layers of the second printed circuit board.

[0021] (8) The antenna package according to (7) above, wherein the first through-hole structure penetrates the outermost insulating layer, and the second through-hole structure penetrates the outermost insulating layer and the first printed circuit board.

[0022] (9) The antenna package according to (3) above, wherein the first printed circuit board is stacked on an outermost insulating layer of the insulating layer of the second printed circuit board.

[0023] (10) The antenna package according to (9) above, further comprising a photo solder resist (PSR) layer formed on the first printed circuit board.

[0024] (11) The antenna package according to (10) above, further comprising a driver integrated circuit (IC) chip stacked on the PSR layer.

[0025] (12) The antenna package according to (3) above, wherein the first printed circuit board further includes a ground layer facing the antenna circuit wiring layer, and the core layer is interposed between the ground layer and the antenna circuit wiring layer.

[0026] (13) The antenna package according to (3) above, wherein the core layer includes a flexible resin, and the insulating layer includes a resin impregnated with inorganic fibers.

[0027] (14) An antenna package according to (3) above, wherein the antenna device includes a radiation pattern, a transmission line extending from the radiation pattern, and a signal pad connected to an end portion of the transmission line, and the signal pad and the antenna circuit wiring layer are electrically connected to each other.

[0028] (15) The antenna package according to (1) above, wherein the first printed circuit board includes a circuit wiring layer, and the second printed circuit board includes an internal wiring layer, wherein the antenna package further includes a third through-hole structure electrically connecting the circuit wiring layer and the internal wiring layer to each other.

[0029] (16) An image display device includes the antenna package according to the above-described embodiment.

[0030] In an antenna package according to an exemplary embodiment of the present invention, a flexible printed circuit board (FPCB) connected to an antenna device may be integrated with a rigid printed circuit board, and a driving integrated circuit chip may be mounted on the rigid printed circuit board.

[0031] Therefore, a signal path between the flexible printed circuit board and the antenna device can be shortened, and heat resistance and mechanical stability required in a mounting process of a driving integrated circuit chip can be enhanced.

[0032] In addition, while integrating the flexible printed circuit board with the rigid printed circuit board, electronic devices such as an RLC circuit device may be packaged together in the antenna package, and thus space utilization efficiency of the image display device to which the antenna package is applied may be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments.

[0034] Figure 2 is a schematic top plan view illustrating an antenna device included in an antenna package according to some exemplary embodiments.

[0035] Figure 3 is a schematic top plan view illustrating an antenna device included in an antenna package according to some exemplary embodiments.

[0036] Figure 4 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments.

[0037] Figure 5 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments.

[0038] Figure 6 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments.

[0039] Figure 7 is a schematic top view illustrating an image display device according to some exemplary embodiments. DETAILED DESCRIPTION

[0040] According to some exemplary embodiments of the present invention, an antenna package is provided, which includes a first printed circuit board and a second printed circuit board integrated with each other, and also includes an antenna device and a driving integrated circuit chip. In addition, an image display device including the antenna package is also provided.

[0041] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. However, those skilled in the art will appreciate that such embodiments described with reference to the accompanying drawings are provided to further understand the spirit of the present invention and are not limitations on the subject matter disclosed in the specific embodiments and the appended claims.

[0042] The terms “first,” “second,” “upper,” “lower,” “top,” “bottom,” etc. are used to indicate relative positions between different elements and are not intended to specify absolute positions.

[0043] Figure 1 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments.

[0044] Reference Figure 1 , the antenna package may include a first printed circuit board 180 , the antenna device 100 , a second printed circuit board 200 , and a driving integrated circuit (IC) chip 260 .

[0045] The first printed circuit board 180 may have higher ductility or flexibility than the second printed circuit board 200. In some exemplary embodiments, the first printed circuit board 180 may be a flexible printed circuit board (FPCB).

[0046] The first printed circuit board 180 may include a core layer 160 including a flexible resin and an antenna circuit wiring layer 170 formed on the core layer 160 .

[0047] For example, the core layer 160 may include a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. In a preferred embodiment, the core layer 160 may include polyimide resin or MPI.

[0048] The antenna circuit wiring layer 170 may include a feed wiring for supplying power from the driving IC chip 260 to the antenna device 100. The end portion of the antenna circuit wiring layer 170 may be electrically connected to the signal pad 132 (see FIG. 1 ) included in the antenna device 100. Figure 2 ).

[0049] The second printed circuit board 200 may have a higher hardness than the first printed circuit board 180 or a lower ductility than the first printed circuit board 180. In some exemplary embodiments, the second printed circuit board 200 may be a rigid printed circuit board.

[0050] The second printed circuit board 200 may include an insulating layer 210 and an internal wiring layer 220. The insulating layer 210 may include a resin (e.g., epoxy resin) impregnated with inorganic fibers such as glass fibers or inorganic particles. For example, the insulating layer 210 may be formed of a prepreg material. For example, the insulating layer 210 may have a higher glass transition temperature Tg than the core layer 160 of the first printed circuit board 180.

[0051] The insulating layer 210 and the internal wiring layer 220 may be stacked alternately and repeatedly. For example, the first internal wiring layer 220a may be disposed on the first insulating layer 210a, and the second insulating layer 210b covering the first internal wiring layer 220a may be stacked on the first insulating layer 210a. The second internal wiring layer 220b may be disposed on the second insulating layer 210b, and the third insulating layer 210c covering the second internal wiring layer 220b may be stacked on the second insulating layer 210b.

[0052] For example, the second printed circuit board 200 may be made of a copper clad laminate (CCL).

[0053] In some exemplary embodiments, the first printed circuit board 180 may be inserted into the second printed circuit board 200 as an intermediate layer. For example, the first printed circuit board 180 may be disposed between internal insulating layers 210 included in the second printed circuit board 200.

[0054] For example, Figure 1 As shown, the first printed circuit board 180 may be disposed on the third insulating layer 210 c , and the fourth insulating layer 210 d may be disposed on the first printed circuit board 180 .

[0055] In some embodiments, a portion of the first printed circuit board 180 may be inserted into the second printed circuit board 200 as described above, and the first printed circuit board 180 may extend to the outside of the second printed circuit board 210 and may be electrically connected to the antenna device 100 .

[0056] In some embodiments, the fourth insulating layer 210d stacked on the first printed circuit board 180 may be the outermost insulating layer of the second printed circuit board 200. The outermost insulating layer may refer to the uppermost insulating layer of the second printed circuit board 200. In some exemplary embodiments, the fourth insulating layer 210d may be directly disposed on the first printed circuit board 180.

[0057] The driver IC chip 260 may be disposed on the second printed circuit board 200. In some exemplary embodiments, the driver IC chip 260 may be mounted on the fourth insulating layer 210d of the second printed circuit board 200. The driver IC chip 260 may be directly mounted on the fourth insulating layer 210d by a surface mounting technology (SMT) method, or may be mounted using conductive balls, solder, resist, etc.

[0058] The antenna package may include a through-hole structure for connecting to wirings of the first printed circuit board 180 and the second printed circuit board 200 .

[0059] The via structure may include, for example, a first via structure 230 that electrically connects the antenna pad of the driving IC chip 260 and the antenna circuit wiring layer 170 of the first printed circuit board 180. For example, the first via structure 230 may be formed through the fourth insulating layer 210d and may contact or be electrically connected to the antenna circuit wiring layer 170.

[0060] The via structure may include, for example, a second via structure 240 that electrically connects the logic pad of the driving IC chip 260 and the internal wiring layer 220 of the second printed circuit board 200. For example, the second via structure 240 may be formed through the fourth insulating layer 210d and the first printed circuit board 180 to be electrically connected to the internal wiring layer 220.

[0061] As described above, the first printed circuit board 180 and the second printed circuit board 200 having different ductility can be combined in one package. The flexibility of the antenna package can be achieved by the first printed circuit board 180 connected to the antenna device 100, and sufficient heat resistance and mechanical stability for high temperature processing included in the mounting of the driver IC chip 260 can be obtained by the second printed circuit board 200.

[0062] In addition, the first printed circuit board 180 can be inserted at the upper portion on the second printed circuit board 200 to be adjacent to the driving IC chip 260, so that the signal path between the driving IC chip 260 and the antenna device 100 can be shortened to improve the antenna feeding efficiency. Therefore, an antenna radiation characteristic with a sufficient gain amount and reduced signal loss can be achieved.

[0063] For example, the package may be bent through a portion of the first printed circuit board 180, which may be exposed to the outside of the second printed circuit board 200. In this case, the driver IC chip 260 may be bent together with the second printed circuit board 200 to be disposed, for example, at the rear or side of the image display device. Therefore, the antenna package may be effectively connected to, for example, a main board of the image display device without reducing the image quality of the image display device.

[0064] Figure 2 is a schematic top plan view illustrating an antenna device included in an antenna package according to some exemplary embodiments.

[0065] Reference Figure 2 , the antenna device 100 may include an antenna pattern disposed on a dielectric layer 90. The antenna pattern may include a radiation pattern 110, a transmission line 120, and a pad 130.

[0066] The dielectric layer 90 may include polyester-based resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate and polybutylene terephthalate; cellulose-based resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene-based resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin-based resins such as polyethylene, polypropylene, cycloolefin or polyolefin having a norbornene structure and ethylene-propylene copolymers; vinyl chloride-based resins; amide-based resins such as nylon and aromatic polyamide; imide-based resins; polyether sulfone-based resins; sulfone-based resins; polyether ether ketone-based resins; polyphenylene sulfide resins; vinyl alcohol-based resins; vinylidene chloride-based resins; vinyl butyral-based resins; allylated-based resins; polyoxymethylene-based resins; epoxy-based resins; urethane or acrylic urethane-based resins; silicon-based resins, etc. These may be used alone or in combination of two or more thereof.

[0067] In some embodiments, an adhesive material such as an optically clear adhesive (OCA), an optically clear resin (OCR), etc. may be included in the dielectric layer 90 .

[0068] In some embodiments, the dielectric layer 90 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0069] In some embodiments, the dielectric constant of the dielectric layer 90 may be adjusted within a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced so that a desired high frequency or ultra-high frequency band driving may not be achieved.

[0070] The radiation pattern 110 may have, for example, a polygonal plate shape, and the transmission line 120 may extend from one side of the radiation pattern 110 to be electrically connected to the signal pad 130. The transmission line 120 may be formed as a single member substantially integral with the radiation pattern 110.

[0071] In some embodiments, the pads 130 may include a signal pad 132 and may further include a ground pad 134. For example, a pair of ground pads 134 may be provided with the signal pad 132 interposed therebetween. The ground pad 134 may be electrically separated from the signal pad 132 and the transmission line 120.

[0072] In one embodiment, the ground pad 134 may be omitted. In addition, the signal pad 132 may be provided at the end portion of the transmission line 120 as an integral member.

[0073] The signal pad 132 may be electrically connected to the driving IC chip 260 via the antenna circuit wiring layer 170 of the first printed circuit board 180. Therefore, feeding and driving control of the radiation pattern 110 may be performed by the driving IC chip 260.

[0074] In some embodiments, the signal pad 132 and the antenna circuit wiring layer 170 may be coupled to each other through a conductive intermediate structure such as an anisotropic conductive film (ACF).

[0075] In some exemplary embodiments, the antenna pattern layer may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals.

[0076] For example, the antenna pattern may include silver (Ag) or a silver alloy (eg, silver-palladium-copper (APC)), or copper (Cu) or a copper alloy (eg, copper-calcium (CuCa)) to achieve a low resistance and fine line width pattern.

[0077] In some embodiments, the antenna pattern 110 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), cadmium tin oxide (CTO), or the like.

[0078] In some embodiments, the radiation pattern 110 and / or the transmission line 120 may have a multi-layer structure, such as a double-layer structure of a metal layer-transparent conductive oxide layer or a triple-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the metal layer may improve flexibility and reduce resistance, while the transparent conductive oxide layer may improve corrosion resistance and transparency.

[0079] In some embodiments, the antenna device 100 may further include a ground layer facing the radiation pattern 110 with the dielectric layer 90 interposed therebetween. In this case, the radiation directivity (eg, vertical radiation) of the radiation pattern 110 may be further promoted.

[0080] In some embodiments, the ground layer may be included in a single element of the antenna device. In some embodiments, a conductive member of an image display device to which the antenna device 100 may be applied may be used as a ground layer.

[0081] For example, the conductive member may include various wirings or electrodes such as a gate electrode of a thin film transistor (TFT) included in the display panel, a data line, a scan line, a pixel electrode, a common electrode, etc.

[0082] In one embodiment, a metal member (such as a SUS plate), a sensor member (such as a digitizer, a heat sink, etc.) disposed at the rear of the image display device may be used as a ground layer.

[0083] Figure 3 is a schematic top plan view illustrating an antenna device included in an antenna package according to some exemplary embodiments.

[0084] Reference Figure 3 , the radiation pattern 110 may have a mesh structure. In some embodiments, the transmission line 120 connected to the radiation pattern 110 may also have a mesh structure.

[0085] The radiation pattern 110 may include a mesh structure so that transmittance may be improved even when the radiation pattern 110 is disposed in a display area of ​​an image display device, thereby preventing electrode visual recognition and image quality from being degraded.

[0086] The dummy mesh pattern 140 may be placed around the radiation pattern 110 and the transmission line 120. The dummy mesh pattern 140 may be electrically and physically separated from the radiation pattern 110 and the transmission line 120 by a separation region 145.

[0087] For example, a conductive layer may be formed on the dielectric layer 90, and then the conductive layer may be etched to form a mesh structure, while also etching a portion of the conductive layer corresponding to the outline of the radiation pattern 110 and the transmission line 120 to form the separation region 145. Thus, a portion of the conductive layer may be converted into the dummy mesh pattern 140.

[0088] In some embodiments, the pad 130 may be formed as a solid structure to reduce the resistance of the feedthrough. For example, the pad 130 may be disposed in a non-display area or a light shielding area of ​​the image display device. Therefore, the pad 130 may be disposed outside the viewing area of ​​the user.

[0089] In some embodiments, at least a portion of the transmission line 120 may also have a solid structure.

[0090] Figure 4 is a schematic cross-sectional view showing an antenna package according to some exemplary embodiments. Figure 1 A detailed description of elements and / or structures that are substantially the same or similar to those described.

[0091] Reference Figure 4 , the first printed circuit board 180 may further include a ground layer 172. For example, the antenna circuit wiring layer 170 may be formed on an upper surface of the core layer 160, and the ground layer 172 may be formed on a lower surface of the core layer 160.

[0092] For example, the ground layer 172 may face the antenna circuit wiring layer 170 with the core layer 160 interposed therebetween, so that noise around the antenna circuit wiring layer 170 may be absorbed or shielded. Therefore, the reliability of feeding / signal transmission between the driving IC chip 260 and the antenna device 100 may be further improved.

[0093] The second via structure 240 may be formed collectively through, for example, the antenna circuit wiring layer 170 , the core layer 160 , and the ground layer 172 to be electrically connected to the internal wiring layer 220 .

[0094] Figure 5 is a schematic cross-sectional view showing an antenna package according to some exemplary embodiments. Figure 1 A detailed description of elements and / or structures that are substantially the same or similar to those described.

[0095] Reference Figure 5, the first printed circuit board 180 may be stacked on the second printed circuit board 200. For example, the first printed circuit board 180 may be stacked on the outermost insulating layer (eg, the third insulating layer 210c) of the second printed circuit board 200.

[0096] A photo solder resist (PSR) layer 250 may be formed on the first printed circuit board 180. The photo solder resist layer 250 may include a photosensitive organic polymer commonly used in the field of circuit board packaging.

[0097] A photo solder resist layer 250 having enhanced heat resistance to high temperatures may be formed on the first printed circuit board 180 , so that thermal damage to the first printed circuit board 180 may be more effectively prevented when the driving IC chip 260 is mounted.

[0098] In addition, a photo solder resist layer 250 capable of being used for fine etching by optical processing may be used so that more conductive pads for connection with, for example, the internal wiring 220 may be included in the driving IC chip 260 .

[0099] The first and second via structures 230 and 240 may be formed through the photo solder resist layer 250 and may be electrically connected to wiring layers included in the first and second printed circuit boards 180 and 200 , respectively.

[0100] In one embodiment, the photo solder resist layer 250 may be provided as an outermost insulating layer or an uppermost insulating layer of the second printed circuit board 200 .

[0101] Figure 6 is a schematic cross-sectional view showing an antenna package according to some exemplary embodiments. Figure 1 A detailed description of elements and / or structures that are substantially the same or similar to those described.

[0102] Reference Figure 6 , the antenna package may further include a third through-hole structure 245, through which the circuit wiring layer (e.g., antenna circuit wiring layer 170) included in the first printed circuit board 180 and the internal wiring layer 220 of the second printed circuit board 200 may be electrically connected to each other. For example, the third through-hole structure 245 may penetrate the core layer 160 and at least one insulating layer 210 of the plurality of insulating layers 210.

[0103] In some embodiments, the second printed circuit board 200 may further include a fourth via structure 247 that electrically connects the internal wiring layers 220 to each other in the insulating layer 210 .

[0104] Figure 7is a schematic top view illustrating an image display device according to some exemplary embodiments.

[0105] Reference Figure 7 , the image display device 300 may be manufactured in a smartphone shape, and Figure 6 The front side or window side of the image display device 300 is shown. The front side of the image display device may include a display area 310 and a peripheral area 320. The peripheral area 320 may substantially correspond to a light shielding portion or a frame portion of the image display device.

[0106] The antenna device 100 included in the antenna package as described above may be disposed below the front surface of the image display device, for example, may be disposed on the display panel. In one embodiment, the radiation pattern 110 may include a mesh structure, and a reduction in transmittance due to the radiation pattern 110 may be prevented. The driver IC chip 260 included in the antenna package may be disposed in the peripheral area 320 to prevent image quality in the display area 310 from being reduced. .

[0107] In some embodiments, the antenna package may be disposed at the rear side of the image display device 300. The antenna package may be bent through the first printed circuit board 180 so that, for example, the second printed circuit board 200 and the driving IC chip 260 may be inserted between the main board and the rear cover of the image display device 300.

[0108] As described above, the first printed circuit board 180 and the second printed circuit board 200 can be integrated so that the driver IC chip 260 and the antenna device 100 can be packaged as a single device structure. Therefore, an image display device equipped with a thin, highly reliable communication structure can be implemented using an antenna package.

Claims

1. An antenna package, characterized in that: The antenna package comprises: Antenna device; a first printed circuit board, the first printed circuit board being electrically connected to the antenna device; a second printed circuit board having a smaller ductility than that of the first printed circuit board and integrated with the first printed circuit board, the second printed circuit board including insulating layers and internal wiring layers stacked alternately and repeatedly; and A driver integrated circuit chip is arranged on the outermost insulating layer of the insulating layer, The first printed circuit board is inserted into the second printed circuit board as an intermediate layer of the second printed circuit board so that the outermost insulating layer of the insulating layers of the second printed circuit board is stacked on the first printed circuit board.

2. The antenna package according to claim 1, characterized in that: The first printed circuit board is a flexible printed circuit board, and the second printed circuit board is a rigid printed circuit board.

3. The antenna package according to claim 1, characterized in that: The first printed circuit board includes a core layer and an antenna circuit wiring layer formed on the core layer, and the antenna circuit wiring layer includes a feed wiring for supplying power from the driving integrated circuit chip to the antenna device.

4. The antenna package according to claim 3, characterized in that: The antenna package further comprises: a first through-hole structure, the first through-hole structure electrically connecting the driving integrated circuit chip and the antenna circuit wiring layer of the first printed circuit board; and A second through-hole structure electrically connects the driving integrated circuit chip and at least one of the internal wiring layers of the second printed circuit board.

5. The antenna package according to claim 4, characterized in that: The first via structure penetrates the outermost insulating layer, and the second via structure penetrates the outermost insulating layer and the first printed circuit board.

6. The antenna package according to claim 3, characterized in that: The first printed circuit board is stacked on an outermost insulating layer of the insulating layers of the second printed circuit board.

7. The antenna package according to claim 6, characterized in that: The antenna package further includes a photo solder resist layer formed on the first printed circuit board.

8. The antenna package according to claim 7, characterized in that: The antenna package also includes a driver integrated circuit chip stacked on the photo solder resist layer.

9. The antenna package according to claim 3, characterized in that: The first printed circuit board further includes a ground layer facing the antenna circuit wiring layer, and the core layer is interposed between the ground layer and the antenna circuit wiring layer.

10. The antenna package according to claim 3, characterized in that: The core layer includes a flexible resin, and the insulating layer includes a resin impregnated with inorganic fibers.

11. The antenna package according to claim 3, characterized in that: The antenna device includes a radiation pattern, a transmission line extending from the radiation pattern, and a signal pad connected to an end portion of the transmission line, The signal pad and the antenna circuit wiring layer are electrically connected to each other.

12. The antenna package according to claim 1, characterized in that: The first printed circuit board includes a circuit wiring layer, and the second printed circuit board includes an internal wiring layer, The antenna package further includes a third through-hole structure electrically connecting the circuit wiring layer and the internal wiring layer to each other.

13. An image display device, characterized in that: The image display device includes the antenna package according to claim 1.

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