Single row welding wire structure

Abstract

The present invention is a single-row welding wire structure, comprising a first circuit board and a wire group. The first circuit board is provided with a board-to-board electrical connector and comprises a single row of first contact groups, wherein the center spacing between each minimum adjacent contact of the first contact group forms the contact width. The wire group comprises a plurality of high-speed signal lines and at least one low-speed signal line connected to the first contact group, wherein the first spacing distance between the high-speed signal pair and each adjacent contact is at least greater than or equal to 2 times the distance between the contact width. The single-row welding wire structure can reduce the number of wires used, increase the spacing between high-speed signal pairs, and improve the wire arrangement method for crosstalk interference.

Description

Technical Field

[0001] The invention relates to a welding wire structure, and in particular to a single-row welding wire structure. Background Art

[0002] 3C electronic products are becoming increasingly miniaturized and thinner. Electrical connections between circuit boards and multiple welding wires are a common design method. Multiple welding wires are used to extend the layout of the circuit board and effectively configure the internal space of the product. Among them, electronic devices (such as notebook computers) are small in size and the internal space is bound to be relatively cramped. Therefore, multiple welding wires or board-to-board (BTB) electrical connectors are usually used between circuit boards to electrically connect each other to achieve better space utilization.

[0003] Generally, multiple solder wires are arranged in a single row of flat cables. The flat cable has 30 data lines and is an interface that meets the requirements for transmitting USB signals, including multiple power lines, multiple ground lines, 4 pairs of high-speed signal lines, 2 low-speed signal lines, etc.

[0004] The arrangement order of 30 data lines in a single row is:

[0005] Location 1 2 3 4 5 6 7 8 9 10 definition Vbus Vbus Vbus GND TX1 TX1 GND RX1 RX1 GND Location 11 12 13 14 15 16 17 18 19 20 definition CC GND SUB2 GND D+ D- GND SUB1 GND CC2 Location 21 22 23 24 25 26 27 28 29 30 definition GND TX2 TX2 GND RX2 RX2 GND Vbus Vbus Vbus

[0006] Because there is a ground wire on the left and right sides of each pair of high-speed differential signal lines, each pair of low-speed differential signal lines, each common-mode auxiliary data signal, common-mode auxiliary control signal line, and E-MAK chip power supply voltage signal line of the flat cable, the flat cable is relatively wide and has several problems:

[0007] 1. Use more wires, higher cost: Ground wires are arranged on each pair of signal pairs and on both sides of the signal line. Too many data lines are used, requiring 30 data lines, which is more expensive.

[0008] 2. High-speed signal interference: Taking 42AWG as an example, adjacent high-speed signal pairs are only separated by a ground wire. If the spacing is too small, the signals may interfere with each other and cause poor crosstalk.

[0009] 3. EMI (Electromagnetic Interference) / RFI (Radio Frequency Interference) problem: The Type-C electrical connector and the soldering wire area of ​​the other male connector are only coated with UV glue without any metal shell for shielding, which can easily cause EMI / RFI problems during high-speed signal transmission. Summary of the invention

[0010] The present invention provides a single-row welding wire structure, including a first circuit board and a wire group. The first circuit board is provided with a board-to-board electrical connector, the first circuit board includes a single row of first contact groups, and the center spacing between each minimum adjacent contact of the first contact group forms the contact width. The wire group includes a plurality of high-speed signal pairs and at least one low-speed signal pair, one end of the plurality of high-speed signal pairs and at least one low-speed signal pair is connected to the first contact group, and the first spacing distance between the plurality of high-speed signal pairs and each adjacent contact is at least greater than or equal to 2 times the distance of the contact width.

[0011] Preferably, the single-row wire bonding structure further comprises a second circuit board, on which an electrical connector is disposed, and the second circuit board comprises a single-row second contact group, each of which is connected to the other end of the wire group.

[0012] Preferably, the wire set includes a plurality of low-speed signal line pairs, and a second spacing distance between each of the low-speed signal line pairs and each adjacent contact is at least greater than or equal to 1.5 times the distance between the contact widths.

[0013] Preferably, the low-speed signal line is a coaxial cable or an electronic cable, and the plurality of high-speed signal pairs and at least one low-speed signal pair are coaxial cables, twin coaxial cables or electronic cables.

[0014] Preferably, the low-speed signal line, the plurality of high-speed signal line pairs and the at least one low-speed signal line pair of the coaxial cable respectively include a conductive layer, and each conductive layer is connected to the ground plate.

[0015] Preferably, the single-row bonding wire structure further includes at least one grounding plate, which is respectively disposed above and below the side ends of the plurality of high-speed signal lines and at least one low-speed signal line.

[0016] Preferably, a plurality of blocks extend from the side end of the grounding plate, and each of the blocks is electrically connected to the first circuit board.

[0017] Preferably, the side ends of the plurality of grounding plates are flush with the side ends of the first circuit board, or the side ends of the plurality of grounding plates protrude from the side ends of the first circuit board.

[0018] Preferably, the portions of the plurality of grounding plates protruding from the side end of the first circuit board are in contact with a metal covering member.

[0019] Preferably, the single-row wire bonding structure further includes at least one electronic wire, which is respectively disposed on both sides of the wire group and connected to the first circuit board.

[0020] Preferably, the single-row wire bonding structure further includes a first outer cover disposed on the first circuit board and covering each of the high-speed signal lines.

[0021] One embodiment of the present invention provides a single-row welding wire structure that can reduce the number of wires used, increase the spacing between high-speed signal pairs, and improve the wire arrangement method for crosstalk interference. There is no grounding wire arranged on each pair of signal pairs and both sides of the signal line, and a metal shell is used for shielding to avoid EMI / RFI problems during high-speed signal transmission. In addition, the height of the single-row welding wire structure is lower than that of the double-row welding wire structure. In addition, a plurality of grounding plates are clamped at both ends of the wire group and fixed on the first circuit board, and the grounding plates contact the conductive layer on each wire and are electrically connected to the first circuit board to provide conduction and grounding effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the appearance of the first embodiment of the present invention.

[0023] Figure 2 It is a schematic diagram of the decomposition of the first embodiment of the present invention.

[0024] Figure 3 It is a schematic diagram of the appearance of the first embodiment of the present invention during welding.

[0025] Figure 4 It is a top view schematic diagram of the first embodiment of the present invention.

[0026] Figure 5 yes Figure 4 A partial enlarged schematic diagram (a).

[0027] Figure 6 yes Figure 4 A partial enlarged schematic diagram (II).

[0028] Figure 7 FIG. 1 is a top view schematic diagram of a board-to-board electrical connector according to a first embodiment of the present invention.

[0029] Figure 8 It is a top view schematic diagram of the second embodiment of the present invention.

[0030] Fig. 9 yes Figure 8 A partial enlarged schematic diagram.

[0031] Fig.10 It is a top view schematic diagram of the third embodiment of the present invention.

[0032] Fig.11 yes Fig.10 A partial enlarged schematic diagram (a).

[0033] Fig.12 yes Fig.10 A partial enlarged schematic diagram (II).

[0034] Fig.13It is a top view schematic diagram of the fourth embodiment of the present invention.

[0035] Fig.14 It is a schematic diagram of the decomposition of the fourth embodiment of the present invention.

[0036] Fig.15 It is a schematic diagram of the appearance of the fourth embodiment of the present invention during welding.

[0037] Fig.16 It is a schematic diagram of the appearance of the fifth embodiment of the present invention.

[0038] Fig.17 It is a schematic diagram of the appearance of the first outer cover of the present invention when it is opened.

[0039] Fig.18 It is a schematic diagram of an exploded view of the present invention using a USB Type-C electrical connector.

[0040] Fig.19 It is a top view schematic diagram of the sixth embodiment of the present invention.

[0041] Explanation of symbols

[0042] 1........ First circuit board

[0043] 1c...... Lateral end

[0044] 11....... First contact group

[0045] 111......Contact

[0046] 112...... Width between contacts

[0047] 2........ Board-to-board electrical connector

[0048] 21....... Insulation body

[0049] 22.......Terminal

[0050] 3........ Wire set

[0051] 3a....... Single row line

[0052] 3b....... Cable

[0053] 31....... High-speed signal alignment

[0054] 312......First interval distance

[0055] 32.......Low-speed signal alignment

[0056] 322...... The second interval distance

[0057] 33....... Electronic wire

[0058] 331...... Ground wire

[0059] 332...... Power cord

[0060] 34.......Low-speed signal line

[0061] 35....... Conductive layer

[0062] 36....... Grounding plate

[0063] 36c...... Side

[0064] 361...... Block

[0065] 4........ First outer cover

[0066] 5........ Circuit Board

[0067] 6........ Second circuit board

[0068] 61....... Second contact group

[0069] 7........ USB Type-C electrical connector

[0070] 71....... Insulation body

[0071] 72.......Terminal

[0072] 73....... Shielded housing

[0073] 8........ Second outer cover

[0074] 9........Metal covering. DETAILED DESCRIPTION

[0075] Reference Figures 1 to 6 , is a first embodiment of a single-row bonding wire structure, Figure 1 It is a schematic diagram of the appearance. Figure 2 For decomposition diagram, Figure 3 This is a schematic diagram of the appearance during welding. Figure 4 A top view diagram is shown. Figure 5 for Figure 4 A partial enlarged schematic diagram (I), Figure 6 for Figure 4In this embodiment, the single-row wire bonding structure includes a first circuit board 1 , a wire assembly 3 and a second circuit board 6 .

[0076] In this embodiment, a board-to-board electrical connector 2 is disposed on the first circuit board 1, and the first circuit board 1 includes a single row of first contact points 11, and the center distance between each minimum adjacent contact point 111 (wire pad) of the first contact point group 11 forms an inter-contact point width 112. In more detail, the center distance between each minimum adjacent contact point 111 forms the inter-contact point width 112, which is set to the same distance, and the number of each minimum adjacent contact point 111 can be increased or decreased according to product needs.

[0077] In this embodiment, the wire set 3 includes a plurality of high-speed signal wire pairs 31 and at least one low-speed signal wire pair 32. One end of the plurality of high-speed signal wire pairs 31 and at least one low-speed signal wire pair 32 is connected to the first contact set 11. The first spacing distance 312 between adjacent contacts 111 connected by the plurality of high-speed signal wire pairs 31 is at least greater than or equal to 2 times the distance between the contact widths 112. Wherein, no ground wires are placed on both sides of the signal wire pairs or signal lines.

[0078] In this embodiment, the second circuit board 6 is provided with an electrical connector. The second circuit board 6 includes a single row of second contact points 61 , which are respectively connected to the other ends of the wire set 3 .

[0079] In this embodiment, more specifically, the second spacing distance 322 between adjacent contacts 111 connected to at least one low-speed signal line pair 32 and a low-speed signal line 34 is at least greater than or equal to 1.5 times the distance between the contact points 112 .

[0080] In this embodiment, in more detail, the first contact group 11 can be disposed on the upper surface or the lower surface of the first circuit board 1 , and the board-to-board electrical connector 2 can be disposed on the upper surface or the lower surface of the first circuit board 1 .

[0081] In this embodiment, in more detail, the board-to-board electrical connector 2 includes an insulating body 21 and a plurality of terminals 22 disposed on the insulating body 21. In addition, the board-to-board electrical connector 2 can be a plug or a socket. The plurality of terminals 22 are used to transmit signals and transmit current of 0.3A to 0.5A.

[0082] In this embodiment, in more detail, the wire group 3 is a single row of wires 3a, which is divided into a single row of flat cables or wire harnesses for use, and is provided with a total of four groups of high-speed signal pairs 31, two groups of low-speed signal pairs 32, and a plurality of low-speed signal lines 34. Among them, the two groups of low-speed signal pairs 32 are arranged between the two left and right groups of the plurality of high-speed signal pairs 31, and each low-speed signal line 34 is arranged close to a group of high-speed signal pairs 31, and the above-mentioned number and position of arrangement are only examples.

[0083] In this embodiment, more specifically, a contact 111 and a low-speed signal line 34 are separated between a plurality of adjacent high-speed signal line pairs 31. Here, the low-speed signal line 34 is arranged close to a left group of high-speed signal line pairs 31, and a contact 111 is separated between the low-speed signal line 34 and another right group of high-speed signal line pairs 31. In addition, at least one low-speed signal line pair 32 may be arranged, and a contact 111 is separated between at least one low-speed signal line pair 32 and an adjacent high-speed signal line pair 31. At least one low-speed signal line pair 32 is arranged between the left and right groups of high-speed signal line pairs 31, and the low-speed signal line 34 is arranged close to a left group of high-speed signal line pairs 31, and a contact 111 is separated between the low-speed signal line 34 and at least one low-speed signal line pair 32.

[0084] See also Figure 4 In this embodiment, a plurality of adjacent high-speed signal line pairs 31 are separated by a contact 111 and a low-speed signal line 34. In addition, at least one low-speed signal line pair 32 is separated from an adjacent high-speed signal line pair 31 by a contact 111.

[0085] In this embodiment, more specifically, the low-speed signal line 34 is a coaxial cable (Coaxial), and the plurality of high-speed signal lines 31 and at least one low-speed signal line 32 are coaxial cables (Coaxial). In addition, the low-speed signal line 34, the plurality of high-speed signal lines 31 and at least one low-speed signal line 32 of the coaxial cable respectively include a conductive layer 35 (mesh braid (Copper Braid Shield, a metal wire mesh such as copper wire or aluminum wire)), and each conductive layer 35 is connected to at least one or more grounding plates 36.

[0086] In this embodiment, in more detail, the single-row wire structure further includes at least one or more electronic wires 33, which are wire pairs or twisted wires. Each electronic wire 33 is a ground wire 331 or a power wire 332 or both. Each electronic wire 33 is respectively arranged on both sides of the wire set 3 and connected to the first circuit board 1. In particular, Figure 4 As shown, two pairs of grounding wires 331 are respectively arranged on both sides of the wire group 3 and the left and right outer sides of the first circuit board 1 (or one grounding wire 331 is respectively arranged on the left and right outer sides of the first circuit board 1). Two pairs of power wires 332 are respectively arranged on both sides of the wire group 3 and the left and right inner sides of the first circuit board 1 (or one power wire 332 is respectively arranged on the left and right outer sides of the first circuit board 1).

[0087] See also Figure 7 , Figure 7This is a top view of a board-to-board electrical connector. In this embodiment, in more detail, the electrical connector provided on the second circuit board 6 can be a board-to-board electrical connector, including an insulating body and a plurality of terminals provided on the insulating body. The board-to-board electrical connector can be a plug or a socket. The plurality of terminals are used to transmit signals, and the transmission current is 0.3A to 0.5A.

[0088] In this embodiment, in more detail, the electrical connector provided on the second circuit board 6 is a USB Type-C electrical connector 7 (such as Fig.15 and Fig.17 ), including an insulating body 71, a plurality of terminals 72 disposed on the insulating body 71, and a shielding shell 73 covering the outside of the insulating body 71. The USB Type-C electrical connector 7 is a socket.

[0089] Here, the second contact group 61 on the second circuit board 6 is connected to the plurality of high-speed signal lines 31, the plurality of low-speed signal lines 32, and the plurality of electronic lines 33. In addition, the second contact group 61 can be disposed on the upper surface or the lower surface of the second circuit board 6, and the USB Type-C electrical connector 7 can be disposed on the upper surface or the lower surface of the second circuit board 6.

[0090] Reference Figures 1 to 6 In this embodiment, in more detail, the single-row wire bonding structure further includes a plurality of grounding plates 36, which are respectively disposed at the upper and lower positions of the side ends of the plurality of high-speed signal lines 31 and at least one low-speed signal line 32. Here, the two ends of the wire group 3 are laser-removed to expose the conductive layer 35 on each wire. Among them, the plurality of grounding plates 36 are clamped at the two ends of the wire group 3, and the plurality of grounding plates 36 are in contact with each conductive layer 35 of the plurality of high-speed signal lines 31 and at least one low-speed signal line 32. In addition, each grounding plate 36 is electrically connected to the first circuit board 1 to provide a conductive and grounding effect.

[0091] Reference Figure 2 , Figure 3 In this embodiment, to be more specific, the side ends 36 c of the plurality of grounding plates 36 are aligned with the side ends 1 c of the first circuit board 1 , but the present invention is not limited thereto.

[0092] In the above embodiment, a set of low-speed signal lines 32 may be used, but the present invention is not limited thereto. Figure 8 and Fig. 9 , is a second embodiment of a single-row bonding wire structure, Figure 8 A top view diagram is shown. Fig. 9 for Figure 8 In the second embodiment, the wire assembly 3 includes a plurality of low-speed signal wire pairs 32, and the second spacing distance 322 between adjacent contacts 111 connected by the plurality of low-speed signal wire pairs 32 is at least greater than or equal to 1.5 times the distance between the contact widths 112.

[0093] See also Figure 8 In this embodiment, two contacts 111 and one low-speed signal line 34 are provided between the plurality of adjacent high-speed signal lines 31 of the plurality of groups. In other words, a contact 111 is provided between a low-speed signal line 34 and the high-speed signal lines 31 on the left and right sides. In addition, two contacts 111 are provided between at least one low-speed signal line 32 and the adjacent high-speed signal line 31, and a low-speed signal line 34 is provided between at least one low-speed signal line 32 and the adjacent high-speed signal line 31, and a contact 111 is provided between a low-speed signal line 34 and at least one low-speed signal line 32 and the high-speed signal line 31 on the left and right sides.

[0094] Reference Figures 10 to 12 , is a third embodiment of a single-row bonding wire structure, Fig.10 A top view diagram is shown. Fig.11 for Fig.10 A partial enlarged schematic diagram (I), Fig.12 for Fig.10 In the third embodiment, the plurality of high-speed signal lines 31 and at least one low-speed signal line 32 are twin coaxial cables.

[0095] See also Fig.10 In this embodiment, two contacts 111 and one low-speed signal line 34 are provided between the plurality of adjacent high-speed signal lines 31. In other words, a contact 111 is provided between a low-speed signal line 34 and the high-speed signal lines 31 on the left and right sides. In addition, at least one low-speed signal line 32 is provided with two contacts 111 between the adjacent high-speed signal lines 31.

[0096] Reference Figures 13 to 15 , is a fourth embodiment of a single-row bonding wire structure, Fig.13 A top view diagram is shown. Fig.14 For decomposition diagram, Fig.15 Schematic diagram of the appearance during welding. In the fourth embodiment, a plurality of blocks 361 extend from the side end of the grounding sheet 36, wherein a plurality of blocks 361 spaced apart from each other are arranged on the side end of the grounding sheet 36, and the grounding sheet 36 as a whole is roughly in the shape of a comb. Here, the plurality of grounding sheets 36 are clamped at the two ends of the wire group 3, and the plurality of grounding sheets 36 are in contact with the conductive layers 35 of the plurality of high-speed signal pairs 31 and at least one low-speed signal pair 32. Each block 361 is electrically connected to the first circuit board 1 to provide conduction and grounding effects.

[0097] Reference Fig.14 , Fig.15In this embodiment, the side ends 36c of the multiple grounding plates 36 protrude from the side ends 1c of the first circuit board 1. The multiple grounding plates 36 are moved so that the side ends 36c protrude from the side ends 1c of the first circuit board 1, thereby reducing the area where the multiple grounding plates 36 are arranged on the circuit board 1, and reducing the area occupied by the multiple grounding plates 36 on the circuit board 1.

[0098] Reference Figure 2 , Fig.16 and Fig.17 , is a fifth embodiment of a single-row bonding wire structure, Fig.16 It is a schematic diagram of the appearance. Fig.17 The figure is a schematic diagram of the appearance of opening the first outer cover. In the fifth embodiment, the single-row welding wire structure further includes a metal cover 9 (a metal-containing shielding material such as conductive cloth or copper foil or aluminum foil) covering the outside of the wire group 3. Here, the wire group 3 is covered with the metal cover 9, which can effectively improve the EMI (Electromagnetic Interference) / RFI (Radio Frequency Interference) problem during high-speed signal transmission.

[0099] like Figure 2 , Fig.16 and Fig.17 As shown, in this embodiment, in more detail, the single-row wire bonding structure further includes a first outer cover 4 (metal cover), which is disposed on the first circuit board 1 and covers a plurality of high-speed signal lines 31, so as to improve the EMI / RFI problem generated when the high-speed signal lines 31 transmit signals. Here, a circuit board 5 is covered on the first circuit board 1, and a board-to-board electrical connector (not shown) is disposed on the circuit board 5, and the board-to-board electrical connector corresponds to the board-to-board electrical connector 2 plugged on the first circuit board 1 and is electrically connected.

[0100] In this embodiment, more specifically, one end of the metal cover 9 contacts the plurality of grounding plates 36, and in particular, the portion of the plurality of grounding plates 36 protruding from the side end 1c of the first circuit board 1 is affixed to the metal cover 9 (not shown). Here, the side end 36c of the protruding plurality of grounding plates 36 is affixed to the metal cover 9 to enhance the fixing effect of the metal cover 9.

[0101] Reference Figure 2 , Fig.18 As shown, Fig.18This is a schematic diagram of an exploded view of a USB Type-C electrical connector. In this embodiment, in more detail, the single-row wire structure further includes a second outer cover 8 (metal cover) disposed on the second circuit board 6 and covering a plurality of high-speed signal pairs 31 to improve the EMI (Electromagnetic Interference) / RFI (Radio Frequency Interference) problem generated when the high-speed signal pairs 31 transmit signals.

[0102] Reference Figure 2 , Fig.19 , is a sixth embodiment of a single-row bonding wire structure, Fig.19 It is a top view. In the sixth embodiment, the wire set 3 is a cable 3b, one end of the wire set 3 is connected to the USB Type-C electrical connector 7, and the other end of the wire set 3 is connected to the first contact set 11 on the first circuit board 1. Here, one end of the wire set 3 is connected to the second circuit board 6 disposed in the USB Type-C electrical connector 7. The wire set 3 and the USB Type-C electrical connector 7 are semi-finished products, that is, the wire set 3 is a cable type extending from the rear end of the USB Type-C electrical connector 7, and the USB Type-C electrical connector 7 can be a plug electrical connector.

[0103] An embodiment of the present invention provides a single-row wire structure that can reduce the number of wires used, increase the spacing between high-speed signal pairs, and improve the wire arrangement method for crosstalk interference. In particular, no ground wires are arranged on each pair of signal pairs and both sides of the signal line, and a metal shell is used for shielding to avoid EMI / RFI problems during high-speed signal transmission. In addition, the height of the single-row wire structure is lower than that of the double-row wire structure.

[0104] Furthermore, a plurality of grounding plates are clamped at two ends of the wire group and fixed on the first circuit board, and the grounding plates contact the conductive layer on each wire and are electrically connected to the first circuit board to provide conduction and grounding effects.

Claims

1. A single-row welding wire structure, characterized in that: A first circuit board is provided with a board-to-board electrical connector, wherein the first circuit board includes a first contact group in a single row, and the center distance between each minimum adjacent contact of the first contact group forms an inter-contact width; and A wire group includes a plurality of high-speed signal wire pairs, a plurality of low-speed signal wires and at least one low-speed signal wire pair, wherein one end of each of the high-speed signal wire pairs and the at least one low-speed signal wire pair is connected to the first contact group, and the at least one low-speed signal wire pair is arranged between the left and right groups of the plurality of high-speed signal wire pairs, and each low-speed signal line is arranged close to a group of high-speed signal wire pairs, and a first spacing distance between each of the high-speed signal wire pairs and each adjacent contact is at least greater than or equal to 2 times the distance between the contact widths.

2. The single-row bonding wire structure according to claim 1, wherein: It further comprises a second circuit board, which is provided with an electrical connector. The second circuit board comprises a second contact group in a single row, which is respectively connected to the other end of the wire group.

3. The single-row bonding wire structure according to claim 1 or 2, characterized in that: The wire set includes a plurality of low-speed signal line pairs, and a second spacing distance between each of the low-speed signal line pairs and each adjacent contact is at least greater than or equal to 1.5 times the distance between the contact widths.

4. The single-row bonding wire structure according to claim 1 or 2, characterized in that: The low-speed signal line is a coaxial cable or an electronic cable, and each of the high-speed signal line pairs and the at least one low-speed signal line pair is a coaxial cable, a twin-core coaxial cable or an electronic cable.

5. The single-row bonding wire structure according to claim 4, characterized in that: The low-speed signal line, each of the high-speed signal line pairs and the at least one low-speed signal line pair of the coaxial cable respectively include a conductive layer, and each of the conductive layers is connected to a ground plate.

6. The single-row bonding wire structure according to claim 1 or 2, characterized in that: It further comprises at least one grounding sheet, which is respectively arranged at the upper and lower positions of the side ends of each of the high-speed signal lines and the at least one low-speed signal line.

7. The single-row bonding wire structure according to claim 6, wherein: A plurality of blocks extend from the side end of the grounding plate, and each of the blocks is electrically connected to the first circuit board.

8. The single-row bonding wire structure according to claim 6, wherein: The portion of the grounding plate protruding from the side end of the first circuit board contacts a metal covering member.

9. The single-row bonding wire structure according to claim 1 or 2, characterized in that: It further includes at least one electronic wire, which is respectively disposed on both sides of the wire set and connected to the first circuit board.

10. The single-row bonding wire structure according to claim 1 or 2, characterized in that: The invention further comprises a first outer cover which is disposed on the first circuit board and covers each of the high-speed signal lines.

11. The single-row bonding wire structure according to claim 1 or 2, characterized in that: The electrical connector is a board-to-board electrical connector, comprising an insulating body and a plurality of terminals arranged on the insulating body. The board-to-board electrical connector is a socket or a plug.

12. The single-row bonding wire structure according to claim 1 or 2, characterized in that: The electrical connector is a USB Type-C electrical connector, including an insulating body, a plurality of terminals arranged on the insulating body, and a shielding shell covering the outside of the insulating body.

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