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Electronic equipment and electronic device

A technology of electronic equipment and electronic devices, which is applied in the construction parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., can solve the problems of heating of electronic equipment, increase the number of heat sources of electronic equipment, etc., and achieve the effect of efficient heat dissipation

Pending Publication Date: 2022-05-03
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a situation increases the number of heat sources in the electronic equipment, causing the electronic equipment to heat up significantly during use.

Method used

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  • Electronic equipment and electronic device
  • Electronic equipment and electronic device
  • Electronic equipment and electronic device

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Embodiment Construction

[0037] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. Embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

[0038] The terminology used in the present disclosure is for the purpose of describing particular embodiments only, and is not intended to limit the present disclosure. Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the ordinary meanings understood by those skilled in the art to which the present disclosure belongs. Words such as "a"...

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Abstract

The invention relates to electronic equipment and an electronic device, and belongs to the technical field of heat dissipation of electronic equipment. By adopting the electronic equipment provided by the invention, a brand new solution is provided for heat dissipation of the electronic equipment, and the heat dissipation efficiency of the electronic equipment is improved. The electronic equipment is provided with a sealed mounting cavity, and further comprises an electronic assembly and insulating heat dissipation liquid. Wherein the electronic component is arranged in the mounting cavity, and a gap is formed between the electronic component and the inner wall of the mounting cavity. The installation cavity is filled with the insulation heat dissipation liquid, and the insulation heat dissipation liquid can flow in the gap.

Description

technical field [0001] The present disclosure relates to the technical field of heat dissipation of electronic equipment, and in particular, to an electronic equipment and an electronic device. Background technique [0002] With the development of hardware technology, more and more electronic components are integrated in electronic devices such as mobile phones. Such a situation increases the number of heat sources in the electronic device, resulting in obvious heating of the electronic device during use. Therefore, how to improve the heat dissipation capability of electronic devices has become an urgent problem to be solved. Contents of the invention [0003] The present disclosure provides an electronic device and an electronic device, and provides a solution for improving the heat dissipation capability of the electronic device. [0004] In a first aspect, an embodiment of the present disclosure provides an electronic device, the electronic device has a sealed install...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/203
Inventor 陈静颜嘉甫
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD