Method and device for automatically adjusting the angle and position of injection needle by applying RTV silicone

By calculating the distance and height of the adjacent component, the angle and location of the injection needle is automatically adjusted by using the triangular positive cut function to solve the problem of inaccurate injection of injection needle adjustment in the existing technology, and improve the pointing efficiency and consistency.

CN116871137BActive Publication Date: 2025-01-28SHENZHEN ZHENHUA MICROELECTRONICS
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Patent Information

Application Number
CN202310742543.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-06-20
Publication Date
2025-01-28
Estimated Expiration
2043-06-20

AI Technical Summary

Technical Problem

During the programming and debugging process of the prior art, the angle, height and horizontal distance of the injection needle are not adjusted accurately, resulting in inconsistent dispensing effects, increasing the operation difficulty and debugging time of engineers.

Method used

By calculating the distance between the adjacent components, establish a right -angle triangle, and use the triangular positive cut function to calculate the angle required to adjust the injection needle, and then automatically adjust the angle, height, and horizontal distance of the injection needle.

Benefits of technology

The efficiency of on -site engineering personnel and the quality of the product point of the product have been improved, the quality of the product point of the product is ensured, and the consistency of the product point glue effect is guaranteed, and the difficulty of the engineering personnel will be reduced.

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Abstract

The invention belongs to the technical field of PCB board dispensing, and discloses a method and device for automatically adjusting the angle and position of an injection needle by dispensing RTV silica gel. The method of the invention obtains the spacing distance between adjacent components by calculation, obtains a right-angled side of a right triangle, takes any height of the adjacent components as the other right-angled side of the right triangle, obtains the angle to be adjusted of the injection needle according to the tangent function of the triangle, and then obtains fixed parameters for automatically adjusting the angle, height and horizontal distance of the injection needle for automatic dispensing, thereby improving the efficiency of on-site engineering personnel in programming and debugging and the quality of product dispensing, ensuring the consistency of product dispensing effect, reducing the difficulty of operation for engineering personnel, and effectively improving dispensing efficiency.
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Description

Technical Field

[0001] The invention relates to a method and a device for automatically adjusting the angle and position of an injection needle by applying RTV silica gel, and belongs to the technical field of PCB board glue application. Background Art

[0002] The silicone process of module circuit points improves the firmness of the connection between the device and the PCB and enhances the reliability of the circuit.

[0003] Usually, SMD components, connectors, E-type magnetic cores, etc. on PCB boards are reinforced by applying RTV silicone. The more components there are, the more glue is applied. The existing silicone application process includes manual application of RTV silicone and machine application of RVT silicone. There are currently two programming methods for applying RVT silicone on machines:

[0004] 1. First scan the mark points at the four corners of the PCB board, then manually obtain the coordinates of each dispensing point and manually adjust the height and angle of the injection needle.

[0005] 2. Take a photo of the product first, and then draw the dispensing track directly on the photo through pixel conversion and manually adjust the height and angle of the injection needle. This will cause great trouble to the on-site engineers in programming and debugging, and repeated debugging is required to achieve the required effect. The angle, height and horizontal distance of the injection needle debugged by each on-site engineer are uneven, and the dispensing effect of the previous and next batches of products is not consistent.

[0006] In order to improve the efficiency and quality of on-site engineering personnel in programming and debugging, it is necessary to develop a method of automatically adjusting the angle, height and horizontal distance of the injection needle by applying RTV silicone.

[0007] In response to existing problems, it is urgent to innovate on the original basis. Summary of the invention

[0008] In view of the deficiencies of the above-mentioned prior art, the purpose of the present invention is to provide a method for automatically adjusting the angle and position of an injection needle by applying RTV silicone. This method obtains a right-angled side of a right triangle through the spacing distance between adjacent components, and uses any height of the adjacent components as the other right-angled side of the right triangle. The angle to be adjusted for the injection needle is obtained according to the tangent function of the triangle, and then the fixed parameters for automatically adjusting the angle, height and horizontal distance of the injection needle are obtained, thereby improving the efficiency of on-site engineering personnel in programming and debugging and the quality of product dispensing, and ensuring the consistency of the product dispensing effect.

[0009] To achieve the above object, the present invention provides a method for automatically adjusting the angle and position of an injection needle by using RTV silicone, comprising the following steps: S1, obtaining the coordinates of adjacent components on the plane of a PCB board through a sensor; S2, calculating the vertical distance between the adjacent components to obtain a right-angled side of a right triangle, set as a; S3, using a sensor to measure the distance from the injection needle to the surface of the PCB board as a reference, respectively measuring the heights of the adjacent components, taking any height of the adjacent components as the other right-angled side of the right triangle, set as b; S4, calculating the angle of β according to the tangent function of the triangle: tanβ=b / a;

[0010] S5. Move the injection needle between adjacent components and adjust the angle between the injection needle and the PCB board to β, with the injection needle pointing toward the side of the component that needs to be glued; S6. Apply glue to the connecting edge on the opposite side of one of the components. After the glue is applied, adjust the injection needle to point to the other component at the same angle, calculate the distance the injection needle moves to the other component in the horizontal direction, and move the injection needle to apply glue to the connecting edge on the opposite side of the other component.

[0011] Further, as a more preferred implementation scheme of the present invention, adjusting the angle between the injection needle and the PCB board in step S5 also includes: 90°-β.

[0012] Further, as a more preferred implementation of the present invention, in step S1 , the coordinates of adjacent components in the X direction are subtracted or the coordinates of adjacent components in the Y direction are subtracted.

[0013] Further, as a more preferred implementation scheme of the present invention, measuring the height of adjacent components in step S3 includes: measuring the distance from the injection needle to any component through a sensor, and subtracting the distance from the injection needle to any component from the distance from the injection needle to the PCB board to obtain the height of the corresponding component.

[0014] Further, as a more preferred implementation scheme of the present invention, the vertical distance between adjacent components is calculated in step S2 to obtain a side of the right triangle, which is set as a, including: taking the coordinates of the center position of the component as a reference; calculating the spacing distance between adjacent components in the X or Y direction, subtracting half the length of one component in the X or Y direction from the spacing distance, and subtracting half the length of another component in the X or Y direction from the spacing distance to obtain the spacing between opposite sides of the adjacent components.

[0015] Further, as a more preferred implementation scheme of the present invention, obtaining the coordinates of adjacent components on the plane of the PCB board through the sensor in step S1 includes taking a corner of the PCB board as the origin, obtaining the distance of a component on the PCB board in the X and Y directions relative to the origin based on the sensor, and respectively obtaining the coordinates of the adjacent components.

[0016] Furthermore, as a more preferred implementation scheme of the present invention, the distance that the injection needle moves in the horizontal direction to another component is calculated in step S6, including: the custom-set active spacing required for the injection needle to discharge glue, and the length of side a minus the active spacing required for the injection needle to discharge glue to obtain the horizontal distance adjusted by the injection needle.

[0017] Based on the same inventive concept, the present invention also provides a device for implementing the above-mentioned method of automatically adjusting the angle, height and horizontal distance of the injection needle by using the point RTV silicone, comprising: a processor and a robotic arm electrically connected to the processor; and also comprising an injection needle and a sensor, wherein the movable end of the robotic arm is respectively provided with the injection needle and the sensor, and the needle direction of the injection needle is consistent with the direction of the detection end of the sensor; and the sensor is electrically connected to the processor.

[0018] Compared with the prior art, the beneficial effects are:

[0019] 1. The method of the present invention obtains a right-angled side of a right triangle by calculating the spacing distance between adjacent components, takes any height of the adjacent components as the other right-angled side of the right triangle, and obtains the angle to be adjusted of the injection needle according to the tangent function of the triangle, thereby obtaining fixed parameters for automatically adjusting the angle, height and horizontal distance of the injection needle for automatic dispensing, thereby improving the efficiency of on-site engineering personnel in programming and debugging and the quality of product dispensing, ensuring the consistency of product dispensing effects, reducing the difficulty of operation for engineering personnel, and effectively improving dispensing efficiency.

[0020] 2. In the method of the present invention, the angle between the injection needle and the PCB board can be adjusted to 90°-β in order to avoid the height of one component being too small relative to the other component. If the angle between the injection needle and the PCB board is directly β, the angle is too small, and the mechanical arm controls the swing of the injection needle, which may result in the following situations: the injection needle touches the component, the edge of the mechanical arm touches the PCB board, or the sensor touches the component.

[0021] 3. After obtaining the spacing distance between adjacent components, the present invention can customize the movable spacing required for the injection needle to discharge glue, and then obtain the distance that the injection needle moves to another component, which is a simpler method. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A flowchart of the method steps of an embodiment;

[0023] Figure 2 It is a structural schematic diagram of the device in the embodiment;

[0024] Figure 3 Schematic diagram of the structure after the angle of the injection needle is adjusted in the embodiment.

[0025] Reference numerals:

[0026] 1-Robotic arm; 2-Injection needle, 3-Sensor, 4-PCB board; 5-Component A; 6-Component B. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of this application.

[0028] It should be noted that when an element is referred to as being "fixed on" or "set on" another component, it can be directly on the other component or indirectly set on the other component; when a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component.

[0029] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" and "several" mean two or more, unless otherwise clearly and specifically defined.

[0031] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0032] Example

[0033] This embodiment is intended to promote the solution of how to improve the efficiency of on-site engineering personnel in programming and debugging and the quality of product dispensing, and ensure the consistency of product dispensing effects. Through the spacing distance of adjacent components, a right-angled side of the right triangle is obtained, and any height of the adjacent components is used as the other right-angled side of the right triangle. According to the tangent function of the triangle, the angle to be adjusted for the injection needle is obtained, and then the fixed parameters for automatically adjusting the angle, height and horizontal distance of the injection needle are obtained.

[0034] Reference Figure 1-3 As shown, this embodiment provides a method for automatically adjusting the angle and position of an injection needle by applying RTV silicone, comprising the following steps:

[0035] S1. Obtain the coordinates of adjacent components on the plane of PCB board 4 through sensor 3.

[0036] Step S1 of calculating the vertical distance between adjacent components includes: subtracting the coordinates of adjacent components in the X direction or subtracting the coordinates of adjacent components in the Y direction.

[0037] In step S1, the coordinates of adjacent components on the plane of the PCB board 4 are obtained by the sensor 3, taking a corner of the PCB board 4 as the origin, obtaining the distances of the component A5 on the PCB board 4 relative to the origin in the X and Y directions according to the sensor 3, and obtaining the coordinates of the component A5 and the component B6 respectively. Figure 2 As shown, in this embodiment, it is assumed that component A5 is flush with component B6 in the X direction, the coordinates of component A5 are (1, 1), the coordinates of component B6 are (3, 1), and the unit length is 1 cm; the glue dispensing position is the side opposite to component A5 and component B6 in the X direction, and the edges where component A5 and component B6 are in contact with PCB board 4 respectively.

[0038] In some embodiments, component A5 is flush with component B6 in the Y direction, and the glue dispensing position is on the side opposite to component A5 and component B6 in the Y direction, the edge where component A5 and component B6 are in contact with PCB board 4 respectively.

[0039] S2. Calculate the vertical distance between adjacent components and obtain a right-angled side of the right triangle, set as a.

[0040] It should be noted that even if the component A5 and the component B6 are located at diagonal positions, only the spacing in the X or Y direction is referenced as a right angle side of the right triangle.

[0041] In this embodiment, the coordinates of component A5 are (1, 1), and the coordinates of component B6 are (3, 1);

[0042] In this embodiment, the coordinates of the center position of the components are used as reference for components A5 and B6; to calculate the actual spacing distance of adjacent components in the X or Y direction, it is necessary to subtract the difference between components B6 and A5 in the X coordinate direction from half the length of component A5 in the X direction and half the length of component B6 in the X direction to obtain the actual spacing distance of the opposite side of the adjacent components. Assuming that the half lengths of components A5 and B6 in the X direction are both 0.5 cm, the length of the bottom side of the right angle is 1 cm.

[0043] S3. Use sensor 3 to measure the distance from injection needle 2 to the surface of PCB board 4 as a reference, measure the height of component A5 and component B6 respectively, and use any height of component A5 or component B6 as the other right-angled side of the right triangle, set as b.

[0044] In step S3, the heights of components A5 and B6 are measured respectively, including: measuring the distance from the injection needle 2 to any component by the sensor 3, and subtracting the distance from the injection needle 2 to any component from the distance from the injection needle 2 to the PCB board 4 to obtain the height of the corresponding component.

[0045] In this embodiment, the height of the component B6 is used as another right-angle side, and the height of the component B6 is set to be 1 cm.

[0046] In some embodiments, the height of device A is , which can also be used as another right-angled side.

[0047] S4. Calculate the angle β according to the tangent function of the triangle: tanβ=b / a; β in this embodiment is 45°.

[0048] S5, move the injection needle 2 to between the component A5 and the component B6, and adjust the angle between the injection needle 2 and the PCB board 4 to β, with the injection needle 2 facing the side of the component that needs to be glued.

[0049] It should be noted that, by adjusting the angle between the injection needle 2 and the PCB board 4 to 45°, the injection needle 2 can dispense glue to the component A5 and the component B6 respectively through this angle.

[0050] If the height of component A5 is too small relative to component B6, if the angle between the injection needle and the PCB board 4 is directly β, the angle is too small, and the mechanical arm 1 controls the swing of the injection needle 2, and the injection needle 2 touches the component, the edge of the mechanical arm 1 touches the PCB board 4, or the sensor 3 touches the component. In some implementations, adjusting the angle between the injection needle 2 and the PCB board 4 also includes: 90°-β.

[0051] S6. Apply glue to the connecting edge on the opposite side of one of the components A5 and B6. After the glue application is completed, adjust the injection needle 2 to face the component B6 at the same angle, calculate the distance that the injection needle 2 moves horizontally to the component B6, and move the injection needle 2 to apply glue to the connecting edge on the opposite side of the component B6.

[0052] To simplify the programming difficulty, in step S6 of this embodiment, the distance that the injection needle 2 moves in the horizontal direction to the component B6 is calculated, including: the movable spacing required for the injection needle 2 to discharge glue, which is set by the user, and the length of the a side minus the movable spacing required for the injection needle 2 to discharge glue to obtain the horizontal distance adjusted by the injection needle 2. Assuming that the movable spacing required for the injection needle 2 to discharge glue is 0.5 cm, the distance that the injection needle 2 moves in the horizontal direction to the component B6 is 0.5 cm.

[0053] It should be noted that, after the injection needle 2 of this embodiment finishes dispensing glue on component A5, the action of moving to component B6 is: control the injection needle 2 to lift to the top of component A5, set the lifting distance to 2 cm, adjust the glue outlet end of the injection needle 2 to remain stationary, face component B6 at the same angle, and then drop 2 cm to dispense glue on the connecting edge of component B6 and PCB board 4.

[0054] This embodiment also provides a device for automatically adjusting the angle, height, and horizontal distance of the injection needle 2 by applying RTV silicone, which is used to implement the above method; it includes: a processor and a robotic arm 1 electrically connected to the processor; it also includes an injection needle 2 and a sensor 3, the movable ends of the robotic arm 1 are respectively provided with the injection needle 2 and the sensor 3, and the needle direction of the injection needle 2 is consistent with the direction of the detection end of the sensor 3; the sensor 3 is electrically connected to the processor.

[0055] The processor controls the robot arm 1, and scans the PCB board 4 by moving the sensor 3 on the robot arm 1, and obtains the relative coordinates of the components A5 and B6, and then moves the sensor 3 to the top of the components A5 and B6 according to the coordinate information, and detects the heights of the components A5 and B6 respectively. According to the coordinate information fed back by the sensor 3, the interval between the components A5 and B6 is calculated, and a right-angled side of the right triangle is obtained. The height of any component A5 or component B6 is used as the other right-angled side of the right triangle, and the angle to be adjusted for the injection needle 2 is obtained according to the tangent function of the triangle. Then, the processor obtains the fixed parameters for automatically adjusting the angle, height and horizontal distance of the injection needle 2, and controls the robot arm 1 to perform the dispensing process according to the fixed parameters, thereby improving the efficiency of on-site engineering personnel in programming and debugging and the quality of product dispensing, ensuring the consistency of product dispensing effects, and reducing the difficulty of operation for engineers.

[0056] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for automatically adjusting the angle and position of an injection needle by applying RTV silica gel, characterized in that: The following steps are involved: S1, obtain the coordinates of adjacent components on the PCB plane through sensors; S2. Calculate the vertical distance between adjacent components and obtain a right-angled side of the right triangle, set as a; S3, using a sensor to measure the distance from the injection needle to the surface of the PCB board as a reference, respectively measure the heights of the adjacent components, and use any height of the adjacent components as the other right-angled side of the right triangle, set as b; S4. Calculate the angle of β according to the tangent function of the triangle: tanβ=b / a; S5, move the injection needle between adjacent components, and adjust the angle between the injection needle and the PCB board to β, with the injection needle facing the side of the component that needs to be dispensed; S6, dispensing glue on the connecting edge on the opposite side of one of the components. After dispensing glue, adjust the injection needle to face the other component at the same angle, calculate the distance that the injection needle moves to the other component in the horizontal direction, and move the injection needle to dispense glue on the connecting edge on the opposite side of the other component; Wherein, in step S2, calculating the vertical distance between adjacent components to obtain one side of the right triangle, which is set as a, includes: taking the coordinates of the center position of the component as a reference; calculating the spacing distance between adjacent components in the X or Y direction, subtracting half the length of one component in the X or Y direction from the spacing distance, and subtracting half the length of another component in the X or Y direction from the spacing distance to obtain the spacing between the opposite sides of the adjacent components; Wherein, obtaining the coordinates of adjacent components on the plane of the PCB board by means of the sensor in step S1 includes taking a corner of the PCB board as the origin, obtaining the distances of a component on the PCB board relative to the origin in the X and Y directions according to the sensor, and respectively obtaining the coordinates of the adjacent components.

2. The method according to claim 1, characterized in that: In step S5, the angle between the injection needle and the PCB board is adjusted further including: 90°-β.

3. The method according to claim 1, characterized in that Measuring the height of adjacent components in step S3 includes: measuring the distance from the injection needle to any component by a sensor, and subtracting the distance from the injection needle to any component from the distance from the injection needle to the PCB board to obtain the height of the corresponding component.

4. The method according to claim 1, characterized in that In step S6, the distance that the injection needle moves in the horizontal direction to another component is calculated, including: the movable spacing required for the injection needle to discharge glue is customized, and the length of side a minus the movable spacing required for the injection needle to discharge glue is used to obtain the horizontal distance adjusted by the injection needle.

5. A device for automatically adjusting the angle and position of an injection needle by applying RTV silica gel, used to implement the method according to any one of claims 1 to 4; characterized in that: include: A processor and a robotic arm electrically connected to the processor; It also includes an injection needle and a sensor. The movable end of the robot arm is respectively provided with the injection needle and the sensor, and the needle direction of the injection needle is consistent with the direction of the detection end of the sensor; the sensor is electrically connected to the processor.

Citation Information

Patent Citations

  • Horizontally rotating glue coating movement platform and coating method thereof

    CN110976207A