A film holder for dry etching machine

Abstract

The invention relates to the technical field of semiconductor industry, and discloses a wafer rack for a dry etching machine, comprising a fixing plate, wherein two fixing plates are provided, and a plurality of receiving grooves are provided on opposite sides of the two fixing plates, and the fixing plates are provided with a plurality of transmission chambers, wherein mounting plates are slidably connected in the transmission chambers, and two positioning rods are fixedly connected to one side of the mounting plate close to the positioning hole, and rubber balls are rotatably connected to the ends of the positioning rods. After a wafer is placed in the wafer rack, the lower inclined surface of the triangular block presses the mounting plate, and the mounting plate can be driven to move toward the receiving groove, so that the positioning rod extends out of the positioning hole, and the rubber balls are used to fit with the surface of the wafer to complete the clamping and fixing of the wafer. The rubber balls can reduce the friction between the rubber balls and the wafers by their rotatable and relatively soft surface, and avoid the problem that scratches are easily generated on the surface of the wafers due to friction between the wafers and the wafer rack.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor industry, in particular to a sheet rack for a dry etching machine. Background Art

[0002] Etcher, also known as etcher, is a key equipment widely used in microelectronics manufacturing and semiconductor industry. Its main function is to perform etching processing on the surface of thin film materials. This process removes part of the material surface by chemical or physical methods to form the desired pattern or structure. Etching can be divided into dry etching and wet etching according to the working principle. Dry etching refers to the method of removing substances by plasma-activated chemical reactions or high-energy ion beam bombardment, which is more common in the semiconductor field.

[0003] In the process of dry etching of semiconductor wafers, it is generally necessary to place the wafers on a wafer rack, use the wafer rack to place multiple wafers, and then perform etching. The wafer rack of the etcher is an important component of the etcher, which is used to support and fix the wafers to be etched (such as single crystal silicon wafers) to ensure the accuracy and stability of the etching process;

[0004] However, during the use of the wafer rack, since the upper and lower sides of the wafer are in contact with the wafer rack, friction will occur between the wafer and the wafer rack when the wafer is taken and placed, which can easily cause scratches on the surface of the wafer and affect the product quality of the wafer. For this reason, we propose a wafer rack for a dry etching machine. Summary of the invention

[0005] The object of the present invention is to provide a wafer rack for a dry etching machine to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a sheet rack for a dry etching machine, comprising a fixing plate, wherein two fixing plates are provided, and a plurality of receiving grooves are provided on opposite sides of the two fixing plates, characterized in that: the fixing plate is provided with a plurality of transmission cavities, and the transmission cavities are distributed on the upper and lower sides of each receiving groove, the inner top wall and the inner bottom wall of the receiving groove are provided with two positioning holes connected with adjacent transmission cavities, the transmission cavities are slidably connected with a mounting plate, the side of the mounting plate close to the positioning hole is fixedly connected with two positioning rods, and the positioning rods are located in the positioning holes on the same side, the ends of the positioning rods are embedded with rotatably connected rubber balls, a plurality of mounting springs are fixedly connected between the side of the mounting plate away from the positioning rod and the inner wall of the transmission cavity, and a mounting box is fixedly connected with one side of the fixing plate;

[0007] A connecting rod is slidably connected in the transmission cavity, and a triangular block is fixedly connected to one end of the connecting rod close to the mounting plate, and the lower inclined surface of the triangular block contacts one side of the mounting plate.

[0008] Preferably, both sides of the installation box are communicated with the transmission cavity in the fixed plate, and a plurality of installation rods are rotatably connected in the installation box, and both ends of the installation rods are fixedly connected with gears.

[0009] Preferably, one end of the connecting rod away from the triangular block is located in the installation box, and one end of the connecting rod located in the installation box is fixedly connected to a rack B meshing with an adjacent gear.

[0010] Preferably, the installation box is slidably connected to a side close to the fixed plate with a plurality of transmission seats, and the transmission seats are respectively aligned with the storage slots on the fixed plate, the transmission seat is fixedly connected to a side close to the inside of the installation box with a limit plate, and the limit plate is slidably connected to the inner wall of the installation box, the upper and lower sides at both ends of the limit plate are fixedly connected with racks A that mesh with the adjacent gears on the same side, and a plurality of limit springs are fixedly connected between the limit plate and the inner wall of the installation box.

[0011] Preferably, the top and bottom of the transmission seat on the side away from the installation box are fixedly connected to mounting frames, and rotating rods are rotatably connected between the mounting frames, and transmission belts are provided between the rotating rods.

[0012] Preferably, the mounting frame is provided with a limiting hole, both ends of the rotating rod are fixedly connected with a shaft rod, and the shaft rod is located in the limiting hole on the same side, and a clockwork spring is fixedly connected between the shaft rod and the inner wall of the limiting hole.

[0013] Preferably, wafers are placed in the storage grooves between the two fixed plates, and both sides of the wafers are located between the positioning holes of the top wall and the bottom wall of the storage groove, and the side of the wafer close to the installation box is in contact with the transmission belt.

[0014] Preferably, a mounting groove is provided on the fixing plate on either side of the mounting box, and the mounting groove is located on the side of the top of the fixing plate away from the mounting box, a limiting groove is provided on the inner wall of the mounting groove, and a plurality of reinforcement rods are fixedly connected between the bottoms of the fixing plates.

[0015] Preferably, a limit rod is rotatably connected in the installation groove, a side wall of the limit rod at one end in the installation groove is provided with a fixed groove, a limit block is slidably connected in the fixed groove, and a fixed spring is fixedly connected between the limit block and the inner wall of the fixed groove.

[0016] Preferably, a top plate is fixedly connected between the tops of the fixed plates, a placement groove is provided on the top of the top plate, a handle is rotatably connected in the placement groove, and a filter screen is fixedly connected to the top plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present invention uses a wider storage groove, so that when placing the wafer, the wafer will not fit with the inner wall of the storage groove. After the wafer is placed in the wafer rack, the wafer is placed against the transmission seat. At this time, the transmission seat drives the rack A to move through the limit plate, and the rack A drives the gear to rotate. At this time, the rack B drives the connecting rod to move toward the mounting plate. At this time, the lower inclined surface of the triangular block squeezes the mounting plate, which can drive the mounting plate to move toward the storage groove, so that the positioning rod extends from the positioning hole, and the rubber ball is used to fit with the surface of the wafer to complete the wafer alignment. The wafer is clamped and fixed, and when taking the wafer, the rubber ball can reduce the friction between the wafer and its rotatable and relatively soft surface. When the wafer rack moves a certain distance, the extrusion of the transmission seat disappears, and the limit spring begins to rebound. At this time, the gear and rack B cooperate to drive the connecting rod to move toward the original position. At this time, the mounting spring rebounds, driving the mounting plate to move, and the positioning rod begins to shrink, so that the rubber ball can be separated from the wafer, avoiding the problem of scratches on the wafer surface due to friction between the wafer and the rack.

[0019] 2. When the wafer is placed in the storage slot, the wafer is against the transmission belt and pushes the transmission seat to move. When the wafer deviates, the wafer will drive the transmission belt to move together. At this time, the rotating rod will drive the spring to tighten through the shaft rod. When the wafer stops moving, the spring begins to shrink and drives the transmission belt to move to its original position through the rotating rod. At this time, the transmission belt can drive the wafer back to a horizontal state, which effectively improves the auxiliary function of the device in the process of placing the wafer.

[0020] 3. The present invention utilizes positioning rods to clamp and support both sides of the wafer, thereby reducing the contact area between the two sides of the wafer and the wafer frame. At the same time, a wider storage groove is utilized to enlarge the gap between the wafers. At this time, when etching the wafer, the plasma can bombard the wafer surface more stably and evenly to complete the etching work, thereby improving the working efficiency of the device for etching the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the structure of the fixing plate and the installation box of the present invention;

[0023] Figure 3 It is a schematic diagram of the cross-sectional structure of the fixing plate of the present invention;

[0024] Figure 4 It is a schematic diagram of the cross-sectional structure of the limiting rod of the present invention;

[0025] Figure 5 It is a schematic diagram of the cross-sectional structure of the installation box of the present invention;

[0026] Figure 6 It is a schematic diagram of the connection structure between the gear and the rack A of the present invention;

[0027] Figure 7 It is a schematic diagram of the transmission seat structure of the present invention;

[0028] Figure 8 It is a structural schematic diagram of the mounting plate and the connecting rod of the present invention;

[0029] Fig. 9 This is a schematic diagram of the mounting plate structure of the present invention;

[0030] Fig.10 for Figure 3 The enlarged structural diagram of area A is shown;

[0031] Fig.11 for Figure 6 The enlarged structural diagram of area B is shown;

[0032] Fig.12 for Figure 7 Schematic diagram of the enlarged structure of region C shown.

[0033] In the figure: 1. fixing plate; 11. storage slot; 12. transmission chamber; 13. positioning hole; 14. mounting slot; 15. limiting slot; 16. reinforcement rod; 2. wafer; 3. limiting rod; 31. fixing slot; 32. limiting block; 33. fixing spring; 4. mounting plate; 41. positioning rod; 42. rubber ball; 43. mounting spring; 5. mounting box; 51. mounting rod; 52. gear; 6. transmission seat; 61. limiting plate; 62. rack A; 63. limiting spring; 7. mounting frame; 71. limiting hole; 72. rotating rod; 73. transmission belt; 74. shaft rod; 75. spring; 8. connecting rod; 81. rack B; 82. triangular block; 9. top plate; 91. placement slot; 92. handle; 93. filter. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] See also Figure 1-Figure 12The present invention provides a technical solution: a wafer rack for a dry etching machine, comprising a fixed plate 1, wherein two fixed plates 1 are provided, and a plurality of receiving grooves 11 are provided on opposite sides of the two fixed plates 1, characterized in that: the fixed plate 1 is provided with a plurality of transmission cavities 12, and the transmission cavities 12 are distributed on the upper and lower sides of each receiving groove 11, and the inner top wall and the inner bottom wall of the receiving groove 11 are provided with two positioning holes 13 connected with adjacent transmission cavities 12, and a mounting groove 14 is provided on the fixed plate 1 on either side of the mounting box 5, and the mounting groove 14 is located on the top side of the fixed plate 1 away from the mounting box 5, and a limiting groove 15 is provided on the inner wall of the mounting groove 14, and a plurality of reinforcing rods 16 are fixedly connected between the bottoms of the fixed plates 1, and wafers 2 are placed in the receiving grooves 11 between the two fixed plates 1, and both sides of the wafer 2 are located between the positioning holes 13 on the inner top wall and the inner bottom wall of the receiving groove 11, and the side of the wafer 2 close to the mounting box 5 contacts the transmission belt 73.

[0036] Furthermore, two fixing plates 1 are provided, and the wafer 2 can be placed by cooperating with the storage grooves 11 on the two fixing plates 1. The stability between the two fixing plates 1 can be improved by the reinforcement rod 16. When placing the wafer 2, ensure that the two sides of the wafer 2 are located between the positioning holes 13.

[0037] Combined with Figure 1 , Figure 2 and Figure 4 As shown, a limiting rod 3 is rotatably connected in the installation groove 14, and a fixing groove 31 is provided on the side wall of one end of the limiting rod 3 located in the installation groove 14. A limiting block 32 is slidably connected in the fixing groove 31, and a fixing spring 33 is fixedly connected between the limiting block 32 and the inner wall of the fixing groove 31.

[0038] Furthermore, after the wafer 2 is placed between the fixing plates 1, the limiting rod 3 is rotated. At this time, the inner wall of the mounting groove 14 limits the limiting block 32, so that it squeezes the fixing spring 33 and shrinks in the fixing groove 31. When the limiting rod 3 is rotated to fit the side of the wafer 2, the limiting block 32 moves to the limiting groove 15 in the mounting groove 14. At this time, the limiting force of the inner wall of the mounting groove 14 on the limiting block 32 disappears. At this time, the fixing spring 33 starts to rebound, driving the limiting block 32 to extend out of the fixing groove 31, so that the limiting block 32 is stuck in the limiting groove 15, and the limiting of the limiting rod 3 is completed. The limiting rod 3 can be used to continuously fix and limit the wafer 2.

[0039] Combined with Figure 8 and Fig. 9As shown, a mounting plate 4 is slidably connected in the transmission cavity 12, two positioning rods 41 are fixedly connected to the side of the mounting plate 4 close to the positioning hole 13, and the positioning rods 41 are all located in the positioning holes 13 on the same side, and the ends of the positioning rods 41 are all embedded with rotatably connected rubber balls 42, and a plurality of mounting springs 43 are fixedly connected between the side of the mounting plate 4 away from the positioning rods 41 and the inner wall of the transmission cavity 12.

[0040] Further, when the triangular block 82 moves toward the mounting plate 4, since the lower inclined surface of the triangular block 82 is in contact with the side surface of the mounting plate 4, the lower inclined surface of the triangular block 82 can press the mounting plate 4 downward during the movement. At this time, the mounting plate 4 drives the positioning rod 41 to move toward the positioning hole 13, so that the positioning rod 41 enters the storage groove 11 through the positioning hole 13, and the rubber ball 42 is in contact with the surface of the wafer 2 to complete the support and limitation of the wafer 2. In the process of moving the mounting plate 4, the mounting spring 43 can be stretched. Since the rubber ball 42 is made of rubber, this When the wafer 2 is taken, the wafer 2 can rub against the rubber ball 42, causing the rubber ball 42 to rotate, and the softness of the rubber can reduce the friction between the rubber ball 42 and the wafer 2, thereby improving the protection of the wafer 2. When the triangular block 82 is away from the mounting plate 4, the mounting plate 4 is squeezed by the triangular block 82 and disappears. At this time, the mounting spring 43 starts to rebound, driving the mounting plate 4 to move, and the mounting plate 4 drives the positioning rod 41 to retract into the transmission cavity 12. At this time, the rubber ball 42 can be separated from the wafer 2, and the wafer 2 can be taken out of the storage slot 11 intact.

[0041] It is worth noting that a rotating shaft is provided in the groove at the end of the positioning rod 41 for engaging the rubber ball 42, and the rotating shaft passes through the rubber ball 42, so that the rubber ball 42 can only rotate in the direction of the receiving groove 11, while reducing the contact surface and friction between the wafer 2 and the wafer 2, so that the wafer 2 can only move along the rotation direction of the rubber ball 42, thereby improving the stability of the wafer 2 during movement.

[0042] Combined with Figure 1 , Figure 2 , Figure 5 , Figure 6 and Fig.11 As shown, a mounting box 5 is fixedly connected to one side of the fixing plate 1, and both sides of the mounting box 5 are connected to the transmission chamber 12 in the fixing plate 1. A plurality of mounting rods 51 are rotatably connected in the mounting box 5, and both ends of the mounting rods 51 are fixedly connected to gears 52;

[0043] The installation box 5 is slidably connected to a side close to the fixed plate 1 with a plurality of transmission seats 6, and the transmission seats 6 are respectively aligned with the storage grooves 11 on the fixed plate 1; the transmission seat 6 is fixedly connected to a side close to the inside of the installation box 5 with a limiting plate 61, and the limiting plate 61 is slidably connected to the inner wall of the installation box 5; the upper and lower sides of both ends of the limiting plate 61 are fixedly connected to racks A62 that mesh with the adjacent gears 52 on the same side; and a plurality of limiting springs 63 are fixedly connected between the limiting plate 61 and the inner wall of the installation box 5.

[0044] Further, the mounting box 5 can cooperate with the fixing plate 1 to limit one side of the wafer 2, and the four sides of the wafer 2 can be limited and fixed by the cooperation of the transmission seat 6, the positioning rod 41 and the limiting rod 3, and the gear 52 can cooperate with the rack A62 and the rack B81 to complete the transmission work of the connecting rod 8;

[0045] Furthermore, when the wafer 2 is limited by the limiting rod 3, the side of the wafer 2 can apply pressure to the transmission seat 6. At this time, the transmission seat 6 moves toward the installation box 5, and the limiting plate 61 is used to drive the rack A62 to move, and the limiting spring 63 is squeezed and contracted. At this time, the moving rack A62 is meshed with the gear 52, so it can drive the gear 52 to rotate, so that the gear 52 cooperates with the rack B81 to drive the connecting rod 8 to move to complete the transmission work. When the wafer 2 is taken out of the storage groove 11, the pressure applied by the wafer 2 to the transmission seat 6 disappears. At this time, the limiting spring 63 begins to rebound, driving the transmission seat 6 to move out of the installation box 5. At this time, the transmission seat 6 drives the rack A62 to move back through the limiting plate 61, and at this time, the rack A62 can drive the gear 52 to rotate in the opposite direction, and the gear 52 can drive the connecting rod 8 to move in the opposite direction.

[0046] Combined with Figure 6 , Figure 7 and Fig.12 As shown, the top and bottom of the transmission seat 6 away from the mounting box 5 are fixedly connected to the mounting frame 7, and the mounting frames 7 are rotatably connected with a rotating rod 72, a transmission belt 73 is provided between the rotating rods 72, and the mounting frames 7 are provided with limiting holes 71, and both ends of the rotating rod 72 are fixedly connected with an axle rod 74, and the axle rod 74 is located in the limiting hole 71 on the same side, and a spring 75 is fixedly connected between the axle rod 74 and the inner wall of the limiting hole 71.

[0047] Furthermore, when the wafer 2 applies pressure to the transmission seat 6, the wafer 2 will be released from the relatively soft transmission belt 73, thereby protecting the side of the wafer 2. At the same time, when the wafer 2 applies pressure to the transmission seat 6, if it deviates, the wafer 2 will drive the transmission belt 73 to move together. At this time, the transmission belt 73 drives the rotating rod 72 to rotate, and the rotating rod 72 tightens the spring 75 through the shaft 74. At this time, the spring 75 can rebound and drive the rotating rod 72 to rotate through the shaft 74, thereby driving the transmission seat 6. The moving belt 73 returns to its original position, and the transmission belt 73 is used to adjust the wafer 2 so that the wafer 2 is always in a horizontal state, to avoid the problem that when the wafer 2 is placed, the wafer 2 is tilted due to the larger space in the storage groove 11, resulting in uneven pressure on the wafer 2 when the positioning rod 41 is extended and the rubber ball 42 contacts the wafer 2. Since the rubber ball 42 on each positioning rod 41 contacts the wafer 2 at different time points, the wafer 2 is easily damaged.

[0048] Combined with Figure 8 As shown, a connecting rod 8 is slidably connected in the transmission cavity 12, and the end of the connecting rod 8 close to the mounting plate 4 is fixedly connected to a triangular block 82, and the lower inclined surface of the triangular block 82 contacts one side of the mounting plate 4, and the end of the connecting rod 8 away from the triangular block 82 is located in the mounting box 5, and the end of the connecting rod 8 located in the mounting box 5 is fixedly connected to a rack B81 that meshes with the adjacent gear 52.

[0049] Furthermore, when the transmission seat 6 enters the mounting box 5, the rack A62 can drive the gear 52 to rotate. At this time, the gear 52 can cooperate with the rack B81 to drive the connecting rod 8 to move toward the mounting plate 4. During the movement, the triangular block 82 can continuously squeeze the mounting plate 4 to extend the positioning rod 41 to clamp and fix the wafer 2. When the transmission seat 6 moves out of the mounting box 5, the rack A62 can drive the gear 52 to rotate in the opposite direction. At this time, the gear 52 cooperates with the rack B81 to drive the connecting rod 8 away from the mounting plate 4. At this time, the triangular block 82 is separated from the mounting plate 4, so that the mounting spring 43 can rebound, drive the mounting plate 4 back to its original position, and retract the positioning rod 41 into the transmission cavity 12, thereby canceling the clamping and fixing of the wafer 2.

[0050] Combined with Figure 1 As shown, a top plate 9 is fixedly connected between the tops of the fixed plates 1 , a placement groove 91 is provided on the top of the top plate 9 , and a handle 92 is rotatably connected in the placement groove 91 , and a filter screen 93 is fixedly connected to the top plate 9 .

[0051] Furthermore, the top plate 9 can cooperate with the reinforcement rod 16 to improve the stability between the two fixed plates 1, and the handle 92 can be taken out from the placement groove 91 to lift the handle 92. At this time, the handle 92 can be held to move the film rack. After moving, the handle 92 is retracted back into the placement groove 91 to reduce the space occupied by the film rack. The area covered by the top plate 9 can be reduced through the filter net 93, so that the wafer 2 can contact with the plasma better and faster and complete the etching work.

[0052] Working principle: first, lift the handle 92 to place the sheet rack at the designated position, and then retract the handle 92 back into the placement slot 91;

[0053] After that, the wafer 2 can be placed, and the wafer 2 is placed in the storage groove 11 between the fixed plates 1 through the automatic guide system. When all the storage grooves 11 are filled with wafers 2, the limit rod 3 is rotated. At this time, the inner wall of the installation groove 14 limits the limit block 32, so that it squeezes the fixing spring 33 and shrinks in the fixing groove 31. When the limit rod 3 is rotated to make it fit with the side of the wafer 2, the limit block 32 moves to the limit groove 15 in the installation groove 14, and at this time, the inner wall of the installation groove 14 limits the limit block When the limiting force of 32 disappears, the fixing spring 33 starts to rebound, driving the limiting block 32 to extend out of the fixing groove 31, so that the limiting block 32 is stuck in the limiting groove 15, and the limiting rod 3 can be limited. The limiting rod 3 can be used to continuously fix and limit the wafer 2, so that the wafer 2 can be placed more stably in the rack. At the same time, the wafer 2 is always in contact with the transmission belt 73, so that the positioning rod 41 is always in an extended state, and the positioning rod 41 and the rubber ball 42 are used to limit and fix the wafer 2 in the up and down directions;

[0054] At this time, since the limiting rod 3 can push the wafer 2 to move a short distance, and the side of the wafer 2 exerts pressure on the transmission seat 6, the transmission seat 6 moves toward the mounting box 5, and uses the limiting plate 61 to drive the rack A62 to move, and at the same time squeezes and contracts the limiting spring 63. At this time, the moving rack A62 is meshed with the gear 52, so it can drive the gear 52 to rotate. At this time, the gear 52 can cooperate with the rack B81 to drive the connecting rod 8 to move toward the mounting plate 4. During the movement of the triangular block 82, since the lower inclined surface of the triangular block 82 is in contact with the side of the mounting plate 4, the lower inclined surface of the triangular block 82 can squeeze the mounting plate 4 downward during the movement. At this time, the mounting plate 4 drives the positioning rod 41 to move toward the positioning hole 13, so that the positioning rod 41 passes through the positioning hole 13 and enters the storage groove 11, and uses the rubber ball 42 to fit the surface of the wafer 2 to complete the support and limitation of the wafer 2;

[0055] During this process, when the wafer 2 applies pressure to the transmission seat 6, the wafer 2 will be released from the relatively soft transmission belt 73, thereby protecting the side of the wafer 2. At the same time, when the wafer 2 applies pressure to the transmission seat 6, if it deviates, the wafer 2 will drive the transmission belt 73 to move together. At this time, the transmission belt 73 drives the rotating rod 72 to rotate, and the rotating rod 72 tightens the spring 75 through the shaft rod 74. At this time, the spring 75 can rebound and drive the rotating rod 72 to rotate through the shaft rod 74, thereby driving the transmission belt 73 back to its original position. The transmission belt 73 is used to adjust the wafer 2 so that the wafer 2 is always in a horizontal state.

[0056] After that, the etching work can be carried out. When the etching work is completed, the limit rod 3 is rotated in the opposite direction to separate the limit rod 3 from the wafer 2. Then, the wafer 2 is taken out of the storage groove 11 by using the guide system. At this time, since the rubber ball 42 is made of rubber, when the wafer 2 is taken out, the wafer 2 can rub against the rubber ball 42, so that the rubber ball 42 rotates, and the soft property of rubber is combined to reduce the friction between the rubber ball 42 and the wafer 2, thereby reducing the damage problem caused by friction when the wafer 2 is taken out;

[0057] At the same time, since the wafer 2 is separated from the transmission seat 6 at this time, the pressure exerted by the wafer 2 on the transmission seat 6 disappears. At this time, the limit spring 63 begins to rebound, driving the transmission seat 6 to move toward the outside of the mounting box 5. At this time, the transmission seat 6 drives the rack A62 to move back through the limit plate 61, and at this time, the rack A62 can drive the gear 52 to rotate in the opposite direction. At this time, the gear 52 cooperates with the rack B81 to drive the connecting rod 8 away from the mounting plate 4. At this time, the triangular block 82 is separated from the mounting plate 4, which can make the mounting spring 43 rebound and drive the mounting plate 4 back to its original position, so that the positioning rod 41 is retracted into the transmission cavity 12, and the clamping and fixing work of the wafer 2 is cancelled. The wafer 2 can be smoothly taken out from between the fixing plates 1, and then the next batch of wafers 2 can be clamped and fixed.

[0058] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0059] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer rack for a dry etching machine, comprising a fixing plate (1), wherein two fixing plates (1) are provided, and a plurality of receiving grooves (11) are provided on opposite sides of the two fixing plates (1), characterized in that: The fixing plate (1) is provided with a plurality of transmission cavities (12), and the transmission cavities (12) are distributed on the upper and lower sides of each receiving groove (11); the inner top wall and the inner bottom wall of the receiving groove (11) are provided with two positioning holes (13) communicating with adjacent transmission cavities (12); the transmission cavities (12) are slidably connected with a mounting plate (4); a side of the mounting plate (4) close to the positioning holes (13) is fixedly connected with two positioning rods (41), and the positioning rods (41) are located in the positioning holes (13) on the same side; the ends of the positioning rods (41) are embedded with rotatably connected rubber balls (42); a side of the mounting plate (4) away from the positioning rods (41) is fixedly connected with a plurality of mounting springs (43) between the inner wall of the transmission cavity (12); and a mounting box (5) is fixedly connected with one side of the fixing plate (1); A connecting rod (8) is slidably connected in the transmission cavity (12); one end of the connecting rod (8) close to the mounting plate (4) is fixedly connected to a triangular block (82), and a lower inclined surface of the triangular block (82) contacts one side of the mounting plate (4).

2. The wafer rack for a dry etching machine according to claim 1, characterized in that: Both sides of the installation box (5) are in communication with the transmission chamber (12) in the fixed plate (1), a plurality of installation rods (51) are rotatably connected in the installation box (5), and both ends of the installation rods (51) are fixedly connected with gears (52).

3. The wafer rack for a dry etching machine according to claim 2, characterized in that: One end of the connecting rod (8) away from the triangular block (82) is located in the installation box (5), and one end of the connecting rod (8) located in the installation box (5) is fixedly connected to a rack B (81) that meshes with an adjacent gear (52).

4. The wafer rack for a dry etching machine according to claim 2, characterized in that: A plurality of transmission seats (6) are slidably connected to one side of the installation box (5) close to the fixed plate (1), and the transmission seats (6) are respectively aligned with the storage slots (11) on the fixed plate (1); a side of the transmission seat (6) close to the inside of the installation box (5) is fixedly connected to a limit plate (61), and the limit plate (61) is slidably connected to the inner wall of the installation box (5); the upper and lower sides of both ends of the limit plate (61) are fixedly connected to racks A (62) that mesh with the gears (52) adjacent to the same side; and a plurality of limit springs (63) are fixedly connected between the limit plate (61) and the inner wall of the installation box (5).

5. The wafer rack for a dry etching machine according to claim 4, characterized in that: The top and bottom of the transmission seat (6) on the side away from the installation box (5) are fixedly connected to the installation frame (7), and the installation frame (7) is rotatably connected with a rotating rod (72), and a transmission belt (73) is arranged between the rotating rods (72).

6. The wafer rack for a dry etching machine according to claim 5, characterized in that: The mounting frame (7) is provided with a limiting hole (71), both ends of the rotating rod (72) are fixedly connected to a shaft rod (74), and the shaft rod (74) is located in the limiting hole (71) on the same side, and a clockwork spring (75) is fixedly connected between the shaft rod (74) and the inner wall of the limiting hole (71).

7. The wafer rack for a dry etching machine according to claim 5, characterized in that: Wafers (2) are placed in the storage grooves (11) between the two fixing plates (1), and both sides of the wafers (2) are located between the positioning holes (13) on the top wall and the bottom wall of the storage grooves (11), and the side of the wafers (2) close to the installation box (5) is in contact with the transmission belt (73).

8. The wafer rack for a dry etching machine according to claim 1, characterized in that: A mounting groove (14) is provided on the fixing plate (1) on either side of the fixing box (5), and the mounting groove (14) is located on a side of the top of the fixing plate (1) away from the fixing box (5), and a limiting groove (15) is provided on the inner wall of the fixing groove (14), and a plurality of reinforcing rods (16) are fixedly connected between the bottoms of the fixing plates (1).

9. The wafer rack for a dry etching machine according to claim 8, characterized in that: A limit rod (3) is rotatably connected in the installation groove (14); a side wall of the limit rod (3) located at one end in the installation groove (14) is provided with a fixing groove (31); a limit block (32) is slidably connected in the fixing groove (31); a fixing spring (33) is fixedly connected between the limit block (32) and the inner wall of the fixing groove (31).

10. The wafer rack for a dry etching machine according to claim 1, characterized in that: A top plate (9) is fixedly connected between the tops of the fixed plates (1), a placement groove (91) is provided on the top of the top plate (9), a handle (92) is rotatably connected in the placement groove (91), and a filter screen (93) is fixedly connected to the top plate (9).

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