Copper foil surface cleaning device and method

Abstract

The present invention relates to the technical field of copper foil cleaning, and in particular to a copper foil surface cleaning device and method, comprising: in the process of cleaning the copper foil by an immersion cleaning device, obtaining the number of bubbles on the copper foil surface, the stirring speed and the ultrasonic wave intensity at each moment in the current preset period; determining the real index of the cleaning state of the current preset period according to the number of bubbles on the copper foil surface and the stirring speed at each moment in the current preset period; determining the intensity compensation coefficient of the ultrasonic wave device at the current moment according to the real index of the cleaning state and the ultrasonic wave intensity of the ultrasonic wave device at each moment; determining the equipment parameters of the immersion cleaning device at the next moment according to the intensity compensation coefficient. The present invention avoids the problem of low cleaning effect caused by improper adjustment of cleaning equipment parameters by determining the intensity compensation coefficient.

Description

Technical Field

[0001] The invention relates to the technical field of copper foil cleaning, and in particular to a copper foil surface cleaning device and method. Background Art

[0002] As an important raw material in the electronics manufacturing industry, copper foil is widely used in the manufacture of printed circuit boards, batteries, conductors and other electronic devices. The surface quality of copper foil will directly affect the performance and reliability of the final product. During the production process, copper foil will be exposed to various chemicals and environmental factors, which may cause the accumulation of impurities such as oil, oxides, particles, etc. on its surface. These impurities not only affect the electrical conductivity and mechanical properties of copper foil, but also may affect subsequent processing such as electroplating, coating and welding. Therefore, keeping the surface of copper foil clean is crucial to ensure the quality of electronic products.

[0003] During the cleaning process of a traditional cleaning device, such as an immersion cleaning device, there may be some blind spots in the copper foil. In order to improve the cleaning effect of the copper foil, an ultrasonic device is added to the immersion cleaning device, and the blind spots that cannot be immersed can be cleaned by the ultrasonic device. However, in the cleaning device after the ultrasonic device is added, there is a mutually influencing working relationship between the stirring device and the ultrasonic device. Excessive ultrasonic intensity may conflict with the flow generated by the stirring device, and the dirt on the surface of the copper foil cannot be cleaned well, resulting in poor cleaning effect. In addition, when the liquid in the solution tank reacts with the substance on the surface of the copper foil, the quality of the liquid in the solution tank is prone to change, and there may be certain residual contaminants in the solution tank. The contaminants may have a certain impact on the newly treated copper foil, and the cleaning solution needs to be replaced in time, but frequent replacement of the cleaning solution and handling of the cleaning container will increase the complexity of the work to a certain extent and cause a certain amount of solution waste. Summary of the invention

[0004] In order to solve the technical problem that the above-mentioned existing cleaning device has a low cleaning effect, the purpose of the present invention is to provide a copper foil surface cleaning device and method, and the technical scheme adopted is as follows:

[0005] An embodiment of the present invention provides a method for cleaning a copper foil surface, the method comprising the following steps:

[0006] In the process of cleaning the copper foil by the immersion cleaning device, the number of bubbles on the surface of the copper foil at each moment in the current preset time period, the stirring speed of the stirring device at each moment, and the ultrasonic intensity of the ultrasonic device at each moment are obtained;

[0007] According to the number of bubbles on the copper foil surface at each moment in the current preset period and the stirring speed of the stirring device at each moment, the real index of the cleaning state of the current preset period is determined;

[0008] Determine the intensity compensation coefficient of the ultrasonic device at the current moment according to the real index of the cleaning state and the ultrasonic intensity of the ultrasonic device at each moment;

[0009] The equipment parameters of the immersion cleaning device at the next moment are determined according to the intensity compensation coefficient, and the equipment parameters are the ultrasonic intensity of the ultrasonic device or the proportional gain value of the PID controller of the stirring device.

[0010] Furthermore, the real indicator of the cleaning state of the current preset period is determined according to the number of bubbles on the copper foil surface at each moment in the current preset period and the stirring speed of the stirring device at each moment, including:

[0011] According to the number of bubbles on the copper foil surface at each moment in the current preset period, a fluctuation factor of the number of bubbles on the copper foil surface in the current preset period is determined;

[0012] Determine the stirring speed fluctuation factor of the current preset period according to the stirring speed of the stirring device at each moment in the current preset period;

[0013] Determine a bubble number fitting curve and a stirring speed fitting curve for a current preset time period, and then calculate a mean square error between the bubble number fitting curve and the stirring speed fitting curve;

[0014] The true index of the cleaning state in the current preset time period is determined by combining the bubble quantity fluctuation factor on the copper foil surface, the stirring speed fluctuation factor and the mean square error.

[0015] Furthermore, the method of determining the fluctuation factor of the number of bubbles on the copper foil surface in the current preset period according to the number of bubbles on the copper foil surface at each moment in the current preset period includes:

[0016] The number of bubbles on the copper foil surface at any two moments in the current preset time period is used to form a control group to obtain each control group;

[0017] Calculate the difference between the number of bubbles on the copper foil surface at two moments in each control group to obtain the number difference value of each control group;

[0018] The average value of the quantity difference values ​​of all control groups is normalized, and the normalized result value is used as the bubble quantity fluctuation factor on the copper foil surface in the current preset time period.

[0019] Furthermore, the determining of the stirring speed fluctuation factor of the current preset period according to the stirring speed of the stirring device at each moment in the current preset period includes:

[0020] According to the stirring speed of the stirring device at each moment in the current preset time period, the variance of the stirring speed is calculated, and the normalized result of the variance is used as the stirring speed fluctuation factor of the current preset time period.

[0021] Furthermore, the true index of the cleaning state in the current preset time period is determined by combining the bubble quantity fluctuation factor on the copper foil surface, the stirring speed fluctuation factor and the mean square error, including:

[0022] First, the product of the bubble quantity fluctuation factor on the copper foil surface and the stirring speed fluctuation factor is calculated as a first product; then, a negative correlation process is performed on the first product to obtain a first negative correlation value of the first product;

[0023] Next, the product of the first negative correlation value of the first product and the mean square error is calculated as the second product; finally, the second product is normalized to obtain a true indicator of the cleaning state in the current preset time period.

[0024] Further, the intensity compensation coefficient of the ultrasonic device at the current moment is determined according to the real index of the cleaning state and the ultrasonic intensity of the ultrasonic device at each moment, including:

[0025] According to the ultrasonic intensity of the ultrasonic device at each moment, the average value of the ultrasonic intensity of the ultrasonic device at all moments is calculated;

[0026] The intensity compensation coefficient of the ultrasonic device at the current moment is determined by combining the average value of the ultrasonic intensity and the real indicator of the cleaning state.

[0027] Furthermore, the combination of the average value of the ultrasonic intensity and the real indicator of the cleaning state to determine the intensity compensation coefficient of the ultrasonic device at the current moment includes:

[0028] Performing negative correlation processing on the average value of the ultrasonic intensity to obtain a second negative correlation value; calculating the product of the second negative correlation value and the real index of the cleaning state as a third product;

[0029] The third product is normalized to obtain the intensity compensation coefficient of the ultrasonic device at the current moment.

[0030] Further, the determining of the equipment parameters of the immersion cleaning device at the next moment according to the intensity compensation coefficient includes:

[0031] When the intensity compensation coefficient is greater than a preset coefficient threshold, the product of the intensity compensation coefficient and the ultrasonic intensity of the ultrasonic device at the current moment is used as the intensity of the ultrasonic device at the next moment;

[0032] When the intensity compensation coefficient is not greater than the preset coefficient threshold, the product of the intensity compensation coefficient and the proportional gain value of the PID controller at the current moment is used as the gain adjustment value, and then the value obtained by adding the gain adjustment value to the proportional gain value of the PID controller at the current moment is used as the proportional gain value at the next moment.

[0033] An embodiment of the present invention further provides a copper foil surface cleaning device, which is used to implement a copper foil surface cleaning method. The copper foil surface cleaning device includes an immersion cleaning device, which includes a stirring device, which is used to increase the fluidity of the cleaning solution and is vertically installed in the solution tank; the copper foil surface cleaning device also includes a data collector, a data processor and a cleaning execution mechanism, wherein the data collector signal is connected to the data processor, and the data processor signal is connected to the cleaning execution mechanism;

[0034] The data collector is used to obtain the number of bubbles on the surface of the copper foil at each moment in the current preset time period, the stirring speed of the stirring device at each moment, and the ultrasonic intensity of the ultrasonic device at each moment during the process of cleaning the copper foil by the immersion cleaning device;

[0035] The data processor is used to determine the real index of the cleaning state of the current preset period according to the number of bubbles on the copper foil surface at each moment in the current preset period and the stirring speed of the stirring device at each moment;

[0036] Determine the intensity compensation coefficient of the ultrasonic device at the current moment according to the real index of the cleaning state and the ultrasonic intensity of the ultrasonic device at each moment;

[0037] Determine the equipment parameter of the immersion cleaning device at the next moment according to the intensity compensation coefficient, wherein the equipment parameter is the ultrasonic intensity of the ultrasonic device or the proportional gain value of the PID controller;

[0038] The cleaning actuator adjusts the operating state of the corresponding equipment in the immersion cleaning device according to the equipment parameters at the next moment, and the corresponding equipment is an ultrasonic device or a driving motor for controlling a stirring device.

[0039] Furthermore, the copper foil surface cleaning device also includes a solution impurity cleaning mechanism, which includes a filter moving assembly and a filter. The filter moving assembly is used to vertically move the filter up and down. The filter is used to filter out sediment and residue in the process of cleaning the copper foil by the immersion cleaning device. The filter is located inside the immersion cleaning device.

[0040] The present invention has the following beneficial effects:

[0041] In view of the problems of low cleaning efficiency, improper setting of cleaning equipment parameters and frequent replacement of cleaning solutions in existing cleaning devices, the present invention provides a copper foil surface cleaning device and method, which avoids the problems of low cleaning effect and cleaning efficiency caused by improper adjustment of cleaning equipment parameters by making certain improvements to the existing immersion cleaning device; specifically, firstly, monitoring data of different dimensions in the process of cleaning copper foil by the immersion cleaning device is obtained, which is conducive to real-time reflection of the cleaning status of the cleaning device; secondly, the real index of the cleaning status in the current preset time period is determined according to the change of the monitoring data, and the real index of the cleaning status can reflect the correlation between the bubble change on the surface of the copper foil and the stirring device, which is conducive to the subsequent calculation of the intensity compensation coefficient of the ultrasonic device at the current moment; then, the intensity compensation coefficient determined by combining the real index of the cleaning status and the ultrasonic intensity is conducive to the subsequent determination of the equipment parameters of the immersion cleaning device at the next moment, so as to realize real-time adjustment of the cleaning equipment parameters and avoid the conflict between the working relationship between the stirring device and the ultrasonic device in the cleaning device, which leads to the problem of low cleaning effect and cleaning efficiency. In addition, the present invention also provides a filtering device in the solution tank, which effectively prevents impurities in the solution tank from being re-deposited on the new copper foil surface during the cleaning process, reduces the pollution of the cleaning solution by the precipitate, thereby extending the service life of the cleaning solution and reducing the need for frequent replacement. Therefore, the present invention can better overcome the shortcomings of the prior art and improve the cleaning efficiency and quality during the copper foil cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions and advantages in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 This is a schematic structural diagram of a copper foil surface cleaning device according to an embodiment of the present invention;

[0044] Figure 2 This is a flow chart of a method for cleaning the surface of a copper foil according to an embodiment of the present invention;

[0045] Figure 3 This is a flow chart for implementing step S2 in a method for cleaning a copper foil surface according to an embodiment of the present invention;

[0046] Figure 4 This is a flow chart for implementing step S3 in a method for cleaning a copper foil surface according to an embodiment of the present invention;

[0047] Figure 1Among them, 1 is a solution tank, 2 is a water outlet, 3 is a switch valve, 4 is a rope on the left side of the solution tank, 5 is a pulley on the left side, 6 is a first roller, 7 is a copper foil, 8 is a drive motor, 9 is a stirring brush, 10 is a connector, 11 is a movable roller, 12 is a filter, 13 is an ultrasonic device, 14 is a second roller, 15 is a water inlet pipe, 16 is a right pulley, 17 is a rope on the right side of the solution tank, 18 is a drive motor bracket, 19 is a first scanning optical sensor, and 20 is a second scanning optical sensor. DETAILED DESCRIPTION

[0048] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the technical solutions proposed by the present invention are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "another embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics in one or more embodiments may be combined in any suitable form.

[0049] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0050] In actual production, the cleaning step of the copper foil surface is a process that cannot be ignored. Traditional cleaning methods such as mechanical scrubbing, chemical immersion and ultrasonic cleaning have specific application scenarios and advantages and disadvantages, as follows:

[0051] Mechanical scrubbing devices usually use rotating brushes or abrasives to physically remove contaminants from the surface of the copper foil, but mechanical scrubbing devices can cause scratches or wear on the surface of the copper foil, which can easily affect the surface quality, especially when processing copper foil with high precision requirements.

[0052] Compared with the mechanical brushing device, the immersion cleaning device can avoid scratches or wear to a certain extent, but its cleaning effect often depends on the concentration and temperature of the cleaning solution. However, too high a concentration of chemical dosage may cause corrosion to the copper foil, resulting in low cleaning efficiency and cleaning quality of the copper foil. In addition, during the cleaning process, the liquid in the solution tank reacts with the material on the surface of the workpiece, which will easily change the quality of the liquid in the solution tank. There may be a certain amount of residual contaminants in the solution tank, which may have a certain impact on the copper foil after cleaning. In order to avoid the influence of contaminants on the cleaning of the copper foil, the cleaning solution can be replaced in time, but frequent replacement of the cleaning solution and handling of the cleaning container will increase the complexity of the work to a certain extent and waste a certain amount of cleaning solution.

[0053] With the development of technology, the requirements for cleaning effects are becoming higher and higher, that is, a copper foil surface cleaning device that is efficient, environmentally friendly and adaptable to different cleaning needs is needed. In view of the shortcomings of the above-mentioned traditional cleaning methods, the present invention provides a copper foil surface cleaning device and method, the main purpose of which is to abandon the defects of poor cleaning effect of existing devices and effectively improve the cleaning efficiency and cleaning quality of copper foil.

[0054] Embodiment 1 of a copper foil surface cleaning device:

[0055] In this embodiment, a schematic diagram of the structure of a copper foil surface cleaning device is shown in FIG. Figure 1 As shown, the copper foil surface cleaning device includes an immersion cleaning device, the chemical immersion cleaning mechanism is a conventional immersion cleaning device, such as an electrolyte cleaning mechanism, and the immersion cleaning device includes a stirring device, which is used to increase the fluidity of the cleaning solution to avoid insufficient fluidity of the cleaning solution, resulting in incomplete cleaning of certain areas of the copper foil, and is vertically installed in the solution tank 1. It should be understood that the immersion cleaning device also includes related cleaning equipment, which is used to assist the stirring device in completing the cleaning operation of the copper foil.

[0056] The copper foil surface cleaning device also includes a data collector, a data processor and a cleaning actuator, wherein the data collector is a first scanning optical sensor 19, a second scanning optical sensor 20, a rotation speed sensor built into the stirring device and an ultrasonic device 13. The data collector is used to obtain the number of bubbles on the copper foil surface at each moment in the current preset time period, the stirring speed of the stirring device at each moment and the ultrasonic intensity of the ultrasonic device 13 at each moment during the process of cleaning the copper foil 7 by the immersion cleaning device; the data collector signal is connected to the data processor. The data processor is used to determine the real index of the cleaning state of the current preset time period according to the number of bubbles on the copper foil surface at each moment in the current preset time period and the stirring speed of the stirring device at each moment; determine the intensity compensation coefficient of the ultrasonic device 13 at the current moment according to the real index of the cleaning state and the ultrasonic intensity of the ultrasonic device 13 at each moment; determine the equipment parameters of the immersion cleaning device at the next moment according to the intensity compensation coefficient, and the equipment parameters are the ultrasonic intensity of the ultrasonic device 13 or the proportional gain value of the controller PID; the data processor signal is connected to the cleaning actuator, and the cleaning actuator adjusts the operating state of the corresponding equipment in the immersion cleaning device according to the equipment parameters at the next moment, and the corresponding equipment includes the ultrasonic device 13 and the drive motor 8 for controlling the stirring device.

[0057] The data processor can be built into the ultrasonic device 13 to obtain data from an external data integration center for data analysis. The data processor can be a data processing chip such as a CPU, MCU, or a data processing device such as a computer host. When the data acquisition device signal is connected to the data processor and the data processor signal is connected to the cleaning actuator, a wired connection can be achieved through a data transmission line, or a wireless connection can be achieved through wireless communication methods such as Bluetooth and WiFi. In addition, the data acquisition device, the data processor and the cleaning actuator can also be integrated to form a device that integrates data acquisition, data processing and mechanism execution.

[0058] In order to overcome the defect that there may be a certain amount of residual contaminants in the solution tank 1 of the cleaning device, the copper foil surface cleaning device also includes a solution impurity cleaning mechanism, which includes a filter moving assembly and a filter 12. The filter moving assembly is used to vertically move the filter 12 up and down. The filter 12 is used to filter out sediment and residues in the process of cleaning the copper foil 7 by the immersion cleaning device. The filter 12 is usually located inside the immersion cleaning device. As a specific embodiment, the filter moving assembly may include a left side rope 4 of the solution tank, a left side pulley 5, a right side rope 17 of the solution tank, a right side pulley 16 and a movable roller 11. One end of the left side rope 4 of the solution tank is connected to the left side of the filter screen 12 through the left side pulley 5, and one end of the right side rope 17 of the solution tank is connected to the right side of the filter screen 12 through the right side pulley 16. When the filter screen 12 is moved up and down, the tension of the ropes on the left and right sides keeps the filter screen 12 parallel to the horizontal plane to avoid tilting and causing pollutants to be scattered back into the cleaning solution. The movable roller 11 can move upward with the stirring device. The purpose of the movement is to pull up the bottom filter screen 12 through the left side rope 4 of the solution tank, the left side pulley 5, the right side rope 17 of the solution tank, and the right side pulley 16; the size of the filter screen 12 needs to be small enough, that is, the mesh needs to be dense enough to filter the sediment in the cleaning solution well.

[0059] It should be noted that after one cleaning is completed, the filter screen 12 at the bottom is pulled up by the left pulley 5 in the solution tank 1, the left rope 4 in the solution tank, the right pulley 16 and the right rope 17 in the solution tank, and then the sediment on the filter screen 12 is filtered, which can effectively reduce the number of times the cleaning solution in the solution tank 1 is replaced, and to a certain extent can reduce the waste of cleaning solution and the impact of excessive discharge of cleaning solution on the environment. After removing the sediment on the filter screen 12, the copper foil surface can be cleaned again, which effectively improves the cleaning efficiency of the copper foil surface cleaning device.

[0060] The operation process of the copper foil surface cleaning device includes: the copper foil 7 is formed of the first roller 6, the second roller 14 and the movable roller 11 to form an in-and-out track of the copper foil 7, and the in-and-out track is connected to the movable roller 11 connected to the stirring device through a connecting piece 10, but the in-and-out track is not affected by the rotation of the stirring device, so as to provide a movable track for the copper foil 7 deep in the solution tank 1; the stirring device penetrates into the solution tank 1 from the bracket, and sends the movable roller 11 to a certain depth, that is, the in-and-out track of the copper foil 7 is completed. It is worth mentioning that the movable roller 11 can move upward with the stirring device, and its main purpose is to cooperate with the filter moving component to pull up or put down the bottom filter 12 for cleaning. Remove the sediment and residue on the filter screen 12; when the movable roller 11 reaches a certain depth, the driving motor 8 located on the driving motor bracket 18 causes the stirring brush 9 to rotate, thereby increasing the fluidity of the cleaning solution in the solution tank 1, and the data acquisition device collects the changes in the number of bubbles on the surface of the copper foil, the changes in the stirring speed of the stirring device, and the ultrasonic intensity of the ultrasonic device 13 to obtain monitoring data, and the controller analyzes the compensation of the driving motor of the ultrasonic device 13 and the stirring device according to the monitoring data; a regular cleaning of the solution tank 1 is set, and when cleaning the solution tank 1, the cleaning solution can be released through the switch valve 3 at the water outlet 2, and then the solution tank 1 is cleaned through the water inlet pipe 15.

[0061] It should be noted that before starting the operation of the copper foil surface cleaning device, check the thickness and surface state of the copper foil 7, specifically, visually inspect and physically measure the copper foil 7 to ensure that there is no obvious damage or defect on its surface; use a dry brush or compressed air to remove loose particles and dust on the surface of the copper foil to avoid contamination by particulate matter during the subsequent wet cleaning process; prepare a cleaning solution, common cleaning solutions include acidic solutions and alkaline solutions, acidic cleaning solutions can remove oxides and rust, and alkaline cleaning solutions are used to remove grease and organic dirt. Among them, the acidic cleaning solution is such as hydrochloric acid or sulfuric acid, and the alkaline cleaning solution is such as sodium hydroxide.

[0062] A copper foil surface cleaning device provided in this embodiment is mainly used to overcome the problems of low cleaning efficiency, improper parameter setting of the cleaning equipment, and frequent replacement of the cleaning solution in the existing cleaning devices. By setting a filtering device in the solution tank 1, it is possible to effectively avoid the impurities in the solution tank 1 from being re-deposited on the new copper foil surface during the cleaning process, reduce the contamination of the cleaning solution by the precipitate, thereby extending its service life and reducing the need for frequent replacement.

[0063] As a specific implementation, a copper foil surface cleaning device of this embodiment will perform the steps of Example 2 of a copper foil surface cleaning method described below, and has the same beneficial effects as a copper foil surface cleaning method.

[0064] A copper foil surface cleaning method embodiment 2:

[0065] In the process of cleaning the surface of copper foil with chemical immersion solution, if the flow of the cleaning solution is insufficient, some areas of the copper foil may not be cleaned thoroughly enough, affecting the cleaning effect of the copper foil. Therefore, stirring equipment is needed to increase the fluidity of the cleaning solution. There may be some blind cleaning areas where the copper foil contacts certain equipment in the cleaning device. Ultrasonic equipment can be used to clean the blind areas that cannot be immersed. However, during the cleaning process, the parameters between the stirring equipment and the ultrasonic equipment need to be coordinated to avoid excessive mechanical stress on the surface of the copper foil or unnecessary bubbles, which will affect the cleaning effect of the copper foil.

[0066] In order to coordinate the parameters between the stirring device and the ultrasonic device, this embodiment provides a copper foil surface cleaning method, and the implementation flow chart of the method is as follows: Figure 2 As shown, including:

[0067] S1, in the process of cleaning the copper foil by an immersion cleaning device, obtaining the number of bubbles on the surface of the copper foil at each moment in a current preset time period, the stirring speed of the stirring device at each moment, and the ultrasonic intensity of the ultrasonic device at each moment.

[0068] In order to facilitate real-time adjustment of the equipment parameters of the immersion cleaning device and avoid the problem of poor copper foil cleaning effect caused by improper adjustment of equipment parameters, it is necessary to first obtain the monitoring data related to copper foil cleaning during the cleaning operation of the immersion cleaning device, namely the number of bubbles on the copper foil surface, the stirring speed of the stirring equipment, and the ultrasonic intensity of the ultrasonic equipment.

[0069] Specifically, during the process of cleaning the copper foil by the immersion cleaning device, the optical sensor installed at a fixed position in the solution tank is used to obtain the bubble situation on the surface of the copper foil immersed in the solution during the current preset period, and specifically collect the number of bubbles on the surface of the copper foil per second within the current 5 minutes; the built-in speed sensor of the stirring device is used to obtain the change of the stirring speed during the current preset period, and specifically collect the stirring speed of the stirring device per second within the current 5 minutes; the ultrasonic device is used to obtain the change of the ultrasonic intensity during the current preset period, and specifically collect the ultrasonic intensity of the ultrasonic device per second within the current 5 minutes. Among them, the collection period and collection frequency of the monitoring data can be set by the implementer according to the specific actual situation, and are not specifically limited here.

[0070] It is worth noting that the temperature of the cleaning solution may change during the cleaning process, but this embodiment does not consider the impact of temperature changes. A pre-set heating device or cooling device is used to maintain the temperature of the cleaning solution within a certain range. That is, in the process of obtaining monitoring data of various dimensions, the temperature of the cleaning solution is maintained within a normal range by default.

[0071] So far, this embodiment has obtained monitoring data of several dimensions at each moment in the current preset time period.

[0072] S2, determining a true indicator of the cleaning state of the current preset period according to the number of bubbles on the copper foil surface at each moment in the current preset period and the stirring speed of the stirring device at each moment.

[0073] When cleaning the copper foil surface in the solution tank, the motor-driven stirring device is subjected to different liquid resistance when stirring in the liquid, which may lead to poor stability of the stirring speed of the stirring device. The unstable stirring speed will generate a certain number of bubbles on the copper foil surface, and the bubbles generated are not bubbles generated by the solution cleaning the copper foil, and cannot reflect the true cleaning state of the copper foil. It is necessary to verify the authenticity of the generated bubbles through the stirring speed. In addition, assuming that the stirring device can maintain a relatively stable stirring behavior, the stable state of the stirring device is reflected by monitoring the changes in the monitoring data during the actual cleaning process, such as the changes in the bubble data on the copper foil surface, and then the authenticity of the generated bubbles is verified based on the stable state. Based on the above description, it can be seen that when determining the true index of the cleaning state, it is necessary to analyze from two dimensions: the number of bubbles on the copper foil surface and the stirring speed of the stirring device. Among them, the true index of the cleaning state characterizes the correlation between the bubble changes on the copper foil surface and the stirring device in the current preset period. The less relevant, the larger the true index of the cleaning state, and the less likely it is that the bubble changes on the copper foil surface are caused by the unstable speed of the stirring device.

[0074] The above step S2 can be Figure 3 The steps shown achieve:

[0075] S301, determining a fluctuation factor of the number of bubbles on the surface of the copper foil in the current preset period according to the number of bubbles on the surface of the copper foil at each moment in the current preset period.

[0076] In this embodiment, by analyzing the difference in the number of bubbles on the copper foil surface at any two moments in the current preset time period, the fluctuation of the number of bubbles on the copper foil surface in the current preset time period can be quantified. The larger the fluctuation factor of the number of bubbles on the copper foil surface, the greater the fluctuation degree of the number of bubbles on the copper foil surface in the current preset time period, and the greater the possibility that the changes in the bubbles on the copper foil surface are caused by the unstable stirring speed of the stirring equipment.

[0077] As a specific implementation method, the number of bubbles on the surface of the copper foil at any two moments in the current preset time period is formed into a control group to obtain each control group; the difference between the number of bubbles on the surface of the copper foil at two moments in each control group is calculated to obtain the number difference value of each control group; the average value of the number difference values ​​of all control groups is normalized, and the normalized result value is used as the fluctuation factor of the number of bubbles on the surface of the copper foil in the current preset time period.

[0078] As an example, the calculation formula of the bubble quantity fluctuation factor on the copper foil surface in the current preset period can be:

[0079] ;

[0080] In the formula, represents the fluctuation factor of the number of bubbles on the copper foil surface in the current preset period, r represents the current preset period, th represents the hyperbolic tangent function, n represents the number of control groups composed of the number of bubbles on the copper foil surface at any two moments in the current preset period, k represents the sequence number of the control group, represents the number of bubbles on the copper foil surface at the i-th moment in the k-th control group, represents the number of bubbles on the copper foil surface at the jth moment in the kth control group, It means to find the absolute value of the difference between the number of bubbles on the copper foil surface at two moments. represents the difference in number of controls in the kth group, Represents the mean of the quantitative difference values ​​of all control groups.

[0081] In the calculation formula of the bubble number fluctuation factor on the copper foil surface, It can characterize the change of the number of bubbles on the copper foil surface in the current preset period. The larger the average value of the number difference of all control groups is, the greater the fluctuation of the number of bubbles on the copper foil surface in the current preset period is, that is, the greater the fluctuation factor of the number of bubbles on the copper foil surface is. In order to facilitate the subsequent unified dimension of data analysis, the hyperbolic tangent function is used to After normalization, the value range of the bubble quantity fluctuation factor on the copper foil surface is between 0 and 1.

[0082] S302: Determine a stirring speed fluctuation factor of the current preset time period according to the stirring speed of the stirring device at each moment in the current preset time period.

[0083] In this embodiment, by analyzing the concentration and stability of the stirring speed of the stirring equipment in the current preset time period, the stirring speed fluctuation factor of the current preset time period can be quantified. The larger the stirring speed fluctuation factor, the more unstable the stirring speed of the stirring equipment in the current preset time period, the greater the possibility of bubbles forming on the copper foil surface, and the smaller the subsequent calculated true index of the cleaning state.

[0084] As a specific implementation, according to the stirring speed of the stirring device at each moment in the current preset period, the variance of the stirring speed is calculated, and the normalized result of the variance is used as the stirring speed fluctuation factor of the current preset period. Of course, by calculating the standard deviation of the stirring speed, the stirring speed fluctuation factor of the current preset period can also be obtained.

[0085] As an example, the calculation formula of the stirring speed fluctuation factor of the current preset period can be:

[0086] ; represents the stirring speed fluctuation factor of the current preset period, Var represents the variance function, v represents the sequence of stirring speeds of the stirring equipment at each moment in the current preset period, Represents the normalization function.

[0087] S303, determining a bubble number fitting curve and a stirring speed fitting curve for the current preset time period, and then calculating a mean square error between the bubble number fitting curve and the stirring speed fitting curve.

[0088] In this embodiment, by analyzing the correlation between the change in the number of bubbles and the change in the stirring speed in the current preset period, the correlation between the change in the number of bubbles on the copper foil surface and the stirring device in the current preset period, that is, the actual cleaning state, can be characterized. By analyzing the mean square error of the monitoring data curve in two dimensions, the correlation between the fluctuation of the bubbles and the stirring speed can be characterized. The smaller the mean square error, the stronger the correlation between the fluctuation of the bubbles and the stirring speed.

[0089] As a specific implementation method, the least square method is first used to respectively curve the number of bubbles on the copper foil surface and the stirring speed of the stirring device in the current preset time period, and obtain a bubble number fitting curve and a stirring speed fitting curve; then the mean square error of the bubble number fitting curve and the stirring speed fitting curve is calculated. Among them, the implementation process of the least square method and the mean square error is both prior art, which is not within the protection scope of the present invention and will not be elaborated in detail here.

[0090] It is worth mentioning that when fitting the curves, the vertical coordinates of the bubble number fitting curve and the stirring speed fitting curve need to be standardized. The value range after standardization is between 0 and 1, and the horizontal coordinate remains unchanged. Subsequently, the two fitting curves are mapped to the same coordinate to facilitate the analysis of the mean square error of the two curves.

[0091] S304, determining a true indicator of the cleaning state in the current preset time period by combining the bubble quantity fluctuation factor on the copper foil surface, the stirring speed fluctuation factor and the mean square error.

[0092] In this embodiment, when the stirring speed is unstable and the bubble fluctuation on the copper foil surface is large, it means that the possibility that the number of bubbles on the copper foil surface in the current period is real bubbles is small. Real bubbles refer to bubbles generated on the copper foil surface when the cleaning solution cleans the dirt on the copper foil surface. Therefore, the fluctuation factor of the number of bubbles on the copper foil surface, the fluctuation factor of the stirring speed and the real index of the cleaning state are negatively correlated, that is, the larger the fluctuation factor of the number of bubbles on the copper foil surface and the fluctuation factor of the stirring speed, the larger the real index of the cleaning state; the weaker the correlation between the bubble fluctuation and the stirring speed, the weaker the correlation between the bubble change on the copper foil surface and the stirring equipment, which means that the possibility that the number of bubbles on the copper foil surface in the current period is real bubbles is greater, so the mean square error is positively correlated with the real index of the cleaning state, that is, the larger the mean square error of the bubble number fitting curve and the stirring speed fitting curve, the larger the real index of the cleaning state.

[0093] As a specific implementation method, the product of the bubble quantity fluctuation factor on the copper foil surface and the stirring speed fluctuation factor is first calculated as the first product; then the first product is negatively correlated to obtain a first negative correlation value of the first product; then, the product of the first negative correlation value of the first product and the mean square error is calculated as the second product; finally, the second product is normalized to obtain a true indicator of the cleaning status of the current preset time period.

[0094] As an example, the calculation formula of the real index of the cleaning status in the current preset period can be:

[0095] ; In the formula, It indicates the real index of the cleaning status in the current preset period, norm indicates the linear normalization function, Indicates the stirring speed fluctuation factor of the current preset period. represents the fluctuation factor of the number of bubbles on the copper foil surface in the current preset period, MSE represents the mean square error function, G represents the bubble number fitting curve, V represents the stirring speed fitting curve, represents the mean square error of the bubble number fitting curve and the stirring speed fitting curve, represents the first product, represents the first negative correlation value of the first product, represents the second product.

[0096] In the calculation formula of the real index of the cleaning state, the stirring speed fluctuation factor can be the first verification factor of the authenticity of the bubble state in the current preset period, and the copper foil surface bubble number fluctuation factor can be the second verification factor of the authenticity of the bubble state in the current preset period. The mean square error represents the correlation between the fluctuation of the bubble and the stirring speed; The smaller it is, the stronger the correlation between the bubble change on the copper foil surface and the stirring equipment is during the current preset time. That is, in the actual cleaning process, the authenticity factor of the cleaning state is lower, which further indicates that the possibility of removing dirt on the copper foil surface is lower. The stirring speed at each moment during the current preset time period does not have the same stirring speed at each moment in order to adapt to different liquid resistances. Therefore, the stirring speed fluctuation factor does not have the possibility of being zero. In addition, the fluctuation factor of the number of bubbles on the copper foil surface is determined by the mean of the number of bubbles at any two moments, so it does not have the possibility of being zero. Of course, there are extreme cases, which lead to The product equals zero. At this time, a constant should be added after the denominator of the fraction. The empirical value of the constant can be 0.01.

[0097] So far, this embodiment has obtained the real indicator of the cleaning status of the current preset time period.

[0098] S3, determining the intensity compensation coefficient of the ultrasonic device at the current moment according to the real indicator of the cleaning state and the ultrasonic intensity of the ultrasonic device at each moment.

[0099] In the actual cleaning process of the copper foil surface, it is necessary to coordinate the working relationship between the stirring device and the ultrasonic device. Excessive ultrasonic intensity may conflict with the flow generated by the stirring device, which is not conducive to cleaning the dirt on the copper foil surface. Reasons for the conflict: Ultrasonic cleaning uses the cavitation effect generated by ultrasonic waves in the liquid to remove dirt and impurities on the surface of the copper foil. Specifically, the cavitation bubbles generated by ultrasonic vibration will generate shock waves when they break, which can effectively clean difficult-to-reach surfaces, while the stirring device enhances the cleaning effect through the flow of liquid and helps to evenly distribute the cleaning solution; the effect of ultrasonic cleaning depends on the cavitation of bubbles in the liquid. If the flow of the stirring device is too strong, it may break the cavitation bubbles generated in the ultrasonic cleaning, thereby reducing the intensity of the cavitation effect and reducing the effect of ultrasonic cleaning. In addition, the flow caused by the stirring device will change the flow field of the liquid, which may cause the propagation path of the ultrasonic wave to be disturbed, thereby affecting the uniform distribution and effect of the ultrasonic wave in the liquid. Especially when the intensity of the liquid flow is very high, the propagation of the ultrasonic wave may be changed or weakened, thereby affecting the cleaning effect. Therefore, in order to avoid these conflicts from affecting the cleaning effect of the copper foil surface cleaning device, it is necessary to optimize the coordination of the ultrasonic device and the stirring device.

[0100] Here, the intensity compensation coefficient is used to determine whether it is necessary to adjust the intensity of the ultrasonic equipment to compensate for the indicators of the actual cleaning process. Therefore, the intensity compensation coefficient can be analyzed by the real indicators of the cleaning state and the changes in the ultrasonic intensity of the ultrasonic equipment during the current preset period. The larger the real indicator of the cleaning state, the more stable the stirring speed of the stirring equipment during the cleaning process. When the ultrasonic intensity is small at this time, in order to reduce the generation of bubbles on the surface of the copper foil during the cleaning process, the intensity of the ultrasonic equipment should be appropriately adjusted to compensate for the actual cleaning effect.

[0101] The above step S3 can be Figure 4 The steps shown achieve:

[0102] S401, calculating an average value of the ultrasonic intensities of the ultrasonic device at all moments according to the ultrasonic intensities of the ultrasonic device at each moment.

[0103] S402, combining the average value of the ultrasonic intensity and the real index of the cleaning state, determining the intensity compensation coefficient of the ultrasonic device at the current moment.

[0104] Specifically, negative correlation processing is performed on the average value of the ultrasonic intensity to obtain a second negative correlation value; the product of the second negative correlation value and the real index of the cleaning state is calculated as the third product; the third product is normalized to obtain the intensity compensation coefficient of the ultrasonic equipment at the current moment.

[0105] As an example, the calculation formula of the intensity compensation coefficient of the ultrasonic device at the current moment can be:

[0106] ;

[0107] In the formula, represents the intensity compensation coefficient of the ultrasonic device at the current moment, th represents the hyperbolic tangent function, It indicates the real index of the cleaning status in the current preset period, m indicates the number of moments in the current preset period, i indicates the sequence number of the moment, It indicates the ultrasonic intensity of the ultrasonic device at the i-th moment in the current preset period. It represents the average value of the ultrasonic intensity of the ultrasonic equipment at all times. represents the second negative correlation value, Represents the third product.

[0108] In the calculation formula of the intensity compensation coefficient, the real index of the cleaning state is positively correlated with the intensity compensation coefficient, while the average value of the ultrasonic intensity of the ultrasonic equipment at all times is negatively correlated with the intensity compensation coefficient, that is, in the process of cleaning the copper foil, the stability of the stirring equipment is within the expected range of variation. When the stirring speed is stable, the smaller the average value of the ultrasonic intensity in the current preset time period, the greater the intensity compensation coefficient of the ultrasonic equipment at the current moment. The reason is that excessive ultrasonic intensity will produce more bubbles. Adjusting the ultrasonic intensity of the ultrasonic equipment can reduce the generation of bubbles and can also reduce the degree of accumulation of bubbles generated during the cleaning process of the ultrasonic equipment. Therefore, in order to reduce the generation of bubbles on the surface of the copper foil during the cleaning process, the intensity of the ultrasonic equipment should be appropriately adjusted to compensate for the actual cleaning process, so as to improve the cleaning effect.

[0109] So far, this embodiment has determined the intensity compensation coefficient of the ultrasonic device at the current moment.

[0110] S4, determining the equipment parameters of the immersion cleaning device at the next moment according to the intensity compensation coefficient.

[0111] After obtaining the intensity compensation coefficient at the current moment, the equipment parameters of the immersion cleaning device at the current moment are adjusted based on the intensity compensation coefficient, and the adjusted equipment parameters are used to adjust the immersion cleaning device at the next moment, so as to realize adaptive adjustment of the equipment parameters, which is beneficial to improve the cleaning effect and cleaning efficiency of the immersion cleaning device.

[0112] In this embodiment, a preset coefficient threshold is set to compare the intensity compensation coefficient of the ultrasonic device at the current moment with the preset coefficient threshold, and the device parameters of the immersion cleaning device at the next moment are determined according to the comparison result, which can be divided into two cases:

[0113] In case 1, when the intensity compensation coefficient is greater than the preset coefficient threshold, the product of the intensity compensation coefficient and the ultrasonic intensity of the ultrasonic equipment at the current moment is used as the intensity of the ultrasonic equipment at the next moment. The intensity of the ultrasonic equipment at the next moment can be used to clean the copper foil surface more deeply.

[0114] Case 2: When the intensity compensation coefficient is not greater than the preset coefficient threshold, it means that the smaller the state authenticity factor is during the cleaning process, the more unstable the actual stirring device is, and the stirring device needs to provide a more stable output. At this time, the product of the intensity compensation coefficient and the proportional gain value of the PID controller at the current moment can be used as the gain adjustment value, and then the value obtained by adding the gain adjustment value to the proportional gain value of the PID controller at the current moment is used as the proportional gain value at the next moment. Among them, in the PID controller, the proportional gain Kp value can be used to improve the response speed of the control system to ensure the stable output of the equipment.

[0115] In this embodiment, the preset coefficient threshold is set to 0.6. The implementer can set the value of the preset coefficient threshold according to the actual situation without making any specific limitation.

[0116] So far, this embodiment has determined the equipment parameters of the immersion cleaning device at the next moment after the current moment.

[0117] In view of the problems of low cleaning efficiency, improper setting of cleaning equipment parameters and frequent replacement of cleaning solution in the existing cleaning devices, the present invention provides a copper foil surface cleaning device and method, which improves the existing immersion cleaning device to avoid the problems of low cleaning effect and cleaning efficiency caused by improper adjustment of cleaning equipment parameters; and by setting a filtering device in the solution tank, it effectively avoids the re-deposition of impurities in the solution tank to the new copper foil surface during the cleaning process, reduces the contamination of the cleaning solution by the precipitate, thereby extending the service life of the cleaning solution and reducing the need for frequent replacement. In short, the present invention can better overcome the shortcomings of the prior art and improve the cleaning efficiency and quality in the copper foil cleaning process.

[0118] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A method for cleaning the surface of a copper foil, characterized in that: The following steps are involved: In the process of cleaning the copper foil by the immersion cleaning device, the number of bubbles on the surface of the copper foil at each moment in the current preset time period, the stirring speed of the stirring device at each moment, and the ultrasonic intensity of the ultrasonic device at each moment are obtained; According to the number of bubbles on the copper foil surface at each moment in the current preset period and the stirring speed of the stirring device at each moment, the real index of the cleaning state of the current preset period is determined; Determine the intensity compensation coefficient of the ultrasonic device at the current moment according to the real index of the cleaning state and the ultrasonic intensity of the ultrasonic device at each moment; The equipment parameters of the immersion cleaning device at the next moment are determined according to the intensity compensation coefficient, and the equipment parameters are the ultrasonic intensity of the ultrasonic device or the proportional gain value of the PID controller of the stirring device.

2. A copper foil surface cleaning method according to claim 1, characterized in that: The method of determining the true index of the cleaning state of the current preset period according to the number of bubbles on the copper foil surface at each moment in the current preset period and the stirring speed of the stirring device at each moment includes: According to the number of bubbles on the copper foil surface at each moment in the current preset period, a fluctuation factor of the number of bubbles on the copper foil surface in the current preset period is determined; Determine the stirring speed fluctuation factor of the current preset period according to the stirring speed of the stirring device at each moment in the current preset period; Determine a bubble number fitting curve and a stirring speed fitting curve for a current preset time period, and then calculate a mean square error between the bubble number fitting curve and the stirring speed fitting curve; The true index of the cleaning state in the current preset time period is determined by combining the bubble quantity fluctuation factor on the copper foil surface, the stirring speed fluctuation factor and the mean square error.

3. A copper foil surface cleaning method according to claim 2, characterized in that: The method of determining the fluctuation factor of the number of bubbles on the surface of the copper foil in the current preset period according to the number of bubbles on the surface of the copper foil at each moment in the current preset period includes: The number of bubbles on the copper foil surface at any two moments in the current preset time period is used to form a control group to obtain each control group; Calculate the difference between the number of bubbles on the copper foil surface at two moments in each control group to obtain the number difference value of each control group; The average value of the quantity difference values ​​of all control groups is normalized, and the normalized result value is used as the fluctuation factor of the number of bubbles on the copper foil surface in the current preset time period.

4. A copper foil surface cleaning method according to claim 3, characterized in that: The step of determining the stirring speed fluctuation factor of the current preset period according to the stirring speed of the stirring device at each moment in the current preset period includes: According to the stirring speed of the stirring device at each moment in the current preset time period, the variance of the stirring speed is calculated, and the normalized result of the variance is used as the stirring speed fluctuation factor of the current preset time period.

5. A copper foil surface cleaning method according to claim 4, characterized in that: The method of combining the bubble quantity fluctuation factor on the copper foil surface, the stirring speed fluctuation factor and the mean square error to determine the true index of the cleaning state in the current preset time period includes: First, the product of the bubble quantity fluctuation factor on the copper foil surface and the stirring speed fluctuation factor is calculated as a first product; then, a negative correlation process is performed on the first product to obtain a first negative correlation value of the first product; Next, the product of the first negative correlation value of the first product and the mean square error is calculated as the second product; finally, the second product is normalized to obtain a true indicator of the cleaning state in the current preset time period.

6. A copper foil surface cleaning method according to claim 1, characterized in that: The step of determining the intensity compensation coefficient of the ultrasonic device at the current moment according to the real indicator of the cleaning state and the ultrasonic intensity of the ultrasonic device at each moment includes: According to the ultrasonic intensity of the ultrasonic device at each moment, the average value of the ultrasonic intensity of the ultrasonic device at all moments is calculated; The intensity compensation coefficient of the ultrasonic device at the current moment is determined by combining the average value of the ultrasonic intensity and the real indicator of the cleaning state.

7. A copper foil surface cleaning method according to claim 6, characterized in that: The step of combining the average value of the ultrasonic intensity and the real indicator of the cleaning state to determine the intensity compensation coefficient of the ultrasonic device at the current moment includes: Performing negative correlation processing on the average value of the ultrasonic intensity to obtain a second negative correlation value; calculating the product of the second negative correlation value and the real index of the cleaning state as a third product; The third product is normalized to obtain the intensity compensation coefficient of the ultrasonic device at the current moment.

8. A copper foil surface cleaning method according to claim 1, characterized in that: The determining of the equipment parameters of the immersion cleaning device at the next moment according to the intensity compensation coefficient includes: When the intensity compensation coefficient is greater than a preset coefficient threshold, the product of the intensity compensation coefficient and the ultrasonic intensity of the ultrasonic device at the current moment is used as the intensity of the ultrasonic device at the next moment; When the intensity compensation coefficient is not greater than the preset coefficient threshold, the product of the intensity compensation coefficient and the proportional gain value of the PID controller at the current moment is used as the gain adjustment value, and then the value obtained by adding the gain adjustment value to the proportional gain value of the PID controller at the current moment is used as the proportional gain value at the next moment.

9. A copper foil surface cleaning device, used to implement a copper foil surface cleaning method as claimed in any one of claims 1 to 8, characterized in that: The copper foil surface cleaning device includes an immersion cleaning device, the immersion cleaning device includes a stirring device, the stirring device is used to increase the fluidity of the cleaning solution, and is vertically installed in the solution tank; the copper foil surface cleaning device also includes a data collector, a data processor and a cleaning execution mechanism, the data collector signal is connected to the data processor, and the data processor signal is connected to the cleaning execution mechanism; The data collector is used to obtain the number of bubbles on the surface of the copper foil at each moment in the current preset time period, the stirring speed of the stirring device at each moment, and the ultrasonic intensity of the ultrasonic device at each moment during the process of cleaning the copper foil by the immersion cleaning device; The data processor is used to determine the real index of the cleaning state of the current preset period according to the number of bubbles on the copper foil surface at each moment in the current preset period and the stirring speed of the stirring device at each moment; Determine the intensity compensation coefficient of the ultrasonic device at the current moment according to the real index of the cleaning state and the ultrasonic intensity of the ultrasonic device at each moment; Determine the equipment parameter of the immersion cleaning device at the next moment according to the intensity compensation coefficient, wherein the equipment parameter is the ultrasonic intensity of the ultrasonic device or the proportional gain value of the PID controller; The cleaning actuator adjusts the operating state of the corresponding equipment in the immersion cleaning device according to the equipment parameters at the next moment, and the corresponding equipment is an ultrasonic device or a driving motor for controlling a stirring device.

10. A copper foil surface cleaning device according to claim 9, characterized in that: The copper foil surface cleaning device also includes a solution impurity cleaning mechanism, which includes a filter moving assembly and a filter. The filter moving assembly is used to vertically move the filter up and down. The filter is used to filter out sediment and residue in the process of cleaning the copper foil by the immersion cleaning device. The filter is located inside the immersion cleaning device.

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