Magnetic current-float-chemical rheological polishing processing and manufacturing method and device

Through magnetoflow-float-chemical rheology polishing technology, magnetic polishing liquid reacts with the workpiece surface under magnetic field and high-speed rotation to remove materials, solving the processing accuracy and cost problems in the existing technology, and achieving high efficiency of atomic near-atomic scale Polishing and avoiding surface damage to the workpiece, it is suitable for a variety of difficult-to-process materials.

CN119077445APending Publication Date: 2024-12-06HEFEI UNIV OF TECH

Patent Information

Application Number
CN202411369839.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-29
Publication Date
2024-12-06

AI Technical Summary

Technical Problem

The existing ultra-precision research and deposition technology has shortcomings in processing accuracy, material removal efficiency and cost, especially the floating method and magnetorheological technology have room for improvement in workpiece shape accuracy and efficient research and deposition, and traditional polishing methods are difficult to avoid workpieces. Surface damage.

Method used

Using magnetic current-float-chemical rheology polishing processing method, magnetic polishing liquid is used to form a flexible polishing medium flow under external magnetic field and high-speed rotation. The thickening group of magnetic chemical abrasive particles reacts with the surface of the workpiece and shears and removes the material, combining with green Chemical action to achieve atomic near-atomic polishing effect.

Benefits of technology

Improve processing efficiency and accuracy, expand the types of processable materials, avoid surface damage of workpieces, low requirements for polishing discs, low cost, and easy to obtain and environmentally friendly raw materials.

✦ Generated by Eureka AI based on patent content.

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Abstract

A magnetic current-float-chemical rheological polishing processing and manufacturing method comprises the following steps: forming a flexible polishing medium flow by using a magnetic polishing solution, and enabling the flexible polishing medium flow to float up and down under the action of an external magnetic field and high-speed rotation so as to be continuously attached to the surface of a workpiece; at the moment, magnetic chemical abrasive particle thickening groups in the flexible floating polishing medium flow react with the surface of the workpiece and efficiently shear to remove the material on the surface of the workpiece, and at the same time, the magnetic chemical abrasive particle thickening groups are separated from the flexible polishing medium flow under the action of centrifugal force and impact at a high speed to remove the material on the surface of the workpiece; according to the'attaching 'and'separating' magnetic float process chemical polishing method, the near-atomic scale polishing effect of atoms can be achieved. The invention further provides a magnetic current-float-chemical rheological polishing machining and manufacturing device. The machining efficiency and precision are improved, and workpiece surface damage is avoided; the polishing disc is low in requirement and high in machining parallelism; the raw materials are easy to obtain, green and environment-friendly, low in cost and capable of efficiently playing a green chemical role.
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Description

Technical Field

[0001] The invention belongs to the technical field of ultra-precision polishing, and in particular relates to a magnetic flow-float-chemical rheological polishing manufacturing method. Background Art

[0002] Ultra-precision grinding and polishing technology can effectively reduce the surface roughness and surface damage layer of the workpiece, obtain high-precision and high-integrity surface quality, and then realize atomic and near-atomic scale damage-free polishing manufacturing. Ultra-precision grinding and polishing manufacturing technology is an important part of advanced manufacturing science and has been widely used in many fields, such as aerospace basic parts, special processing basic parts, 3D printing basic parts, semiconductors, optical components, functional ceramics and other hard and brittle materials and high-performance processing and manufacturing of metal plastic components.

[0003] Float polishing technology is a non-contact ultra-precision polishing method with extremely high precision that uses a tin polishing disc with high flatness and concentric or spiral grooves and a polishing machine with high rotation accuracy to cover the entire surface of the polishing disc with polishing liquid. The polishing disc and the workpiece rotate at high speed so that the polishing liquid between the two is in a dynamic pressure fluid state and forms a layer of liquid film, which realizes material removal in a floating state of the workpiece. The processing efficiency and quality of float polishing are usually regulated and restricted by factors such as the impact frequency and impact speed of the abrasive particles, the surface atomic binding energy distribution and mutual diffusion difficulty of the workpiece and the abrasive particles, and the reduction ratio of the binding energy of the surface atoms of the workpiece when impurity atoms invade.

[0004] Magnetorheological polishing is a polishing method that uses the rheological properties of magnetorheological fluid to remove trace amounts of surface material. Magnetorheological fluid is a special material that changes its flow characteristics when affected by a magnetic field, especially under the action of an external magnetic field, it may become more viscous or more fluid. In magnetorheological polishing technology, the magnetorheological fluid contacts the surface of the workpiece to be polished, and the external magnetic field is regulated to change the flow characteristics of the magnetorheological fluid, thereby achieving the effect of regulating the polishing quality of the workpiece. Since this technology can perform high-precision polishing on complex shapes and tiny parts, and has computer control, stability of the removal function, and controllability of the performance of magnetorheological micro-grinding heads, it has broad application prospects in aerospace, optical manufacturing, and automotive parts molds. However, this method still has problems such as low material removal efficiency and expensive magnetorheological fluid costs.

[0005] The principle of mechanochemical polishing is to mix abrasives with chemical solutions under the action of mechanical force to form friction and chemical reactions between abrasive particles on the surface of the material. Abrasive particles can play a role in grinding and removing surface defects, while chemical solutions can dissolve and remove pollutants to make the surface smoother. By regulating the mechanical force, the size of abrasive particles and the composition of chemical solutions, polishing of different materials can be achieved. Waste liquid and waste materials generated during the polishing process need to be treated and disposed of to avoid pollution to the environment. The effect of polishing is limited by the properties of the material itself, and the ideal polishing effect may not be achieved for some special materials.

[0006] The invention patent (CN114800060A) has been published, a chemical magnetorheological polishing device and method based on eddy current cavitation. The eddy current cavitator described in the invention includes: a converging chamber; a conical contraction chamber; an outlet pipe, and a plurality of placement grooves are arranged at the lower end of the outlet pipe, and the placement grooves are arranged on the same circumference at equal angles relative to the axis of the outlet pipe, and a magnetic tile is arranged in each of the placement grooves, and the magnetic tile is made of a permanent magnet. The invention device combines the eddy current cavitation effect, the Fenton reaction and the magnetorheological effect, and can achieve a better polishing effect. However, this patent does not involve the float mechanism and characteristics, so there is still room for improvement in the expansion of processing materials and performance.

[0007] The invention patent (CN109732471A) has been published, a chemical mechanical-mechanical chemical synergistic micro-grinding method and a composite abrasive type micro-grinding tool. The steps of the processing method are: 1) grinding fluid corrodes the modified processing layer; 2) grinding the coarse abrasive of the grinding tool to remove the modified layer; 3) repeating steps 1) to 2); 4) stopping the supply of grinding fluid; 5) grinding the fine abrasive of the grinding tool to remove the excess layer; 6) cleaning to remove surface debris. The grinding tool is a two-level composite abrasive type micro-grinding tool composed of abrasives of different particle sizes and different types, and the processing process does not require the grinding tool to be replaced. The present invention combines the advantages of chemical mechanics, mechanochemistry and micro-grinding, and can achieve high geometric accuracy, high surface quality and high efficiency processing of complex structure micro parts of silicon and silicon-based materials, and the processing method is simple and convenient, low cost, and fully meets the requirements of industrial production. However, this patent does not involve mechanisms such as float and magnetorheology, and there is still room for improvement in workpiece shape accuracy and efficient grinding and polishing.

[0008] A Chinese invention patent (CN201810122104.8) has been disclosed, a high-efficiency ultra-precision shear thickening chemical collaborative polishing device. The implementation equipment of this patent includes a polishing tool, a polishing tool fixture, a polishing fixed disk, a dust cover and a polishing liquid circulation device. The present invention utilizes the active constraint of the liquid flow boundary and the active control of the polishing liquid flow, and the synergistic effect of shear thickening and green chemistry to improve processing efficiency and precision, and expand the machinable materials and surface shapes. The advantages of this patent are a wide range of machinable materials, a variety of machining surface shapes, and environmentally friendly polishing liquid. The shear thickening effect is utilized to make the polishing flexible, improve the certainty of material removal, and reduce the surface deterioration layer. However, this patent does not involve mechanisms such as magnetic fields, and the quality of ultra-precision polishing of atomic and near-atomic scales of workpieces can be further improved. Summary of the invention

[0009] In order to overcome the shortcomings of the existing technology, to solve the problems of machining accuracy, high-quality material removal, and to expand high-performance machining of various workpiece materials to reduce surface damage, and to realize new technologies and process methods for ultra-precision grinding and polishing of workpieces at atomic and near-atomic scales, the present invention provides a magnetic flow-float-chemical rheological polishing manufacturing method and device, which utilizes float polishing, magnetorheology and green chemistry to improve machining efficiency and accuracy, and expand machinable materials; avoid workpiece surface damage; have low polishing disc requirements and high machining parallelism; raw materials are easy to obtain, green and environmentally friendly, low cost, good dispersion of abrasive particles therein, do not interfere with the magnetic flux aggregation effect of nano-magnetic particles, and can efficiently exert green chemistry.

[0010] The technical solution adopted by the present invention to solve its technical problem is:

[0011] A magnetic flow-float-chemical rheological polishing manufacturing method uses magnetic polishing liquid to form a flexible polishing medium flow, and under the action of an external magnetic field and high-speed rotation, the flexible polishing medium flow floats up and down to continuously fit the surface of a workpiece. At this time, the magnetic chemical abrasive thickening group in the flexible floating polishing medium flow reacts with the workpiece surface and efficiently shears and removes the workpiece surface material. At the same time, under the action of centrifugal force, the magnetic chemical abrasive thickening group separates from the flexible polishing medium flow and impacts and removes the workpiece surface material at high speed; this "fitting" and "detaching" magnetic float chemical polishing method can achieve atomic and near-atomic scale polishing effects.

[0012] The method comprises the following steps:

[0013] (1) Fix the flat workpiece on the workpiece fixture on the polishing rotating axis in the equipment;

[0014] (2) preparing a polishing liquid, wherein a magnetic chemical abrasive thickening mass, nano magnetic particles, a pH adjuster, a corrosion inhibitor, an oxidant and a green chemical environmentally friendly substance are added to ultrapure water at 5° C. to 50° C. to prepare a polishing liquid, wherein the polishing liquid comprises the following components in percentage by mass: a magnetic chemical abrasive thickening mass having a mass fraction of 2% to 20%, a pH adjuster having a mass fraction of 0.05% to 1.0%, a corrosion inhibitor having a mass fraction of 0.05% to 1.0%, an oxidant having a mass fraction of 0.05% to 0.1%, and a green chemical environmentally friendly substance having a mass fraction of 1% to 10%;

[0015] (3) Add the prepared polishing liquid to the polishing liquid supply device, turn on the polishing liquid circulation start device, so that the polishing liquid is supplied to the polishing workbench through the temperature control device, the supply pump, and the polishing liquid delivery device. The polishing disc must be completely immersed, and the processing environment temperature is maintained by the constant temperature chamber;

[0016] (4) Turn on the drive device and the current control switch. Under the action of the magnetic flux coil, the magnetic nanoparticles in the polishing liquid assist the magnetic chemical abrasive thickening group to produce a clustering effect to form a flexible polishing medium flow. Further, the polishing disc and the planar workpiece rotate in the same direction. At this time, the flexible polishing medium flow between the polishing disc and the planar workpiece surface floats up and down. At this time, the magnetic chemical abrasive thickening group in the flexible floating polishing medium flow reacts with the workpiece surface and efficiently shears and removes the workpiece surface material. At the same time, under the action of centrifugal force, the magnetic chemical abrasive thickening group separates from the flexible polishing medium flow and impacts and removes the workpiece surface material at high speed. This "fitting" and "detaching" magnetic float chemical composite polishing mechanism will be able to achieve an atomic and near-atomic scale removal effect, thereby realizing the magnetic flow-float-chemical rheological polishing processing and manufacturing of the workpiece material.

[0017] Furthermore, in the step (2), the magnetic chemical abrasive thickening group is a mixture of one or at least two or more of SiO2, CeO2, ZrO2, Ce2O3, Fe2O3, MgO, LiF, graphite and Al2O3, wherein the nanomagnetic particles include ferrite (Fe3O4), iron, cobalt, nickel and magnetic alloys.

[0018] Furthermore, in step (2), the pH adjuster is an aqueous ammonia solution, sodium hydroxide or potassium hydroxide, the oxidant is potassium permanganate or a hydrogen peroxide solution, and the green chemical environmentally friendly substance is a natural green animal and plant extract or a green chemical environmentally friendly mixture that can achieve acid-base neutral transformation.

[0019] Furthermore, in step (3), the polishing disc is a polishing disc with a grooved circular hole structure, which can have a good grip on the flexible polishing medium flow in the polishing liquid to prevent the polishing liquid from affecting the surface removal effect of the planar workpiece during the polishing process.

[0020] In the step (4), the planar workpiece is a crystalline material, and the workpiece is required to have high flatness and a surface roughness of no more than 35 nm.

[0021] In step (4), the current control switch is connected to a flux coil, which can provide a strong magnetic field. The size of the magnetic field can be changed by changing the number of turns of the flux coil, the current size provided by the power supply, and the presence or absence of an iron core, and the direction of the magnetic field can be changed by changing the direction of the current.

[0022] In the step (4), during the polishing process, when the polishing liquid or green chemical environmentally friendly substance needs to be replenished, it can be replenished by adding it to the polishing liquid replenishing device through the integrated polishing liquid replenishing device.

[0023] A magnetic flow-float-chemical rheological polishing manufacturing device comprises a main rotating shaft, a polishing rotating shaft, a workpiece fixture, a polishing disc, a polishing workbench, a magnetic flux coil, a constant temperature chamber and a polishing liquid replenishing integrated device. The main rotating shaft, the polishing rotating shaft, a spring coil, a workpiece fixture, a flat workpiece, a polishing disc, a polishing workbench, a magnetic flux coil and a current control switch are arranged inside the constant temperature chamber. The left side of the constant temperature chamber is connected to the outlet of the polishing liquid replenishing integrated device, and the lower right part is connected to the inlet of the polishing liquid replenishing integrated device. The top of the polishing rotating shaft is connected to the main rotating shaft, and the polishing rotating shaft is arranged in a circle. cloth; a workpiece fixture is provided at the lower end of the polishing rotating shaft, a flat workpiece is installed on the workpiece fixture, and a spring ring is attached to the polishing rotating shaft; the main rotating shaft drives the polishing rotating shaft and the flat workpiece to perform orbital motion, the polishing rotating shaft drives the flat workpiece to perform rotational motion, and the polishing workbench drives the polishing disc to revolve; the main rotating shaft, the polishing rotating shaft, the spring ring, the workpiece fixture and the flat workpiece are all located at the upper end of the polishing workbench, and the polishing disc is installed on the polishing workbench on the same axis as the polishing rotating shaft; the magnetic flux coil is arranged inside the polishing workbench and is externally connected to a current control switch.

[0024] Furthermore, the integrated polishing liquid replenishing device includes a polishing replenishing device, a temperature control device, a supply pump, a polishing liquid conveying device and a polishing cycle starting device, and the polishing replenishing device, the temperature control device, the supply pump and the polishing liquid conveying device are arranged in sequence on the polishing liquid supply channel. The polishing cycle starting device is connected to the starting switch of the supply pump; the outlet of the integrated polishing liquid replenishing device is the outlet of the polishing liquid conveying device, and the inlet of the integrated polishing liquid replenishing device is the inlet of the polishing supply device.

[0025] Furthermore, the polishing disc is a grooved circular hole structure.

[0026] The beneficial effects of the present invention are mainly manifested in:

[0027] 1. The present invention utilizes float polishing, magnetorheology and green chemistry to synergistically improve processing efficiency and precision, and expand the processable materials (including difficult-to-process materials such as plastic, brittle, hard-brittle, soft-brittle, etc.).

[0028] 2. The present invention belongs to a flexible processing method. Under the action of the magnetic field control system, the polishing liquid with magnetic particles is highly consistent with the shape of the planar workpiece and the material is removed.

[0029] 3. Avoid damage to the workpiece surface. The traditional method uses hard abrasives to polish soft workpieces, which is difficult to avoid damage to the workpiece surface. However, in the polishing process of the present invention, when the abrasives and the workpiece rub against each other, the binding energy distribution of the two material surfaces overlaps, so that the surface atoms of the material with high strength may be removed by the impact of the surface atoms of the material with low strength, that is, the magnetic chemical abrasive thickening balls are used to process hard materials, and the workpiece material will not undergo plastic deformation and dislocation.

[0030] 4. The polishing disc has low requirements and high processing parallelism. Under the dynamic pressure liquid state, the flatness of the workpiece surface is higher than that of the polishing disc. Even if there is a slight unevenness on the surface of the polishing disc, it will not affect the surface flatness of the workpiece, and the polishing disc has very little wear during the polishing process.

[0031] 5. The raw materials of the polishing liquid used in the present invention are easy to obtain, green and environmentally friendly, low in cost, and the abrasive particles have good dispersion therein, do not interfere with the magnetic flux aggregation effect of the nanomagnetic particles, and can efficiently exert green chemical effects. The green chemical natural environmentally friendly substances can be natural green animal and plant extract substances, or can be affected by temperature (acidic and alkaline substances at room temperature, which can be neutral due to high temperature decomposition under the condition that the processing temperature changes to a certain value in the processing area during processing, and can be neutral without the presence of green chemical natural environmentally friendly substances when flowing out of the processing area), or some green chemical mixtures that can achieve acid-base neutral transformation only under the influence of concentration (guaranteeing the initial acidity and alkalinity, the chemical effect in the processing area, and the concentration is reduced to neutral).

[0032] 6. The present invention has relatively low requirements on processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 Schematic diagram of the magnetic flow-float-chemical rheological polishing manufacturing device.

[0034] Figure 2 This is a schematic diagram of the processing principle of the magnetic flow-float-chemical rheological polishing manufacturing device.

[0035] Figure 3 Schematic diagram of the atomic-level processing principle of this patent

[0036] Figure 4 Schematic diagram of the polishing component device.

[0037] Figure 5 Schematic diagram of the polishing disc device.

[0038] Among them, 1. Magnetic chemical abrasive thickening group; 2. Nano-magnetic particles; 3. Main rotating axis; 4. Constant temperature chamber; 5. Polishing rotating axis; 6. Spring coil; 7. Workpiece fixture; 8. Flat workpiece; 9. Polishing disk; 10. Polishing workbench; 11. Flux coil; 12. Current control switch; 13. Polishing liquid replenishing device; 14. Temperature control device; 15. Supply pump; 16. Polishing liquid delivery device; 17. Polishing liquid circulation start device; 18. Polishing liquid; 19. Green chemical environmentally friendly substances; 20. Filter, 21. Groove; 22. Circular hole; 301. Material removal; 302. Abrasive impact; 303. Workpiece surface atoms. DETAILED DESCRIPTION

[0039] The present invention will be further described below in conjunction with the accompanying drawings.

[0040] Reference Figure 1 to Figure 5 A magnetic flow-float-chemical rheological polishing manufacturing method uses magnetic polishing liquid to form a flexible polishing medium flow, and under the action of an external magnetic field and high-speed rotation, the flexible polishing medium flow floats up and down and continuously fits the workpiece surface. At this time, the magnetic chemical abrasive thickening group in the flexible floating polishing medium flow reacts with the workpiece surface and efficiently shears and removes the workpiece surface material. At the same time, under the action of centrifugal force, the magnetic chemical abrasive thickening group separates from the flexible polishing medium flow and impacts and removes the workpiece surface material at high speed; this "fitting" and "detaching" magnetic float chemical polishing method can achieve atomic and near-atomic scale polishing effects.

[0041] The method comprises the following steps:

[0042] (1) Fix the flat workpiece on the workpiece fixture on the polishing rotating axis in the equipment;

[0043] (2) preparing a polishing liquid, adding a magnetic chemical abrasive thickening mass, nano magnetic particles, a pH adjuster, a corrosion inhibitor, an oxidant and a green chemical environmentally friendly substance to ultrapure water at 5° C. to 50° C. to prepare a polishing liquid, wherein the polishing liquid comprises the following components in percentage by mass: a magnetic chemical abrasive thickening mass having a mass fraction of 2% to 20%, a pH adjuster having a mass fraction of 0.05% to 1.0%, a corrosion inhibitor having a mass fraction of 0.05% to 1.0%, an oxidant having a mass fraction of 0.05% to 0.1%, and a green chemical environmentally friendly substance having a mass fraction of 1% to 10%;

[0044] (3) Add the prepared polishing liquid to the polishing liquid supply device, turn on the polishing liquid circulation start device, so that the polishing liquid is supplied to the polishing workbench through the temperature control device, the supply pump, and the polishing liquid delivery device. The polishing disc must be completely immersed, and the processing environment temperature is maintained by the constant temperature chamber;

[0045] (4) Turn on the drive device and the current control switch. Under the action of the magnetic flux coil, the magnetic nanoparticles in the polishing liquid assist the magnetic chemical abrasive thickening group to produce a clustering effect to form a flexible polishing medium flow. Further, the polishing disc and the planar workpiece rotate in the same direction. At this time, the flexible polishing medium flow between the polishing disc and the planar workpiece surface floats up and down. At this time, the magnetic chemical abrasive thickening group in the flexible floating polishing medium flow reacts with the workpiece surface and efficiently shears and removes the workpiece surface material. At the same time, under the action of centrifugal force, the magnetic chemical abrasive thickening group separates from the flexible polishing medium flow and impacts and removes the workpiece surface material at high speed. This "fitting" and "detaching" magnetic float chemical composite polishing mechanism will be able to achieve an atomic and near-atomic scale removal effect, thereby realizing the magnetic flow-float-chemical rheological polishing processing and manufacturing of the workpiece material.

[0046] Furthermore, in the step (2), the magnetic chemical abrasive thickening group is a mixture of one or at least two or more of SiO2, CeO2, ZrO2, Ce2O3, Fe2O3, MgO, LiF, graphite and Al2O3, wherein the nanomagnetic particles include ferrite (Fe3O4), iron, cobalt, nickel and magnetic alloys.

[0047] Furthermore, in step (2), the pH adjuster is an aqueous ammonia solution, sodium hydroxide or potassium hydroxide, the oxidant is potassium permanganate or a hydrogen peroxide solution, and the green chemical environmentally friendly substance is a natural green animal and plant extract or a green chemical environmentally friendly mixture that can achieve acid-base neutral transformation.

[0048] Furthermore, in step (3), the polishing disc is a polishing disc with a grooved circular hole structure, which can have a good grip on the flexible polishing medium flow in the polishing liquid to prevent the polishing liquid from affecting the surface removal effect of the planar workpiece during the polishing process.

[0049] In the step (4), the planar workpiece is a crystalline material, and the workpiece is required to have high flatness and a surface roughness of no more than 35 nm.

[0050] In step (4), the current control switch is connected to a flux coil, which can provide a strong magnetic field. The size of the magnetic field can be changed by changing the number of turns of the flux coil, the current size provided by the power supply, and the presence or absence of an iron core, and the direction of the magnetic field can be changed by changing the direction of the current.

[0051] In the step (4), during the polishing process, when the polishing liquid or green chemical environmentally friendly substance needs to be replenished, it can be replenished by adding it to the polishing liquid replenishing device through the integrated polishing liquid replenishing device.

[0052] A magnetic flow-float-chemical rheological polishing manufacturing device comprises a main rotating shaft 3, a polishing rotating shaft 5, a workpiece fixture 7, a polishing disc 9, a polishing workbench 10, a magnetic flux coil 11, a constant temperature chamber 14 and a polishing liquid supplying integrated device.

[0053] A main rotating shaft 3, a polishing rotating shaft 5, a spring coil 6, a workpiece fixture 7, a planar workpiece 8, a polishing disc 9, a polishing workbench 10, a flux coil 11 and a current control switch 12 are arranged inside the constant temperature chamber 4. The left side of the constant temperature chamber 4 is connected to the outlet of the polishing liquid delivery device 16, and the lower right part is connected to the inlet of the polishing supply device 13. The top of the polishing rotating shaft 5 is connected to the main rotating shaft 3 and arranged in a circle; a workpiece fixture 7 is provided at the lower end of the polishing rotating shaft 5, and a planar workpiece 8 is installed on the workpiece fixture 7. The polishing rotating shaft 5 is attached There is a spring ring 6; the main rotating shaft 3 drives the polishing rotating shaft 5 and the planar workpiece 8 to perform orbital motion, the polishing rotating shaft 5 drives the planar workpiece 8 to rotate, and the polishing workbench 10 drives the polishing disk 9 to revolve; the main rotating shaft 3, the polishing rotating shaft 5, the spring ring 6, the workpiece fixture 7 and the planar workpiece 8 are all located at the upper end of the polishing workbench 10, and the polishing disk 9 is installed on the polishing workbench and is on the same axis as the polishing rotating shaft 5; the magnetic flux coil 11 is arranged inside the polishing workbench 10, and an external current control switch 12 is connected.

[0054] The polishing liquid replenishing integrated device comprises a polishing replenishing device 13, a temperature control device 14, a supply pump 15, a polishing liquid conveying device 16 and a polishing circulation starting device 17. The polishing liquid replenishing channel is sequentially provided with the polishing replenishing device 13, the temperature control device 14, the supply pump 15 and the polishing liquid conveying device 16. The polishing circulation starting device 17 is connected to the starting switch of the supply pump 15. The outlet of the polishing liquid replenishing integrated device is the outlet of the polishing liquid conveying device, and the inlet of the polishing liquid replenishing integrated device is the inlet of the polishing replenishing device. The configured polishing liquid 18 is added to the polishing liquid replenishing device 13, and the polishing liquid circulation starting device 17 is turned on, so that the polishing liquid 18 is supplied to the surface of the planar workpiece 8 through the temperature control device 14, the supply pump 15 and the polishing liquid conveying device 16, and then the processing environment temperature is ensured by the constant temperature chamber 4. During the polishing process, when the polishing liquid 18 or the green chemical environmental protection material 19 needs to be replenished, it can be replenished by adding it to the polishing liquid replenishing device 13 through the polishing liquid replenishing integrated device.

[0055] The green chemical environmentally friendly substance 19 can be a natural green animal and plant extract substance, or it can be affected by temperature (acidic and alkaline substance at room temperature, which can be neutral due to high-temperature decomposition when the processing temperature changes to a certain value in the processing area during processing, and can be neutral without green chemical natural environmentally friendly substances when flowing out of the processing area), or some green chemical mixtures that can only achieve acid-base neutral transformation due to concentration (ensuring the initial acidity and alkalinity, the processing area exerts chemical effects, and the concentration decreases to neutral).

[0056] The polishing disc 9 is a polishing disc 9 with a grooved circular hole structure, which can have a good holding force on the polishing liquid 18 to prevent the polishing liquid 18 from affecting the surface removal effect of the planar workpiece 8 during the polishing process. Figure 5 As shown, the upper figure is a top view of the polishing disc, the lower figure is an interface view of the polishing disc, 21 is a groove, and 22 is a circular hole.

[0057] The spring ring 6 can reduce the impact of the polishing disc 9 on the planar workpiece 8 and increase the smoothness of the polishing of the planar workpiece 8.

[0058] The flux coil 11 can provide a strong magnetic field. The size of the magnetic field can be changed by changing the number of turns of the flux coil 11, the current provided by the power supply, and the presence or absence of an iron core. The direction of the magnetic field can be changed by changing the direction of the current.

[0059] The constant temperature chamber 4 not only provides a stable constant temperature condition for the polishing liquid 18, but also provides a dustproof effect. The left end of the constant temperature chamber 4 is connected to the input port of the polishing liquid conveying device 16, and the bottom is connected to the polishing liquid outlet. A filter 20 is left at the outlet. The filter 20 includes a multi-dimensional filter device that uses hierarchical and multi-dimensional filtering to filter processing debris and processing impurities, a polishing liquid effective substance collector, etc. Among them: metal materials can be separated by considering electromagnetic force effects and vibrations; hard and brittle materials can be separated by particle size stratification screening and other methods.

[0060] The temperature control device of the polishing liquid 18 can adjust the temperature of the polishing liquid 18 to 25° C. to 50° C., and can quickly adjust the temperature to a suitable range by arranging a “U”-shaped cooling method with low-temperature water.

[0061] The contents described in the embodiments of this specification are merely enumerations of implementation forms of the inventive concept and are for illustrative purposes only. The protection scope of the present invention should not be considered to be limited to the specific forms described in this embodiment, and the protection scope of the present invention also extends to equivalent technical means that can be thought of by ordinary technicians in this field based on the inventive concept.

Claims

1. A magnetic flow-float-chemical rheological polishing manufacturing method, characterized in that: A magnetic polishing liquid is used to form a flexible polishing medium flow, which is made to float up and down and continuously fit the workpiece surface under the action of an external magnetic field and high-speed rotation. At this time, the magnetic chemical abrasive thickening group in the flexible floating polishing medium flow reacts with the workpiece surface and efficiently shears and removes the workpiece surface material. At the same time, under the action of centrifugal force, the magnetic chemical abrasive thickening group separates from the flexible polishing medium flow and impacts at high speed to remove the workpiece surface material. This "fitting" and "detaching" magnetic float chemical polishing method can achieve atomic and near-atomic scale polishing effects.

2. A magnetic flow-float-chemical rheological polishing manufacturing method as claimed in claim 1, characterized in that: The method comprises the following steps: (1) Fix the flat workpiece on the workpiece fixture on the polishing rotating axis in the equipment; (2) preparing a polishing liquid, adding a magnetic chemical abrasive thickening mass, nano magnetic particles, a pH adjuster, a corrosion inhibitor, an oxidant and a green chemical environmentally friendly substance to ultrapure water at 5° C. to 50° C. to prepare a polishing liquid, wherein the polishing liquid comprises the following components in percentage by mass: a magnetic chemical abrasive thickening mass having a mass fraction of 2% to 20%, a pH adjuster having a mass fraction of 0.05% to 1.0%, a corrosion inhibitor having a mass fraction of 0.05% to 1.0%, an oxidant having a mass fraction of 0.05% to 0.1%, and a green chemical environmentally friendly substance having a mass fraction of 1% to 10%; (3) Add the prepared polishing liquid to the polishing liquid supply device, turn on the polishing liquid circulation start device, so that the polishing liquid is supplied to the polishing workbench through the temperature control device, the supply pump, and the polishing liquid delivery device. The polishing disc must be completely immersed, and the processing environment temperature is maintained by the constant temperature chamber; (4) Turn on the drive device and the current control switch. Under the action of the magnetic flux coil, the magnetic nanoparticles in the polishing liquid assist the magnetic chemical abrasive thickening group to produce a clustering effect to form a flexible polishing medium flow. Further, the polishing disc and the planar workpiece rotate in the same direction. At this time, the flexible polishing medium flow between the polishing disc and the planar workpiece surface floats up and down. At this time, the magnetic chemical abrasive thickening group in the flexible floating polishing medium flow reacts with the workpiece surface and efficiently shears and removes the workpiece surface material. At the same time, under the action of centrifugal force, the magnetic chemical abrasive thickening group separates from the flexible polishing medium flow and impacts and removes the workpiece surface material at high speed. This "fitting" and "detaching" magnetic float chemical composite polishing mechanism will be able to achieve an atomic and near-atomic scale removal effect, thereby realizing the magnetic flow-float-chemical rheological polishing processing and manufacturing of workpiece materials.

3. A magnetic flow-float-chemical rheological polishing manufacturing method as claimed in claim 2, characterized in that: In the step (2), the magnetic chemical abrasive thickening mass is a mixture of one or two or more of SiO2, CeO2, ZrO2, Ce2O3, Fe2O3, MgO, LiF, graphite and Al2O3, wherein the nanomagnetic particles include ferrite (Fe3O4), iron, cobalt, nickel and magnetic alloys.

4. A magnetic flow-float-chemical rheological polishing manufacturing method as claimed in claim 2 or 3, characterized in that: In step (2), the pH adjuster is an aqueous ammonia solution, sodium hydroxide or potassium hydroxide, the oxidant is potassium permanganate or a hydrogen peroxide solution, and the green chemical environmentally friendly substance is a natural green animal and plant extract or a green chemical environmentally friendly mixture that can achieve acid-base neutral transformation.

5. A magnetic flow-float-chemical rheological polishing manufacturing method as claimed in claim 2 or 3, characterized in that: In the step (3), the polishing disc is a polishing disc with a grooved circular hole structure, which can have a good grip on the flexible polishing medium flow in the polishing liquid to prevent the polishing liquid from affecting the surface removal effect of the planar workpiece during the polishing process.

6. A magnetic flow-float-chemical rheological polishing manufacturing method as claimed in claim 2 or 3, characterized in that: In the step (4), the planar workpiece is a crystalline material, and the workpiece is required to have high flatness and a surface roughness of no more than 35 nm.

7. A magnetic flow-float-chemical rheological polishing manufacturing method as claimed in claim 2 or 3, characterized in that: In step (4), the current control switch is connected to a flux coil, which can provide a strong magnetic field. The size of the magnetic field can be changed by changing the number of turns of the flux coil, the current size provided by the power supply, and the presence or absence of an iron core, and the direction of the magnetic field can be changed by changing the direction of the current.

8. A magnetic flow-float-chemical rheological polishing manufacturing method as claimed in claim 2 or 3, characterized in that: In the step (4), during the polishing process, when the polishing liquid or green chemical environmentally friendly substance needs to be replenished, it can be replenished by adding it to the polishing liquid replenishing device through the integrated polishing liquid replenishing device.

9. A device for implementing the magnetic flow-float-chemical rheological polishing manufacturing method as claimed in claim 1, characterized in that: The device comprises a main rotating shaft, a polishing rotating shaft, a workpiece fixture, a polishing disc, a polishing workbench, a magnetic flux coil, a constant temperature chamber and a polishing liquid replenishing integrated device. The main rotating shaft, the polishing rotating shaft, a spring coil, a workpiece fixture, a planar workpiece, a polishing disc, a polishing workbench, a magnetic flux coil and a current control switch are arranged inside the constant temperature chamber. The left side of the constant temperature chamber is connected to the outlet of the polishing liquid replenishing integrated device, and the lower right part is connected to the inlet of the polishing liquid replenishing integrated device. The top end of the polishing rotating shaft is connected to the main rotating shaft and arranged in a circle; the lower end of the polishing rotating shaft is provided with a workpiece fixture, on which a planar workpiece is mounted, and a spring coil is attached to the polishing rotating shaft; the main rotating shaft drives the polishing rotating shaft and the planar workpiece to perform an orbital motion together, the polishing rotating shaft drives the planar workpiece to perform a self-rotation motion, and the polishing workbench drives the polishing disc to orbit; the main rotating shaft, the polishing rotating shaft, the spring coil, the workpiece fixture and the planar workpiece are all located at the upper end of the polishing workbench, and the polishing disc is mounted on the polishing workbench and is on the same axis as the polishing rotating shaft; the magnetic flux coil is arranged inside the polishing workbench and is externally connected to a current control switch.

10. The device according to claim 9, characterized in that The integrated polishing liquid replenishing device includes a polishing replenishing device, a temperature control device, a supply pump, a polishing liquid conveying device and a polishing cycle starting device. The polishing replenishing device, the temperature control device, the supply pump and the polishing liquid conveying device are arranged in sequence on the polishing liquid supply channel. The polishing cycle starting device is connected to the starting switch of the supply pump; the outlet of the integrated polishing liquid replenishing device is the outlet of the polishing liquid conveying device, and the inlet of the integrated polishing liquid replenishing device is the inlet of the polishing supply device.

Citation Information

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