Light-emitting assembly, display panel and preparation method of light-emitting assembly

Abstract

The embodiment of the invention provides a light-emitting assembly, a display panel and a preparation method of the light-emitting assembly. The light-emitting assembly comprises a light-emitting unit and a light-emitting unit, wherein the light-emitting unit comprises a first electrode, a second electrode and a light-emitting part; the driving unit comprises a third electrode, a fourth electrode and a driving part, the third electrode and the fourth electrode are both located on the side, facing the light-emitting unit, of the driving unit, the third electrode is electrically connected with the first electrode, and the fourth electrode is electrically connected with the second electrode; the plurality of pins are located on one side, deviating from the light-emitting unit, of the driving unit and are electrically connected with the driving circuit; a first filling part, a second filling part and a third filling part are arranged between the light-emitting unit and the driving unit; the first filling part surrounds the second filling part and the third filling part, and the thickness of the first filling part is greater than that of the second filling part and the third filling part; the second filling part is in contact with the first electrode and the third electrode respectively; and the third filling part is respectively in contact with the second electrode and the fourth electrode.

Description

Technical Field

[0001] The present disclosure relates to the display field, and in particular to a light-emitting component, a display panel, and a method for preparing the light-emitting component. Background Art

[0002] Micro light emitting diode (Micro LED) display panel includes a driving unit integrated on the display backplane and a light emitting chip bonded to the driving unit, wherein the driving unit is located inside the display backplane and integrated with the backplane through semiconductor processing technology. However, it is difficult to repair individual defects of the driving unit, resulting in a low production yield of the display backplane and a large number of bad pixels on the final display panel. Summary of the invention

[0003] In view of this, the embodiments of the present disclosure propose a light-emitting component, a display panel and a method for preparing the light-emitting component to solve the following problems in the prior art: it is difficult to repair individual defects of the driving unit during the preparation process of the existing Micro LED display panel, and there are many bad pixels on the display panel.

[0004] On the one hand, the embodiment of the present disclosure proposes a light-emitting component, comprising: a light-emitting unit, the light-emitting unit comprising a first electrode, a second electrode and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; a driving unit, the driving unit comprising a third electrode, a fourth electrode and a driving portion, the third electrode and the fourth electrode are both located on the side of the driving unit facing the light-emitting unit, the third electrode and the fourth electrode are respectively electrically connected to a driving circuit in the driving portion, the third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode; a plurality of pins, the plurality of pins are all located on the side of the driving unit away from the light-emitting unit and are electrically connected to the driving circuit; wherein a first filling portion, a second filling portion and a third filling portion are included between the light-emitting unit and the driving unit; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion; the second filling portion is located between the first electrode and the third electrode, and is respectively in contact with the first electrode and the third electrode; the third filling portion is located between the second electrode and the fourth electrode, and is respectively in contact with the second electrode and the fourth electrode.

[0005] In some embodiments, at least one of the plurality of pins includes a first metal layer and a second metal layer stacked together, the first metal layer being located between the second metal layer and the driving unit; wherein the material of the first metal layer includes nickel, and the material of the second metal layer includes gold.

[0006] In some embodiments, the first filling portion is insulating, the second filling portion is conductive, and the third filling portion is conductive; the first filling portion is in direct contact with the second filling portion; the first filling portion is in direct contact with the third filling portion; and a portion of the first filling portion is located between the second filling portion and the third filling portion.

[0007] In some embodiments, the density of the first filling portion is less than the density of the second filling portion; and the density of the first filling portion is less than the density of the third filling portion.

[0008] In some embodiments, the light emitting component includes a transparent substrate, and the transparent substrate is located on a side of the light emitting unit away from the driving substrate; the orthographic projection of the first filling portion on the plane where the transparent substrate is located is located inside the transparent substrate.

[0009] In some embodiments, an outer contour of the orthographic projection of the first filling portion on the plane where the transparent substrate is located coincides with an outer contour of the transparent substrate.

[0010] In some embodiments, the light-emitting component includes a transparent substrate, which is located on a side of the light-emitting unit away from the driving substrate; the light-emitting unit includes a light-emitting part, which includes: a raised electrode, a first insulating layer, and a first doped layer, a multi-quantum well layer, and a second doped layer stacked in sequence away from the transparent substrate; wherein the second electrode is located on a side of the second doped layer away from the multi-quantum well layer, and the second doped layer is electrically connected to the second electrode; the raised electrode is located between the first doped layer and the first electrode, and is electrically connected to the first doped layer and the first electrode, respectively; the first insulating layer is located on a side of the first doped layer away from the transparent substrate and is arranged in contact with the first doped layer.

[0011] In some embodiments, the first filling portion includes a first sub-filling portion and a second sub-filling portion; the orthographic projection of the first sub-filling portion on the plane where the transparent substrate is located does not overlap with the orthographic projection of the light-emitting unit on the plane where the transparent substrate is located; wherein the second sub-filling portion is at least partially located between the raised electrode and the multi-quantum well layer, and the first sub-filling portion surrounds the overall arrangement of the raised electrode, the multi-quantum well layer, and the second sub-filling portion.

[0012] In some embodiments, the thickness of the first sub-filling portion is greater than or equal to the distance between the first insulating layer and the driving portion; the thickness of the second sub-filling portion is equal to the maximum distance between the first insulating layer and the driving portion.

[0013] In some embodiments, the first sub-filling portion includes at least a portion located between the transparent substrate and the driving portion; the relationship between the thickness T1 of the portion located between the transparent substrate and the driving portion and the thickness T2 of the second sub-filling portion satisfies: 0.5T1 <T2<0.95T1。

[0014] In some embodiments, the light-emitting component includes multiple light-emitting units and the driving unit corresponding to the multiple light-emitting units; the multiple light-emitting units include a first color light-emitting unit, a second color light-emitting unit and a third color light-emitting unit, wherein the first color, the second color and the third color are different from each other; the light-emitting unit includes a color film layer (1014), a color conversion layer and a light-emitting part stacked in sequence along a direction away from the transparent substrate; the light-emitting color of the light-emitting part is blue; wherein the light-emitting part includes a first light-emitting part, a second light-emitting part and a third light-emitting part, the first light-emitting part is located in the first color light-emitting unit, the second light-emitting part is located in the second color light-emitting unit, and the third light-emitting part is located in the third color light-emitting unit.

[0015] In some embodiments, the driving unit also includes a substrate and a connecting structure, the substrate has a connecting via, the connecting structure is located in the connecting via, and the driving circuit is located on one side of the substrate; the pin is located on a side of the substrate away from the driving circuit, and the pin is in contact with the connecting structure, and the pin and the driving circuit are connected through the connecting structure.

[0016] In some embodiments, the driving circuit includes multiple thin film transistors and at least one storage capacitor, each of the thin film transistors includes a gate, a source and a drain; one of the multiple pins is connected to the source of a thin film transistor among the multiple thin film transistors, and is used to provide the driving circuit with a data driving signal transmitted from a display backplane in a display panel.

[0017] In some embodiments, the driving circuit includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source-drain layer and a planar layer, which are located on one side of the substrate and stacked in sequence; the third electrode and the fourth electrode are located on a side of the planar layer away from the substrate; the active layer includes a plurality of active patterns corresponding to the plurality of thin film transistors, each of the active patterns includes a source region, a drain region and a channel region; the source and the drain of the thin film transistor are located in the source-drain layer, the source of the thin film transistor is connected to the source region, and the drain of the thin film transistor is connected to the drain region; the first gate layer includes a plurality of gate patterns corresponding to the plurality of thin film transistors, and the channel region is an overlapping area of ​​an orthographic projection of the gate pattern on the substrate and an orthographic projection of the active pattern on the substrate.

[0018] In some embodiments, the area of ​​the orthographic projection of the pin on the substrate is larger than the area of ​​the orthographic projection of the connection structure on the substrate, and the orthographic projection of the pin on the substrate covers the orthographic projection of the connection structure on the substrate.

[0019] On the other hand, an embodiment of the present disclosure proposes a display panel, which includes a display backplane, and a plurality of light-emitting components described in any embodiment of the present disclosure, which are located on one side of the display backplane and arranged in an array; wherein the display backplane is used to provide a driving signal to a driving unit through a plurality of pins in the light-emitting component, so that the driving unit drives the light-emitting unit to emit light.

[0020] On the other hand, an embodiment of the present disclosure proposes a method for preparing a light-emitting component, which is used to prepare the light-emitting component provided by any embodiment of the present disclosure, comprising: pressing an anisotropic conductive film (ACF) to be compressed, a light-emitting unit and a driving unit to obtain a bonded light-emitting component, wherein the pressed anisotropic conductive film comprises: a first filling portion, a second filling portion and a third filling portion; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion; the second filling portion is located between the first electrode of the light-emitting unit and the third electrode of the driving unit, and is respectively in contact with the first electrode and the third electrode; the third filling portion is located between the second electrode of the light-emitting unit and the fourth electrode of the driving unit, and is respectively in contact with the second electrode and the fourth electrode; placing the bonded light-emitting component in a target solution for electroplating or chemical plating process to obtain a light-emitting component having multiple pins on the driving unit.

[0021] The disclosed embodiment provides a light-emitting component, which bonds a light-emitting unit to a driving unit to form a new active chip with its own driving circuit. The light-emitting component and the display backplane only need a one-time transfer bonding, and the process is simple, which improves the product yield. The interval gap between the light-emitting unit and the driving unit is filled with a first filling part, and the thickness of the first filling part is greater than the thickness of the second filling part and the third filling part, thereby at least protecting the second filling part and the third filling part from corrosion during the electroplating of the pins. By controlling the set thickness of the first filling part, it can be ensured that the second filling part, the third filling part, and even the electrode of the light-emitting component are not corroded by the plating solution, and the light-emitting component will not have short circuit or device failure problems, thereby improving product performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0023] Figure 1 A schematic cross-sectional structure diagram of a light emitting assembly provided in an embodiment of the present disclosure;

[0024] Figure 2 A schematic cross-sectional structure diagram of a light-emitting component provided in an embodiment of the present disclosure without a first filling portion;

[0025] Figure 3 A schematic diagram of the enclosing of a first filling portion and a light-emitting unit provided in an embodiment of the present disclosure;

[0026] Figure 4 A process flow chart for preparing a light-emitting component provided in an embodiment of the present disclosure;

[0027] Figure 5 A schematic diagram of the cross-sectional structure of a light-emitting component provided in an embodiment of the present disclosure;

[0028] Figure 6 A flow chart of a method for preparing a light-emitting component provided in an embodiment of the present disclosure.

[0029] Reference numerals:

[0030] first electrode 1, second electrode 2, third electrode 3, fourth electrode 4, light emitting portion 5, driving portion 6, pin 7, second filling portion 8, third filling portion 9, first filling portion 10, first thickness portion 101, second thickness portion 102, first sub-filling portion 11, second sub-filling portion 12, thickness T1 of the first sub-filling portion, thickness T2 of the second sub-filling portion;

[0031] Raised electrode 51, first doped layer 52, multi-quantum well layer 53, second doped layer 54, color conversion layer 55, color filter layer 56, transparent substrate 57, first insulating layer 58, first part 581, second part 582, third part 583;

[0032] Substrate 61 , planar layer 62 , driving circuit 63 , connection structure 64 . DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0034] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0035] In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of well-known functions and well-known components.

[0036] The present disclosure provides a light emitting component, the cross-sectional structure of which is shown as follows: Figure 1 As shown, including:

[0037] A light-emitting unit, the light-emitting unit comprising a first electrode 1, a second electrode 2, and a light-emitting portion 5 electrically connected to the first electrode 1 and the second electrode 2 respectively;

[0038] A driving unit, the driving unit comprises a third electrode 3, a fourth electrode 4 and a driving part 6, the third electrode 3 and the fourth electrode 4 are both located on a side of the driving unit facing the light-emitting unit, the third electrode 3 and the fourth electrode 4 are electrically connected to a driving circuit 63 in the driving part 6, respectively, the third electrode 3 is electrically connected to the first electrode 1, and the fourth electrode 4 is electrically connected to the second electrode 2;

[0039] A plurality of pins 7, wherein the plurality of pins 7 are all located at a side of the driving unit away from the light-emitting unit and are electrically connected to the driving circuit 63;

[0040] Among them, a first filling portion 10, a second filling portion 8 and a third filling portion 9 are included between the light-emitting unit and the driving unit; the first filling portion 10 surrounds the second filling portion 8 and the third filling portion 9, and the thickness of the first filling portion 10 is greater than the thickness of the second filling portion 8 and the third filling portion 9; the second filling portion 8 is located between the first electrode 1 and the third electrode 3, and is respectively in contact with the first electrode 1 and the third electrode 3; the third filling portion 9 is located between the second electrode 2 and the fourth electrode 4, and is respectively in contact with the second electrode 2 and the fourth electrode 4.

[0041] Related technology When preparing Micro LED display panels, in order to achieve color display, it is necessary to transfer and bond light-emitting chips of different colors to a display backplane integrated with a drive unit, and the light-emitting chips of the same color are transferred at the same time, and the light-emitting chips of different colors are transferred in batches. That is, the number of transfers is the number of colors of the light-emitting chip. Optionally, the light-emitting chip includes light-emitting chips of three colors, such as a red (red, R) light-emitting chip, a green (green, G) light-emitting chip, and a blue (blue) light-emitting chip, and three transfers are required. This solution requires more transfers when preparing Micro LED display panels, and the process is more complicated.

[0042] In addition, in order to reduce the manufacturing cost of Micro LED display panels, the size of the display backplane will not be designed to be too large, because if the size is designed to be too large, if some of the light-emitting chips fail to emit light after transfer, the entire product will be scrapped, and the cost will be high. Therefore, if this solution needs to achieve large-size display, it can only be achieved through splicing, and the display effect is poor.

[0043] The disclosed embodiment bonds the display chip to the driving unit separately. For the red, green and blue micro display chip (RGB Micro LED), it can be bonded to the driving unit to form a new active-matrix light-emitting diode (AM-LED) chip with its own driving circuit 63. The AM-LED chip includes light-emitting chips of three colors, red, green and blue, and a driving unit for driving the light-emitting chip. Furthermore, the corresponding number of AM-LED chips and the display backplane are used for one-time transfer bonding according to the size of the display panel to achieve the preparation of a glass-based color light-emitting diode (LED) display panel. At the same time, this solution only requires one transfer process, and the process is relatively simple. In addition, large-size display can be achieved without splicing, which can improve the glass utilization rate of the display backplane, thereby reducing costs.

[0044] Furthermore, the AM-LED chip can realize electrical / optical dual detection through detection technology, and screen out chips that meet the requirements of optical performance and driving performance. In this way, compared with the solution of integrating the driving circuit 63 on the display backplane to form a display panel, it is more conducive to improving the chip yield on the display panel and is also convenient for repairing and replacing defective chips.

[0045] Before the AM-LED chip is bonded to the display backplane, a pin 7 (Bump) for bonding connection needs to be made on the AM-LED chip, and the pin 7 is usually prepared by electroplating or chemical plating. When preparing the pin 7 in the electroplating or chemical plating process, the AM-LED chip needs to be placed in a specific solution. Since the electrodes after the AM-LED chip and the driving unit are bonded and connected are in contact with the solution, short circuit, open circuit or device failure may occur. The cross-sectional structure of the above-mentioned light-emitting component without the first filling part 10 can be as follows: Figure 2 As shown, the gaps therein may allow the plating liquid to penetrate during the electroplating process of the pins 7 .

[0046] However, in the embodiment of the present disclosure, the first filling portion 10 is filled in the interval gap between the electrical connection part of the light-emitting unit and the driving unit, and the thickness of the first filling portion 10 is greater than the thickness of the second filling portion 8 and the third filling portion 9, thereby at least protecting the second filling portion 8 and the third filling portion 9 from corrosion during the electroplating process of the pin 7. By controlling the setting thickness of the first filling portion 10, it can be ensured that the second filling portion 8, the third filling portion 9, and even the electrode of the light-emitting component are not corroded by the electroplating solution, and the light-emitting component will not have short circuit or device failure problems, thereby further improving product performance.

[0047] In a specific implementation, the thicker the thickness of the first filling portion 10 is, the less the exposed first electrode 1 and the second electrode 2 are, and in the subsequent process of electroplating the pin 7, the less the first electrode 1 and the second electrode 2 are corroded by the plating solution. In an optional embodiment, the thickness of the first filling portion 10 is set to be greater than the sum of the thickness of the first electrode 1, the thickness of the third electrode 3 and the thickness of the second filling portion 8; since the thickness of the second electrode 2 is the same as the thickness of the first electrode 1, the thickness of the fourth electrode 4 is the same as the thickness of the third electrode 3, and the thickness of the third filling portion 9 is the same as the thickness of the second filling portion 8, the thickness of the first filling portion 10 may also be greater than the sum of the thickness of the second electrode 2, the thickness of the fourth electrode 4 and the thickness of the third filling portion 9.

[0048] In some embodiments, the thickness of the first filling part 10 is greater than the sum of the thickness of the first electrode 1 , the thickness of the third electrode 3 , and the thickness of the second filling part 8 . Figure 1 The first filling portion 10 has at least a first thickness and a second thickness, the first thickness is greater than the distance between the first surface of the light-emitting portion 5 and the first surface of the driving portion 6, and is less than or equal to the distance between the second surface of the light-emitting portion 5 and the first surface of the driving portion 6; the second thickness is less than or equal to the distance between the first surface of the light-emitting portion 5 and the first surface of the driving portion 6; wherein the second surface of the light-emitting portion 5 is a surface of the light-emitting portion 5 away from the driving portion 6, and the first surface of the driving portion 6 and the first surface of the light-emitting portion 5 are arranged opposite to each other.

[0049] In some embodiments, the first filling part 10 is disposed around the light emitting unit, and the light emitting unit includes a plurality of electrodes connected to the driving unit, and the plurality of electrodes include a first electrode 1 and a second electrode 2. Figure 3 , the number of electrodes is, for example, 4, including 3 first electrodes 1 and 1 second electrode 2, wherein the 3 first electrodes 1 correspond to the red, green and blue sub-pixels of the light-emitting unit, respectively, and provide driving signals for the 3 sub-pixels respectively; 1 second electrode 2 is electrically connected to the red, green and blue sub-pixels, respectively, as a common electrode; correspondingly, the driving unit also has 4 electrodes electrically connected to the 4 electrodes of the light-emitting unit respectively. For example, the first electrode 1 can be the anode of the light-emitting unit, and the second electrode 2 can be the cathode of the light-emitting unit. For example, the first electrode 1 can be the cathode of the light-emitting unit, and the second electrode 2 can be the anode of the light-emitting unit. For example, in order to ensure that the first filling portion 10 has a better protection effect, refer to Figure 3, the first filling portion 10 has a first thickness and a second thickness, wherein the first thickness portion 101 is arranged around the second thickness portion 102, and the first thickness portion 101 and the second thickness portion 102 are arranged in contact, wherein the minimum distance n between the inner boundary and the outer boundary of the first thickness portion 101 is greater than or equal to 20 microns. In a specific embodiment, the orthographic projection of the inner boundary of the first thickness portion 101 on the plane where the driving portion 6 is located coincides with the orthographic projection of the light-emitting portion 5 on the plane where the driving portion 6 is located. It should be noted that the plane where the driving portion 6 is located can be understood as a plane perpendicular to the stacking direction of the film layer of the driving portion 6.

[0050] In some embodiments, the first filling portion 10 is in direct contact with the second filling portion 8, and the first filling portion 10 is also in direct contact with the third filling portion 9. A portion of the first filling portion 10 is located between the second filling portion 8 and the third filling portion 9, that is, located in the interval gap (i.e., the gap between the anode and the cathode of the light-emitting unit due to the inability to contact each other) Figure 2 The spaced gap in the middle will also be filled with the first filling part 10. The first filling part 10 surrounds the second filling part 8 and the third filling part 9, completely surrounding the second filling part 8 and also completely surrounding the third filling part 9.

[0051] In order to ensure that the basic functions of the light-emitting component are not destroyed, the first filling part 10 should be insulating, the second filling part 8 should be conductive, and the third filling part 9 should also be conductive. The first filling part 10, the second filling part 8, and the third filling part 9 can be made of different materials or the same material. If the first filling part 10, the second filling part 8, and the third filling part 9 are made of different materials, it is necessary to add an additional process for preparing the first filling part 10 compared to preparing them with the same material.

[0052] Since the conductivity of the first filling part 10, the second filling part 8 and the third filling part 9 are different, it is necessary to consider that the material should have different conductivity in different states when selecting the same preparation material. The embodiment of the present disclosure selects anisotropic conductive film (ACF) as an example. The anisotropic conductive film is insulating in a normal state or when it is not compressed to a certain proportion, and starts to be conductive after being compressed to a certain proportion.

[0053] In some embodiments, the process flow of using anisotropic conductive adhesive to prepare a light-emitting component can be as follows: Figure 4As shown in the figure, first, prepare an independent driving unit, a light-emitting unit, and an anisotropic conductive film. Then, bond the light-emitting unit and the driving unit according to a predetermined processing technology to compress the anisotropic conductive film between the first electrode 1 and the third electrode 3 into a second filling portion 8, and compress the anisotropic conductive film between the second electrode 2 and the fourth electrode 4 into a third filling portion 9. The other anisotropic conductive films form a first filling portion 10. Subsequently, remove the glass substrate on the lower side of the driving unit, and prepare pins 7 connected to the electrodes of the driving unit on the surface after removing the glass substrate. Then, connect to the data line through the pins 7 to receive control signals.

[0054] To ensure that the first filling portion 10 can play a sufficient protective role, the density of the first filling portion 10 should be less than the density of the second filling portion 8, and the density of the first filling portion 10 should also be less than the density of the third filling portion 9. Thus, the first filling portion 10 can tightly wrap around the outside of the second filling portion 8 and the third filling portion 9 to avoid corrosion by the electroplating solution during the electroplating process.

[0055] In some embodiments, the second thickness portion 102, the second filling portion 8, and the third filling portion 9 are formed by compressing the anisotropic conductive film; the relationship between the thickness M1 of the second thickness portion 102 before being compressed and the second thickness M2 satisfies: 0.5M1 < M2 < 0.95M1. M2 being less than 95% of M1 can avoid defects such as bubbles and delamination caused by insufficient filling of the second sub-filling portion 12 in the thickness direction. At the same time, M2 being greater than 50% of M1 can avoid the second sub-filling portion 12 overflowing due to the excessive thickness of the filling portion, resulting in fewer conductive particles in the second filling portion 8 and the third filling portion 9, thereby causing poor conductivity. For example, the second thickness can be determined in the following way: M2 = k * d + l, where k is the upper limit of the compression ratio that makes the conductive particles have good conductivity in the ACF conductive adhesive, d is the average particle size of the conductive particles in the compression direction before compression, and l is the sum of the distance between the surface of the first electrode 1 close to the second electrode 2 and the light-emitting portion 5 and the distance between the surface of the third electrode 3 close to the second electrode 2 and the driving portion 6. Therefore, k * d is the minimum compression degree that makes the conductive particles conductive in the compression direction. For example, if the average particle size in the compression direction is 2 microns, and the good conductivity range for compressing the conductive particles is 20% - 80%, then d is taken as 2 microns and k1 is taken as 80%. In this way, it can guide how to design the second thickness M2.

[0056] Since the embodiments of the present disclosure involve the first electrode 1 and the second electrode 2 of the light-emitting unit, and the third electrode 3 and the fourth electrode 4 of the driving unit, so Figure 1The main structure of the light-emitting unit 5 and the driving unit 6 is only shown in a schematic manner. The specific structures of the light-emitting unit and the driving unit do not limit the embodiments of the present disclosure. As long as the first electrode 1 and the third electrode 3 are electrically connected, the second electrode 2 and the fourth electrode 4 are electrically connected, and there is a gap around the two electrically connected parts after connection, the solution provided by the embodiments of the present disclosure is applicable.

[0057] The disclosed embodiment provides a light-emitting component, which bonds a light-emitting unit to a driving unit to form a new active chip with a built-in driving circuit 63. The light-emitting component and the display backplane only need a one-time transfer bonding, and the process is simple, which improves the product yield. The first filling part 10 is filled in the interval gap between the electrical connection part of the light-emitting unit and the driving unit. The thickness of the first filling part 10 is greater than the thickness of the second filling part 8 and the third filling part 9, and thus can at least protect the second filling part 8 and the third filling part 9 from being corroded during the electroplating process of the pin 7. By controlling the setting thickness of the first filling part 10, it can be ensured that the second filling part 8, the third filling part 9, and even the electrode of the light-emitting component are not corroded by the electroplating solution, the light-emitting component will not have short circuit or device failure problems, and the product performance is improved.

[0058] The pin 7 of the embodiment of the present disclosure is formed by electroplating, and at least one pin 7 among the plurality of pins 7 includes a first metal layer and a second metal layer stacked, and the first metal layer is located between the second metal layer and the driving unit; the material of the first metal layer may include nickel, and the material of the second metal layer may include gold. The pin 7 designed in this way may be fixedly connected to the pad of the back plate through a welding process in a subsequent process.

[0059] like Figure 4 As shown, the light emitting assembly of the embodiment of the present disclosure includes a transparent substrate 57, which is located on a side of the light emitting unit away from the driving substrate. The transparent substrate 57 may be a glass substrate, for example. Figure 4 As shown, in an optional embodiment, the orthographic projection of the first filling portion 10 on the plane where the transparent substrate 57 is located is located inside the transparent substrate 57 , and the outer contour of the orthographic projection of the first filling portion 10 on the plane where the transparent substrate 57 is located coincides with the outer contour of the transparent substrate 57 .

[0060] In some embodiments, the structure of the light emitting portion 5 of the light emitting unit can be as follows: Figure 5As shown, the light-emitting portion 5 includes: a raised electrode 51, a first insulating layer 58, and a first doped layer 52, a multi-quantum well layer 53, and a second doped layer 54 which are stacked in sequence in a direction away from the transparent substrate 57; wherein the second electrode 2 is located on a side of the second doped layer 54 away from the multi-quantum well layer 53, and the second doped layer 54 is electrically connected to the second electrode 2; the raised electrode 51 is located between the first doped layer 52 and the first electrode 1, and is electrically connected to the first doped layer 52 and the first electrode 1 respectively; the first insulating layer 58 is located on a side of the first doped layer 52 away from the transparent substrate 57 and is arranged in contact with the first doped layer 52.

[0061] The orthographic projection of the above-mentioned raised electrode 51 on the transparent substrate 57 is located inside the orthographic projection of the first doped layer 52 on the transparent substrate 57; the orthographic projection of the second doped layer 54 on the transparent substrate 57 is located inside the orthographic projection of the first doped layer 52 on the transparent substrate 57; the first insulating layer 58 includes a first part 581, a second part 582 and a third part 583, the first part 581 is provided with a first via hole, the first via hole is filled with a part of the first electrode 1, and the first part 581 and the part of the first electrode 1 together wrap the raised electrode 51; the second part 582 is provided with a second via hole, the second via hole is filled with a part of the second electrode 2, and the second part 582 and the part of the second electrode 2 together wrap the first doped layer 52 and the multi-quantum well layer 53; the third part 583 is arranged in contact with the first part 581 and the second part 582 respectively, to form a continuous film layer. For example, the distance between the third part 583 and the driving part 6 is greater than the distance between the first part 581 and the driving part 6; for example, the distance between the third part 583 and the driving part 6 is greater than the distance between the first part 581 and the driving part 6; the distance between the third part 583 and the driving part 6 is greater than the distance between the second part 582 and the driving part 6; for example, the third part 583 is in direct contact with the second doping layer 54.

[0062] For example, the first doping layer 52 is n-type doped, and the second doping layer 54 is p-type doped. For example, the first doping layer 52 is p-type doped, and the second doping layer 54 is n-type doped.

[0063] In some embodiments, based on Figure 5 The first filling portion 10 is further described, and the above-mentioned first filling portion 10 includes a first sub-filling portion 11 and a second sub-filling portion 12; wherein, the orthographic projection of the first sub-filling portion 11 on the plane where the transparent substrate 57 is located does not overlap with the orthographic projection of the light-emitting unit on the plane where the transparent substrate 57 is located; the second sub-filling portion 12 is at least partially located between the raised electrode 51 and the multi-quantum well layer 53, and the first sub-filling portion 11 surrounds the overall arrangement of the raised electrode 51, the multi-quantum well layer 53, and the second sub-filling portion 12.

[0064] For example, to ensure that the first filling portion 10 has a better protection effect, the first sub-filling portion 11 and the second sub-filling portion 12 are in contact with each other, wherein the minimum distance n between the inner peripheral boundary and the outer peripheral boundary of the first sub-filling portion 11 is greater than or equal to 20 micrometers.

[0065] For example, the thickness of the first sub-filling portion 11 is greater than or equal to the distance between the first insulating layer 58 and the driving portion 6; the thickness of the second sub-filling portion 12 is equal to the maximum distance between the first insulating layer 58 and the driving portion 6. In this way, the first sub-filling portion 11 protects the electrodes surrounded by it due to its greater thickness compared to the first sub-filling portion 11, and the second sub-filling portion 12 exactly fills the gap between the first insulating layer 58 and the driving portion 6, preventing the solution from contacting the electrodes through the gap during electroplating or electroless plating operations, thereby ensuring the reliability of the device. Preferably, the gaps in the internal space surrounded by the first sub-filling portion 11, the light-emitting portion 5, and the driving portion 6 are all filled with the second sub-filling portion 12, so that the solution erosion can be better isolated.

[0066] In some embodiments, the second sub-filling portion 12, the second filling portion 8, and the third filling portion 9 are formed by compressing an anisotropic conductive film; the relationship between the thickness H1 of the second sub-filling portion 12 before compression and the thickness H2 of the second sub-filling portion 12 satisfies: 0.5H1 < H2 < 0.95H1. H2 being less than 95% of H1 can avoid defects such as bubbles and delamination caused by insufficient filling of the second sub-filling portion 12 in the thickness direction; at the same time, H2 being greater than 50% of H1 can avoid the second sub-filling portion 12 overflowing due to excessive thickness of the filling portion, resulting in fewer conductive particles in the second filling portion 8 and the third filling portion 9, thereby causing poor conductivity. For example, the thickness of the second sub-filling portion 12 can be determined in the following way: H2 = k * d + l, where k is the upper limit of the compression ratio that makes the conductive particles have good conductivity in the ACF conductive adhesive, d is the average particle size of the conductive particles in the compression direction before compression, and l is the sum of the distance between the surface of the first electrode 1 close to the second electrode 2 and the light-emitting portion 5 and the distance between the surface of the third electrode 3 close to the second electrode 2 and the driving portion 6. Therefore, k * d is the minimum compression degree that makes the conductive particles conductive in the compression direction. For example, if the average particle size in the compression direction is 2 micrometers and the good conductivity range for the compression of the conductive particles is 20% - 80%, then d is taken as 2 micrometers and k1 is taken as 80%. In this way, it can guide how to design the thickness H2 of the second sub-filling portion 12.

[0067] In some embodiments, the second sub-filling portion 12, the second filling portion 8, and the third filling portion 9 are formed by compressing an anisotropic conductive film; the first sub-filling portion 11 at least includes a portion between the transparent substrate 57 and the driving portion 6. The relationship between the thickness T1 of the first sub-filling portion 11 between the transparent substrate 57 and the driving portion 6 and the thickness T2 of the second sub-filling portion 12 satisfies: 0.5T1 < T2 < 0.95T1. Among them, the portion of the first sub-filling portion 11 between the transparent substrate 57 and the driving portion 6 may be slightly compressed (still in an insulating state) or may not be compressed. The thickness T2 of the second sub-filling portion 12 being less than 95% of the thickness T1 of the first sub-filling portion 11 can prevent defects such as bubbles and delamination caused by insufficient filling of the second sub-filling portion 12 in the thickness direction; at the same time, the thickness T2 of the second sub-filling portion 12 being greater than 50% of the thickness T1 of the first sub-filling portion 11 can prevent the second sub-filling portion 12 from overflowing due to excessive thickness of the filling portion, resulting in fewer conductive particles in the second filling portion 8 and the third filling portion 9, thereby causing poor conductivity. For example, the thickness of the second sub-filling portion 12 can be determined in the following manner: T2 = k*d + l, where k is the upper limit of the compression ratio that enables the conductive particles in the ACF conductive adhesive to have good conductivity, d is the average particle size of the conductive particles in the compression direction before compression, and l is the sum of the distance between the surface of the first electrode 1 close to the second electrode 2 and the light-emitting portion 5 and the distance between the surface of the third electrode 3 close to the second electrode 2 and the driving portion 6. Therefore, k*d is the minimum degree of compression that enables the conductive particles to have conductivity in the compression direction. For example, if the average particle size in the compression direction is 2 microns and the good conductivity range for the compression of the conductive particles is 20% - 80%, then d is taken as 2 microns and k1 is taken as 80%. In this way, it can guide how to design the thickness T2 of the second sub-filling portion 12.

[0068] For example, the first sub-filling portion 11 may all be located between the transparent substrate 57 and the driving portion 6; for example, a part of the first sub-filling portion 11 is all located between the transparent substrate 57 and the driving portion 6, and the other part protrudes from the transparent substrate 57, that is, the orthographic projection of the first sub-filling portion 11 on the plane where the transparent substrate 57 is located does not overlap with the first substrate.

[0069] Since the light-emitting component includes a plurality of light-emitting units and a driving unit corresponding to the plurality of light-emitting units, the plurality of light-emitting units may include a first color light-emitting unit, a second color light-emitting unit and a third color light-emitting unit, wherein the first color, the second color and the third color are different from each other, and the three colors may generally be red, green and blue. In order to be able to emit light of different colors to the screen, the light-emitting unit needs to include a color filter layer 56, a color conversion layer 55 and the light-emitting part 5 in the above embodiment which are sequentially stacked in a direction away from the transparent substrate 57; the light-emitting color of the light-emitting part 5 is blue. Among them, the light-emitting part 5 includes a first light-emitting part 5, a second light-emitting part 5 and a third light-emitting part 5, wherein the first light-emitting part 5 is located in the first color light-emitting unit, the second light-emitting part 5 is located in the second color light-emitting unit, and the third light-emitting part 5 is located in the third color light-emitting unit. Since the light to be emitted is red, blue and green, but the light-emitting unit 5 only emits blue light, a color conversion layer 55 is needed to convert the blue light, that is, to convert the blue light into green and red light, and then emit green and red light. For the color conversion layer 55 of the blue light part, since color conversion is not required, a transparent material can be used, and then displayed through the color filter layer 56.

[0070] For the drive unit, the settings of each level can be set according to actual needs, such as Figure 5 As shown, the driving unit includes a driving part 6, a third electrode 3 and a fourth electrode 4, and the third electrode 3 and the fourth electrode 4 are located on the side of the driving part 6 close to the light-emitting unit; wherein the driving part 6 includes a substrate 61, a connection structure 64, a driving circuit 63 and a flat layer 62, wherein the substrate 61 has a connection via, the connection structure 64 is located in the connection via, the driving circuit 63 is located on the side of the substrate 61 close to the light-emitting unit, the flat layer 62 is located on the side of the driving circuit 63 close to the light-emitting unit, and the flat layer 62 is provided with a via, and the third electrode 3 and the fourth electrode 4 are electrically connected to the driving circuit 63 through the via. For example, the third electrode 3 and the fourth electrode 4 are respectively provided with at least a portion of the flat layer 62 protruding from the side of the driving unit toward the light-emitting unit. The pin 7 is located on the side of the substrate 61 away from the driving circuit 63, and the pin 7 is in contact with the connection structure 64, and the pin 7 and the driving circuit 63 are connected through the connection structure 64. For example, the area of ​​the orthographic projection of the pin 7 on the substrate 61 is larger than the area of ​​the orthographic projection of the connection structure 64 on the substrate 61 , and the orthographic projection of the pin 7 on the substrate 61 covers the orthographic projection of the connection structure 64 on the substrate 61 .

[0071] The above-mentioned driving circuit 63 includes multiple thin film transistors and at least one storage capacitor, each thin film transistor includes a gate, a source and a drain; one pin 7 among the multiple pins 7 is connected to the source of a thin film transistor among the multiple thin film transistors, and is used to provide the driving circuit 63 with a data driving signal transmitted from the display backplane in the display panel. The driving circuit 63 may specifically include a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source-drain layer and a flat layer 62 which are located on one side of the substrate 61 and stacked in sequence; the third electrode 3 and the fourth electrode 4 are located on the side of the flat layer 62 away from the substrate 61; the active layer includes a plurality of active patterns corresponding to a plurality of thin film transistors, each of which includes a source region, a drain region and a channel region; the source and drain of the thin film transistor are located in the source-drain layer, the source of the thin film transistor is connected to the source region, and the drain of the thin film transistor is connected to the drain region; the first gate layer includes a plurality of gate patterns corresponding to a plurality of thin film transistors, and the channel region is the overlapping area of ​​the orthographic projection of the gate pattern on the substrate 61 and the orthographic projection of the active pattern on the substrate 61. Since the specific structure of the driving circuit 63 is similar to the design concept of the driving circuit 63 in the related art, it will not be repeated here.

[0072] The embodiment of the present disclosure also provides a display panel, which at least includes a display backplane and a plurality of the above-mentioned light-emitting components arranged in an array and located on one side of the display backplane; wherein the display backplane is used to provide a driving signal to a driving unit through a plurality of pins 7 in the light-emitting component, so that the driving unit drives the light-emitting unit to emit light. The structure of the above-mentioned light-emitting component is not described in detail here.

[0073] The disclosed embodiment separates the complex driving circuit 63 from the display substrate. The driving substrate only needs to be provided with basic data lines, and there is no need to carry out complex wiring of the driving circuit 63. The wiring structure on the driving substrate is very simple, and the wiring difficulty of the driving substrate is reduced exponentially, which also reduces the difficulty of processing and manufacturing, and is beneficial to industrial development.

[0074] The present disclosure also provides a method for preparing a light-emitting component, which is used to prepare the light-emitting component. Figure 6 As shown, it includes steps S601 to S602:

[0075] S601, pressing the anisotropic conductive adhesive film to be compressed, the light-emitting unit and the driving unit to obtain a bonded light-emitting component, wherein the pressed anisotropic conductive adhesive film includes: a first filling portion 10, a second filling portion 8 and a third filling portion 9; the first filling portion 10 surrounds the second filling portion 8 and the third filling portion 9, and the thickness of the first filling portion 10 is greater than the thickness of the second filling portion 8 and the third filling portion 9; the second filling portion 8 is located between the first electrode 1 of the light-emitting unit and the third electrode 3 of the driving unit, and is respectively in contact with the first electrode 1 and the third electrode 3; the third filling portion 9 is located between the second electrode 2 of the light-emitting unit and the fourth electrode 4 of the driving unit, and is respectively in contact with the second electrode 2 and the fourth electrode 4;

[0076] S602, placing the bonded light-emitting components in an electroplating solution to perform an electroplating process to obtain a light-emitting component having a plurality of pins 7 on the driving unit.

[0077] In the process of bonding the light-emitting unit and the driving unit in the embodiment of the present disclosure, an anisotropic conductive film bonding method is used. The anisotropic conductive film can play two roles: (1) the pressing position serves as a circuit connection between the LED and the backplane; (2) the anisotropic conductive film at the non-pressing position is non-conductive and serves as a packaging isolation, preventing the plating liquid from penetrating into the space between the light-emitting unit and the driving unit during the electroplating process for preparing the pin 7, thereby playing an anti-corrosion role.

[0078] In addition, although exemplary embodiments have been described herein, the scope includes any and all embodiments based on the present disclosure with equivalent elements, modifications, omissions, combinations (e.g., various embodiments intersecting schemes), adaptations or changes. The elements in the claims will be interpreted broadly based on the language adopted in the claims, and are not limited to the examples described in this specification or during the implementation of this application, and the examples will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered as examples only, and the true scope and spirit are indicated by the following claims and the full scope of their equivalents.

[0079] The above description is intended to be illustrative rather than restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. For example, a person of ordinary skill in the art can use other embodiments when reading the above description. In addition, in the above-mentioned specific embodiments, various features can be grouped together to simplify the present disclosure. This should not be interpreted as an intention that a disclosed feature that is not required to be protected is necessary for any claim. On the contrary, the subject matter of the present disclosure may be less than all the features of a specific disclosed embodiment. Thus, the following claims are incorporated into the specific embodiments as examples or embodiments, wherein each claim is independently used as a separate embodiment, and it is considered that these embodiments can be combined with each other in various combinations or arrangements. The scope of the present disclosure should be determined with reference to the attached claims and the full scope of equivalent forms granted by these claims.

[0080] Multiple embodiments of the present disclosure are described in detail above, but the present disclosure is not limited to these specific embodiments. Those skilled in the art can make various variations and modifications to the embodiments based on the concepts of the present disclosure, and these variations and modifications should all fall within the scope of protection required by the present disclosure.

Claims

1. A light emitting component, characterized in that: include: A light-emitting unit, the light-emitting unit comprising a first electrode, a second electrode, and a light-emitting portion electrically connected to the first electrode and the second electrode respectively; A driving unit, the driving unit comprising a third electrode, a fourth electrode and a driving part, the third electrode and the fourth electrode are both located on a side of the driving unit facing the light-emitting unit, the third electrode and the fourth electrode are electrically connected to a driving circuit in the driving part, respectively, the third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode; A plurality of pins, wherein the plurality of pins are all located at a side of the driving unit away from the light-emitting unit and are electrically connected to the driving circuit; Among them, a first filling portion, a second filling portion and a third filling portion are included between the light-emitting unit and the driving unit; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion; the second filling portion is located between the first electrode and the third electrode, and is respectively in contact with the first electrode and the third electrode; the third filling portion is located between the second electrode and the fourth electrode, and is respectively in contact with the second electrode and the fourth electrode.

2. The light emitting assembly according to claim 1, characterized in that: At least one of the plurality of pins comprises a first metal layer and a second metal layer which are stacked, wherein the first metal layer is located between the second metal layer and the driving unit; The material of the first metal layer includes nickel, and the material of the second metal layer includes gold.

3. The light emitting assembly according to claim 1, characterized in that: The first filling portion is insulating, the second filling portion is conductive, and the third filling portion is conductive; The first filling portion is in direct contact with the second filling portion; The first filling part is in direct contact with the third filling part; A portion of the first filling portion is located between the second filling portion and the third filling portion.

4. The light emitting assembly according to claim 1, characterized in that: The density of the first filling part is less than the density of the second filling part; The density of the first filling part is lower than the density of the third filling part.

5. The light emitting assembly according to claim 1, characterized in that: The light emitting assembly comprises a transparent substrate, and the transparent substrate is located at a side of the light emitting unit away from the driving substrate; The orthographic projection of the first filling portion on the plane where the transparent substrate is located is located inside the transparent substrate.

6. The light emitting assembly according to claim 5, characterized in that: An outer contour of an orthographic projection of the first filling portion on a plane where the transparent substrate is located coincides with an outer contour of the transparent substrate.

7. The light emitting assembly according to claim 1, characterized in that: The light emitting assembly comprises a transparent substrate, and the transparent substrate is located at a side of the light emitting unit away from the driving substrate; The light emitting unit includes a light emitting portion, and the light emitting portion includes: A pad electrode, a first insulating layer, and a first doped layer, a multi-quantum well layer, and a second doped layer are sequentially stacked in a direction away from the transparent substrate; Wherein, the second electrode is located at a side of the second doped layer away from the multi-quantum well layer, and the second doped layer is electrically connected to the second electrode; The pad electrode is located between the first doping layer and the first electrode, and is electrically connected to the first doping layer and the first electrode respectively; The first insulating layer is located at a side of the first doping layer away from the transparent substrate and is disposed in contact with the first doping layer.

8. The light emitting assembly according to claim 7, characterized in that: The first filling portion includes a first sub-filling portion and a second sub-filling portion; The orthographic projection of the first sub-filling portion on the plane where the transparent substrate is located does not overlap with the orthographic projection of the light-emitting unit on the plane where the transparent substrate is located; The second sub-filling portion is at least partially located between the padding electrode and the multi-quantum well layer, and the first sub-filling portion surrounds the padding electrode, the multi-quantum well layer, and the second sub-filling portion as a whole.

9. The light emitting assembly according to claim 8, characterized in that: The thickness of the first sub-filling portion is greater than or equal to the distance between the first insulating layer and the driving portion; The thickness of the second sub-filling portion is equal to a maximum distance between the first insulating layer and the driving portion.

10. The light emitting assembly according to claim 9, characterized in that: The first sub-filling portion at least includes a portion located between the transparent substrate and the driving portion; The relationship between the thickness T1 of the portion between the transparent substrate and the driving portion and the thickness T2 of the second sub-filling portion satisfies: 0.5T1 <T2<0.95T1。 11. The light emitting assembly according to any one of claims 1 to 10, characterized in that: The light-emitting component includes a plurality of light-emitting units and the driving unit corresponding to the plurality of light-emitting units; the plurality of light-emitting units include a first color light-emitting unit, a second color light-emitting unit and a third color light-emitting unit, wherein the first color, the second color and the third color are different from each other; The light-emitting unit comprises a color filter layer (1014), a color conversion layer and a light-emitting portion which are sequentially stacked in a direction away from the transparent substrate; the light-emitting color of the light-emitting portion is blue; The light-emitting portion includes a first light-emitting portion, a second light-emitting portion and a third light-emitting portion, the first light-emitting portion is located in the first color light-emitting unit, the second light-emitting portion is located in the second color light-emitting unit, and the third light-emitting portion is located in the third color light-emitting unit.

12. The light emitting assembly according to any one of claims 1 to 10, characterized in that: The driving unit further comprises a substrate and a connection structure, wherein the substrate has a connection via hole, the connection structure is located in the connection via hole, and the driving circuit is located on one side of the substrate; The pin is located at a side of the substrate away from the driving circuit, and the pin is in contact with the connection structure, and the pin and the driving circuit are connected through the connection structure.

13. The light emitting assembly according to claim 12, characterized in that: The driving circuit includes a plurality of thin film transistors and at least one storage capacitor, each of the thin film transistors includes a gate, a source and a drain; One of the plurality of pins is connected to a source electrode of a thin film transistor among the plurality of thin film transistors, and is used for providing the driving circuit with a data driving signal transmitted from a display backplane in the display panel.

14. The light emitting assembly according to claim 13, characterized in that: The driving circuit includes a buffer layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source-drain electrode layer and a planar layer, which are located on one side of the substrate and are stacked in sequence; the third electrode and the fourth electrode are located on a side of the planar layer away from the substrate; The active layer includes a plurality of active patterns corresponding to the plurality of thin film transistors, each of the active patterns includes a source region, a drain region and a channel region; The source electrode and the drain electrode of the thin film transistor are located in the source-drain electrode layer, the source electrode of the thin film transistor is connected to the source region, and the drain electrode of the thin film transistor is connected to the drain region; The first gate layer includes a plurality of gate patterns corresponding to the plurality of thin film transistors, and the channel region is an overlapping region of an orthographic projection of the gate pattern on the substrate and an orthographic projection of the active pattern on the substrate.

15. The light emitting assembly according to claim 12, characterized in that: The area of ​​the orthographic projection of the pin on the substrate is larger than the area of ​​the orthographic projection of the connection structure on the substrate, and the orthographic projection of the pin on the substrate covers the orthographic projection of the connection structure on the substrate.

16. A display panel, characterized in that: The display panel comprises a display backplane, and a plurality of light-emitting components according to any one of claims 1 to 15 arranged in an array and located on one side of the display backplane; The display backplane is used to provide a driving signal to the driving unit through a plurality of pins in the light-emitting component, so that the driving unit drives the light-emitting unit to emit light.

17. A method for preparing a light-emitting component, used for preparing the light-emitting component according to any one of claims 1 to 15, characterized in that: include: The anisotropic conductive adhesive film to be compressed, the light-emitting unit and the driving unit are pressed together to obtain a bonded light-emitting component, wherein the pressed anisotropic conductive adhesive film comprises: a first filling portion, a second filling portion and a third filling portion; the first filling portion surrounds the second filling portion and the third filling portion, and the thickness of the first filling portion is greater than the thickness of the second filling portion and the third filling portion; the second filling portion is located between the first electrode of the light-emitting unit and the third electrode of the driving unit, and is respectively in contact with the first electrode and the third electrode; the third filling portion is located between the second electrode of the light-emitting unit and the fourth electrode of the driving unit, and is respectively in contact with the second electrode and the fourth electrode; The bonded light-emitting components are placed in a target solution for electroplating or chemical plating to obtain a light-emitting component with a plurality of pins on the driving unit.

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