Liquid cooling optical module and optical communication equipment

Abstract

The invention discloses a liquid cooling optical module and optical communication equipment, the liquid cooling optical module comprises a circuit board, a photoelectric conversion unit, a sealing cover and a shell, the photoelectric conversion unit is arranged on the circuit board, the sealing cover covers the circuit board to form a sealing cavity with the circuit board, the photoelectric conversion unit is located in the sealing cavity, and the shell is provided with an installation cavity. The circuit board and the sealing cover are arranged in the installation cavity, a first heat dissipation hole is formed in the shell, the installation cavity is communicated with the external environment through the first heat dissipation hole, and the first heat dissipation hole is configured to allow cooling liquid to flow in or out of the installation cavity so that the cooling liquid can flow through the surface of the circuit board and the surface of the sealing cover. According to the liquid-cooled optical module and the optical communication equipment provided by the invention, the heat dissipation efficiency of the liquid-cooled optical module can be effectively improved, so that the heat dissipation effect of the liquid-cooled optical module is improved, the stability of the liquid-cooled optical module is improved, and the service life of the liquid-cooled optical module is prolonged.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to a liquid-cooled optical module and an optical communication device. Background Art

[0002] With the growth of the Internet system and the increase in networked devices, the data information generated by the Internet is growing exponentially, which has led to the rapid development of optical communication technology with larger transmission bandwidth and capacity, lower transmission loss, stronger anti-electromagnetic interference ability and higher transmission quality. As a key component in the optical communication system, the optical module affects the transmission speed and quality of data. As the transmission rate of the optical module increases, its power also increases, and a large amount of heat is inevitably generated. If this heat cannot be effectively discharged, it will directly affect the stability of the internal environment of the optical module, resulting in a decrease in the quality of the transmitted light signal, and may even accelerate the aging of components and shorten the life of the optical module. Therefore, the heat dissipation of the optical module is a problem that needs to be solved urgently. Summary of the invention

[0003] The embodiments of the present application disclose a liquid-cooled optical module and an optical communication device, which can improve the heat dissipation effect of the liquid-cooled optical module, thereby improving the stability of the liquid-cooled optical module and extending the service life of the liquid-cooled optical module.

[0004] In order to achieve the above objectives, in a first aspect, an embodiment of the present application discloses a liquid-cooled optical module, comprising: Circuit boards; A photoelectric conversion unit, wherein the photoelectric conversion unit is disposed on the circuit board; a sealing cover, the sealing cover being arranged on the circuit board to form a sealing cavity with the circuit board, the photoelectric conversion unit being located in the sealing cavity; and The shell has an installation cavity, the circuit board and the sealing cover are arranged in the installation cavity, the shell is provided with a first heat dissipation hole, the first heat dissipation hole connects the installation cavity with the external environment, and the first heat dissipation hole is configured to allow coolant to flow into or out of the installation cavity, so that the coolant flows through the surface of the circuit board and the sealing cover.

[0005] The liquid-cooled optical module provided in the embodiment of the present application has a photoelectric conversion unit located in a sealed cavity formed by the sealing cover and the circuit board, and a first heat dissipation hole connecting the installation cavity and the external environment is provided on the shell for the circulation of the cooling liquid. Therefore, when the cooling liquid dissipates heat for the liquid-cooled optical module, it can prevent the cooling liquid from entering the photoelectric conversion unit and affecting the transmission of the optical path, and can also allow the cooling liquid to flow in the installation cavity, thereby taking away the heat of the circuit board and the photoelectric conversion unit, and thus achieving heat dissipation for the liquid-cooled optical module. In addition, compared with the heat dissipation method in which the cooling liquid only flows on the surface of the liquid-cooled optical module, the method of opening the first heat dissipation hole to allow the cooling liquid to flow in the installation cavity can effectively improve the heat dissipation efficiency, which is beneficial to improving the heat dissipation effect of the liquid-cooled optical module, and thus is beneficial to improving the stability of the liquid-cooled optical module and extending the service life of the liquid-cooled optical module.

[0006] As an optional implementation, a chip is provided on a surface of the circuit board away from the photoelectric conversion unit; The liquid-cooled optical module further includes a first heat-conducting member, which is disposed on the chip.

[0007] By providing a first heat-conducting member on the chip, the heat generated on the chip can be guided to the first heat-conducting member through the first heat-conducting member, thereby avoiding excessive concentration of heat on the chip; and when the cooling liquid flows in the installation cavity, the heat of the chip can be dissipated through the side surface of the chip and the upper surface and side surface of the first heat-conducting member, which is beneficial to expanding the heat dissipation area, thereby helping to further improve the heat dissipation efficiency of the liquid-cooled optical module.

[0008] As an optional embodiment, the liquid-cooled optical module also includes a second heat-conducting member, which is arranged on the inner wall surface of the shell corresponding to the first heat-conducting member, the second heat-conducting member abuts against the first heat-conducting member, and the first heat-dissipating hole and the second heat-conducting member are staggered. Since the second heat-conducting member abuts against the first heat-conducting member, and the first heat-dissipating hole and the second heat-conducting member are staggered, on the one hand, it is possible to avoid reducing the contact area between the second heat-conducting member and the shell due to the setting of the first heat-dissipating hole, thereby avoiding reducing the heat transfer efficiency of the second heat-conducting member to the shell, and effectively realizing the heat on the chip is guided to the shell. On the other hand, it is possible to avoid the occurrence of the situation where the second heat-conducting member covers part of the first heat-dissipating hole and causes the cooling liquid inlet and outlet to be reduced, which is beneficial to improve the fluidity of the cooling liquid in the installation cavity, thereby helping to further improve the heat dissipation efficiency of the liquid-cooled optical module. In addition, the cooling liquid flows through the surface of the shell to take away the heat, which is beneficial to expand the heat dissipation area of ​​the liquid-cooled optical module, thereby helping to further improve the heat dissipation efficiency of the liquid-cooled optical module.

[0009] As an optional embodiment, the first heat dissipation hole is provided on at least one of the top surface of the shell, the bottom surface of the shell, and the side wall surface of the shell. By providing the first heat dissipation hole on any outer surface of the shell, the coolant can flow in the installation cavity, which is beneficial to improving the heat dissipation effect of the liquid-cooled optical module. In addition, by providing the first heat dissipation hole on multiple outer surfaces of the shell at the same time, the fluidity of the coolant in the installation cavity can be further improved, which is beneficial to further improve the heat dissipation efficiency of the liquid-cooled optical module, and then it is beneficial to improve the stability of the liquid-cooled optical module and extend the service life of the liquid-cooled optical module.

[0010] As an optional embodiment, the shell includes a first subshell and a second subshell, the first subshell is connected to the second subshell to enclose the installation cavity, the photoelectric conversion unit is arranged on the side of the circuit board close to the second subshell, and the first heat dissipation hole is provided on at least one of the top surface of the first subshell, the side wall surface of the first subshell, the bottom surface of the second subshell and the side wall surface of the second subshell. The first subshell and the second subshell are connected to enclose the installation cavity to facilitate the installation of the circuit board. In addition, by providing the first heat dissipation holes on the top surface of the first subshell, the side wall surface of the first subshell, the bottom surface of the second subshell and the side wall surface of the second subshell, the coolant can flow in the installation cavity, so that the coolant can enter from any of the first heat dissipation holes, and can also flow out from any of the first heat dissipation holes, which is beneficial to improve the heat dissipation efficiency of the liquid-cooled optical module. In addition, by simultaneously arranging the first heat dissipation holes on multiple outer surfaces of the first sub-shell and the second sub-shell, the fluidity of the coolant in the installation cavity can be further improved, which is beneficial to further improve the heat dissipation efficiency of the liquid-cooled optical module, and further beneficial to improve the stability of the liquid-cooled optical module and extend the service life of the liquid-cooled optical module.

[0011] As an optional embodiment, a plurality of heat dissipation fins are provided on the top surface of the first sub-shell, and two adjacent heat dissipation fins are arranged at intervals to form a heat dissipation channel. Since part of the heat in the liquid-cooled optical module will be transferred to the housing, by providing heat dissipation fins on the top surface of the first sub-shell and forming a heat dissipation channel, the contact area between the first sub-shell and the coolant can be increased, that is, the heat dissipation area of ​​the first sub-shell is increased, which is conducive to further improving the heat dissipation efficiency of the liquid-cooled optical module.

[0012] As an optional embodiment, the liquid-cooled optical module further includes an optical cage, the optical cage wraps the shell, and a second heat dissipation hole is provided on the optical cage corresponding to the first heat dissipation hole, and the second heat dissipation hole is connected to the first heat dissipation hole. By wrapping the shell with the optical cage, the liquid-cooled optical module can be protected to prevent external objects or the environment from damaging the liquid-cooled optical module, thereby extending the service life of the liquid-cooled optical module and improving its stability and reliability; and by providing a second heat dissipation hole connected to the first heat dissipation hole on the optical cage, the coolant can flow into or out of the installation cavity through the first heat dissipation hole and the second heat dissipation hole, thereby avoiding the occurrence of a situation where the fluidity of the coolant in the installation cavity is reduced due to the provision of the optical cage.

[0013] As an optional embodiment, a card slot is provided on the outer surface of the shell, and a locking spring is provided on the inner wall surface of the optical cage corresponding to the card slot, and the locking spring is engaged with the card slot. By engaging the card slot on the outer surface of the shell and the locking spring on the inner wall of the optical cage, the shell and the optical cage can be fixed, and the connection stability between the shell and the optical cage can be improved, which is beneficial to improving the overall stability of the liquid-cooled optical module. In addition, by engaging, there is no need for welding, which can reduce the production cost and the difficulty of assembling the shell and the optical cage, facilitate the assembly between the shell and the optical cage, and also facilitate disassembly and replacement.

[0014] As an optional embodiment, the housing has an optical port and an electrical port opposite to each other, and the optical cage has a first opening, and the first opening is configured to allow the electrical port to extend therein, so that the optical cage is wrapped around the outer periphery of the housing; The first heat dissipation hole is located between the electrical port and the card slot, and / or the first heat dissipation hole is located between the card slot and the optical port.

[0015] By setting the first heat dissipation hole between the electrical port and the card slot, and between the card slot and the optical port, the coolant can flow in the installation cavity without affecting the assembly effect of the liquid-cooled optical module, which is beneficial to improving the heat dissipation efficiency of the liquid-cooled optical module. In addition, by setting the first heat dissipation hole between the electrical port and the card slot and between the card slot and the optical port at the same time, compared with setting the first heat dissipation hole between the electrical port and the card slot or between the card slot and the optical port alone, the fluidity of the coolant in the installation cavity can be further improved, which is beneficial to further improving the heat dissipation efficiency of the liquid-cooled optical module.

[0016] As an optional embodiment, the outer surface of the housing provided with the card slot is also provided with the first heat dissipation hole, and when the first heat dissipation hole is located between the electrical port and the card slot, the projection of the locking spring on the first plane is at least partially staggered with the projection of the first heat dissipation hole on the first plane, wherein the first plane is a plane perpendicular to a first direction, and the first direction is the direction from the optical port to the electrical port; and / or, The liquid-cooled optical module also includes a pull ring and a connecting piece, the pull ring is connected to the connecting piece, the connecting piece is connected to the outer surface of the shell, and the connecting piece is located between the card slot and the optical port end, the outer surface of the shell is provided with the first heat dissipation hole, and when the first heat dissipation hole is located between the card slot and the optical port end, an avoidance opening is provided on the connecting piece corresponding to the first heat dissipation hole, and the avoidance opening is connected to the first heat dissipation hole.

[0017] In the above embodiment, during the assembly process, the electrical port of the housing is inserted into the first opening of the optical cage, and then the locking spring piece is aligned and engaged with the card slot. Therefore, the locking spring piece will pass through the first heat dissipation hole provided between the electrical port and the card slot. By staggering the projection of the locking spring piece on the first plane at least partially with the projection of the first heat dissipation hole on the first plane, the locking spring piece and the first heat dissipation hole can be avoided during the assembly or disassembly process, which is conducive to improving the assembly or disassembly efficiency of the housing and the optical cage.

[0018] Furthermore, the connection and fixation of the pull ring can be realized through the connecting piece, and when the first heat dissipation hole and the connecting piece are located between the card slot and the optical port end, by correspondingly setting an avoidance port connected to the first heat dissipation hole on the connecting piece, it is helpful to avoid the situation where the coolant is blocked from flowing into or out of the installation cavity due to the setting of the pull ring and the connecting piece, thereby avoiding the situation where the connecting piece reduces the heat dissipation effect of the first heat dissipation hole, and then the coolant can flow in the installation cavity without affecting the assembly effect of the liquid-cooled optical module, which is helpful to improve the heat dissipation efficiency of the liquid-cooled optical module. In addition, by operating the pull ring, the shell can be separated from the optical cage, realizing the plug-in and unplug function of the liquid-cooled optical module.

[0019] In a second aspect, an embodiment of the present application further discloses an optical communication device, comprising the liquid-cooled optical module as described in the first aspect above. The optical communication device having the liquid-cooled optical module of the first aspect above can also improve the heat dissipation effect of the liquid-cooled optical module, thereby improving the stability of the liquid-cooled optical module and extending the service life of the liquid-cooled optical module, which is beneficial to improving the stability of the optical communication device and extending the service life of the optical communication device.

[0020] Compared with the prior art, the beneficial effects of this application are: The liquid-cooled optical module and optical communication equipment provided in the embodiment of the present application, because the photoelectric conversion unit of the liquid-cooled optical module is located in the sealed cavity formed by the sealing cover and the circuit board, and a first heat dissipation hole connecting the installation cavity and the external environment is opened on the shell for the circulation of cooling liquid, so that when the cooling liquid dissipates heat for the liquid-cooled optical module, it can not only prevent the cooling liquid from entering the photoelectric conversion unit and affecting the transmission of the optical path, but also enable the cooling liquid to flow in the installation cavity to dissipate the heat of the circuit board and the photoelectric conversion unit, so as to achieve the heat dissipation of the liquid-cooled optical module. In addition, compared with the heat dissipation method in which the cooling liquid only flows on the surface of the liquid-cooled optical module, the method of opening the first heat dissipation hole to allow the cooling liquid to flow in the installation cavity can effectively improve the heat dissipation efficiency, which is beneficial to improving the heat dissipation effect of the liquid-cooled optical module, and further beneficial to improving the stability of the liquid-cooled optical module and extending the service life of the liquid-cooled optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a structural schematic diagram of a liquid-cooled optical module provided in this application; Figure 2 It is a structural schematic diagram of a liquid-cooled optical module provided by the present application (a first heat dissipation hole is provided on the top surface and the bottom surface of the shell) under one viewing angle; Figure 3 It is a structural schematic diagram of a liquid-cooled optical module provided by the present application (a first heat dissipation hole is provided on the top surface and the bottom surface of the shell) from another perspective; Figure 4 is a cross-sectional view of a liquid-cooled optical module provided by the present application; Figure 5 yes Figure 4 A partial enlarged view of the middle A; Figure 6 It is a structural schematic diagram of a liquid-cooled optical module (a first heat dissipation hole is provided on the side wall surface of the shell) provided in the present application under one viewing angle; Figure 7 It is a structural schematic diagram of a liquid-cooled optical module (a first heat dissipation hole is provided on the side wall surface of the shell) provided by the present application from another perspective; Figure 8 It is a structural schematic diagram of an optical communication device provided in an embodiment of the present application.

[0023] Description of reference numerals: 100-liquid-cooled optical module; 1-circuit board; 11-chip; 2-photoelectric conversion unit; 3-sealed cover; 31-sealed cavity; 4-shell; 41-installation cavity; 42-first heat dissipation hole; 43-first subshell; 431-top surface; 432-heat dissipation fins; 433-heat dissipation channel; 44-second subshell; 441-bottom surface; 4a-side wall surface; 45-card slot; 46-optical port; 47-electrical port; 5-first heat conducting member; 6-second heat conducting member; 7-optical cage; 71-second heat dissipation hole; 72-locking spring; 73-first opening; 74-second opening; 81-pull ring; 82-connector; P-first plane; X-first direction; 200-optical communication equipment. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0025] In this application, the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0026] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0027] In addition, the terms "disposed", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0029] Before explaining the technical solution of the present application, the inventive concept of the present application is first explained.

[0030] Optical communication is a communication method that uses light waves as carrier waves. With the development of Internet technology, the Internet system has grown rapidly, resulting in an exponential growth in the amount of data and information generated by the Internet. This has led to the rapid development of optical communication technology with greater transmission bandwidth and capacity, lower transmission loss, stronger anti-electromagnetic interference ability and higher transmission quality. As a key component in the optical communication system, the optical module affects the transmission speed and quality of data. As the transmission rate of the optical module increases, its power also increases, inevitably generating a large amount of heat. If this heat cannot be effectively discharged, it will directly affect the stability of the internal environment of the optical module, resulting in a decrease in the quality of the transmitted light signal, and may even accelerate the aging of components and shorten the life of the optical module. Therefore, the heat dissipation of the optical module is a problem that needs to be solved urgently.

[0031] In the related art, the optical module is cooled by air cooling (wind cooling), but the heat dissipation effect of air cooling is limited and is easily affected by dust and impurities. Therefore, in order to improve the heat dissipation effect of the optical module, the inventor tried to place the optical module in the coolant by immersion liquid cooling, and take away the heat of the optical module by the flow of the coolant. However, after research, the inventor found that although the immersion liquid cooling method can further improve the heat dissipation effect of the optical module compared to the air cooling method, since the coolant inside the optical module is in a low flow state, a large amount of heat is still retained inside the optical module, thereby affecting the stability of the internal environment of the optical module.

[0032] In view of this, an embodiment of the present application provides a liquid-cooled optical module and an optical communication device. The liquid-cooled optical module is provided with a first heat dissipation hole on the shell, which connects the installation cavity and the external environment for the circulation of cooling liquid. When the cooling liquid dissipates heat to the liquid-cooled optical module, the cooling liquid can flow in the installation cavity to dissipate the heat of the circuit board and the photoelectric conversion unit, which is beneficial to improving the heat dissipation effect of the liquid-cooled optical module, and further beneficial to improving the stability of the liquid-cooled optical module and extending the service life of the liquid-cooled optical module.

[0033] Specifically, the present application discloses a liquid-cooled optical module and an optical communication device. The packaging form of the liquid-cooled optical module includes but is not limited to a small form-factor pluggable package (SFP, Small Form-factor Pluggable), a quad small form-factor pluggable package (QSFP, Quad Small Form-factor Pluggable), a double-density quad small form-factor pluggable package (QSFP-DD, Quad Small Form-factor Pluggable Double Density), and an octal small form-factor pluggable package (OSFP, Octal Small Form-factor Pluggable). It can be seen that the liquid-cooled optical module of the present application can adopt packaging forms such as SFP packaging, QSFP packaging, QSFP-DD packaging or OSFP packaging, which can be selected according to actual conditions, and this embodiment does not specifically limit this.

[0034] In order to facilitate the explanation of the specific structure of the liquid-cooled optical module, the technical solution of the present application will be further explained below in combination with the embodiments and drawings. For ease of understanding, this embodiment will be explained by taking the liquid-cooled optical module using OSFP packaging as an example.

[0035] See also Figures 1 to 3 , Figure 1 It is a structural schematic diagram of a liquid-cooled optical module provided in this application; Figure 2 It is a structural schematic diagram of a liquid-cooled optical module provided by the present application (a first heat dissipation hole is provided on the top surface and the bottom surface of the shell) under one viewing angle; Figure 3 It is a structural schematic diagram of a liquid-cooled optical module (a first heat dissipation hole is provided on the top surface of the shell and the bottom surface of the shell) provided by the present application from another perspective. In the first aspect, the embodiment of the present application discloses a liquid-cooled optical module 100, including a circuit board 1, a photoelectric conversion unit 2, a sealing cover 3 and a shell 4, the photoelectric conversion unit 2 is arranged on the circuit board 1, the sealing cover 3 is arranged on the circuit board 1 to form a sealed cavity 31 between the circuit board 1, the photoelectric conversion unit 2 is located in the sealed cavity 31, the shell 4 has an installation cavity 41, the circuit board 1 and the sealing cover 3 are arranged in the installation cavity 41, and a first heat dissipation hole 42 is opened on the shell 4, the first heat dissipation hole 42 connects the installation cavity 41 with the external environment, and the first heat dissipation hole 42 is configured to allow coolant to flow into or out of the installation cavity 41, so that the coolant flows through the surface of the circuit board 1 and the sealing cover 3.

[0036] In the liquid-cooled optical module 100 provided in the embodiment of the present application, since the photoelectric conversion unit 2 is located in the sealed cavity 31 formed by the sealing cover 3 and the circuit board 1, and a first heat dissipation hole 42 connecting the installation cavity 41 with the external environment is provided on the shell 4 for the circulation of the cooling liquid, when the cooling liquid dissipates heat for the liquid-cooled optical module 100, it can prevent the cooling liquid from entering the photoelectric conversion unit 2 and affecting the transmission of the optical path, and can also make the cooling liquid flow in the installation cavity 41, so as to take away the heat of the circuit board 1 and the photoelectric conversion unit 2, and then achieve the heat dissipation of the liquid-cooled optical module 100. In addition, compared with the heat dissipation method in which the cooling liquid only flows on the surface of the liquid-cooled optical module 100, the method in which the cooling liquid can flow in the installation cavity 41 by providing the first heat dissipation hole 42 can effectively improve the heat dissipation efficiency, which is beneficial to improving the heat dissipation effect of the liquid-cooled optical module 100, and thus is beneficial to improving the stability of the liquid-cooled optical module 100 and extending the service life of the liquid-cooled optical module 100.

[0037] It can be understood that the liquid-cooled optical module 100 of the present application can be an optical receiving module, an optical sending module, an integrated optical transceiver module, or an optical forwarding module, etc., and this embodiment does not limit this.

[0038] Optionally, the photoelectric conversion unit 2 includes a light receiver, a light transmitter, etc., which is not limited in this embodiment.

[0039] Optionally, the sealing cover 3 may be a single layer or a multi-layer, which is not limited in this embodiment. It is understood that when the sealing cover 3 is multi-layered, it may be, for example, 2 layers, 3 layers, 4 layers, 5 layers, etc., which is not limited in this embodiment. By setting the sealing cover 3 to be multi-layered, it is beneficial to improve the sealing effect of the sealing cavity 31, so that the sealing performance of the sealing cover 3 to the photoelectric conversion unit 2 is more reliable.

[0040] Optionally, there are multiple implementations of the sealing connection between the sealing cover 3 and the circuit board 1. The sealing connection may be achieved by setting a sealant, or a sealing ring may be set between the sealing cover 3 and the circuit board 1, and the sealing cover 3 and the circuit board 1 are fixedly connected by screws, and the sealing cover 3 and the circuit board 1 are squeezed by the screws to squeeze the sealing ring, thereby achieving a sealing connection between the sealing cover 3 and the circuit board 1, and so on. This embodiment is not limited to this.

[0041] Optionally, the material of the sealing cover 3 includes graphite, ceramic, metal, alloy, etc., which is not limited in this embodiment. Since materials such as graphite, ceramic, metal, alloy, etc. have good thermal conductivity, by providing a sealing cover 3 made of graphite, ceramic, metal, alloy, etc., it is possible to achieve sealing of the photoelectric conversion unit 2 while dissipating the heat generated by the photoelectric conversion unit 2, which is beneficial to improving the heat dissipation effect of the liquid-cooled optical module 100.

[0042] It is understandable that in order to avoid the influence of the coolant on the electronic devices (such as the circuit board 1, the chip 11, etc.) in the liquid-cooled optical module 100, and in order to improve the heat dissipation efficiency of the coolant on the liquid-cooled optical module 100, the coolant is a non-conductive liquid. In this way, when the coolant flows directly through the surface of the electronic device in the liquid-cooled optical module 100, it can not only avoid the short circuit failure of the electronic device caused by the coolant, but also take away the heat generated by the electronic device through direct contact, avoiding the process of indirect heat transfer, which is conducive to improving the heat dissipation efficiency of the liquid-cooled optical module 100.

[0043] Optionally, the above-mentioned coolant includes but is not limited to fluorinated liquid, synthetic oil, etc.

[0044] Optionally, the opening shape of the first heat dissipation hole 42 includes a circle, an ellipse, a polygon, a rounded rectangle, etc., which is not limited in this embodiment.

[0045] Since the chip 11 on the circuit board 1 is the main heat generating element, the present application also designs a solution for improving the heat dissipation efficiency of the chip 11, as shown below: As an optional implementation, Figure 2 and Figure 3 As shown, a chip 11 is provided on the side of the circuit board 1 facing away from the photoelectric conversion unit 2, and the liquid-cooled optical module 100 further includes a first heat-conducting member 5, which is provided on the chip 11. By providing the first heat-conducting member 5 on the chip 11, the heat generated on the chip 11 can be guided to the first heat-conducting member 5 through the first heat-conducting member 5, so as to avoid excessive concentration of heat on the chip 11; and when the cooling liquid flows in the mounting cavity 41, the heat of the chip 11 can be dissipated through the side of the chip 11 and the upper surface and side surface of the first heat-conducting member 5, which is beneficial to expand the heat dissipation area, thereby further improving the heat dissipation efficiency of the liquid-cooled optical module 100.

[0046] Optionally, the first heat conducting member 5 includes a heat conducting sheet, a heat conducting plate, a heat conducting block, etc., which is not limited in this embodiment.

[0047] Optionally, the material of the first heat-conducting member 5 includes thermally conductive silicone, synthetic graphite, ceramic, etc., which is not limited in this embodiment.

[0048] It can be understood that the above-mentioned first heat-conducting member 5 may not be connected to the shell 4, so that the coolant can flow through the outer surface of the first heat-conducting member 5 to take away the heat; the first heat-conducting member 5 may also be connected to the shell 4, so that part of the heat of the chip 11 can be transferred to the shell 4 through the first heat-conducting member 5 to expand the heat dissipation area.

[0049] Please combine Figure 4 and Figure 5 , Figure 4 is a cross-sectional view of a liquid-cooled optical module provided by the present application; Figure 5 yes Figure 4 Optionally, the first heat conducting member 5 may be directly connected to the housing 4, or may be connected to the housing 4 by setting a second heat conducting member 6, which is not limited in this embodiment. Figure 2 and Figure 5 As shown, the liquid-cooled optical module 100 further includes a second heat-conducting member 6, which is arranged on the inner wall surface of the housing 4 corresponding to the first heat-conducting member 5, the second heat-conducting member 6 abuts against the first heat-conducting member 5, and the first heat-dissipating hole 42 is staggered with the second heat-conducting member 6. Since the second heat-conducting member 6 abuts against the first heat-conducting member 5, and the first heat-dissipating hole 42 is staggered with the second heat-conducting member 6, on the one hand, it is possible to avoid reducing the contact area between the second heat-conducting member 6 and the housing 4 due to the setting of the first heat-dissipating hole 42, thereby avoiding reducing the heat transfer efficiency of the second heat-conducting member 6 to the housing 4, and effectively realizing the heat on the chip 11 is guided to the housing 4. On the other hand, it is possible to avoid the occurrence of a situation where the second heat-conducting member 6 covers part of the first heat-dissipating hole 42, which causes the cooling liquid inlet and outlet to be reduced, which is beneficial to improving the fluidity of the cooling liquid in the mounting cavity 41, thereby further improving the heat dissipation efficiency of the liquid-cooled optical module 100. In addition, the cooling liquid flows through the surface of the shell 4 to take away the heat, which is beneficial to expand the heat dissipation area of ​​the liquid-cooled optical module 100, thereby helping to further improve the heat dissipation efficiency of the liquid-cooled optical module 100.

[0050] Optionally, the second heat-conducting member 6 includes a heat-conducting sheet, a heat-conducting plate, a heat-conducting block, etc., which is not limited in this embodiment.

[0051] Optionally, the material of the second heat-conducting member 6 includes thermally conductive silicone, synthetic graphite, ceramic, metal, alloy, etc., which is not limited in this embodiment.

[0052] It can be understood that the second heat conducting member 6 and the first heat conducting member can be made of the same material or different materials, which is not limited in this embodiment.

[0053] Optionally, the second heat-conducting member 6 and the first heat-conducting member 5 may be integrally formed or separately formed, and this embodiment does not limit this. For example, the second heat-conducting member 6 and the first heat-conducting member 5 are integrally formed, and the integral forming can facilitate the assembly of the second heat-conducting member 6 and the first heat-conducting member 5 to the liquid-cooled light module 100, which is conducive to reducing the production process of the liquid-cooled light module 100. For another example, the second heat-conducting member 6 and the first heat-conducting member 5 are separately formed. Since the second heat-conducting member 6 and the first heat-conducting member 5 are separately formed, the second heat-conducting member 6 and the first heat-conducting member 5 can respectively select suitable heat-conducting materials, thereby achieving a higher heat dissipation efficiency through the cooperation of the second heat-conducting member 6 and the first heat-conducting member 5, which is conducive to improving the heat dissipation effect of the liquid-cooled light module 100.

[0054] Please combine Figure 6 and Figure 7 , Figure 6 It is a structural schematic diagram of a liquid-cooled optical module (a first heat dissipation hole is provided on the side wall surface of the shell) provided in the present application under one viewing angle; Figure 7 4 is a schematic structural diagram of a liquid-cooled optical module (a first heat dissipation hole is provided on the side wall surface of the shell) provided in the present application from another perspective. Optionally, a first heat dissipation hole 42 is provided on the top surface 431 of the shell 4.

[0055] Optionally, a first heat dissipation hole 42 is provided on the bottom surface 441 of the housing 4 .

[0056] Alternatively, if Figure 6 and Figure 7 As shown, a first heat dissipation hole 42 is provided on the side wall surface 4 a of the housing 4 .

[0057] It can be seen that the first heat dissipation hole 42 can be provided on any surface of the housing 4. That is, in the above embodiment, by providing the first heat dissipation hole 42 on any outer surface of the housing 4, the cooling liquid can flow in the installation cavity 41, thereby facilitating the improvement of the heat dissipation effect of the liquid-cooled optical module 100.

[0058] Alternatively, if Figure 2 and Figure 3 As shown, first heat dissipation holes 42 are provided on the top surface 431 of the housing 4 and the bottom surface 441 of the housing 4 .

[0059] Optionally, first heat dissipation holes 42 are provided on the top surface 431 of the shell 4 and the side wall surface 4 a of the shell 4 .

[0060] Optionally, first heat dissipation holes 42 are provided on the bottom surface 441 of the shell 4 and the side wall surface 4 a of the shell 4 .

[0061] Optionally, first heat dissipation holes 42 are provided on the top surface 431 of the shell 4 , the bottom surface 441 of the shell 4 , and the side wall surface 4 a of the shell 4 .

[0062] In the above embodiment, by simultaneously providing the first heat dissipation holes 42 on multiple outer surfaces of the shell 4, the fluidity of the cooling liquid in the installation cavity 41 can be further improved, which is beneficial to further improve the heat dissipation efficiency of the liquid-cooled optical module 100, and further beneficial to improve the stability of the liquid-cooled optical module 100 and extend the service life of the liquid-cooled optical module 100.

[0063] It can be understood that the shell 4 has two opposite side walls 4a, and the side walls 4a of the shell 4 are provided with first heat dissipation holes 42. It can be that one of the two side walls 4a of the shell 4 is provided with the first heat dissipation holes 42; or it can be that both side walls 4a of the shell 4 are provided with first heat dissipation holes 42, which is not limited in this embodiment.

[0064] In some optional implementations, such as Figures 2 to 6 As shown, the housing 4 includes a first sub-shell 43 and a second sub-shell 44, the first sub-shell 43 and the second sub-shell 44 are connected to enclose a mounting cavity 41, and the photoelectric conversion unit 2 is arranged on a side of the circuit board 1 close to the second sub-shell 44, and a first heat dissipation hole 42 can be arranged on the first sub-shell 43 and the second sub-shell 44, as described below: Alternatively, if Figure 2 As shown, a first heat dissipation hole 42 is defined on the top surface 431 of the first sub-shell 43 .

[0065] Optionally, a first heat dissipation hole 42 is formed on the side wall surface 4 a of the first sub-shell 43 .

[0066] Alternatively, if Figure 2 As shown, a first heat dissipation hole 42 is formed on the bottom surface 441 of the second sub-shell 44 .

[0067] Alternatively, if Figure 6 As shown, a first heat dissipation hole 42 is formed on the side wall surface 4 a of the second sub-shell 44 .

[0068] Optionally, first heat dissipation holes 42 are formed on the top surface 431 of the first sub-shell 43 and the side wall surface 4 a of the first sub-shell 43 .

[0069] Alternatively, if Figure 2 and Figure 3 As shown, first heat dissipation holes 42 are formed on the top surface 431 of the first sub-shell 43 and the bottom surface 441 of the second sub-shell 44 .

[0070] Optionally, first heat dissipation holes 42 are formed on the top surface 431 of the first sub-shell 43 and the side wall surface 4 a of the second sub-shell 44 .

[0071] Optionally, first heat dissipation holes 42 are formed on the side wall surface 4 a of the first sub-shell 43 and the bottom surface 441 of the second sub-shell 44 .

[0072] Optionally, first heat dissipation holes 42 are formed on the side wall surface 4 a of the first sub-shell 43 and the side wall surface 4 a of the second sub-shell 44 .

[0073] Optionally, first heat dissipation holes 42 are formed on the bottom surface 441 of the second sub-shell 44 and the side wall surface 4 a of the second sub-shell 44 .

[0074] Optionally, first heat dissipation holes 42 are formed on the top surface 431 of the first sub-shell 43 , the side wall surface 4 a of the first sub-shell 43 , and the bottom surface 441 of the second sub-shell 44 .

[0075] Optionally, first heat dissipation holes 42 are formed on the top surface 431 of the first sub-shell 43 , the side wall surface 4 a of the first sub-shell 43 , and the side wall surface 4 a of the second sub-shell 44 .

[0076] Optionally, first heat dissipation holes 42 are formed on the top surface 431 of the first sub-shell 43 , the bottom surface 441 of the second sub-shell 44 , and the side wall surface 4 a of the second sub-shell 44 .

[0077] Optionally, first heat dissipation holes 42 are formed on the side wall surface 4 a of the first sub-shell 43 , the bottom surface 441 of the second sub-shell 44 , and the side wall surface 4 a of the second sub-shell 44 .

[0078] Optionally, first heat dissipation holes 42 are formed on the top surface 431 of the first sub-shell 43 , the side wall surface 4 a of the first sub-shell 43 , the bottom surface 441 of the second sub-shell 44 , and the side wall surface 4 a of the second sub-shell 44 .

[0079] The above-mentioned method of connecting the first sub-shell 43 and the second sub-shell 44 to enclose and form the installation cavity 41 can facilitate the installation of the circuit board 1. In addition, by providing the first heat dissipation holes 42 on the top surface 431 of the first sub-shell 43, the side wall surface 4a of the first sub-shell 43, the bottom surface 441 of the second sub-shell 44, and the side wall surface 4a of the second sub-shell 44, the cooling liquid can flow in the installation cavity 41, so that the cooling liquid can enter from any first heat dissipation hole 42 and can also flow out from any first heat dissipation hole 42, which is beneficial to improve the heat dissipation efficiency of the liquid-cooled optical module 100. In addition, by providing the first heat dissipation holes 42 on multiple outer surfaces of the first sub-shell 43 and the second sub-shell 44 at the same time, the fluidity of the cooling liquid in the installation cavity 41 can be further improved, which is beneficial to further improve the heat dissipation efficiency of the liquid-cooled optical module 100, and further beneficial to improve the stability of the liquid-cooled optical module 100 and extend the service life of the liquid-cooled optical module 100.

[0080] It is understandable that if Figures 2 to 6As shown, the top surface 431 of the first sub-shell 43 can be the top surface 431 of the shell 4, or can be the bottom surface 441 of the shell 4; that is, when the top surface 431 of the first sub-shell 43 is the top surface 431 of the shell 4, the bottom surface 441 of the second sub-shell 44 is the bottom surface 441 of the shell 4; or, when the top surface 431 of the first sub-shell 43 is the bottom surface 441 of the shell 4, the bottom surface 441 of the second sub-shell 44 is the top surface 431 of the shell 4, which is not limited in this embodiment.

[0081] It can be understood that the side wall surface 4 a of the first sub-shell 43 and the side wall surface 4 a of the second sub-shell 44 constitute the side wall surface 4 a of the housing 4 .

[0082] It can be understood that the above-mentioned first sub-shell 43 has two opposite side wall surfaces 4a, and the side wall surfaces 4a of the above-mentioned first sub-shell 43 are provided with first heat dissipation holes 42. It can be that one of the two side wall surfaces 4a of the first sub-shell 43 is provided with the first heat dissipation holes 42; or it can be that both side wall surfaces 4a of the first sub-shell 43 are provided with first heat dissipation holes 42, which is not limited in this embodiment.

[0083] It can be understood that the second sub-shell 44 has two opposite side wall surfaces 4a, and the side wall surfaces 4a of the second sub-shell 44 are provided with first heat dissipation holes 42. It can be that one of the two side wall surfaces 4a of the second sub-shell 44 is provided with the first heat dissipation holes 42; or it can be that both side wall surfaces 4a of the second sub-shell 44 are provided with first heat dissipation holes 42, which is not limited in this embodiment.

[0084] It can be understood that when the first heat dissipation holes 42 are provided on the side wall surface 4a of the first sub-shell 43, and the first heat dissipation holes 42 are also provided on the side wall surface 4a of the second sub-shell 44, the first heat dissipation holes 42 may be provided on the side wall surfaces 4a on the opposite sides of the first sub-shell 43 and the second sub-shell 44 respectively; or the first heat dissipation holes 42 may be provided on the side wall surfaces 4a on the same side of the first sub-shell 43 and the second sub-shell 44 respectively; or the first heat dissipation holes 42 may be provided on both side wall surfaces 4a of the first sub-shell 43, and the first heat dissipation holes 42 may be provided on one of the two side wall surfaces 4a of the second sub-shell 44; or the first heat dissipation holes 42 may be provided on one of the two side wall surfaces 4a of the first sub-shell 43, and the first heat dissipation holes 42 may be provided on both side wall surfaces 4a of the second sub-shell 44, which is not limited in this embodiment.

[0085] It can be understood that when the first sub-shell 43 and the second sub-shell 44 are located on the same side and the side wall surface 4a are respectively provided with the first heat dissipation holes 42, the first heat dissipation holes 42 on the side wall surface 4a of the first sub-shell 43 and the first heat dissipation holes 42 on the side wall surface 4a of the second sub-shell 44 can be interconnected; or the first heat dissipation holes 42 on the side wall surface 4a of the first sub-shell 43 and the first heat dissipation holes 42 on the side wall surface 4a of the second sub-shell 44 are not connected, and this embodiment is not limited to this.

[0086] As an optional implementation, Figure 3 and Figure 7 As shown, a plurality of heat dissipation fins 432 are provided on the top surface 431 of the first sub-shell 43, and two adjacent heat dissipation fins 432 are arranged at intervals to form a heat dissipation channel. Since part of the heat in the liquid-cooled optical module 100 will be transferred to the housing 4, by providing heat dissipation fins 432 on the top surface 431 of the first sub-shell 43 and forming a heat dissipation channel, the contact area between the first sub-shell 43 and the coolant can be increased, that is, the heat dissipation area of ​​the first sub-shell 43 is increased, which is conducive to further improving the heat dissipation efficiency of the liquid-cooled optical module 100.

[0087] In some optional implementations, such as Figure 6 and Figure 7 As shown, in order to prevent external objects or the environment from damaging the liquid-cooled optical module 100, the liquid-cooled optical module 100 further includes an optical cage 7, which wraps the housing 4, and provides protection for the liquid-cooled optical module 100. However, since the gap between the optical cage 7 and the housing 4 is small, the present application also designs a solution to avoid reducing the heat dissipation efficiency of the liquid-cooled optical module 100 due to the provision of the optical cage 7, as shown below: As an optional implementation, Figure 6 and Figure 7 As shown, the liquid-cooled optical module 100 further includes an optical cage 7, the optical cage 7 wraps the housing 4, and a second heat dissipation hole 71 is provided on the optical cage 7 corresponding to the first heat dissipation hole 42, and the second heat dissipation hole 71 is communicated with the first heat dissipation hole 42. By wrapping the housing 4 with the optical cage 7, the liquid-cooled optical module 100 can be protected to prevent damage to the liquid-cooled optical module 100 by external objects or the environment, thereby extending the service life of the liquid-cooled optical module 100 and improving its stability and reliability; and by providing the second heat dissipation hole 71 communicated with the first heat dissipation hole 42 on the optical cage 7, the coolant can flow into or out of the installation cavity 41 through the first heat dissipation hole 42 and the second heat dissipation hole 71, thereby avoiding the occurrence of a situation where the fluidity of the coolant in the installation cavity 41 is reduced due to the provision of the optical cage 7.

[0088] Optionally, the opening shape of the second heat dissipation hole 71 includes a circle, an ellipse, a polygon, a rounded rectangle, etc., which is not limited in this embodiment.

[0089] It can be understood that the second heat dissipation holes 71 are provided on the above-mentioned light cage 7 corresponding to the first heat dissipation holes 42, which means that: when the first heat dissipation holes 42 are provided on the top surface 431 of the shell 4, the second heat dissipation holes 71 are also provided on the top surface 431 of the light cage 7; when the first heat dissipation holes 42 are provided on the bottom surface 441 of the shell 4, the second heat dissipation holes 71 are also provided on the bottom surface 441 of the light cage 7; when the first heat dissipation holes 42 are provided on the side wall surface 4a of the shell 4, the second heat dissipation holes 71 are also provided on the side wall surface 4a of the light cage 7.

[0090] As an optional implementation, Figure 6 and Figure 7 As shown, a slot 45 is provided on the outer surface of the shell 4, and a locking spring 72 is provided on the inner wall surface of the optical cage 7 corresponding to the slot 45, and the locking spring 72 is engaged with the slot 45. By engaging the slot 45 on the outer surface of the shell 4 and the locking spring 72 on the inner wall of the optical cage 7, the shell 4 and the optical cage 7 can be fixed, and the connection stability between the shell 4 and the optical cage 7 can be improved, which is beneficial to improving the overall stability of the liquid-cooled optical module 100. In addition, by engaging, welding is not required, which can reduce the production cost and the difficulty of assembling the shell 4 and the optical cage 7, facilitate the assembly between the shell 4 and the optical cage 7, and also facilitate disassembly and replacement.

[0091] It can be understood that the outer surface of the shell 4 includes the bottom surface 441 of the shell 4, the top surface 431 of the shell 4 and the side wall surface 4a of the shell 4. The outer surface of the shell 4 is provided with a card slot 45, which may be that the bottom surface 441 of the shell 4 is provided with a card slot 45. Alternatively, the top surface 431 of the shell 4 is provided with a card slot 45. Alternatively, the side wall surface 4a of the shell 4 is provided with a card slot 45. Alternatively, the bottom surface 441 of the shell 4 and the top surface 431 of the shell 4 are provided with a card slot 45. Alternatively, the bottom surface 441 of the shell 4 and the side wall surface 4a of the shell 4 are provided with a card slot 45. Alternatively, the top surface 431 of the shell 4 and the side wall surface 4a of the shell 4 are provided with a card slot 45. Alternatively, the bottom surface 441 of the shell 4, the top surface 431 of the shell 4 and the side wall surface 4a of the shell 4 are provided with a card slot 45, which is not limited in the embodiment of the present application.

[0092] It can be understood that the shell 4 has two opposite side walls 4a, and the side walls 4a of the shell 4 are provided with a card groove 45. It can be that one of the two side walls 4a of the shell 4 is provided with a card groove 45; or it can be that both side walls 4a of the shell 4 are provided with a card groove 45, which is not limited to the present embodiment.

[0093] In an optional implementation, if Figure 6 and Figure 7As shown, the housing 4 has an optical port 46 and an electrical port 47 opposite to each other, the optical cage 7 has a first opening 73, and the first opening 73 is configured to allow the electrical port 47 to extend therein, so that the optical cage 7 is wrapped around the outer periphery of the housing 4, and the first heat dissipation hole 42 is located between the electrical port 47 and the card slot 45. By arranging the first heat dissipation hole 42 between the electrical port 47 and the card slot 45, the cooling liquid can flow in the installation cavity 41 without affecting the assembly effect of the liquid-cooled optical module 100, which is beneficial to improving the heat dissipation efficiency of the liquid-cooled optical module 100.

[0094] In another optional embodiment, the housing 4 has an optical port 46 and an electrical port 47 opposite to each other, the optical cage 7 has a first opening 73, and the first opening 73 is configured to allow the electrical port 47 to extend therein, so that the optical cage 7 is wrapped around the outer periphery of the housing 4, and the first heat dissipation hole 42 is located between the card slot 45 and the optical port 46. By arranging the first heat dissipation hole 42 between the card slot 45 and the optical port 46, the cooling liquid can flow in the installation cavity 41 without affecting the assembly effect of the liquid-cooled optical module 100, which is beneficial to improving the heat dissipation efficiency of the liquid-cooled optical module 100.

[0095] In another optional embodiment, the housing 4 has an optical port 46 and an electrical port 47 opposite to each other, the optical cage 7 has a first opening 73, and the first opening 73 is configured to allow the electrical port 47 to extend therein, so that the optical cage 7 is wrapped around the outer periphery of the housing 4, and the first heat dissipation hole 42 is located between the electrical port 47 and the card slot 45 and between the card slot 45 and the optical port 46. By simultaneously providing the first heat dissipation hole 42 between the electrical port 47 and the card slot 45 and between the card slot 45 and the optical port 46, compared with providing the first heat dissipation hole 42 between the electrical port 47 and the card slot 45 or between the card slot 45 and the optical port 46 alone, the fluidity of the coolant in the mounting cavity 41 can be further improved, thereby facilitating further improving the heat dissipation efficiency of the liquid-cooled optical module 100.

[0096] Optionally, a second opening is provided at one end of the optical cage 7 away from the first opening 73 , and the second opening is configured for the circuit board 1 to be plugged into the optical communication device.

[0097] Alternatively, if Figure 6 and Figure 7As shown, the outer surface of the housing 4 provided with the slot 45 is also provided with a first heat dissipation hole 42, and when the first heat dissipation hole 42 is located between the electrical port end 47 and the slot 45, the projection of the locking spring 72 on the first plane P is at least partially staggered with the projection of the first heat dissipation hole 42 on the first plane P, wherein the first plane P is a plane perpendicular to the first direction X, and the first direction X is the direction from the optical port end 46 to the electrical port end 47. During the assembly process, the electrical port end 47 of the housing 4 is extended from the first opening 73 of the optical cage 7, and then the locking spring 72 is aligned and engaged with the slot 45, so the locking spring 72 will pass through the first heat dissipation hole 42 provided between the electrical port end 47 and the slot 45. By staggering the projection of the locking spring 72 on the first plane P at least partially with the projection of the first heat dissipation hole 42 on the first plane P, it is possible to avoid affecting the engagement of the locking spring 72 with the first heat dissipation hole 42 during the assembly or disassembly process, which is conducive to improving the assembly or disassembly efficiency of the housing 4 and the optical cage 7.

[0098] Optionally, the liquid-cooled optical module 100 also includes a pull ring 81 and a connector 82, the pull ring 81 is connected to the connector 82, the connector 82 is connected to the outer surface of the shell 4, and the connector 82 is located between the card slot 45 and the light port end 46, the outer surface of the shell 4 is provided with a first heat dissipation hole 42, and when the first heat dissipation hole 42 is located between the card slot 45 and the light port end 46, an avoidance opening is provided on the connector 82 corresponding to the first heat dissipation hole 42, and the avoidance opening is connected to the first heat dissipation hole 42. In this way, the connection and fixation of the pull ring 81 can be realized through the connector 82, and when the first heat dissipation hole 42 and the connector are located between the card slot 45 and the optical port end 46, by correspondingly setting a relief port connected to the first heat dissipation hole 42 on the connector 82, it is helpful to avoid the situation where the coolant is blocked from flowing into or out of the installation cavity 41 due to the setting of the pull ring 81 and the connector 82, thereby avoiding the situation where the connector 82 reduces the heat dissipation effect of the first heat dissipation hole 42, and then the coolant can flow in the installation cavity 41 without affecting the assembly effect of the liquid-cooled optical module 100, which is beneficial to improve the heat dissipation efficiency of the liquid-cooled optical module 100. In addition, by operating the pull ring 81, the housing 4 can be separated from the optical cage 7, and the plug-in and unplug function of the liquid-cooled optical module 100 can be realized.

[0099] Optionally, the connecting member 82 includes but is not limited to a connecting piece and a connecting column.

[0100] See also Figure 8 , Figure 8It is a structural schematic diagram of an optical communication device provided in an embodiment of the present application. In the second aspect, the embodiment of the present application also discloses an optical communication device 200, including the liquid-cooled optical module 100 as described in the first aspect above. The optical communication device 200 includes but is not limited to optical fiber communication equipment, laser wireless communication equipment, wireless network equipment, radar equipment, and detection equipment. The optical communication device 200 having the liquid-cooled optical module 100 of the first aspect above can also improve the heat dissipation effect of the liquid-cooled optical module 100, thereby improving the stability of the liquid-cooled optical module 100 and extending the service life of the liquid-cooled optical module 100, which is beneficial to improving the stability of the optical communication device 200 and extending the service life of the optical communication device 200.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid-cooled optical module, characterized in that: include: Circuit boards; A photoelectric conversion unit, wherein the photoelectric conversion unit is disposed on the circuit board; A sealing cover, wherein the sealing cover is disposed on the circuit board to form a sealed cavity with the circuit board, and the photoelectric conversion unit is located in the sealed cavity; as well as The shell has an installation cavity, the circuit board and the sealing cover are arranged in the installation cavity, the shell is provided with a first heat dissipation hole, the first heat dissipation hole connects the installation cavity with the external environment, and the first heat dissipation hole is configured to allow coolant to flow into or out of the installation cavity, so that the coolant flows through the surface of the circuit board and the sealing cover.

2. The liquid-cooled optical module according to claim 1, characterized in that: A chip is provided on a surface of the circuit board facing away from the photoelectric conversion unit; The liquid-cooled optical module further includes a first heat-conducting member, which is disposed on the chip.

3. The liquid-cooled optical module according to claim 2, characterized in that: The liquid-cooled optical module also includes a second heat-conducting member, which is arranged on the inner wall surface of the shell corresponding to the first heat-conducting member, the second heat-conducting member is in contact with the first heat-conducting member, and the first heat dissipation hole and the second heat-conducting member are staggered.

4. The liquid-cooled optical module according to any one of claims 1 to 3, characterized in that: The first heat dissipation hole is provided on at least one of the top surface of the shell, the bottom surface of the shell, and the side wall surface of the shell.

5. The liquid-cooled optical module according to claim 4, characterized in that: The shell includes a first sub-shell and a second sub-shell, the first sub-shell is connected to the second sub-shell to enclose the installation cavity, the photoelectric conversion unit is arranged on a side of the circuit board close to the second sub-shell, and the first heat dissipation hole is opened on at least one of the top surface of the first sub-shell, the side wall surface of the first sub-shell, the bottom surface of the second sub-shell and the side wall surface of the second sub-shell.

6. The liquid-cooled optical module according to any one of claims 1 to 3, characterized in that: The liquid-cooled optical module further includes an optical cage, which wraps the shell, and a second heat dissipation hole is arranged on the optical cage corresponding to the first heat dissipation hole, and the second heat dissipation hole is connected to the first heat dissipation hole.

7. The liquid-cooled optical module according to claim 6, characterized in that: A card slot is arranged on the outer surface of the shell, and a locking spring piece is arranged on the inner wall surface of the light cage corresponding to the card slot, and the locking spring piece is engaged with the card slot.

8. The liquid-cooled optical module according to claim 7, characterized in that: The housing has an optical port and an electrical port opposite to each other, and the optical cage has a first opening, wherein the first opening is configured to allow the electrical port to extend therein, so that the optical cage is wrapped around the outer periphery of the housing; The first heat dissipation hole is located between the electrical port and the card slot, and / or the first heat dissipation hole is located between the card slot and the optical port.

9. The liquid-cooled optical module according to claim 8, characterized in that: The first heat dissipation hole is also provided on the outer surface of the housing provided with the card slot, and when the first heat dissipation hole is located between the electrical port and the card slot, the projection of the locking spring on the first plane is at least partially staggered with the projection of the first heat dissipation hole on the first plane, wherein the first plane is a plane perpendicular to a first direction, and the first direction is the direction from the optical port to the electrical port; and / or, The liquid-cooled optical module also includes a pull ring and a connecting piece, the pull ring is connected to the connecting piece, the connecting piece is connected to the outer surface of the shell, and the connecting piece is located between the card slot and the optical port end, the outer surface of the shell is provided with the first heat dissipation hole, and when the first heat dissipation hole is located between the card slot and the optical port end, an avoidance opening is provided on the connecting piece corresponding to the first heat dissipation hole, and the avoidance opening is connected to the first heat dissipation hole.

10. An optical communication device, characterized in that: Comprising a liquid-cooled optical module as described in any one of claims 1-9.

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