Automatic die bonder

Abstract

The invention discloses an automatic die bonder which is characterized in that a rotating table is mounted at the top of a processing table, a rotating disc is arranged above the rotating table, an electric telescopic rod is arranged between the rotating disc and the rotating table, the movable end of the electric telescopic rod is movably connected with the rotating disc, and a connecting frame is fixedly mounted on the upper surface of the rotating disc; one end of the connecting frame is connected with a swing arm with a suction nozzle, a limiting baffle is located on the side, opposite to the swing arm, of the connecting frame and fixedly connected with the rotating table, a rotating plate with a sliding groove formed in the surface is rotationally installed on the side, opposite to the connecting frame, of the limiting baffle, and the other end of the connecting frame is provided with a sliding block connected with the sliding groove in a sliding mode. A first driving motor is installed at the lower end of the limiting baffle, and a transmission mechanism is arranged between the first driving motor and the second limiting shaft. The moving precision of the suction nozzle is improved, the leftward and rightward moving range of the suction nozzle is expanded, the device can be suitable for picking up different materials, the accuracy and stability of material picking up are improved, and the overall applicability of the device is improved.

Description

Technical Field

[0001] The invention relates to the technical field of crystal bonding, and in particular to an automatic crystal bonding machine. Background Art

[0002] Traditional die bonders are used to achieve electrical connection between semiconductor devices and substrates. Traditional die bonders can bond semiconductor devices to substrates using conductive silver paste or non-conductive glue. Then a baking process is performed to solidify the semiconductor devices bonded with conductive silver paste or non-conductive glue. Finally, under the action of hot pressing and ultrasound, the substrate and the semiconductor device are connected by gold wire (copper wire or silver alloy wire) through a wire bonding machine to achieve electrical connection between the semiconductor device and the substrate.

[0003] After searching, the patent publication number CN105448780B discloses a "crystal bonding machine", including: a machine platform; a substrate mounting mechanism for loading the substrate, the substrate mounting mechanism is arranged on the machine platform; a screen printing mechanism for printing solder paste on the substrate by screen printing; a semiconductor device conveying mechanism for loading semiconductor devices, which is arranged on the machine platform and located on one side of the substrate mounting mechanism; a device grabbing mechanism for grabbing semiconductor devices and placing them on the substrate so that the semiconductor devices are fixed to the substrate through the solder paste. The device realizes the metal bonding of the electrodes between the semiconductor device and the substrate through the solder paste by screen printing the solder paste on the substrate, which facilitates the control of the glue amount of the crystal bonding machine, improves the yield of the product, and can automatically identify the substrate and the semiconductor device to accurately print the solder paste, and accurately grab and fix the semiconductor device, further improving the quality of the product.

[0004] In the prior art, materials are generally sucked up through a suction nozzle connected to an air source. Due to the different sizes of materials, the center of gravity of the materials will change. Although the suction nozzle can be moved by rotating the swing arm, the rotation amplitude of the swing arm is large, while the offset position of the center of the material is small, resulting in the suction nozzle on the adjusted swing arm being unable to adapt to the material position, making it difficult to pick up the material stably. The chip picked up by the suction nozzle is easy to fall off, and the applicability is poor. Summary of the invention

[0005] The object of the present invention is to provide an automatic crystal bonding machine, which not only improves the moving accuracy of the suction nozzle, but also expands the moving range of the suction nozzle, can adapt to picking up different materials, improves the accuracy and stability of material picking, and improves the overall applicability of the device.

[0006] To achieve the above object, the technical solution adopted by the present invention is: an automatic crystal bonding machine, comprising: a processing table, a rotating table is installed on the top of the processing table, a rotating disk is arranged above the rotating table, an electric telescopic rod is arranged between the rotating disk and the rotating table, and the movable end of the electric telescopic rod is movably connected to the rotating disk, a connecting frame is fixedly installed on the upper surface of the rotating disk, and one end of the connecting frame is connected to a swing arm with a suction nozzle; A limit baffle is located on the side of the connecting frame opposite to the swing arm and fixedly connected to the rotating table. A rotating plate with a sliding groove on the surface is rotatably installed on the limit baffle relative to one side of the connecting frame, and the other end of the connecting frame has a sliding block slidably connected to the sliding groove. A second limit shaft is fixedly connected to the lower end of the rotating plate, and a first driving motor is installed on the lower end of the limit baffle, and a transmission mechanism is arranged between the first driving motor and the second limit shaft.

[0007] The further improved scheme in the above technical scheme is as follows: 1. In the above scheme, a heat sink with a semiconductor refrigeration sheet inside is arranged on one side of the rotating table, and the semiconductor refrigeration sheet divides the interior of the heat sink into a first cavity and a second cavity. The side walls of the first cavity and the second cavity are each provided with an air inlet connected to the outside. The cooling end of the semiconductor refrigeration sheet is located inside the first cavity, and the heating end of the semiconductor refrigeration sheet is located inside the second cavity. A first air outlet is arranged on the side of the first cavity away from the semiconductor refrigeration sheet, and a first fan for blowing the gas inside the first cavity toward the top of the processing table is arranged on the inner wall of the first air outlet.

[0008] 2. In the above solution, a second air outlet with a second fan installed on the inner wall of the second cavity is provided on a side away from the semiconductor cooling plate.

[0009] 3. In the above solution, a plurality of metal conductive sheets are provided at intervals inside the first cavity.

[0010] 4. In the above solution, a plurality of heat dissipation fins are arranged at intervals inside the second cavity.

[0011] 5. In the above solution, a filter is provided on the outer wall of the heat dissipation box and on the first air outlet.

[0012] 6. In the above scheme, the transmission mechanism includes: a first limiting shaft fixedly connected to the output shaft of the first driving motor, a driving pulley sleeved on the outer wall of the first limiting shaft, and a driven pulley sleeved on the outer wall of the second limiting shaft, and a transmission belt is commonly connected between the driving pulley and the driven pulley.

[0013] 7. In the above solution, a base is provided between the rotating table and the processing table.

[0014] 8. In the above solution, a support frame is provided at the bottom of the processing table, and a plurality of storage boxes are provided inside the support frame.

[0015] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The automatic crystal bonding machine of the present invention comprises a rotating disk disposed above the rotating table, an electric telescopic rod disposed between the rotating disk and the rotating table, a connecting frame fixedly mounted on the upper surface of the rotating disk, one end of the connecting frame being connected to a swing arm with a suction nozzle, a rotating plate with a sliding groove on the surface of the limiting baffle being rotatably mounted relative to one side of the connecting frame, and a sliding block slidably connected to the sliding groove on the other end of the connecting frame, a second limiting shaft being fixedly connected to the lower end of the rotating plate, a first driving motor being mounted on the lower end of the limiting baffle, a transmission mechanism disposed between the first driving motor and the second limiting shaft, the second limiting shaft being driven to rotate by the first driving motor through the transmission mechanism, and the second limiting shaft being driven to rotate by the first driving motor through the transmission mechanism. The rotating plate can be adjusted to rotate around the axis, and during the rotation of the rotating plate, the connecting frame will be driven to deviate left and right, and the connecting frame will rotate around the axis of the rotating disk, thereby realizing left and right micro-adjustment of the swing arm and improving the movement accuracy of the suction nozzle; further, its electric telescopic rod drives the connecting frame on the rotating disk to move in the vertical direction, so that the height of the swing arm can be adjusted, and the end of the connecting frame away from the swing arm is slidably connected to the rotating plate, and the distance between the connecting frame and the second limit axis can also be adjusted, thereby expanding the movement range of the suction nozzle, thereby improving the accuracy and stability of material picking, can adapt to the picking of different materials, and improves the overall applicability of the device.

[0016] 2. In the automatic crystal bonding machine of the present invention, the semiconductor refrigeration plate divides the interior of the heat sink into a first cavity and a second cavity, and the side walls of the first cavity and the second cavity are provided with an air inlet connected to the outside, the cooling end of the semiconductor refrigeration plate is located in the first cavity, and the heating end of the semiconductor refrigeration plate is located in the second cavity, and a first air outlet is provided on the side of the first cavity away from the semiconductor refrigeration plate, and the inner wall of the first air outlet is provided with a first fan for blowing the gas inside the first cavity to the top of the processing table. Depending on the actual situation, the first fan can be operated to blow the air inside the first cavity to the top of the processing table to dissipate heat for the corresponding components and semiconductor crystals, and the semiconductor refrigeration plate can also be started to cool the air passing through the first cavity. When the first fan is running, the cooled air is blown to the top of the processing table to achieve rapid cooling and heat dissipation of the corresponding components and semiconductor crystals, thereby improving the overall heat dissipation effect and the applicability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Attached Figure 1 It is a schematic structural diagram of the automatic crystal bonding machine of the present invention from a first viewing angle; Attached Figure 2 It is a structural schematic diagram of the automatic crystal bonding machine of the present invention from a second viewing angle; Attached Figure 3 It is a partial structural schematic diagram of the automatic crystal bonding machine of the present invention; Attached Figure 4 The present invention is attached Figure 3 A magnified image of point A; Attached Figure 5 It is a partial structural cross-sectional view of the automatic crystal bonding machine of the present invention; Attached Figure 6 The figure is a schematic diagram of the internal structure of the heat dissipation box in the automatic crystal bonding machine of the present invention.

[0018] In the above drawings: 1. support frame; 2. processing table; 3. storage box; 4. pull-out placement plate; 5. heat dissipation box; 501. first cavity; 502. second cavity; 5031. first air outlet; 5032. second air outlet; 61. base; 62. rotating table; 63. electric telescopic rod; 64. connecting frame; 65. rotating disk; 66. swing arm; 67. first drive motor; 71. air inlet; 72. filter; 73. semiconductor refrigeration plate; 74. heat dissipation fin; 75. metal conduction plate; 76. first mounting frame; 77. first fan; 78. second mounting frame; 79. second fan; 8. driving pulley; 9. driven pulley; 10. transmission belt; 11. first limit shaft; 12. second limit shaft; 13. rotating plate; 14. slide groove; 15. slider; 16. limit baffle. DETAILED DESCRIPTION

[0019] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0020] Embodiment 1: An automatic crystal bonding machine, comprising: a processing table 2, a rotating table 62 is installed on the top of the processing table 2, a rotating disk 65 is arranged above the rotating table 62, an electric telescopic rod 63 is arranged between the rotating disk 65 and the rotating table 62, and the movable end of the electric telescopic rod 63 is movably connected to the rotating disk 65, a connecting frame 64 is fixedly installed on the upper surface of the rotating disk 65, one end of the connecting frame 64 is connected to a swing arm 66 with a suction nozzle, and the suction nozzle is located at the end of the swing arm 66 away from the connecting frame 64; A limit baffle 16 is located on the side of the connecting frame 64 opposite to the swing arm 66 and fixedly connected to the rotating table 62. A rotating plate 13 with a slide groove 14 on the surface is rotatably installed on the limit baffle 16 relative to one side of the connecting frame 64, and the other end of the connecting frame 64 has a slider 15 slidably connected to the slide groove 14. A second limit shaft 12 is fixedly connected to the lower end of the rotating plate 13. A first drive motor 67 is installed at the lower end of the limit baffle 16. A transmission mechanism is provided between the first drive motor 67 and the second limit shaft 12. The electric telescopic rod is operated to drive the connecting frame to move, and the connecting frame moves in the slide groove of the rotating plate through the slider, so as to adjust the height position of the swing arm. The first driving motor is operated to drive the first limit shaft to rotate, thereby driving the active pulley to rotate, and the driven pulley is driven by the belt transmission action of the transmission belt to rotate, thereby driving the second limit shaft to rotate, and then driving the rotating plate to rotate, so that the swing arm can be fine-tuned and swung left and right through the connecting frame.

[0021] A heat sink 5 having a semiconductor cooling sheet 73 inside is arranged on one side of the rotating table 62. The semiconductor cooling sheet 73 divides the inside of the heat sink 5 into a first cavity 501 and a second cavity 502. The side walls of the first cavity 501 and the second cavity 502 are both provided with an air inlet 71 connected to the outside. The cooling end of the semiconductor cooling sheet 73 is located inside the first cavity 501, and the heating end of the semiconductor cooling sheet 73 is located inside the second cavity 502. A first air outlet 5031 is arranged on the side of the first cavity 501 away from the semiconductor cooling sheet 73. The inner wall of the first air outlet 5031 is provided with a first fan 77 for blowing the gas inside the first cavity 501 to the top of the processing table 2. Depending on the actual situation, the first fan can be operated to blow the air inside the first cavity to the top of the processing table to dissipate heat for the corresponding components and semiconductor crystals. The semiconductor refrigeration sheet can also be started to cool the air passing through the first cavity. When the first fan is running, the cooled air is blown to the top of the workbench to achieve rapid cooling and heat dissipation of the corresponding components and semiconductor crystals, thereby improving the overall heat dissipation effect and the applicability of the device.

[0022] A second air outlet 5032 with a second fan 79 installed on the inner wall of the second cavity 502 is provided on a side away from the semiconductor cooling plate 73 .

[0023] A plurality of metal conductive sheets 75 are disposed at intervals inside the first cavity 501 ; the metal conductive sheets 75 are copper sheets.

[0024] A plurality of heat sink fins 74 are arranged in the internal intervals of the second cavity 502. The heat generated by the semiconductor refrigeration plate during operation can be dissipated through the heat sink fins, and the heat can be dissipated by blowing the heat sink fins through the second fan to ensure the normal operation of the entire device.

[0025] A filter 72 is disposed on the outer wall of the heat dissipation box 5 and covers the first air outlet 5031. The filter is installed on one side of the heat dissipation box to improve the filtering effect and facilitate unified cleaning later.

[0026] The transmission mechanism includes: a first limiting shaft 11 fixedly connected to the output shaft of the first drive motor 67, a driving pulley 8 sleeved on the outer wall of the first limiting shaft 11, and a driven pulley 9 sleeved on the outer wall of the second limiting shaft 12, and a transmission belt 10 is commonly connected between the driving pulley 8 and the driven pulley 9.

[0027] A base 61 is disposed between the rotating table 62 and the processing table 2 .

[0028] A support frame 1 is disposed at the bottom of the processing table 1 , and a plurality of storage boxes 3 are disposed inside the support frame 1 .

[0029] The top of the storage box 3 is slidably connected with a plurality of drawer plates 4 .

[0030] The suction nozzle is connected to an air source and is used to pick up semiconductor crystals.

[0031] Embodiment 2: An automatic crystal bonding machine, comprising: a processing table 2, a rotating table 62 is installed on the top of the processing table 2, a rotating disk 65 is arranged above the rotating table 62, an electric telescopic rod 63 is arranged between the rotating disk 65 and the rotating table 62, and the movable end of the electric telescopic rod 63 is movably connected to the rotating disk 65, a connecting frame 64 is fixedly installed on the upper surface of the rotating disk 65, and one end of the connecting frame 64 is connected to a swing arm 66 with a suction nozzle; The first driving motor drives the second limit shaft to rotate through the transmission mechanism, so that the rotating plate can be adjusted to rotate around the axis, and during the rotation of the rotating plate, the connecting frame will be driven to deviate left and right, and the connecting frame will rotate around the axis of the rotating disk, thereby realizing left and right micro-adjustment of the swing arm, thereby improving the movement accuracy of the suction nozzle; A limit baffle 16 is located on the side of the connecting frame 64 opposite to the swing arm 66 and fixedly connected to the rotating table 62. A rotating plate 13 with a slide groove 14 on the surface is rotatably installed on the limit baffle 16 relative to one side of the connecting frame 64, and the other end of the connecting frame 64 has a slider 15 slidably connected to the slide groove 14. A second limit shaft 12 is fixedly connected to the lower end of the rotating plate 13. A first drive motor 67 is installed at the lower end of the limit baffle 16. A transmission mechanism is provided between the first drive motor 67 and the second limit shaft 12. Furthermore, the electric telescopic rod drives the connecting frame on the rotating disk to move in the vertical direction, so that the height of the swing arm can be adjusted, and the end of the connecting frame away from the swing arm is slidably connected to the rotating plate, and the distance between the connecting frame and the second limit axis can also be adjusted, thereby expanding the moving range of the suction nozzle, thereby improving the accuracy and stability of material picking, can adapt to the picking of different materials, and improves the overall applicability of the device.

[0032] A heat sink 5 having a semiconductor cooling sheet 73 inside is arranged on one side of the rotating table 62. The semiconductor cooling sheet 73 divides the inside of the heat sink 5 into a first cavity 501 and a second cavity 502. The side walls of the first cavity 501 and the second cavity 502 are both provided with an air inlet 71 connected to the outside. The cooling end of the semiconductor cooling sheet 73 is located inside the first cavity 501, and the heating end of the semiconductor cooling sheet 73 is located inside the second cavity 502. A first air outlet 5031 is arranged on the side of the first cavity 501 away from the semiconductor cooling sheet 73. The inner wall of the first air outlet 5031 is provided with a first fan 77 for blowing the gas inside the first cavity 501 to the top of the processing table 2. The cooling mode is adjusted according to the actual cooling demand. When the cooling is normal, the first fan is operated to cool the components and semiconductor crystals on the workbench. When rapid cooling is required, the semiconductor refrigeration sheet is started, and the air in the cooling box is cooled by the metal conduction sheet. The first fan is operated to quickly cool the components and semiconductor crystals on the workbench, thereby achieving the required cooling.

[0033] A second air outlet 5032 with a second fan 79 installed on the inner wall of the second cavity 502 is provided on a side away from the semiconductor cooling plate 73 .

[0034] A filter screen 72 is disposed on the outer wall of the heat dissipation box 5 and covers the first air outlet 5031 .

[0035] The transmission mechanism includes: a first limiting shaft 11 fixedly connected to the output shaft of the first drive motor 67, a driving pulley 8 sleeved on the outer wall of the first limiting shaft 11, and a driven pulley 9 sleeved on the outer wall of the second limiting shaft 12, and a transmission belt 10 is commonly connected between the driving pulley 8 and the driven pulley 9.

[0036] A support frame 1 is disposed at the bottom of the processing table 1 , and a plurality of storage boxes 3 are disposed inside the support frame 1 .

[0037] A first mounting bracket 76 is disposed between the first air outlet 5031 and the first fan 77 .

[0038] A second mounting bracket 78 is disposed between the second air outlet 5032 and the second fan 79 .

[0039] The metal conductive sheet 75 is an aluminum sheet.

[0040] The working principle is: When in use, the electric telescopic rod is operated to drive the connecting frame to move, and the connecting frame moves in the slide groove of the rotating plate through the slider, so as to adjust the height position of the swing arm, and the first limit shaft is driven to rotate by the first driving motor, thereby driving the active pulley to rotate, and the driven pulley is driven to rotate under the belt transmission action of the transmission belt, thereby driving the second limit shaft to rotate, and then driving the rotating plate to rotate, so that the swing arm can be fine-tuned and swung left and right through the connecting frame; The heat dissipation mode is adjusted according to the actual heat dissipation demand. When the heat dissipation is normal, the first fan is operated to dissipate the heat of the components and semiconductor crystals on the workbench normally. When the heat dissipation needs to be quickly processed, the semiconductor refrigeration sheet is started, and the air in the heat dissipation box is cooled by the metal conduction sheet. The first fan is operated to dissipate the heat of the components and semiconductor crystals on the workbench quickly, thereby achieving the heat dissipation requirement; A filter is installed on one side of the heat sink to improve the filtering effect and facilitate unified cleaning later. The heat generated by the semiconductor refrigeration plate during operation can be dissipated through the cooling fins, and the second fan can blow the cooling fins to dissipate heat, ensuring the normal operation of the overall equipment.

[0041] When the above-mentioned automatic crystal bonding machine is used, the first driving motor drives the second limiting shaft to rotate through the transmission mechanism, so that the rotating plate can be adjusted to rotate around the axis, and during the rotation of the rotating plate, the connecting frame will be driven to deviate left and right, and the connecting frame rotates around the axis of the rotating disk, thereby realizing left and right micro-adjustment of the swing arm, and improving the moving accuracy of the suction nozzle; further, its electric telescopic rod drives the connecting frame on the rotating disk to move in the vertical direction, so that the height of the swing arm can be adjusted, and the end of the connecting frame away from the swing arm is slidably connected to the rotating plate, and the distance between the connecting frame and the second limiting shaft can also be adjusted, thereby expanding the moving range of the suction nozzle, thereby improving the accuracy and stability of material picking, and can adapt to picking up different materials, thereby improving the overall applicability of the device; In addition, depending on the actual situation, the first fan can be operated to blow the air inside the first cavity to the top of the processing table to dissipate heat for the corresponding components and semiconductor crystals. The semiconductor refrigeration sheet can also be started to cool the air passing through the first cavity. When the first fan is running, the cooled air is blown to the top of the workbench to achieve rapid cooling and heat dissipation of the corresponding components and semiconductor crystals, thereby improving the overall heat dissipation effect and enhancing the applicability of the device.

[0042] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic die bonding machine, comprising: A processing table (2), wherein a rotating table (62) is installed on the top of the processing table (2), characterized in that: a rotating disk (65) is arranged above the rotating table (62), an electric telescopic rod (63) is arranged between the rotating disk (65) and the rotating table (62), and the movable end of the electric telescopic rod (63) is movably connected to the rotating disk (65), a connecting frame (64) is fixedly installed on the upper surface of the rotating disk (65), and one end of the connecting frame (64) is connected to a swing arm (66) with a suction nozzle; A limit baffle (16) is located on a side of the connecting frame (64) opposite to the swing arm (66) and is fixedly connected to the rotating table (62). A rotating plate (13) having a sliding groove (14) on its surface is rotatably mounted on the limit baffle (16) relative to one side of the connecting frame (64). The other end of the connecting frame (64) has a sliding block (15) slidably connected to the sliding groove (14). A second limit shaft (12) is fixedly connected to the lower end of the rotating plate (13). A first drive motor (67) is mounted on the lower end of the limit baffle (16). A transmission mechanism is arranged between the first drive motor (67) and the second limit shaft (12).

2. The automatic die bonding machine according to claim 1, characterized in that: A heat sink (5) having a semiconductor cooling sheet (73) inside is arranged on one side of the rotating table (62); the semiconductor cooling sheet (73) divides the inside of the heat sink (5) into a first cavity (501) and a second cavity (502); the side walls of the first cavity (501) and the second cavity (502) are each provided with an air inlet (71) connected to the outside; the cooling end of the semiconductor cooling sheet (73) is located inside the first cavity (501); the heating end of the semiconductor cooling sheet (73) is located inside the second cavity (502); a first air outlet (5031) is arranged on a side of the first cavity (501) away from the semiconductor cooling sheet (73); and a first fan (77) for blowing the gas inside the first cavity (501) toward the top of the processing table (2) is arranged on the inner wall of the first air outlet (5031).

3. The automatic crystal bonding machine according to claim 2, characterized in that: A second air outlet (5032) having a second fan (79) installed on an inner wall is provided on a side of the second cavity (502) away from the semiconductor cooling plate (73).

4. The automatic crystal bonding machine according to claim 2, characterized in that: A plurality of metal conductive sheets (75) are arranged at intervals inside the first cavity (501).

5. The automatic die bonding machine according to claim 2, characterized in that: A plurality of heat dissipation fins (74) are arranged at intervals inside the second cavity (502).

6. The automatic die bonding machine according to claim 2, characterized in that: A filter screen (72) is provided on the outer wall of the heat dissipation box (5) and covers the first air outlet (5031).

7. The automatic crystal bonding machine according to claim 1, characterized in that: The transmission mechanism comprises: a first limiting shaft (11) fixedly connected to the output shaft of a first drive motor (67), a driving pulley (8) sleeved on the outer wall of the first limiting shaft (11), and a driven pulley (9) sleeved on the outer wall of a second limiting shaft (12), wherein a transmission belt (10) is commonly connected between the driving pulley (8) and the driven pulley (9).

8. The automatic die bonding machine according to claim 1, characterized in that: A base (61) is provided between the rotating table (62) and the processing table (2).

9. The automatic die bonding machine according to claim 1, characterized in that: A support frame (1) is arranged at the bottom of the processing table (1), and a plurality of storage boxes (3) are arranged inside the support frame (1).

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