Adjusting mechanism and semiconductor process equipment

Abstract

The invention provides an adjusting mechanism and semiconductor process equipment, and the adjusting mechanism comprises a mounting flange which is fixedly disposed in a reaction chamber; the movable flange is arranged on the mounting flange and is connected with the gas spraying head; the locking piece is connected with the mounting flange and the movable flange and can realize locking and unlocking between the mounting flange and the movable flange; the adjusting part is movably connected with the mounting flange and the movable flange and is used for adjusting the position of the movable flange relative to the mounting flange; one of the locking piece and the adjusting piece is of a hollow structure, and the other one of the locking piece and the adjusting piece is sleeved with the locking piece and the adjusting piece. According to the adjusting mechanism, as the locking piece is used for locking the gas spraying head, fluctuation of the distance and the levelness between the gas spraying head and the silicon wafer is avoided, and the adjusting piece and the locking piece which are arranged in a sleeved mode can balance stress of the movable flange and the installation flange so as to eliminate bending moment and avoid stress deformation.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to an adjustment mechanism and semiconductor process equipment. Background Art

[0002] The gas shower head is a core component of CVD equipment (CVD, full name Chemical Vapor Deposition) and ALD equipment (ALD, full name Atomic Layer Deposition). It is used to input process gas into the reaction chamber to form a thin film on the silicon wafer. During the thin film formation process, it is necessary to maintain a constant airflow field between the gas shower head and the silicon wafer. Accurate control of the airflow field requires precise adjustment of the distance and levelness between the gas shower head and the silicon wafer.

[0003] At present, the adjustment mechanism for adjusting the distance and level between the gas shower head and the silicon wafer, after the position and level of the gas shower head are adjusted (the silicon wafer remains horizontal and motionless in the reaction chamber), the positioning of the gas shower head is achieved by spring compression. Since the spring is prone to elastic deformation, when the vacuum degree of the reaction chamber changes, the gas shower head is also prone to overcome the compression force of the spring, resulting in fluctuations in the distance and level with the silicon wafer, affecting the film quality; in addition, on the adjustment component of the adjustment mechanism connected to the gas shower head, the compression position of the spring is different from the support and adjustment position of the gas shower head, which will cause the adjustment component to deform due to uneven force, affecting the control accuracy of the distance and level between the gas shower head and the silicon wafer. Summary of the invention

[0004] In view of this, the present application provides an adjustment mechanism, which can improve the stability and force balance of the gas shower head, thereby improving the quality of thin film generation. In addition, the present application also provides a semiconductor process equipment having the above adjustment mechanism.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] An adjustment mechanism, used for installing a gas shower head in a reaction chamber and adjusting the position of the gas shower head, comprises:

[0007] A mounting flange, fixedly disposed on the reaction chamber;

[0008] A movable flange, arranged on the mounting flange and connected to the gas shower head, wherein the gas shower head axially passes through the movable flange and the mounting flange;

[0009] A locking piece connected to the mounting flange and the movable flange, and capable of achieving locking and unlocking between the mounting flange and the movable flange;

[0010] An adjusting member, movably connected to the mounting flange and the movable flange, and adjusting the position of the movable flange relative to the mounting flange;

[0011] Wherein, one of the locking member and the adjusting member is a hollow structure and is sleeved on the outside of the other.

[0012] Optionally, the above-mentioned adjustment mechanism further includes a cooling flange which is detachably arranged on the movable flange and thermally connected to the gas shower head, and the cooling flange is provided with a cooling channel for guiding the cooling medium.

[0013] Optionally, in the above-mentioned adjustment mechanism, the cooling flange includes a plurality of cooling flanges with different thermal conductivities, and each cooling flange can be assembled with the movable flange and cooperate with the mounting flange, the locking member and the adjustment member.

[0014] Optionally, in the above-mentioned adjustment mechanism, the cooling flange includes at least two annular parts which are stacked in the axial direction and fixedly connected.

[0015] Optionally, in the above-mentioned adjustment mechanism, a first threaded hole is provided on the movable flange, the adjustment member is a threaded member threadedly connected to the first threaded hole, and one end of the adjustment member passes through the first threaded hole and abuts against the mounting flange.

[0016] Optionally, in the above-mentioned adjustment mechanism, the adjustment member is a hollow structure and is sleeved on the outside of the locking member, and,

[0017] A second threaded hole is provided on the mounting flange, one end of the locking piece passing through the adjusting piece is a threaded end that can be threadedly connected to the second threaded hole, and the other end of the locking piece that does not pass through the adjusting piece is provided with a flange that can press against the adjusting piece.

[0018] Optionally, in the above-mentioned adjustment mechanism, a protrusion is provided on the end surface of the cooling flange abutting against the movable flange, and the protrusion extends into the flange hole of the movable flange and is fixed and thermally connected to the gas shower head.

[0019] Optionally, in the above-mentioned adjustment mechanism, the cooling channel extends around the raised portion in the circumferential direction of the cooling flange, and the cooling flange is provided with a radially protruding coolant inlet joint and a coolant outlet joint, and the two ends of the cooling channel are respectively connected to the coolant inlet joint and the coolant outlet joint.

[0020] Optionally, in the above-mentioned adjustment mechanism, the mounting flange and the movable flange are connected via a bellows, and the gas shower head passes through the bellows;

[0021] The cooling flange is provided with a purge gas path, and the gas blown out of the purge gas path enters the gap between the bellows and the gas shower head.

[0022] Optionally, in the above-mentioned regulating mechanism, the purge gas path includes:

[0023] An air inlet connector, arranged on the cooling flange;

[0024] an annular gas path, arranged on the cooling flange and arranged around the raised portion in the circumferential direction of the cooling flange;

[0025] A plurality of uniform flow holes are all communicated with the annular gas path and are axially opened on the cooling flange to form a plurality of air outlets.

[0026] Optionally, in the above-mentioned adjustment mechanism, the mounting flange and the movable flange are connected via a bellows, and,

[0027] An annular connecting groove is provided on the end surface of the mounting flange facing the movable flange, and the bellows extends into the annular connecting groove and is connected to the bottom wall of the annular connecting groove.

[0028] Optionally, in the above-mentioned adjustment mechanism, the annular portion includes a first annular portion and a second annular portion, and splicing grooves are provided on the joint surfaces of the first annular portion and the second annular portion, and the cooling channel is formed by splicing the splicing grooves on the first annular portion with the splicing grooves on the second annular portion.

[0029] A semiconductor process equipment comprises a reaction chamber, a gas shower head and an adjusting mechanism for installing the gas shower head in the reaction chamber and adjusting the position of the gas shower head. The adjusting mechanism is the above-mentioned adjusting mechanism.

[0030] The adjustment mechanism provided by the present application is characterized in that the mounting flange is fixedly arranged on the reaction chamber, the movable flange is connected to the mounting flange through the adjustment piece and the locking piece, the gas shower head is connected to the movable flange, and extends into the reaction chamber after passing through the movable flange and the mounting flange in the axial direction of the movable flange and the mounting flange, and, when the locking piece remains unlocked, the multiple adjustment pieces distributed in the circumferential direction of the movable flange can adjust the position of the movable flange, that is, make the whole or part of the movable flange approach or move away from the mounting flange in the axial direction. Since the gas shower head is connected to the movable flange, the gas shower head can be moved and the horizontality can be changed with the movement of the movable flange, thereby realizing the adjustment of the distance and horizontality between the gas shower head and the silicon wafer. After the adjustment is completed, the locking piece is used to realize the locking (i.e., locking and fixing) between the mounting flange and the movable flange, so that the movable flange and the mounting flange can be firmly connected, that is, the gas shower head and the reaction chamber can be firmly connected. Even if the vacuum degree of the reaction chamber changes, the gas shower head will not be displaced, thereby avoiding the fluctuation of the distance and horizontality between the gas shower head and the silicon wafer. At the same time, when setting the adjusting piece and the locking piece, one of them is set to a hollow structure so that it is sleeved on the outside of the other, so that the setting positions of the adjusting piece and the locking piece on the movable flange and the mounting flange are the same, that is, the position where the movable flange and the mounting flange bear the locking force is the position where the adjusting force is beared, so that the axial force on the movable flange and the mounting flange can be balanced, the bending moment between the movable flange and the mounting flange can be eliminated, and deformation due to force can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0032] Figure 1 A schematic diagram of the structure of the adjustment mechanism provided in the embodiment of the present application in cooperation with the gas shower head and the reaction chamber;

[0033] Figure 2 for Figure 1 A top view of

[0034] Figure 3 for Figure 2 A cross-sectional view of

[0035] Figure 4 It is a top view of the cooling flange;

[0036] Figure 5 for Figure 4 A cross-sectional view of

[0037] Figure 6 for Figure 5 A cross-sectional view of

[0038] Figure 7 It is a top view of the mounting flange and the movable flange;

[0039] Figure 8 for Figure 7 A cross-sectional view of

[0040] Fig. 9 is a top view of a gas shower head;

[0041] Fig.10 for Fig. 9 A cross-sectional view of

[0042] Fig.11 It is a schematic diagram of the structure of the connection between the regulating mechanism, the gas shower head and the reaction chamber;

[0043] Fig.12 It is a schematic diagram of the structure of the adjustment mechanism, gas shower head, silicon wafer and heater.

[0044] exist Figure 1-Figure 12 middle:

[0045] 1-regulating mechanism, 2-gas shower head, 3-reaction chamber, 4-silicon wafer, 5-heater;

[0046] 11-mounting flange, 12-moving flange, 13-locking piece, 14-adjusting piece, 15-cooling flange, 16-bellows, 17-first sealing ring, 18-second sealing ring, 19-third sealing ring;

[0047] 111 - second threaded hole, 112 - annular connecting groove, 113 - third through hole;

[0048] 121-first threaded hole, 122-third threaded hole, 123-second sealing groove;

[0049] 1501-cooling channel, 1502-raised portion, 1503-first sealing surface, 1504-second sealing surface, 1505-cooling liquid inlet joint, 1506-cooling liquid outlet joint, 1507-air inlet joint, 1508-annular air path, 1509-flow-uniform hole, 1510-first annular portion, 1511-joining groove, 1512-first through hole, 1513-second through hole;

[0050] 21-spraying part, 22-piercing part, 23-air inlet end, 24-contact surface, 25-fourth threaded hole, 26-first sealing groove;

[0051] 31-fifth threaded hole, 32-third sealing groove. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0053] like Figure 1-Figure 12As shown, an embodiment of the present application provides an adjustment mechanism 1, which is used to be installed on a semiconductor process device to set a gas shower head 2 on a reaction chamber 3 of the semiconductor process device, and can adjust the position of the gas shower head 2. The adjustment mechanism 1 mainly includes a mounting flange 11, a movable flange 12, a locking piece 13 and an adjusting piece 14, wherein the mounting flange 11 is fixedly arranged on the reaction chamber 3, and can be specifically arranged on the upper cover of the reaction chamber 3. The mounting flange 11 is an installation base for components such as the movable flange 12, the locking piece 13, the adjusting piece 14 and the gas shower head 2, that is, the other components of the adjustment mechanism 1 and the gas shower head 2 are The installation on the reaction chamber 3 is achieved by the mounting flange 11; the movable flange 12 is movably arranged on the mounting flange 11, and the gas shower head 2 is fixedly arranged on the movable flange 12, so that the gas shower head 2 is moved relative to the reaction chamber 3 (and the silicon wafer 4 horizontally and fixedly arranged in the reaction chamber 3) by the movement of the movable flange 12 relative to the mounting flange 11, thereby achieving the adjustment of the distance and horizontality between the gas shower head 2 and the silicon wafer 4 (since the silicon wafer 4 is fixedly placed on the heater 5 in the reaction chamber 3, the distance between the gas shower head 2 and the silicon wafer 4 can be achieved by moving the gas shower head 2 and changing the horizontality. When the gas shower head 2 is connected to the movable flange 12, the portion of the gas shower head 2 located outside the reaction chamber 3 (i.e., the penetration portion 22 described later) is firstly axially passed through the mounting flange 11, the bellows 16 described later and the movable flange 12 for connection, while the other portion of the gas shower head 2 (i.e., the spraying portion 21 described later) is located in the reaction chamber 3 for spraying process gas to the silicon wafer 4; the locking piece 13 is a component for locking and fixing the movable flange 12. After the movable flange 12 drives the gas shower head 2 to move into place, the locking piece 13 can be operated to achieve locking between the mounting flange 11 and the movable flange 12, so that the movable flange 1 2 can no longer change its position relative to the mounting flange 11, so that the gas shower head 2 can no longer change its position relative to the reaction chamber 3 and the silicon wafer 4 therein (position change includes distance change and level change), thereby realizing a stable arrangement of the gas shower head 2 in the reaction chamber 3, avoiding fluctuations in the distance and level between the gas shower head 2 and the silicon wafer 4 due to changes in the vacuum degree of the reaction chamber 3. When the position of the gas shower head 2 needs to be adjusted, the locking piece 13 can unlock the movable flange 12, so that the movable flange 12 can drive the gas shower head 2 to move, thereby realizing changes in the distance and level between the gas shower head 2 and the silicon wafer 4;The adjusting member 14 is used to adjust the position of the movable flange 12 relative to the mounting flange, that is, the adjusting member 14 is a component for driving the movable flange 12 and the gas shower head 2 thereon to move. The adjusting member 14 is movably connected to the mounting flange 11 and the movable flange 12. The activities include movement, rotation, and self-expansion, and the connection includes abutment, natural contact, etc. That is, the adjusting member 14 can realize the movement of the movable flange 12 relative to the mounting flange 11 by means of movement, rotation, and self-expansion, as well as the connection, abutment, or natural contact with the mounting flange 11 and the movable flange 12. For example, the adjusting member 14 can realize the spacing adjustment between the two by rotating relative to the movable flange 12 and abutting with the mounting flange 11, so as to drive the gas shower head 2 to move. More preferably, a plurality of adjusting members 14 are further provided, and these adjusting members 14 are distributed in the circumferential direction of the mounting flange 11 and the movable flange 12, for example, they are distributed at equal intervals (or equal angles) in the circumferential direction. When the adjusting members 14 at different angles are operated respectively, the horizontality of the movable flange 12 and the gas shower head 2 can be changed. More importantly, in the above structure, one of the locking member 13 and the adjusting member 14 is set as a hollow structure and is sleeved on the outside of the other, that is, the adjusting member 14 can be set as a hollow structure and the locking member 13 passes through and is set inside the adjusting member 14, or the locking member 13 can be set as a hollow structure and the adjusting member 14 passes through and is set inside the locking member 13, so that the adjustment point position and the locking point position on the mounting flange 11 and the movable flange 12 coincide.;

[0054] Compared with the adjustment mechanism in the prior art, the adjustment mechanism 1 of the above structure no longer uses a spring compression method to position the adjusted gas shower head 2, but uses a locking piece 13 to lock and fix the adjusted gas shower head 2. Compared with a spring that is prone to elastic deformation, this positioning method has a more stable and reliable positioning effect, and can achieve a firm positioning of the gas shower head 2. Even if the vacuum degree of the reaction chamber 3 changes, the gas shower head 2 will not be displaced, thereby avoiding fluctuations in the distance and levelness between the gas shower head 2 and the silicon wafer 4, and ensuring the film Generate quality; on the other hand, by arranging the adjusting member 14 and the locking member in a sleeve manner, the setting positions of the adjusting member 14 and the locking member 13 on the movable flange 12 and the mounting flange 11 are overlapped, that is, the position where the movable flange 12 and the mounting flange 11 bear the locking force is the position where the adjusting force is beared, and because the directions of these two forces are opposite, such an arrangement can balance the axial forces of the movable flange 12 and the mounting flange 11, eliminate the bending moment between the movable flange 12 and the mounting flange 11 and avoid deformation due to force, thereby improving the adjustment efficiency and accuracy of the gas sprinkler head 2.

[0055] Further, such as Figure 1-Figure 6As shown, the above-mentioned adjustment mechanism 1 also includes a cooling flange 15 which is detachably arranged on the movable flange 12 and is thermally connected to the gas shower head 2. The cooling flange 15 can extract the heat of the gas shower head 2 to achieve heat dissipation of the gas shower head 2, and the cooling flange 15 includes multiple cooling flanges with different thermal conductivity coefficients, each cooling flange 15 can be assembled with the movable flange 12 and cooperate with the mounting flange 11, the locking piece 13 and the adjustment piece 14. In some processes, it is necessary to adjust and control the temperature of the gas shower head 2, but the adjustment mechanism in the prior art is an integrated structure, that is, the entire adjustment mechanism is composed of a single material, and its thermal conductivity is fixed, resulting in the inability to adjust the heat dissipation effect of the gas shower head 2 and unable to meet the diverse process requirements. Moreover, when the adjustment mechanism of the integrated structure in the prior art cannot meet different process requirements, the entire adjustment mechanism can only be replaced, resulting in increased production costs. The regulating mechanism 1 in the present application is equipped with a plurality of cooling flanges 15 of different materials, each of which has a different thermal conductivity, and can achieve different heat dissipation effects on the gas shower head 2. The cooling flange 15 is detachably connected to the movable flange 12 and the gas shower head 2, so that the cooling flange 15 with different thermal conductivity can be replaced to connect with the movable flange 12 and the gas shower head 2, and the gas shower head 2 can be subjected to different degrees of temperature change and gas parameter change (the change of gas parameter is, for example, to select cooling flanges 15 of different materials to match the process gas according to the process gas), so that under the same cooling conditions, the gas shower head 2 has more (or less) heat transferred to the cooling flange 15 and heat exchanged with the cooling medium in the cooling flange 15, so as to reduce (or increase) the temperature of the gas shower head 2 in a more targeted manner. At the same time, by setting the cooling flange 15, the movable flange 12 and the gas shower head 2 as a split structure, only a part of the structure of the regulating mechanism 1 (i.e., the cooling flange 15) can be replaced to meet the requirements of different process equipment and realize different functions, so that the versatility of the regulating mechanism 1 is higher.

[0056] In order to improve the heat dissipation efficiency of the cooling flange 15 to the gas shower head 2, as shown in FIG. Figure 4-6 as well as Fig.11As shown, a cooling channel 1501 for guiding the cooling medium is also provided on the cooling flange 15, so that the cooling flange 15 can not only achieve heat dissipation through heat exchange between its outer surface and the environment, but also can take away heat more efficiently by allowing the cooling medium to flow inside the cooling flange 15, wherein the cooling medium can be a liquid medium with higher heat exchange efficiency, such as cooling water or cooling oil, so that the cooling flange 15 is a liquid-cooled component, or the cooling medium flowing in the cooling channel 1501 can be a gas, such as air, so that the cooling flange 15 is an air-cooled component. In the present application, the connection method of the movable flange 12 and the gas shower head 2 is to connect the movable flange 12 with the cooling flange 15 and the cooling flange 15 with the gas shower head 2, that is, the movable flange 12 is connected to the gas shower head 2 through the transition connection of the cooling flange 15, and the cooling flange 15 is a component directly connected to the gas shower head 2, so that the cooling flange 15 has a heat dissipation function and the heat dissipation efficiency of the cooling flange 15 is improved by opening the cooling channel 1501, so that the temperature control of the gas shower head 2 can be better achieved. Specifically, the heat on the gas shower head 2 is conducted to the cooling flange 15 through its own contact surface 24 and the first sealing surface 1503 of the cooling flange 15 (the contact surface 24 and the first sealing surface 1503 are the surfaces of the gas shower head 2 and the cooling flange 15 that are in contact and in contact with each other, respectively). The coolant flows in the cooling channel 1501 to take away the heat conducted to the cooling flange 15, thereby cooling the gas shower head 2.

[0057] In an optional embodiment, if Figure 1-Figure 12As shown, a first threaded hole 121 is formed on the movable flange 12 , the adjusting member 14 is a threaded member threadedly connected to the first threaded hole 121 , and one end of the adjusting member 14 passes through the first threaded hole 121 and abuts against the mounting flange 11 . This structure realizes the adjustment of the movable flange 12 by making the adjusting member 14 and the movable flange 12 threadedly cooperate with each other. Specifically, the adjusting member 14 is set as a threaded member, such as a bolt or a screw sleeve, and a first threaded hole 121 is opened on the movable flange 12 along its axial direction to cooperate with it. The adjusting member 14 can be screwed into the first threaded hole 121 to achieve a threaded connection with the first threaded hole 121. As the screwing continues, the adjusting member 14 can be screwed to a state where one end of the adjusting member 14 passes through the first threaded hole 121 and abuts against the mounting flange 11 below the movable flange 12. Moreover, under the action of gravity of components such as the movable flange 12, the cooling flange 15 and the gas shower head 2, the end of the adjusting member 14 passing through the first threaded hole 121 will always remain in abutment with the mounting flange 11. When the adjusting member 14 is screwed again, the length of the adjusting member 14 passing through the first threaded hole 121 can be changed, thereby changing the distance between the movable flange 12 and the mounting flange 11, thereby realizing the position change of the movable flange 12 and the gas shower head 2 thereon. As mentioned above, there are multiple adjusting members 14 arranged on the circumference of the mobile flange 12 and the mounting flange 11, and correspondingly, there are multiple first threaded holes 121 arranged on the mobile flange 12, and each adjusting member 14 passes through a first threaded hole 121 and abuts against the mounting flange 11. In this case, by screwing the adjusting members 14 at different positions respectively, the mobile flange 12 and the gas shower head 2 thereon can be lifted and lowered at different parts in the circumference, thereby adjusting the distance and level of the gas shower head 2. Moreover, in this structure, the adjusting member 14 can be screwed with a torque wrench, so that the locking force of each adjusting member 14 after screwing is consistent, thereby achieving accurate adjustment of the distance and level of the gas shower head 2. The adjusting member 14 is a threaded member, and a threaded hole is arranged on the mobile flange 12 to cooperate with it. Not only can the fine adjustment of the distance and level be achieved through the thread with high processing accuracy, but also the structure of the threaded member and the threaded hole is relatively simple, easy to process, and more suitable for use on the adjustment mechanism 1 provided in the present application. In addition, the adjusting member 14 may also adopt other structures. For example, the adjusting member 14 may be a telescopic member that is arranged between the movable flange 12 and the mounting flange 11 and can be telescopic itself, such as a telescopic sleeve, a scissors mechanism, etc.

[0058] In an optional embodiment, if Figure 1-Figure 12As shown, the adjusting member 14 is a hollow structure and is sleeved on the outside of the locking member 13 (that is, the adjusting member 14 can be set as a threaded sleeve), and a second threaded hole 111 is provided on the mounting flange 11, and one end of the locking member 13 that passes through the adjusting member 14 is a threaded end that can be threadedly connected to the second threaded hole 111, and the other end of the locking member 13 that does not pass through the adjusting member 14 is provided with a flange that can press the adjusting member 14. Among them, on the one hand, it is preferred that the adjusting member 14 is a hollow structure, and the locking member 13 passes through the adjusting member 14 with a through hole; on the other hand, the locking method of the locking member 13 and the mounting flange 11 is also selected as a threaded connection, and the locking method of the locking member 13 and the movable flange 12 is selected as blocking and pressing. Specifically, one end of the locking member 13 that passes through the through hole is a threaded end, and the other end that does not pass through the through hole is provided with a flange. This structure is similar to a bolt, or the locking member 13 can be set as a bolt. The second threaded hole 111 is provided on the mounting flange 11. After the threaded end of the locking member 13 passes through the through hole, It can be screwed into the second threaded hole 111 and connected with the second threaded hole 111. As the locking piece 13 goes deeper into the second threaded hole 111, since the outer diameter of the flange is larger than the inner diameter of the through hole, the flange will press against the adjusting piece 14, so that the adjusting piece 14 and the movable flange 12 are locked by the bolt-shaped locking piece 13. Since the locking piece 13 is sleeved by the adjusting piece 14, the adjustment point position and the fixed point position on the movable flange 12 and the mounting flange 11 coincide, so the opposite forces can be offset to avoid the movable flange 12 from generating bending moment and being deformed by force. Further, in order to more fully offset the axial force of the movable flange 12 and the mounting flange 11, the locking piece 13 and the adjusting piece 14 can be coaxially sleeved, that is, the above-mentioned through hole opened on the adjusting piece 14 is preferably an axial hole, and correspondingly, the first threaded hole 121 on the movable flange 12 and the second threaded hole 111 on the mounting flange 11 are also coaxially arranged. By adopting the arrangement mode that the adjusting member 14 is sleeved on the outside of the locking member 13, the diameter of the second thread on the mounting flange 11 can be made smaller than the diameter of the first threaded hole 121 on the movable flange 12, so that the end of the adjusting member 14 passing through the first threaded hole 121 directly abuts against the surface of the mounting flange 11, and the abutting position is the outer annular portion of the opening of the second threaded hole 111, so that the adjustment accuracy and processing accuracy can be improved. Among them, the locking member 13 can also be other structures or types, for example, the locking member 13 can be a magnetic member that can be magnetically connected to the mounting flange 11, and the magnetic attraction of the locking member 13 is greater than the maximum fluctuation force generated when the vacuum degree of the reverse chamber changes.

[0059] Alternatively, the locking member 13 may be a hollow structure and sleeved on the outside of the adjusting member 14, that is, the structures of the locking member 13 and the adjusting member 14 may be interchanged, so that the locking member 13 is a threaded sleeve and the adjusting member 14 is a bolt-shaped, and the outer locking member 13 is threadedly connected to the first threaded hole 121 and the second threaded hole 111, and the inner wall of the locking member 13 is also provided with a thread, which can be connected with the thread on the adjusting member 14 located on the inner side (the thread on the adjusting member 14 can still be Fig.11 The adjusting member 14 and the movable flange 12 are connected by the threads on the inner and outer walls of the locking member 13, and the abutting end of the adjusting member 14 abuts against the bottom wall of the second threaded hole 111. When adjusting the position, firstly, the outer locking member 13 is screwed while ensuring that the adjusting member 14 does not rotate, so that the end of the locking member 13 that passes through the first threaded hole 121 is disengaged from the second threaded hole 111, thereby releasing the locking fixation of the movable flange 12 and the mounting flange 11, and then the adjusting member 14 is screwed while ensuring that the locking member 13 does not rotate in the first threaded hole 121. Since the adjusting member 14 abuts against the bottom wall of the second threaded hole 111 of the mounting flange 11, and the threads on the adjusting member 14 are meshed with the threads on the inner wall of the locking member 13, Therefore, by screwing the adjusting member 14, the locking member 13 and the movable flange 12 (since the locking member 13 does not rotate in the first threaded hole 121, the locking member 13 and the movable flange 12 can be regarded as fixedly connected at this time) can be synchronously moved relative to the mounting flange 11 through the meshing of the threads, thereby adjusting the distance and levelness of the gas shower head 2. Finally, the locking member 13 is screwed in the opposite direction while ensuring that the adjusting member 14 does not rotate, so that the locking member 13 is inserted into the second threaded hole 111 again to lock the movable flange 12 and the mounting flange 11. The locking member 13 and the adjusting member 14 can be prevented from rotating by positioning them with a wrench or a screwdriver.

[0060] It should be noted that, in order to adjust the horizontality of the gas shower head 2, multiple adjusting parts 14 are arranged in the circumferential direction of the movable flange 12 and the mounting flange 11, and when the adjusting parts 14 and the locking parts 13 are arranged in a sleeve, and the locking function is normally realized, the number of locking parts 13 can be flexibly set. For example, a locking part 13 can be set in each adjusting part 14 to maximize the working stability and reliability of the adjusting mechanism 1, or, the locking parts 13 can be set only in some of the adjusting parts 14, for example, a locking part 13 is set in each of the two adjusting parts 14 symmetrically arranged among the four adjusting parts 14 evenly distributed in the circumferential direction.

[0061] like Figure 3 , Figure 5 and Fig.11As shown, a protruding portion 1502 is provided on the end surface of the cooling flange 15 abutting against the movable flange 12. The protruding portion 1502 protruding along the axial direction of the cooling flange 15 extends into the flange hole of the movable flange 12 and is fixed and thermally connected to the gas shower head 2. The protruding portion 1502 is a structure of the cooling flange 15 for connecting with the gas shower head 2. The protruding portion 1502 can be more stably and conveniently connected to the gas shower head 2 by extending into the flange hole of the movable flange 12. The protruding portion 1502 is circular and located at the center of the end surface of the movable flange 12. A flange hole penetrating the cooling flange 15 is provided in the center of the protruding portion 1502 for the gas inlet end 23 of the gas shower head 2 to pass through. The surface of the protruding portion 1502 forms a first sealing surface 1503 connected and sealed with the gas shower head 2, and a part of the surface of the end surface of the cooling flange 15 surrounding the protruding portion 1502 forms a second sealing surface 1504 connected and sealed with the movable flange 12. By providing the raised portion 1502, the matching structure of the cooling flange 15, the gas shower head 2 and the movable flange 12 can be optimized, the connection stability between the gas shower head 2 and the cooling flange 15 can be improved, and the cooling effect of the cooling flange 15 on the gas shower head 2 can also be improved, which is also beneficial for the compensation of process gas into the reaction chamber 3 as described later.

[0062] Further, such as Figure 4 and Figure 5 As shown, in the circumferential direction of the cooling flange 15, the cooling channel 1501 extends around the protrusion 1502, and the cooling flange 15 is provided with a radially protruding coolant inlet joint 1505 and a coolant outlet joint 1506, and the two ends of the cooling channel 1501 are respectively connected to the coolant inlet joint 1505 and the coolant outlet joint 1506. By extending the cooling channel 1501 along the circumferential direction of the cooling flange 15, not only the length of the cooling channel 1501 can be increased, but also the cooling channel 1501 can be more evenly distributed on the cooling flange 15, so that the coolant can flow through the cooling flange 15 more fully, thereby improving the cooling effect of the cooling flange 15 as much as possible. Since the gas shower head 2 is connected to the protrusion 1502, the cooling channel 1501 is arranged around the protrusion 1502 to more fully and efficiently take away the heat transferred from the gas shower head 2 to the cooling flange 15. The coolant inlet joint 1505 is connected to the external pipeline and is used to introduce coolant into the cooling channel 1501. The coolant flows in the cooling channel 1501 and absorbs the heat of the gas shower head 2, and then flows out of the cooling channel 1501 from the coolant outlet joint 1506. The coolant outlet joint 1506 is also connected to the external pipeline to send away the coolant that absorbs the heat. In order to optimize the structure, facilitate the connection of the pipeline and facilitate the setting of structures such as threaded holes on the cooling flange 15, in this application, the coolant inlet joint 1505 and the coolant outlet joint 1506 are set at the edge of the cooling flange 15 and extend radially along the cooling flange 15.

[0063] And, if Figure 3 , Figure 8 and Fig.11 As shown, the flange hole of the mounting flange 11 and the flange hole of the movable flange 12 are connected through the bellows 16, and the gas shower head 2 passes through the bellows 16, and there are radial gaps between the protrusion 1502 and the flange hole wall of the movable flange 12, between the gas shower head 2 and the bellows 16, and between the gas shower head 2 and the flange hole wall of the mounting flange 11; a purge gas path is provided on the cooling flange 15, and the gas blown out of the purge gas path enters the gap between the bellows 16 and the gas shower head 2, that is, the gas outlet of the purge gas path is located between the protrusion 1502 and the flange hole wall of the movable flange 12 and is connected to the radial gap, so that the purge gas blown out from the gas outlet can enter the reaction chamber 3 through the flange hole of the movable flange 12, the bellows 16 and the flange hole of the mounting flange 11 in sequence. In some processes, it is necessary to fill the reaction chamber 3 with process gas to compensate for the pressure in the reaction chamber 3. Therefore, a purge gas path is set on the cooling flange 15. In order to ensure that the process gas can enter the reaction chamber 3 through the purge gas path, a bellows 16 is set between the flange hole of the mounting flange 11 and the flange hole of the movable flange 12 to achieve the connection between the two flange holes. The gas spray head 2 connected to the cooling flange 15 passes through the bellows 16. The bellows 16 is selected because the bellows 16 can be retracted and retracted, thereby ensuring normal adjustment between the movable flange 12 and the mounting flange 11. At the same time, in order to better adapt to different process gases and to extend the life of the bellows 16, the material of the bellows 16 is preferably metal. The air outlet of the purge gas path is located between the protrusion 1502 and the flange hole wall of the movable flange 12. The inner diameter of the bellows 16 is larger than the inner diameter of the flange hole of the movable flange 12 and the inner diameter of the flange hole of the mounting flange 11. By setting the above-mentioned multiple radial gaps, the process gas can smoothly enter the reaction chamber 3 to achieve pressure compensation, so that when the flow rate of other process gases changes, the pressure in the reaction chamber 3 can be balanced by changing the flow rate of this gas.

[0064] Furthermore, the process gas is blown into the reaction chamber 3 through the above-mentioned multiple radial gaps in sequence, which can achieve pressure compensation while preventing the gas and particles in the reaction chamber 3 from entering the radial gaps, thereby avoiding contamination of the radial gaps. The blown gas can even purge the radial gaps to clean them.

[0065] In the above structure, the cooling channel 1501 of the guide coolant and the purge air path of the guide gas are both arranged on the detachable cooling flange 15, so that the structure of the adjustment mechanism 1 can be optimized and the functional layout is more reasonable, that is, the connection structures of the water path, the gas path and the gas spray head 2 are all arranged on the cooling flange 15, and the mounting flange 11 and the movable flange 12 only play the role of adjusting the distance and horizontality of the gas spray head 2, so that different process equipment requirements can be met by only replacing the cooling flange 15, making the design of the adjustment mechanism 1 more reasonable, lower cost and higher versatility.

[0066] like Figure 2-Figure 5 as well as Fig.11 As shown, the purge air circuit includes: an air inlet connector 1507, which is protrudingly arranged on the cooling flange 15; an annular air circuit 1508, which is opened on the cooling flange 15 and is arranged around the raised portion 1502 in the circumferential direction of the cooling flange 15; and a plurality of uniform flow holes 1509, which are all connected to the annular air circuit 1508 and are all axially opened on the cooling flange 15 to form a plurality of air outlets evenly distributed around the raised portion 1502. By setting up the purge gas path in this way, the process gas can enter the annular gas path 1508 from the gas inlet connector 1507, and the process gas is distributed in the circumferential direction of the protrusion 1502 through the flow guidance of the annular gas path 1508. Then, the process gas is blown into the radial gap from the upper part of the gas shower head 2 through the uniform flow hole 1509, and an air curtain is formed around the protrusion 1502. After passing through the flange hole of the movable flange 12, the bellows 16 and the flange hole of the mounting flange 11, the air curtain finally enters the reaction chamber 3 and passes through the upper surface of the silicon wafer 4 for thin film growth.

[0067] In an optional embodiment, if Figure 8 As shown, the flange hole of the mounting flange 11 and the flange hole of the movable flange 12 are connected through a bellows 16, and an annular connecting groove 112 is provided on the end surface of the mounting flange 11 facing the movable flange 12, and the bellows 16 extends into the annular connecting groove 112 and is connected to the bottom wall of the annular connecting groove 112. The inner diameter of the annular connecting groove 112 is larger than the flange hole of the mounting flange 11, so that the bellows 16 surrounds the outer side of the flange hole of the mounting flange 11. Among them, by providing the annular connecting groove 112 and connecting the bellows 16 to the bottom wall of the groove, the length of the bellows 16 can be increased, so that the movable flange 12 can have a larger adjustment stroke, a larger adjustment amount, and the working performance of the gas shower head 2 is more outstanding. Specifically, the annular connecting groove 112 can be formed in cooperation with the flange hole of the mounting flange 11, that is, the annular connecting groove 112 and the flange hole are combined to form a stepped hole, and the end of the stepped hole close to the movable flange 12 has a larger diameter to become the annular connecting groove 112, and the end of the stepped hole away from the movable flange 12 is the flange hole, and the bellows 16 is connected to the stepped surface of the stepped hole.

[0068] In addition, the cooling flange 15 includes at least two annular parts stacked in the axial direction and fixedly connected. In specific processing, at least two annular parts can be processed according to the structure of the cooling flange 15, and then these annular parts are stacked in the axial direction, and finally the adjacent annular parts are welded to finally form the cooling flange 15. By manufacturing the cooling flange 15 in this way, it is easy to process and manufacture the cooling flange 15 provided with the cooling channel 1501 and the purge gas path, and the manufacturing difficulty of the cooling flange 15 is reduced.

[0069] Among them, Figure 4-Figure 6 As shown, the annular portion includes a first annular portion 1510 and a second annular portion, and a splicing groove 1511 is provided on the joint surface of the first annular portion 1510 and the second annular portion, and the cooling channel 1501 is formed by splicing the splicing groove 1511 on the first annular portion 1510 with the splicing groove 1511 on the second annular portion. By such a setting, the splicing groove 1511 can be processed on the annular portion first, and then the circumferentially closed cooling channel 1501 is formed by splicing the splicing groove 1511, so that the cooling channel 1501 can be processed and formed more simply and conveniently. Similarly, the purge air path on the cooling flange 15 can also be processed and formed in this way.

[0070] In this application, if Figure 4-Figure 11As shown, the cooling flange 15 and the movable flange 12, the cooling flange 15 and the gas shower head 2, and the mounting flange 11 and the reaction chamber 3 are all fixedly connected by the cooperation of bolts and threaded holes, and are sealed by sealing rings. In the specific setting, a plurality of first through holes 1512 and a plurality of second through holes 1513 are provided on the cooling flange 15, a plurality of third threaded holes 122 are provided on the movable flange 12, a plurality of fourth threaded holes 25 are provided on the gas shower head 2, a plurality of third through holes 113 are provided on the mounting flange 11, and a plurality of fifth threaded holes 31 are provided on the reaction chamber 3. When connected, the bolts pass through the first through holes 1512 and extend into the third threaded holes 122 and are threadedly connected with the third threaded holes 122 to achieve a fixed connection between the cooling flange 15 and the movable flange 12, the bolts pass through the second through holes 1513 and extend into the fourth threaded holes 25 and are threadedly connected with the fourth threaded holes 25 to achieve a fixed connection between the cooling flange 15 and the gas shower head 2, and the bolts pass through the third through holes 113 and extend into the fifth threaded holes 31 and are threadedly connected with the fifth threaded holes 31 to achieve a fixed connection between the mounting flange 11 and the reaction chamber 3. At the same time, a first sealing groove 26 is provided on the gas shower head 2, a second sealing groove 123 is provided on the movable flange 12, and a third sealing groove 32 is provided on the reaction chamber 3. The first sealing ring 17 is arranged in the first sealing groove 26 and realizes the sealing connection between the cooling flange 15 and the gas shower head 2 by abutting against the first sealing surface 1503. The second sealing ring 18 is arranged in the second sealing groove 123 and realizes the sealing connection between the cooling flange 15 and the movable flange 12 by abutting against the second sealing surface 1504. The third sealing ring 19 is arranged in the third sealing groove 32 and realizes the sealing connection between the mounting flange 11 and the gas reaction chamber 3 by abutting against the mounting flange 11, thereby realizing the sealing isolation of the radial gap from the outside, so that the process gas can smoothly enter the reaction chamber 3 from the purge gas path.

[0071] In addition, an embodiment of the present application further provides a semiconductor process equipment, which includes a reaction chamber 3, a gas shower head 2, and an adjustment mechanism 1 for installing the gas shower head 2 in the reaction chamber 3 and adjusting the position of the gas shower head 2. The adjustment mechanism 1 is the above-mentioned adjustment mechanism 1.

[0072] Since the semiconductor process equipment has the above-mentioned regulating mechanism 1 , the beneficial effects of the semiconductor process equipment brought by the regulating mechanism 1 can be found in the above-mentioned contents and will not be described in detail here.

[0073] like Figure 9-11As shown, the gas shower head 2 of the semiconductor process equipment includes: a shower part 21, which is located in the reaction chamber 3 and has a plurality of uniformly distributed gas outlets; a penetration part 22, which is connected to the shower part 21 and is used to guide the process gas to the shower part 21, and passes through the upper cover, the mounting flange 11 and the movable flange 12 of the reaction chamber 3; an air inlet end 23, which is connected to the end of the penetration part 22 away from the shower part 21 and passes through the cooling flange 15; wherein, the end of the penetration part 22 away from the shower part 21 is provided with a plurality of fourth threaded holes 25 and a first sealing groove 26, so as to realize a fixed connection with the cooling flange 15 by threaded connection with the bolts passing through the cooling flange 15. The gas shower head 2 of this structure is adapted to the above-mentioned adjustment mechanism 1, so that the adjustment effect can be improved more efficiently and accurately, so that the film can be generated with high quality.

[0074] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0075] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0076] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0077] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0078] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0079] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. An adjustment mechanism, characterized in that: Used to install a gas shower head in a reaction chamber and adjust the position of the gas shower head, comprising: A mounting flange, fixedly disposed on the reaction chamber; A movable flange, arranged on the mounting flange and connected to the gas shower head, wherein the gas shower head axially passes through the movable flange and the mounting flange; A locking piece connected to the mounting flange and the movable flange, and capable of achieving locking and unlocking between the mounting flange and the movable flange; An adjusting member, movably connected to the mounting flange and the movable flange, and adjusting the position of the movable flange relative to the mounting flange; Wherein, one of the locking member and the adjusting member is a hollow structure and is sleeved on the outside of the other.

2. The adjustment mechanism according to claim 1, characterized in that: It also includes a cooling flange which is detachably arranged on the movable flange and thermally connected to the gas shower head. The cooling flange is provided with a cooling channel for guiding the cooling medium.

3. The adjustment mechanism according to claim 2, characterized in that: The cooling flanges include a plurality of flanges with different thermal conductivities, and each of the cooling flanges can be assembled with the movable flange and cooperate with the mounting flange, the locking member and the adjusting member.

4. The adjustment mechanism according to claim 2, characterized in that: The cooling flange includes at least two annular parts which are stacked in an axial direction and fixedly connected.

5. The adjustment mechanism according to claim 1, characterized in that: The movable flange is provided with a first threaded hole, the adjusting member is a threaded member threadedly connected to the first threaded hole, and one end of the adjusting member passes through the first threaded hole and abuts against the mounting flange.

6. The adjustment mechanism according to claim 1 or 5, characterized in that: The adjusting member is a hollow structure and is sleeved on the outside of the locking member, and, A second threaded hole is provided on the mounting flange, one end of the locking piece passing through the adjusting piece is a threaded end that can be threadedly connected to the second threaded hole, and the other end of the locking piece that does not pass through the adjusting piece is provided with a flange that can press against the adjusting piece.

7. The adjustment mechanism according to claim 2, characterized in that: A protrusion is provided on the end surface of the cooling flange abutting against the movable flange. The protrusion extends into the flange hole of the movable flange and is fixed and heat-conductingly connected to the gas shower head.

8. The adjustment mechanism according to claim 7, characterized in that: In the circumferential direction of the cooling flange, the cooling channel extends around the raised portion, and the cooling flange is provided with a radially protruding coolant inlet joint and a coolant outlet joint, and both ends of the cooling channel are respectively connected to the coolant inlet joint and the coolant outlet joint.

9. The adjustment mechanism according to claim 7, characterized in that: The mounting flange and the movable flange are connected through a bellows, and the gas shower head passes through the bellows; The cooling flange is provided with a purge gas path, and the gas blown out of the purge gas path enters the gap between the bellows and the gas shower head.

10. The adjustment mechanism according to claim 9, characterized in that: The purge gas circuit comprises: An air inlet connector, arranged on the cooling flange; an annular gas path, arranged on the cooling flange and arranged around the raised portion in the circumferential direction of the cooling flange; A plurality of uniform flow holes are all communicated with the annular gas path and are all axially opened on the cooling flange to form a plurality of air outlets.

11. The adjustment mechanism according to claim 1, characterized in that: The mounting flange and the movable flange are connected via a bellows, and An annular connecting groove is provided on the end surface of the mounting flange facing the movable flange, and the bellows extends into the annular connecting groove and is connected to the bottom wall of the annular connecting groove.

12. The adjustment mechanism according to claim 4, characterized in that: The annular portion includes a first annular portion and a second annular portion, and joint grooves are provided on the joint surfaces of the first annular portion and the second annular portion, and the cooling channel is formed by splicing the joint grooves on the first annular portion with the joint grooves on the second annular portion.

13. A semiconductor process equipment, characterized in that: The invention comprises a reaction chamber, a gas shower head and an adjusting mechanism for installing the gas shower head in the reaction chamber and adjusting the position of the gas shower head. The adjusting mechanism is the adjusting mechanism according to any one of claims 1 to 12.

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