Inductor exclusion component and preparation method thereof

Abstract

The invention relates to a row inductance component and a preparation method thereof, and the preparation method comprises the steps: providing a conductive coil which comprises a conductive main body and conductive pins, the conductive pins comprise a first pin set and a second pin set, and the first pin set and the second pin set are respectively arranged at two opposite sides in the conductive main body, a gap is formed between the opposite ends of the first pin set and the second pin set, and the other ends of the first pin set and the second pin set are respectively connected with the conductive main body; the assembly comprises a magnetic material and at least two conductive coils which are arranged in the magnetic material and are sequentially arranged along a set direction; and cutting the aggregate along the arrangement direction of the conductive coils, wherein a cutting line passes through the first pin set and the second pin set. The inductor arrangement component provided by the invention can realize the combination of a plurality of inductors, improves the space utilization rate and the mounting efficiency, has the advantages of high power, low loss, good heat dissipation and the like, and meets the use requirements of a chip power supply circuit.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to an array of inductor components and a preparation method thereof. Background Art

[0002] Inductors refer to components that can convert electrical energy into magnetic energy and store it. Currently, inductors are widely used in electronic terminal products. As the density requirements of power circuits increase, the reduction in the size of electronic components has become an inevitable trend, especially in the design of circuits that power chips, which requires reducing the size of components to increase mounting density. At the same time, as the performance of electronic equipment continues to increase, the requirements for component power are also increasing, which leads to the dual challenges of miniaturization and high power faced by inductor products.

[0003] In the design of the chip's DC-DC power supply circuit, the application of multi-channel power supply mode can effectively disperse the current load, thereby reducing the loss of a single inductor component. This design not only improves the efficiency of the overall circuit, but also helps to improve the stability and reliability of the system. To further optimize the power supply efficiency, the inductor components need to be as close to the chip as possible and laid out in the form of an array, which can minimize the power supply path and reduce energy loss during transmission.

[0004] At present, it is difficult to manufacture small-sized inductor components while ensuring high power, and it is difficult to mass-produce them, so they cannot be widely used in common electronic terminal products.

[0005] Therefore, how to achieve miniaturization and high power of inductor components is a technical problem that needs to be solved at present. Summary of the invention

[0006] In view of the above problems, the purpose of the present invention is to provide an inductor component array and a preparation method thereof. Compared with the prior art, the inductor component array provided by the present invention can realize the combination of multiple inductors, improve space utilization and mounting efficiency, and has the advantages of high power, low loss and good heat dissipation, thereby meeting the use requirements of chip power supply circuits.

[0007] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0008] In a first aspect, the present invention provides a method for preparing a sensor array component, the method comprising:

[0009] A conductive coil is provided, the conductive coil comprising a conductive body and conductive pins arranged inside the conductive body, the conductive pins inside the conductive body comprising a first pin set and a second pin set, the first pin set and the second pin set are respectively arranged on two opposite sides inside the conductive body, a gap is set between opposite ends of the first pin set and the second pin set, and the other ends are respectively connected to the conductive body;

[0010] forming an assembly, the assembly comprising a magnetic material and at least two conductive coils disposed in the magnetic material and arranged in sequence along a set direction;

[0011] The assembly is cut along the arrangement direction of the conductive coils, with the cutting line passing through the first pin assembly and the second pin assembly, to obtain a magnetic core containing a conductive body.

[0012] In the present invention, the number of conductive coils arranged in the magnetic material can be flexibly set according to the use requirements, for example, it can be 2, 3, 4, 5, 6, 7 or 8, etc. The present invention can conveniently reduce or increase the number of coil combinations as needed.

[0013] In the present invention, the set direction is: the direction in which the stacking layers extend when a layer of magnetic material and a layer of conductive coil are stacked and laid in sequence in a mold.

[0014] In the present invention, on the one hand, by designing the shape of the conductive coil and matching the corresponding cutting method, the conductive body after cutting can be used as the conductor of at least two magnetic cores respectively, thereby optimizing the structural design of the assembly and simplifying the manufacturing process of the inductive component array; on the other hand, by controlling the cutting line to pass through the first pin set and the second pin set, the first pin set and the second pin set can be used as the pins of the corresponding magnetic cores after cutting, thereby further simplifying the internal structure of the assembly, improving the compactness of the pin layout, reducing the volume of the components, simplifying the process flow, thereby significantly improving production efficiency and reducing production costs; on the other hand, by designing the layout of the conductive coil and the magnetic material in the assembly, the present invention can integrate multiple inductive components into a single inductive component array. This integrated design not only greatly improves the space utilization rate, but also reduces the space gap between adjacent inductive elements, thereby reducing the circuit loss. The obtained inductive component array has excellent inductance value, saturation characteristics and heat dissipation, while maintaining the characteristics of miniaturization and high power, thereby improving the reliability and stability of the circuit.

[0015] Preferably, the shape of the conductive body includes a plurality of inverted U-shapes and U-shapes arranged alternately in sequence along the axial direction, the bottom edges of the inverted U-shape and the U-shape are connected to each other to form a bottom edge connection portion, the free edges of the inverted U-shape and the U-shape are connected to each other, and a first pin set and a second pin set are respectively arranged at the connection points of the free edges.

[0016] Preferably, the number of the inverted U-shaped and U-shaped structures is at least 1 independently, for example, it can be 1, 2, 3 or 4, but is not limited to the listed values, and other unlisted values within the numerical range are equally applicable.

[0017] Preferably, when the number of the inverted U-shaped or U-shaped structures is at least 2, the cutting line also passes through the connecting part of the bottom edges of the inverted U-shaped and U-shaped structures.

[0018] Preferably, the shape of the conductive coil is a "day" - shaped structure with a middle horizontal break.

[0019] Preferably, the cutting process cuts and separates the first pin set into two parts, which are respectively used as two first pins.

[0020] Preferably, the cutting process cuts and separates the second pin set into two parts, which are respectively used as two second pins.

[0021] In the present invention, the cutting line only needs to divide the first pin set into two first pins and divide the second pin set into two second pins. It can divide them into two equal parts by passing through the middle axis of the first pin set and the second pin set, or it can divide them into two unequal parts by a parallel line of the axis.

[0022] Preferably, the cut surface obtained by cutting the first pin or the second pin is an electrode surface.

[0023] Preferably, the area of the electrode surface > the radial cross-sectional area of the conductive body.

[0024] Preferably, the conductive body is completely embedded in the magnetic material, or at least one of the two opposite side surfaces connecting the conductive pins is exposed outside the magnetic material.

[0025] Preferably, the preparation method includes the following steps:

[0026] (1) Provide a conductive coil, lay the magnetic material and the conductive coil in a lamination manner in a pressing mold in sequence, and then perform pressing and baking in sequence to obtain an aggregate;

[0027] (2) Perform a cutting process on the aggregate obtained in step (1) to obtain a magnetic core containing a conductor;

[0028] (3) Anneal, perform surface insulation treatment and electrode manufacturing on the magnetic core obtained in step (2) in sequence to obtain an inductor component.

[0029] In the present invention, the material of the conductive coil can be a common conductive metal in the art, for example, it can be any one of copper, silver or gold or a combination of at least two of them.

[0030] In the present invention, the magnetic material may be any magnetic material commonly used in the art for making inductors, for example, a metal magnetic material and / or an amorphous magnetic material, wherein the metal magnetic material includes but is not limited to any one of FeSi, FeSiAl, Fe, FeNi or FeSiCr or a combination of at least two thereof, and the amorphous magnetic material includes but is not limited to any one of Fe-based amorphous magnetic material, FeNi-based amorphous magnetic material or Co-based magnetic material or a combination of at least two thereof.

[0031] Preferably, the pressing in step (1) to a density of 5.8-7.0 g / cm 3 , for example, it can be 5.8 g / cm 3 , 6g / cm 3 、6.2g / cm 3 、6.4g / cm 3 、6.6g / cm 3 、6.8g / cm 3 or 7g / cm 3 , but not limited to the listed values, other unlisted values ​​within the numerical range are also applicable.

[0032] Preferably, the baking temperature in step (1) is 100-200°C, for example, 100°C, 120°C, 140°C, 160°C, 180°C or 200°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0033] Preferably, the baking time is 0.5-4 h, for example, 0.5 h, 1 h, 2 h, 3 h or 4 h, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0034] In the present invention, the co-firing of the magnetic material and the conductive coil is achieved through a baking process, which can make the microstructures of the magnetic material and the conductive coil tightly combined, improve the product density and bonding strength, and provide higher stability and durability for the inductor; at the same time, during the high-temperature co-firing process, the stress inside the material can be effectively released, which helps to eliminate the compression stress inside the product, ensure the reliability of the inductor during long-term operation, and greatly improve the electromagnetic properties of the product.

[0035] Preferably, the annealing temperature in step (3) is 600-950°C, for example, it can be 600°C, 620°C, 640°C, 660°C, 680°C, 700°C, 720°C, 740°C, 760°C, 780°C, 800°C, 820°C, 840°C, 860°C, 880°C, 900°C, 920°C, 940°C or 950°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0036] Preferably, the annealing time is 1-4 hours, for example, 1 hour, 2 hours, 3 hours or 4 hours, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0037] Preferably, the annealing is performed under a protective atmosphere.

[0038] Preferably, the protective atmosphere comprises nitrogen.

[0039] Preferably, the surface insulation treatment in step (3) includes coating the surface of the magnetic core with an insulating material.

[0040] Preferably, the insulating material includes any one of epoxy resin, phenolic resin or polyurethane resin, or a combination of at least two of them.

[0041] Preferably, the electrode manufacturing includes: removing the insulating material at the first pin and the second pin, and then electroplating and welding the electrodes in sequence.

[0042] Preferably, the insulating material removal method comprises laser or CNC engraving.

[0043] Preferably, the electroplated material includes any one of Cu, Au, Ni, Sn or Ag, or a combination of at least two of them.

[0044] The coating, laser, CNC engraving, electroplating and welding in the present invention can all adopt the common methods for preparing inductor components in the art, and the present invention does not impose any specific restrictions on this.

[0045] In a second aspect, the present invention provides an inductor component array, which is obtained by the method for preparing an inductor component array described in the first aspect of the present invention, and the inductor component array includes a magnetic core, at least two conductors are arranged inside the magnetic core along a set direction, the conductors include a first pin and a second pin that are relatively arranged, and also include a conductive body between the first pin and the second pin.

[0046] The inductor component array provided by the present invention can integrate multiple inductor components into a single inductor component array by arranging multiple conductors in a directional manner inside a magnetic core, which not only greatly improves space utilization, but also reduces the space gap between adjacent inductor elements, thereby reducing circuit losses. The resulting inductor component array has excellent inductance value and saturation characteristics, while maintaining the characteristics of miniaturization and high power, thereby improving circuit reliability and stability.

[0047] Compared with the prior art, the present invention has at least one or more of the following beneficial effects:

[0048] (1) The inductor component array and its preparation method provided by the present invention can realize high-density integration of multiple inductors, so that one inductor component array can achieve the effect of multiple inductors, greatly improving space utilization, mounting efficiency and mounting density, and reducing the space gap between adjacent inductor elements. The resulting inductor component array has excellent inductance value, saturation current, strength and heat dissipation, achieving miniaturization and high power effects.

[0049] (2) The preparation method provided by the present invention can set the number of conductive coils in the magnetic material according to the use requirements, and can easily increase or decrease the number of coils, providing a high degree of manufacturing flexibility.

[0050] (3) The preparation method provided by the present invention co-fires the magnetic material and the conductive coil by baking, which can make the product have higher density and bonding strength. Since the magnetic core and the conductor are tightly combined, it has good thermal conductivity and heat dissipation effects. At the same time, it can more comprehensively eliminate the compression stress, significantly improve the electromagnetic properties of the product, increase the anisotropic properties, and reduce losses.

[0051] (4) The preparation method provided by the present invention achieves high combination density, greatly saves space, and provides conditions for the design of compact electronic devices. In addition, the preparation method is simple and easy to operate, meets the requirements of automated production, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 A schematic diagram of a three-dimensional structure of a conductive coil provided in the embodiment of the present invention and comparative example 1;

[0053] Figure 2 for Figure 1 Schematic diagram of the planar structure of the conductive coil;

[0054] Figure 3 A schematic diagram of a planar structure of another conductive coil provided by an embodiment of the present invention;

[0055] Figure 4 A schematic diagram of a planar structure of a cutting process of an assembly provided by an embodiment of the present invention;

[0056] Figure 5 for Figure 4 Schematic diagram of the three-dimensional structure of the aggregate undergoing cutting processing;

[0057] Figure 6 A schematic diagram of the three-dimensional structure of a sensor array component provided by an embodiment of the present invention;

[0058] Among them, 1-conductive coil; 101-conductive body; 102-first pin set; 103-second pin set; 104-bottom edge connection part; 2-assembly; 3-cutting line; 4-electrode surface; 5-radial section of conductive body; 6-row inductive components; 7-conductor; 8-second pin; 9-first pin. DETAILED DESCRIPTION

[0059] It should be understood that, in the description of the present invention, the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0060] It should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "disposed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0062] In a specific embodiment, the present invention provides a method for preparing a sensor array component, the preparation method comprising:

[0063] Provide a conductive coil 1, such as Figure 1 , Figure 2 and Figure 3 As shown, the conductive coil 1 includes a conductive body 101 and conductive pins arranged inside the conductive body 101, the conductive pins inside the conductive body 101 include a first pin set 102 and a second pin set 103, the first pin set 102 and the second pin set 103 are respectively arranged on two opposite sides inside the conductive body 101, a gap is set between opposite ends of the first pin set 102 and the second pin set 103, and the other ends are respectively connected to the conductive body 101;

[0064] Form an aggregate 2, such as Figure 4 and Figure 5 shown, the aggregate 2 includes a magnetic material and at least two conductive coils 1 disposed in the magnetic material and arranged in sequence along a set direction;

[0065] Cut the aggregate 2 along the arrangement direction of the conductive coils 1, and the cutting line 3 passes through the first pin set 102 and the second pin set 103 to obtain a magnetic core containing a conductor 7, such as Figure 6 shown.

[0066] In the present invention, the arrangement number of the conductive coils 1 in the magnetic material can be flexibly set according to usage requirements. For example, it can be 2, 3, 4, 5, 6, 7, or 8, etc. The present invention can conveniently reduce or increase the number of coil combinations as needed.

[0067] The preparation method provided by the present invention can optimize the structural layout of the aggregate 2, simplify the manufacturing process of the sense inductor component 6, and the obtained sense inductor component 6 can integrate multiple inductor components, greatly improving the space utilization rate, and improving the inductance value and saturation characteristics, having the advantages of miniaturization and high power.

[0068] In some embodiments, such as Figure 3 shown, the shape of the conductive main body 101 includes a plurality of inverted U-shaped and U-shaped arranged alternately along the axial direction. The bottom edges of the inverted U-shaped and U-shaped are connected to form a bottom edge connection portion 104. The free edges of the inverted U-shaped and U-shaped are connected to each other, and the first pin set 102 and the second pin set 103 are respectively arranged at the connection positions of the free edges.

[0069] In some embodiments, the number of the inverted U-shaped and U-shaped is at least 1 independently. For example, it can be 1, 2, 3, or 4, but is not limited to the listed values, and other unlisted values within the numerical range are also applicable.

[0070] In some embodiments, when the number of the inverted U-shaped or U-shaped is at least 2, the cutting line 3 also passes through the bottom edge connection portion 104 of the inverted U-shaped and U-shaped.

[0071] In the present invention, by arranging a plurality of inverted U-shaped and U-shaped alternately along the axial direction, a plurality of magnetic cores can be obtained through cutting treatment, and then multiple sense inductor components 6 can be prepared in one step, simplifying the process steps.

[0072] In some embodiments, such as Figure 1 and Figure 2 shown, the shape of the conductive coil 1 is a "day" - shaped structure with a middle horizontal break.

[0073] In the present invention, it is preferable that the shape of the conductive coil 1 is a "day" - shaped structure with a horizontal break in the middle, and two row inductance components 6 can be obtained in one - step preparation.

[0074] In some embodiments, the cutting process cuts and separates the first pin set 102 into two parts, which are respectively used as two first pins 9.

[0075] In some embodiments, the cutting process cuts and separates the second pin set 103 into two parts, which are respectively used as two second pins 8.

[0076] In some embodiments, the cut surface obtained by cutting the first pin 9 or the second pin 8 is the electrode surface 4.

[0077] In the present invention, by designing the first pin set 102 and the second pin set 103, the corresponding magnetic - core pins can be obtained through the cutting process, which simplifies the internal structure of the assembly 2, improves the compactness of the pin layout, reduces the volume of the component, and the obtained cut surface is the electrode surface 4 for installing the electrode.

[0078] In some embodiments, the area of the electrode surface 4 > the area of the radial cross - section 5 of the conductive body.

[0079] In the present invention, by preferably controlling the area of the electrode surface 4 > the area of the radial cross - section 5 of the conductive body, the reliability of mounting and conduction can be improved.

[0080] In some embodiments, the conductive body 101 is completely buried in the magnetic material. In some embodiments, at least one of the opposite two sides of the conductive body 101 connecting the conductive pins is exposed outside the magnetic material.

[0081] In the present invention, when the conductive body 101 is completely buried in the magnetic material, it can be fully combined with the magnetic material and has good heat - conduction effect, which is mainly applicable to the occasions of high - current and high - power; while controlling at least one of the opposite two sides of the conductive body connecting the conductive pins to be exposed outside the magnetic material can play the role of side - welding, which is mainly applicable to the occasions with high welding requirements.

[0082] In some embodiments, the preparation method includes the following steps:

[0083] (1) Provide the conductive coil 1, lay the magnetic material and the conductive coil 1 in layers in a pressing mold in sequence, and then perform pressing and baking in sequence to obtain the assembly 2;

[0084] (2) Perform a cutting process on the assembly 2 obtained in step (1) to obtain a magnetic core containing the conductor 7.

[0085] (3) The magnetic core obtained in step (2) is subjected to annealing, surface insulation treatment and electrode manufacturing in sequence to obtain an inductive component array 6.

[0086] The preparation method provided by the present invention can prepare the row inductor component 6 through a combination of processes such as pressing, baking, cutting, annealing, surface insulation treatment and electrode production, and the process flow is simple and convenient for industrial production.

[0087] In some embodiments, the pressing step (1) is performed to a density of 5.8-7.0 g / cm 3 , for example, it can be 5.8 g / cm 3 , 6g / cm 3 、6.2g / cm 3 、6.4g / cm 3 、6.6g / cm 3 、6.8g / cm 3 or 7g / cm 3 , but not limited to the listed values, other unlisted values ​​within the numerical range are also applicable.

[0088] In the present invention, the density endpoint of the pressing is preferably controlled to be 5.8-7.0 g / cm 3 , which can improve the magnetic properties and mechanical strength of the product.

[0089] In some embodiments, the baking temperature is 100-200°C, for example, 100°C, 120°C, 140°C, 160°C, 180°C or 200°C, but is not limited to the listed values, and other unlisted values ​​within the numerical range are also applicable.

[0090] In some embodiments, the baking time is 0.5-4h, for example, 0.5h, 1h, 2h, 3h or 4h, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0091] In the present invention, the mechanical strength of the product can be improved by preferably controlling the baking temperature and time within a specific range.

[0092] In the present invention, the co-firing of the magnetic material and the conductive coil 1 is achieved through a baking process, which can make the microstructures of the magnetic material and the conductive coil 1 tightly combined, improve the product density and bonding strength, and provide higher stability and durability for the inductor; at the same time, during the high-temperature co-firing process, the stress inside the material can be effectively released, which helps to eliminate the compression stress inside the product, ensure the reliability of the inductor during long-term operation, and greatly improve the electromagnetic properties of the product.

[0093] In some embodiments, the annealing temperature in step (3) is 600-950°C, for example, it can be 600°C, 620°C, 640°C, 660°C, 680°C, 700°C, 720°C, 740°C, 760°C, 780°C, 800°C, 820°C, 840°C, 860°C, 880°C, 900°C, 920°C, 940°C or 950°C, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0094] In some of the embodiments, the annealing time is 1-4 hours, for example, 1 hour, 2 hours, 3 hours or 4 hours, but is not limited to the listed values, and other values ​​not listed within the numerical range are also applicable.

[0095] In the present invention, by optimally controlling the annealing temperature and time, the internal stress can be sufficiently removed, thereby improving the magnetic properties and mechanical strength of the product.

[0096] In some embodiments, the annealing is performed under a protective atmosphere.

[0097] In some embodiments, the protective atmosphere includes nitrogen.

[0098] In the present invention, by optimally controlling the atmosphere of the annealing treatment, it is possible to prevent the metal coils in the product from being affected by oxidation or other unnecessary chemical reactions, thereby improving the safety and stability of production.

[0099] In some embodiments, the surface insulation treatment in step (3) includes coating the surface of the magnetic core with an insulating material.

[0100] In some embodiments, the insulating material includes any one of epoxy resin, phenolic resin or polyurethane resin, or a combination of at least two of them.

[0101] In the present invention, the product is provided with a complete protective layer by coating the insulating material, thereby preventing the conductive part of the inductor from accidentally making electrical contact with the external circuit, reducing the risk of short circuit, and reducing the interference to the inductor.

[0102] In some embodiments, the electrode manufacturing includes: removing the insulating material at the first pin 9 and the second pin 8, and then electroplating and welding the electrodes in sequence.

[0103] In some of the embodiments, the insulating material removal method includes laser or CNC engraving.

[0104] In some embodiments, the electroplated material includes any one of Cu, Au, Ni, Sn or Ag, or a combination of at least two of them.

[0105] The coating, laser, CNC engraving, electroplating and welding in the present invention can all adopt the common methods for preparing inductor components in the art, and the present invention does not impose any specific restrictions on this.

[0106] In another specific embodiment, the present invention provides an inductor component array 6, which is made by a preparation method described in a specific embodiment, and the inductor component array 6 includes a magnetic core, and at least two conductors 7 are arranged inside the magnetic core along a set direction, and the conductors 7 include a first pin 9 and a second pin 8 that are relatively arranged, and also include a conductive body 101 between the first pin 9 and the second pin 8.

[0107] The inductor component array 6 provided by the present invention can achieve high-density integration of multiple inductors, so that one inductor component array 6 can achieve the effect of multiple inductors, greatly improving space utilization, mounting efficiency and mounting density, and reducing the space gap between adjacent inductor elements. The resulting inductor component array 6 has excellent inductance value, saturation current and strength, achieving miniaturization and high power effects.

[0108] The technical effects of the present invention are further illustrated below by using Examples 1-3 and Comparative Example 1.

[0109] Example 1

[0110] This embodiment provides a method for preparing a sensor array component, the method comprising the following steps:

[0111] (1) providing a conductive coil, the conductive coil being Figure 1 and Figure 2 As shown in the figure, a first layer of magnetic material, a first layer of conductive coil, a second layer of magnetic material, a second layer of conductive coil, a third layer of magnetic material, a third layer of conductive coil, a fourth layer of magnetic material, a fourth layer of conductive coil and a fifth layer of magnetic material are sequentially stacked and laid in a press mold, the magnetic material is FeSiAl, and the conductive coil is made of copper, and then pressed to a density of 6.0 g / cm 3 , and then baked at 180°C for 2h to obtain an aggregate;

[0112] (2) cutting the assembly obtained in step (1) along the arrangement direction of the conductive coils, with the cutting line passing through the middle axis of the first pin assembly and the second pin assembly, to obtain a pair of magnetic cores containing conductive bodies;

[0113] (3) The magnetic core obtained in step (2) is annealed at a temperature of 800° C. for 2 h, and then coated with phenolic resin on the surface. Thereafter, the insulating material at the first pin and the second pin is removed, copper is electroplated on the electrode surface, and then the electrodes are welded to obtain an inductor component array.

[0114] Example 2

[0115] This embodiment provides a method for preparing a sensor array component, the method comprising the following steps:

[0116] (1) providing a conductive coil, the conductive coil being Figure 1 and Figure 2 As shown in the figure, a first layer of magnetic material, a first layer of conductive coil, a second layer of magnetic material, a second layer of conductive coil, a third layer of magnetic material, a third layer of conductive coil, a fourth layer of magnetic material, a fourth layer of conductive coil and a fifth layer of magnetic material are sequentially stacked and laid in a pressing mold, the magnetic material is FeSi, and the conductive coil is made of silver, and then pressed to a density of 5.8 g / cm 3 , and then baked at 100°C for 4h to obtain an aggregate;

[0117] (2) cutting the assembly obtained in step (1) along the arrangement direction of the conductive coils, with the cutting line passing through the middle axis of the first pin assembly and the second pin assembly, to obtain a pair of magnetic cores containing conductive bodies;

[0118] (3) The magnetic core obtained in step (2) is annealed at a temperature of 600° C. for 4 hours, and then epoxy resin is coated on the surface. Thereafter, the insulating material at the first pin and the second pin is removed, silver is electroplated on the electrode surface, and then the electrodes are welded to obtain an inductor component array.

[0119] Example 3

[0120] This embodiment provides a method for preparing a sensor array component, the method comprising the following steps:

[0121] (1) providing a conductive coil, the conductive coil being Figure 3 As shown in the figure, a first layer of magnetic material, a first layer of conductive coil, a second layer of magnetic material, a second layer of conductive coil, a third layer of magnetic material, a third layer of conductive coil, a fourth layer of magnetic material, a fourth layer of conductive coil and a fifth layer of magnetic material are sequentially stacked and laid in a pressing mold, the magnetic material is FeNi, and the conductive coil is made of gold, and then pressed to a density of 7.0 g / cm 3 , and then baked at 200°C for 0.5h to obtain an aggregate;

[0122] (2) cutting the assembly obtained in step (1) along the arrangement direction of the conductive coils, with the cutting line passing through the middle axis of the first pin assembly and the second pin assembly, and through the bottom edge connection portion of the inverted U-shape and the U-shape in the conductive body, to obtain four magnetic cores containing conductive bodies;

[0123] (3) The magnetic core obtained in step (2) is annealed at a temperature of 850° C. for 1 h, and then epoxy resin is coated on the surface. Thereafter, the insulating material at the first pin and the second pin is removed, gold is electroplated on the electrode surface, and then the electrodes are welded to obtain an inductor component array.

[0124] Comparative Example 1

[0125] This comparative example provides a method for preparing an inductor component, which differs from Example 1 only in that in step (1), a first layer of magnetic material, a first layer of conductive coil and a second layer of magnetic material are sequentially stacked and laid in a pressing mold.

[0126] The inductance value and saturation current of the products prepared in Examples 1-3 and Comparative Example 1 were measured using an inductance tester. The results are shown in Table 1.

[0127] Table 1

[0128] Inductance value / nH Saturation current / A Example 1 88 75 Example 2 92 81 Example 3 78 86 Comparative Example 1 65 70

[0129] From the data in Table 1, we can see the following points:

[0130] (1) It can be seen from the data of Examples 1-3 that the inductor component array provided by the present invention can achieve an inductance value of more than 78 nH and a saturation current of more than 75 A, and has excellent electromagnetic characteristics and saturation characteristics.

[0131] (3) A comprehensive comparison of the data of Example 1 and Comparative Example 1 shows that, compared with Example 1, Comparative Example 1 has only one layer of conductive coil disposed inside, and Comparative Example 1 cannot achieve the effect of a combination of multiple inductors. The inductance value and saturation current in Example 1 are significantly higher than those in Comparative Example 1. It can be seen that the present invention can achieve the integration of multiple inductors and optimize the inductance performance.

[0132] In summary, the inductor component array provided by the present invention can realize the combination of multiple inductors, improve space utilization and mounting efficiency, and has excellent inductance value and saturation characteristics, meeting the use requirements of chip power supply circuits.

[0133] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A method for preparing an array of inductive components, characterized in that: The preparation method includes: Providing a conductive coil, the conductive coil including a conductive body and conductive pins disposed inside the conductive body. The conductive pins inside the conductive body include a first pin set and a second pin set. The first pin set and the second pin set are respectively disposed on opposite sides inside the conductive body. A gap is provided between opposite ends of the first pin set and the second pin set, and the other ends are respectively connected to the conductive body; Forming an aggregate, the aggregate including a magnetic material and at least two conductive coils disposed in the magnetic material and arranged in sequence along a set direction; Performing a cutting process on the aggregate along the arrangement direction of the conductive coils, with the cutting line passing through the first pin set and the second pin set, to obtain a magnetic core including a conductor.

2. The preparation method according to claim 1, characterized in that: The shape of the conductive body includes a plurality of inverted U-shapes and U-shapes alternately arranged along the axis in sequence. The bottom edges of the inverted U-shapes and the U-shapes are connected to form a bottom edge connection portion. The free edges of the inverted U-shapes and the U-shapes are connected, and the first pin set and the second pin set are respectively provided at the connection points of the free edges; Preferably, the number of the inverted U-shapes and the U-shapes is at least 1 independently; Preferably, when the number of the inverted U-shapes or the U-shapes is at least 2, the cutting line also passes through the bottom edge connection portion of the inverted U-shapes and the U-shapes; Preferably, the shape of the conductive coil is a "day"-shaped structure with a middle horizontal break; 3. The preparation method according to claim 1 or 2, characterized in that: The cutting process cuts the first pin set into two parts, respectively serving as two first pins; Preferably, the cutting process cuts the second pin set into two parts, respectively serving as two second pins; Preferably, the cut surface obtained by the cutting process of the first pin or the second pin is an electrode surface; Preferably, the area of the electrode surface > the radial cross-sectional area of the conductive body; Preferably, the conductive body is completely buried inside the magnetic material, or at least one of the opposite two side surfaces connecting the conductive pins is exposed outside the magnetic material.

4. The preparation method according to any one of claims 1 to 3, characterized in that: The preparation method includes the following steps: (1) Providing a conductive coil, stacking the magnetic material and the conductive coil in sequence in a pressing mold, and then performing pressing and baking in sequence to obtain an aggregate; (2) Performing a cutting process on the aggregate obtained in step (1) to obtain a magnetic core including a conductor; (3) Annealing, surface insulation treatment, and electrode manufacturing are performed on the magnetic core obtained in step (2) in sequence to obtain an inductor component.

5. The preparation method according to claim 4, characterized in that: The step (1) is pressed to a density of 5.8-7.0 g / cm 3 .

6. The preparation method according to claim 4, characterized in that: The temperature of the baking in step (1) is 100 - 200 °C; Preferably, the baking time is 0.5 - 4 h.

7. The preparation method according to claim 4, characterized in that: The temperature of the annealing in step (3) is 600 - 950 °C; Preferably, the annealing time is 1 - 4 h; Preferably, the annealing is performed in a protective atmosphere; Preferably, the protective atmosphere includes nitrogen.

8. The preparation method according to claim 4, characterized in that: The surface insulation treatment in step (3) includes coating an insulating material on the surface of the magnetic core; Preferably, the insulating material includes any one or a combination of at least two of epoxy resin, phenolic resin, or polyurethane resin.

9. The preparation method according to claim 4, characterized in that: The electrode manufacturing in step (3) includes: removing the insulating material at the first pin and the second pin, and then performing electroplating and welding electrodes in sequence. Preferably, the insulating material removal method comprises laser or CNC engraving; Preferably, the electroplated material includes any one of Cu, Au, Ni, Sn or Ag, or a combination of at least two of them.

10. A row of inductive components, characterized in that: The inductor component array is obtained by the preparation method of the inductor component array according to any one of claims 1 to 9, and the inductor component array includes a magnetic core, at least two conductors are arranged inside the magnetic core along a set direction, the conductors include a first pin and a second pin that are relatively arranged, and also include a conductive body between the first pin and the second pin.

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