Display panel circuit repairing method and device, electronic equipment and storage medium

Abstract

The invention discloses a display panel circuit repairing method and device, electronic equipment and a storage medium, and the method comprises the steps: determining the disconnection width of an open-circuit region when the open-circuit region of a circuit in a display panel is detected, determining the deposition width according to the disconnection width, enabling the open-circuit region to be fully filled if the deposition width is greater than the disconnection width, and improving the circuit repairing efficiency. The repair success rate is improved; a metal deposition process is carried out on the open circuit area based on the deposition width, so that the open circuit area is filled with metal, the circuit is in a connected state, the metal is conductive metal, and the filling thickness of the metal is smaller than or equal to the thickness of the circuit; according to the method, a thin metal film can be generally formed on the upper surface of the circuit without forming a bulge with a large volume, so that the influence on the arrangement position of a structural layer can be avoided while the circuit is repaired, the repair process of the circuit is simplified, the repair cost is reduced, and meanwhile, the panel yield is also improved.

Description

Technical Field

[0001] The present invention relates to the technical field of display panel circuit repair, and in particular to a display panel circuit repair method, device, electronic equipment and storage medium. Background Art

[0002] The circuits in the display panel are usually of a multi-layer structure, with a buffer layer disposed between circuits of different layers, and vias disposed in the buffer layer, so that the circuits of different layers transmit signals and power.

[0003] In the traditional process, after laying a layer of circuits, the circuits of the current layer will be checked. When a circuit in a certain layer is broken, if the broken part needs to be repaired by welding, on the one hand, there may be a problem of insufficient welding raw materials, resulting in repair failure. On the other hand, due to the large amount of welding raw materials, a large protrusion may be generated, which may affect the layout of the structural layer. Usually, the signal layer is peeled off and the circuit layer is remade. However, this operation is not only complicated and costly, but also leads to a low panel yield. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a display panel circuit repair method.

[0005] In a first aspect, the present invention provides a display panel circuit repair method, comprising:

[0006] When detecting that an open circuit area exists in a circuit of the display panel, determining a disconnection width of the open circuit area;

[0007] Determine a deposition width according to the disconnection width, wherein the deposition width is greater than the disconnection width;

[0008] A metal deposition process is performed on the open area based on the deposition width to fill the open area with metal, thereby making the circuit in a connected state. The metal is a conductive metal, and the filling thickness of the metal is less than or equal to the thickness of the circuit.

[0009] In a second aspect, the present invention provides a display panel circuit repair device, comprising:

[0010] A disconnection width determination module, configured to determine a disconnection width of an open circuit area when detecting that an open circuit area exists in a circuit of a display panel;

[0011] A deposition width determination module, used to determine a deposition width according to the disconnection width, wherein the deposition width is greater than the disconnection width;

[0012] A metal deposition module is used to perform a metal deposition process on the open area based on the deposition width to fill the open area with metal, thereby making the circuit in a connected state, wherein the metal is a conductive metal, and the filling thickness of the metal is less than or equal to the thickness of the circuit.

[0013] In a third aspect, the present invention provides an electronic device, the electronic device comprising:

[0014] at least one processor; and

[0015] a memory communicatively connected to the at least one processor; wherein,

[0016] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the display panel circuit repairing method described in the first aspect of the present invention.

[0017] In a fourth aspect, the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the display panel circuit repair method described in the first aspect of the present invention when executed.

[0018] The display panel circuit repair method provided by the embodiment of the present invention determines the disconnection width of the open circuit area when an open circuit area is detected in the circuit of the display panel, and determines the deposition width according to the disconnection width. If the deposition width is greater than the disconnection width, the open circuit area can be fully filled, thereby improving the repair success rate; based on the deposition width, a metal deposition process is performed on the open circuit area to fill the open circuit area with metal, thereby making the circuit in a connected state. The metal is a conductive metal, and the filling thickness of the metal is less than or equal to the thickness of the circuit. When the metal deposition process is used, a thinner metal film can usually be formed on the upper surface of the circuit without forming a large protrusion, so that the layout position of its structural layer can be avoided from being affected while repairing the circuit, thereby simplifying the circuit repair process, reducing the repair cost, and also improving the panel yield.

[0019] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a flow chart of a display panel circuit repair method provided by Embodiment 1 of the present invention;

[0022] Figure 2 is a schematic diagram of a laser deposition process provided by Embodiment 1 of the present invention;

[0023] Figure 3 is a schematic diagram of a display panel structure provided by Embodiment 2 of the present invention;

[0024] Figure 4 This is a schematic diagram of the effect of performing metal deposition on an open circuit area according to a deposition width provided in the second embodiment of the present invention;

[0025] Figure 5 is a flow chart of a display panel circuit repair method provided by Embodiment 2 of the present invention;

[0026] Figure 6 This is a schematic diagram of a display panel circuit repair process provided by Embodiment 2 of the present invention;

[0027] Figure 7 is a schematic diagram of the structure of a repaired display panel provided in the second embodiment of the present invention;

[0028] Figure 8 This is a rendering of a display panel structure after metal deposition provided by the second embodiment of the present invention;

[0029] Fig. 9 It is a structural schematic diagram of a display panel circuit repair device provided by Embodiment 3 of the present invention;

[0030] Fig.10 It is a schematic diagram of the structure of an electronic device provided in Embodiment 4 of the present invention. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0032] The metal deposition process used in the present invention refers to a technique for depositing metal or metal compound on the surface of a substrate through a chemical or physical process, and can be applied to form a thin film of metal or metal oxide on the substrate.

[0033] Embodiment 1

[0034] Figure 1 This is a flow chart of a display panel circuit repair method provided in Embodiment 1 of the present invention. This embodiment is applicable to the case of display panel circuit repair. The method can be executed by a display panel circuit repair device. The display panel circuit repair device can be implemented in the form of hardware and / or software. The display panel circuit repair device can be configured in an electronic device. Figure 1 As shown, the display panel circuit repair method includes:

[0035] S101 . When it is detected that an open area exists in a circuit of a display panel, determine a disconnection width of the open area.

[0036] The display panel is a multi-layer structure, which includes at least two layers of circuits, and the number of circuits in each layer is multiple. When a layer of circuits is laid, the circuits of the current layer will be checked, specifically, the voltage, resistance, current and other parameters of the circuits can be checked. When a circuit is broken (the resistance tends to infinity and the current tends to 0), the part where the circuit is broken is considered to be an open circuit area, and the disconnection width of the open circuit area can be measured.

[0037] S102, determining a deposition width according to the disconnection width, wherein the deposition width is greater than the disconnection width.

[0038] Metal deposition is a layer-by-layer deposition process. The metal has a certain fluidity during the deposition process. Therefore, the metal deposition process is difficult to control completely and accurately. The deposition width is the metal covering width during metal deposition. If the deposition width is set to be exactly equal to the disconnection width, the edge area of ​​the deposition area may be filled with less metal or not filled, resulting in repair failure. Therefore, this embodiment sets the deposition width to be greater than the disconnection width. When the metal deposition process is implemented, the metal filling width can be greater than the disconnection width, so that the filled metal can completely cover the open area, thereby improving the repair success rate.

[0039] Generally speaking, in order to avoid excessive deposition of metal, the deposition width is set to be slightly larger than the disconnection width. In one example, the sum of the open area and the preset redundant width is set as the deposition width, and the redundant width is greater than 0. The specific redundant width can be determined according to the performance of the deposition device during deposition. For example, when the deposition device A is depositing, the width U1 of the single-sided edge area in the deposition area with less metal filled or not filled is set to 2U1, and when the deposition device B is depositing, the width U2 of the single-sided edge area in the deposition area with less metal filled or not filled is set to 2U2. The single-sided edge area mentioned here refers to the area on any side of the open area connected to the line. In addition, the redundant width can also be positively correlated with the disconnection width of the open area, that is, calculated, for example, the redundant width is obtained by calculating the ratio of the open area to the preset redundant ratio, and the preset redundant ratio can be 10%-20%, but at the same time, the upper limit of the redundant width should be set. When the calculated redundant width exceeds the upper limit, the upper limit is used as the final redundant width to avoid excessive deposition width and waste of filled metal materials.

[0040] S103 , performing a metal deposition process on the open area based on the deposition width to fill the open area with metal, thereby making the circuit in a connected state.

[0041] Specifically, after determining the deposition width, the display panel is placed on the metal deposition equipment, and the deposition width of the equipment is set according to the placement position of the display panel so that the deposition area of ​​the equipment can cover the open area. After confirming that the position is completed, start the equipment to perform the metal deposition process.

[0042] Optionally, this embodiment uses laser deposition technology, which uses the basic principle of rapid prototyping, uses metal powder as raw material, uses high-energy laser as energy source, and melts the metal powder fed synchronously layer by layer according to a predetermined processing path, rapidly solidifies and deposits layer by layer, thereby realizing direct manufacturing of metal parts. The specific laser deposition process diagram is shown in FIG. Figure 2 As shown, the raw gas is input from the air inlet of the equipment, and the position of the laser can be set according to the placement of the display panel so that the center of the irradiated area coincides with the center of the open area. Because the width of the irradiated area of ​​the laser is the deposition width, when the center of the irradiated area coincides with the center of the open area, the metal deposition area can completely cover the open area, thereby fully filling the open area.

[0043] Wherein, the metal is a conductive metal, and the filled metal can be used as a part of the circuit. In an optional example, the material of the metal is the same as the material of the circuit.

[0044] In order to avoid affecting the layout of other structural layers by filling too thick metal, the metal filling thickness is set to be less than or equal to the thickness of the circuit. The metal thickness of the open area after filling is still less than or equal to the thickness of the circuit, which can achieve the effect of connecting the originally disconnected circuit.

[0045] The display panel circuit repair method provided by the embodiment of the present invention determines the disconnection width of the open circuit area when an open circuit area is detected in the circuit of the display panel, and determines the deposition width according to the disconnection width. If the deposition width is greater than the disconnection width, the open circuit area can be fully filled, thereby improving the repair success rate; based on the deposition width, a metal deposition process is performed on the open circuit area to fill the open circuit area with metal, thereby making the circuit in a connected state. The metal is a conductive metal, and the filling thickness of the metal is less than or equal to the thickness of the circuit. When the metal deposition process is used, a thinner metal film can usually be formed on the upper surface of the circuit without forming a large protrusion, so that the layout position of its structural layer can be avoided from being affected while repairing the circuit, thereby simplifying the circuit repair process, reducing the repair cost, and also improving the panel yield.

[0046] Embodiment 2

[0047] Figure 3 is a schematic diagram of a display panel structure, such as Figure 3 As shown, in the display panel of this embodiment, at least one buffer layer and one other layer of circuits are laid in sequence on the circuits with open circuit areas. The buffer layer can make the circuit surface flat because the surface of the circuit is uneven after laying; secondly, the buffer layer is used to separate the multiple layers of circuits to play an insulating role, and the nodes that need to be connected between the circuits of different layers are connected by vias.

[0048] Figure 4 It is a schematic diagram of the effect of metal deposition on the open circuit area according to the deposition width, such as Figure 4 As shown, if the calculated deposition width is directly used for metal deposition, the deposition width D is greater than the disconnection width d of the open circuit area. If there are buffer layers and other circuits in the upper layer of the current circuit, then the thickness of the metal in the area covered by the deposition width and other areas except the open circuit area will affect the thickness of the buffer layer, that is, the thickness of the buffer layer is thinned. Then, the buffer layer between the metal filled in the circuit and other circuits is very thin, and it is easy for the metal (or the current circuit) and other connections to short-circuit, thereby causing a poor display panel. Therefore, this embodiment is optimized on the basis of embodiment one to solve this technical problem.

[0049] Figure 5 A flow chart of a display panel circuit repair method provided in Embodiment 2 of the present invention is shown in FIG. Figure 5 As shown, the display panel circuit repair method includes:

[0050] S501: When it is detected that an open area exists in a circuit of a display panel, determine a disconnection width of the open area.

[0051] S502 , determining a deposition width according to the disconnection width, wherein the deposition width is greater than the disconnection width.

[0052] S501-S502 are the same as those in the first embodiment, and the details may refer to the contents in the first embodiment.

[0053] Figure 6 A schematic diagram of a display panel circuit repair process is shown in FIG. Figure 6 As shown in (a), in the present method, the display panel is still provided with a substrate and a current circuit. After the current circuit is laid, when an inspection is performed and an open circuit area is found, the present method is used for repair. However, the buffer layer and other circuits have not yet been set. The buffer layer and other circuits are laid after the current circuit is repaired. When the buffer layer or other circuits are mentioned, the influence between different circuits and buffer layers is considered in advance. Therefore, the effect that can be achieved by the present method will be explained in combination with the layout effect diagram of the buffer layer and other circuits, and the buffer layer or other circuits have not been arranged.

[0054] S503 , obtaining a first thickness of the metal to be filled in the open area and a second thickness of the buffer layer.

[0055] like Figure 4 As shown, the thickness of the metal is the first thickness, and the initial set thickness of the buffer layer is the second thickness. For the structure of a fixed model display panel, its manufacturing process is relatively fixed, so the set thickness of each layer in the normal panel can be known, including the thickness of the circuit and the initial set thickness of the buffer layer (i.e., the second thickness). The repair process is also relatively fixed, so the thickness of the metal to be filled (i.e., the first thickness) can be set according to the overall thickness of the circuit.

[0056] S504: Determine whether the difference between the second thickness and the first thickness is less than a preset thickness threshold.

[0057] If yes, then S505 - S507 are executed to adjust the deposition thickness; if no, then S508 is executed to directly perform metal deposition.

[0058] The first thickness is the thickness of the metal. Except for the open circuit area, after the metal deposition on the top of the circuit is completed, the layout thickness of the buffer layer at this position will be occupied. In order to avoid the remaining available buffer layer layout thickness at this position being too small to cause a short circuit between the current circuit and other circuits, the layout thickness of the remaining available buffer layer is evaluated. The difference between the second thickness and the first thickness is the layout thickness of the remaining available buffer layer.

[0059] The preset thickness threshold is the thickness at which the lines on both sides of the buffer layer will not short-circuit, and can be specifically determined based on the performance or material of the buffer layer.

[0060] S505: Determine the cutting thickness based on the difference.

[0061] When the remaining available buffer layer layout thickness is less than the preset thickness threshold, it indicates that there is a short circuit risk. Therefore, the current circuit needs to be cut and the top position of the circuit is moved downward while keeping the metal deposition thickness at the top of the circuit unchanged. That is, the metal position is moved downward, thereby avoiding occupying the buffer layer layout thickness.

[0062] In an optional example, determining the cutting thickness based on the difference includes: calculating the product of the difference and a preset ratio value to obtain the cutting thickness, the preset ratio value is greater than 1, and the cutting thickness is less than the thickness of the current line.

[0063] Here, the preset ratio value is set to be greater than 1, so that more cutting thickness can be obtained, and the layout thickness of the buffer layer is occupied less, further ensuring that the layout thickness of the buffer layer is sufficient, avoiding short circuits of the lines on both sides of the buffer zone, and reducing the risk of display panel failure. Specifically, the preset ratio value can be in the range of 1.1-1.3.

[0064] S506: Take the lines at both ends of the open circuit area as target lines.

[0065] like Figure 6 As shown in (a), the lines at both ends of the open circuit area are the target lines, and the number of target lines is 2.

[0066] S507 , cutting the target line adjacent to the open area based on the cutting thickness, the disconnection width and the deposition width.

[0067] Laser, based on cutting thickness and deposition width Figure 6 The target lines adjacent to the open circuit area in (a) are cut to obtain Figure 6 (b) The display panel structure shown.

[0068] Specifically, half of the difference between the deposition width and the disconnection width (i.e., half of the redundant width) is calculated to obtain the cutting width; in each target line at both ends of the open circuit area, the area whose distance from the open circuit area is less than or equal to the cutting width is used as the cutting area; and the cutting area is cut using a laser at a cutting thickness.

[0069] S508 , performing a metal deposition process on the open area based on the deposition width to fill the open area with metal, thereby making the circuit in a connected state.

[0070] The metal is a conductive metal, and the filling thickness of the metal is less than or equal to the thickness of the circuit.

[0071] S508 is similar to S103 in the first embodiment, and the details may refer to the relevant description in S103.

[0072] The display panel structure after metal deposition is as follows Figure 6 (c) as shown.

[0073] The above S501-S508 completes the repair of the circuit in the display panel, and then the buffer layer and other circuits can be laid on the repaired circuit to obtain the following Figure 6 (d) The display panel structure shown in Figure 6 In (d), it is obvious that the thickness of the metal in the buffer layer structure is small, so the thickness of the buffer layer between the current line and other lines is large, and the possibility of a short circuit between the two is very small.

[0074] In an optional embodiment, when cutting the target circuit, the cutting thickness is the thickness of the metal to be set (i.e., the first thickness). Then, after the metal is deposited, the top of the metal deposited in the cut portion of the circuit can be relatively flush with the top of the uncut portion of the circuit. The operation process is similar to S501-S508. The specific effect diagram is as follows: Figure 7 The advantage of such a configuration is that it can completely avoid the filling metal from occupying the layout position of the circuit, so that the thickness of the buffer layer remains unchanged, further reducing the risk of short circuits on both sides of the buffer layer.

[0075] In an alternative embodiment, the metal includes molybdenum-titanium alloy and copper.

[0076] Based on this embodiment, in an optional example, a metal deposition process is performed in the open circuit area based on the deposition width, including: using copper as a raw material and performing a metal deposition process in the open circuit area based on the deposition width to obtain a first deposition layer; using molybdenum-titanium alloy as a raw material and performing a metal deposition process on the first deposition layer based on the deposition width to obtain a second deposition layer, and the thickness and value of the first deposition layer and the second deposition layer are the thickness of the metal to be deposited. Optionally, the display panel structure effect diagram after metal deposition is as follows Figure 8 shown.

[0077] Embodiment 3

[0078] Fig. 9 This is a schematic diagram of the structure of a display panel circuit repair device provided by Embodiment 3 of the present invention. Fig. 9 As shown, the display panel circuit repair device includes:

[0079] A disconnection width determination module 901 is used to determine the disconnection width of the open area when detecting that an open area exists in the circuit of the display panel;

[0080] A deposition width determination module 902, configured to determine a deposition width according to the disconnection width, wherein the deposition width is greater than the disconnection width;

[0081] A metal deposition module 903 is used to perform a metal deposition process on the open circuit area based on the deposition width to fill the open circuit area with metal, thereby making the circuit in a connected state, wherein the metal is a conductive metal, and the filling thickness of the metal is less than or equal to the thickness of the circuit

[0082] Optionally, the deposition width determination module 902 includes:

[0083] The deposition width determination submodule is used to calculate the sum of the disconnection width and a preset redundant width as the deposition width.

[0084] Optionally, in the display panel, at least one buffer layer and one other layer of circuits are sequentially laid on the circuits with open circuit areas, and the display panel circuit repairing device further includes:

[0085] A thickness acquisition module, used to acquire a first thickness of the metal to be filled in the open area and a second thickness of the buffer layer;

[0086] A remaining thickness determination module, used to determine whether the difference between the second thickness and the first thickness is less than a preset thickness threshold; if so, the contents of the cutting thickness determination module are executed; if not, the contents of the metal deposition module 903 are executed;

[0087] a cutting thickness determination module, configured to determine the cutting thickness based on the difference;

[0088] A target line determination module, used to take the lines at both ends of the open circuit area as target lines;

[0089] A cutting module is used to cut the target line adjacent to the open area based on the cutting thickness, the disconnection width and the deposition width.

[0090] Optionally, the cutting thickness determination module includes:

[0091] The cutting thickness determination submodule is used to calculate the product of the difference and a preset ratio value to obtain the cutting thickness, wherein the preset ratio value is greater than 1 and the cutting thickness is less than the current thickness of the line.

[0092] Optionally, the cutting module includes:

[0093] A cutting width calculation submodule, used for calculating half of the difference between the deposition width and the disconnection width to obtain a cutting width;

[0094] A cutting area determination submodule, configured to use, in each of the target lines at both ends of the open area, an area whose distance from the open area is less than or equal to the cutting width as a cutting area;

[0095] The cutting submodule is used to cut the cutting area with the cutting thickness by using a laser.

[0096] Optionally, the metal includes molybdenum-titanium alloy and copper.

[0097] Optionally, the metal deposition module 903 includes:

[0098] A first deposition submodule, configured to use copper as a raw material and perform a metal deposition process on the open circuit area based on the deposition width to obtain a first deposition layer;

[0099] The second deposition submodule is used to use the molybdenum-titanium alloy as a raw material and perform a metal deposition process on the first deposition layer based on the deposition width to obtain a second deposition layer.

[0100] The display panel circuit repairing device provided in the embodiment of the present invention can execute the display panel circuit repairing method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0101] Embodiment 4

[0102] Fig.10 A schematic diagram of an electronic device 40 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0103] like Fig.10As shown, the electronic device 40 includes at least one processor 41, and a memory connected to the at least one processor 41, such as a read-only memory (ROM) 42, a random access memory (RAM) 43, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 41 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 42 or the computer program loaded from the storage unit 48 to the random access memory (RAM) 43. In the RAM 43, various programs and data required for the operation of the electronic device 40 can also be stored. The processor 41, the ROM 42, and the RAM 43 are connected to each other through a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.

[0104] A number of components in the electronic device 40 are connected to the I / O interface 45, including: an input unit 46, such as a keyboard, a mouse, etc.; an output unit 47, such as various types of displays, speakers, etc.; a storage unit 48, such as a disk, an optical disk, etc.; and a communication unit 49, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 49 allows the electronic device 40 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0105] The processor 41 may be a variety of general and / or dedicated processing components with processing and computing capabilities. Some examples of the processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 41 performs the various methods and processes described above, such as a display panel line repair method.

[0106] In some embodiments, the display panel line repair method may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 48. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 40 via the ROM 42 and / or the communication unit 49. When the computer program is loaded into the RAM 43 and executed by the processor 41, one or more steps of the display panel line repair method described above may be performed. Alternatively, in other embodiments, the processor 41 may be configured to execute the display panel line repair method in any other appropriate manner (e.g., by means of firmware).

[0107] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0108] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0109] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0110] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0111] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0112] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0113] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0114] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display panel circuit repair method, characterized in that: include: When detecting that an open circuit area exists in a circuit of the display panel, determining a disconnection width of the open circuit area; Determine a deposition width according to the disconnection width, wherein the deposition width is greater than the disconnection width; A metal deposition process is performed on the open area based on the deposition width to fill the open area with metal, thereby making the circuit in a connected state. The metal is a conductive metal, and the filling thickness of the metal is less than or equal to the thickness of the circuit.

2. The display panel circuit repair method according to claim 1, characterized in that: The step of determining the deposition width according to the disconnection width comprises: The sum of the disconnection width and a preset redundant width is calculated as the deposition width.

3. The display panel circuit repair method according to claim 1, characterized in that: In the display panel, at least one buffer layer and one other layer of circuits are sequentially laid on the circuits with open circuit areas. After the deposition width is determined according to the disconnection width, the method further includes: Obtaining a first thickness of the metal to be filled in the open area and a second thickness of the buffer layer; Determining whether a difference between the second thickness and the first thickness is less than a preset thickness threshold; If not, performing a step of performing a metal deposition process on the open area based on the deposition width; If so, determining the cutting thickness based on the difference; Taking the lines at both ends of the open circuit area as target lines; The target line adjacent to the open area is cut based on the cutting thickness, the disconnection width, and the deposition width.

4. The display panel circuit repair method according to claim 3, characterized in that: The determining of the cutting thickness based on the difference comprises: The product of the difference and a preset ratio value is calculated to obtain the cutting thickness, the preset ratio value is greater than 1, and the cutting thickness is less than the current thickness of the line.

5. The display panel circuit repair method according to claim 3, characterized in that: The step of cutting the target line adjacent to the open area based on the cutting thickness, the disconnection width and the deposition width comprises: Calculating half of the difference between the deposition width and the disconnection width to obtain a cutting width; In each of the target lines at both ends of the open area, an area whose distance from the open area is less than or equal to the cutting width is used as a cutting area; The cutting area is cut with the cutting thickness by using a laser.

6. The display panel circuit repair method according to any one of claims 1 to 5, characterized in that: The metals include molybdenum-titanium alloy and copper.

7. The display panel circuit repair method according to claim 6, characterized in that: The performing a metal deposition process on the open area based on the deposition width comprises: Using copper as a raw material and performing a metal deposition process on the open circuit area based on the deposition width to obtain a first deposition layer; A metal deposition process is performed on the first deposition layer based on the deposition width using molybdenum-titanium alloy as a raw material to obtain a second deposition layer.

8. A display panel circuit repair device, characterized in that: include: A disconnection width determination module, configured to determine a disconnection width of an open circuit area when detecting that an open circuit area exists in a circuit of a display panel; A deposition width determination module, used to determine a deposition width according to the disconnection width, wherein the deposition width is greater than the disconnection width; A metal deposition module is used to perform a metal deposition process on the open area based on the deposition width to fill the open area with metal, thereby making the circuit in a connected state, wherein the metal is a conductive metal, and the filling thickness of the metal is less than or equal to the thickness of the circuit.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the display panel line repairing method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the display panel circuit repair method according to any one of claims 1 to 7 when executed.

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