Air-cooled millimeter wave high-power solid-state power amplifier

Abstract

The invention belongs to the technical field of solid-state power amplifiers, and particularly relates to an air-cooled millimeter wave high-power solid-state power amplifier. According to the technical scheme, the air cooling type millimeter wave high-power solid-state power amplifier comprises an upper cover plate, a heat dissipation base and a bottom frame which are sequentially connected from top to bottom, a circuit function unit is installed in the heat dissipation base, the bottom of the heat dissipation base is connected with an efficient heat dissipation air channel, and the efficient heat dissipation air channel is arranged in the bottom frame. A fan assembly is further connected between one side of the bottom frame and the heat dissipation base. The invention provides an air-cooled millimeter-wave high-power solid-state power amplifier, aiming at solving the technical bottlenecks of light miniaturization and efficient heat dissipation of the millimeter-wave high-power solid-state power amplifier.

Description

Technical Field

[0001] The invention belongs to the technical field of solid-state power amplifiers, and in particular relates to an air-cooled millimeter-wave high-power solid-state power amplifier. Background Art

[0002] With the needs of business development and technological progress, the operating frequency of the communication system has gradually risen to the millimeter wave band. The millimeter wave high-power solid-state amplifier is the core equipment of the millimeter wave communication system, which is widely used in satellite communications, aerospace measurement and control, satellite Internet and other fields. Its main function is to amplify the power of millimeter wave signals and complete signal transmission through the antenna servo feed system to establish a communication connection with the spacecraft. Its performance determines the operating distance, communication quality, data transmission rate, measurement and control accuracy of the entire system.

[0003] With the rapid development of microwave and millimeter wave technology, the demand for high-power solid-state amplifiers is increasing day by day, especially in the fields of satellite communications, aerospace measurement and control, satellite Internet, etc., the requirements for the output power, equipment volume, weight, etc. of millimeter wave solid-state amplifiers are becoming more and more stringent, the output power requirements are getting higher and higher, and the equipment volume and weight are required to be smaller, lighter, and more integrated. At present, high-power chips in the millimeter wave band basically use GaN power chips. Compared with traditional GaAs power chips, GaN power chips have greater power density, which can effectively reduce the synthesis scale of solid-state amplifiers. However, the heat flux density of GaN power chips is 2 to 3 times that of GaAs power chips. How to effectively dissipate heat has become a difficult problem in the application of GaN power chips. Although GaN chips have high power density and can effectively reduce the size of equipment, efficient heat dissipation and volume are contradictory, which has become a bottleneck problem restricting the development of millimeter wave high-power solid-state amplifiers. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the purpose of the present invention is to provide an air-cooled millimeter-wave high-power solid-state power amplifier to solve the technical bottleneck of lightweight miniaturization and efficient heat dissipation of millimeter-wave high-power solid-state power amplifiers.

[0005] The technical solution adopted by the present invention is:

[0006] A wind-cooled millimeter-wave high-power solid-state amplifier comprises an upper cover plate, a heat sink and a bottom frame which are sequentially connected from top to bottom. A circuit functional unit is installed in the heat sink. The bottom of the heat sink is connected to an efficient heat dissipation duct which is arranged in the bottom frame. A fan assembly is also connected between one side of the bottom frame and the heat sink.

[0007] The millimeter wave high-power solid-state power amplifier of the present invention adopts air cooling and heat dissipation, which is light in weight, high in reliability and good in maintainability, and solves the shortcomings of liquid cooling and heat dissipation, such as large volume, complex installation, high price and low reliability.

[0008] The millimeter wave high-power solid-state power amplifier of the present invention adopts an upper, middle and lower three-layer design, has a compact overall layout, a small device size, good maintainability and reliability, and can be directly applied to the design of millimeter wave solid-state power amplifiers.

[0009] The present invention is applicable to the fields of microwave, millimeter wave satellite communication, aerospace measurement and control, satellite Internet, etc.

[0010] As a preferred solution of the present invention, the heat sink includes a front panel and a rear panel; the front panel is provided with an input radio frequency connector, a panel indicator light, a monitoring connector, a power supply connector and a panel switch.

[0011] As a preferred solution of the present invention, an output RF port and an output RF test port are provided on the rear panel.

[0012] As a preferred solution of the present invention, the circuit functional unit includes a power supply unit, a radio frequency predistortion driving unit, a final stage power amplifier unit and a monitoring unit.

[0013] As a preferred solution of the present invention, the power supply unit, the RF predistortion drive unit, the final power amplifier unit, and the monitoring unit are located on the same plane, and the heat sources are all located on the bottom surface. All components of the circuit functional unit are located on the same plane, and the heat sources are all located on the same bottom surface, which is convenient for heat dissipation design. This layout method realizes high-density integrated design, reduces the volume and weight of the equipment, and is convenient for disassembly and subsequent maintenance.

[0014] As a preferred embodiment of the present invention, the fan assembly includes a fan assembly mounting plate, on which a fan waterproof power connector and a plurality of DC waterproof fans are mounted, and the plurality of DC waterproof fans are electrically connected to the fan waterproof power connector respectively.

[0015] As a preferred solution of the present invention, the fan assembly is installed on the front end surface of the heat sink, and can be quickly removed and installed from the front end surface as a whole during maintenance, which has good maintainability. The millimeter wave high-power solid-state amplifier of the present invention adopts a quickly detachable fan assembly form, which can realize the rapid disassembly and replacement of the fan assembly, solving the problem of difficult fan replacement in conventional designs.

[0016] As a preferred solution of the present invention, the high-efficiency heat dissipation duct includes fins welded on the height-reducing fins and the equal-height fins, the thickness of the height-reducing fins is less than that of the equal-height fins, the height-reducing fins are arranged at the bottom of the low heat consumption area of ​​the circuit functional unit, and the equal-height fins are arranged at the bottom of the high heat consumption area of ​​the circuit functional unit; the bottom frame encloses the height-reducing fins and the equal-height fins to form a heat dissipation duct. The millimeter-wave high-power solid-state amplifier of the present invention adopts the form of height-reducing fins and equal-height fins according to the heat consumption distribution of the circuit unit, which ensures the heat dissipation capacity while effectively reducing the weight of the equipment.

[0017] As a preferred solution of the present invention, a plurality of bottom heat pipes are fixed on the upper side of the height-reducing fins and the upper side of the equal-height fins, and the bottom heat pipes are welded to the bottom of the circuit functional unit. The heat dissipation floor of the millimeter-wave high-power solid-state amplifier of the present invention adopts heat pipe temperature equalization technology, so that the heat of the amplifier is quickly dispersed laterally and evenly distributed on the heat dissipation bottom surface, which plays a role in temperature equalization of the heat dissipation bottom surface and realizes efficient heat dissipation of the amplifier.

[0018] As a preferred solution of the present invention, a plurality of U-shaped heat pipes are also provided on the fins of equal height, the middle section of the U-shaped heat pipe is welded to the bottom of the circuit functional unit, and the two ends of the U-shaped heat pipe are welded and inserted into the fins of equal height. The millimeter-wave high-power solid-state amplifier heat dissipation fins of the present invention adopt the form of interlaced U-shaped heat pipes to guide heat from the top end of the fin to the bottom end, thereby realizing efficient heat exchange of the heat dissipation fins.

[0019] The beneficial effects of the present invention are:

[0020] 1. The millimeter wave high-power solid-state power amplifier of the present invention adopts air cooling and heat dissipation, which is light in weight, highly reliable and easy to maintain, and solves the shortcomings of liquid cooling and heat dissipation, such as bulky volume, complex installation, high price and low reliability. The millimeter wave high-power solid-state power amplifier of the present invention adopts a three-layer design of upper, middle and lower layers, with a compact overall layout, small equipment size, good maintainability and reliability, and can be directly applied to the design of millimeter wave solid-state power amplifiers. The present invention is suitable for microwave, millimeter wave satellite communications, aerospace measurement and control, satellite Internet and other fields.

[0021] 2. All circuit functional units of the millimeter wave high-power solid-state power amplifier of the present invention are located on the same plane, and the heat sources are all located on the same bottom surface, which is convenient for heat dissipation design. This layout realizes high-density integrated design, reduces the volume and weight of the equipment, and is convenient for disassembly and subsequent maintenance.

[0022] 3. The millimeter-wave high-power solid-state amplifier of the present invention adopts a rapidly disassembled fan assembly, which can realize rapid disassembly and replacement of the fan assembly, thus solving the problem of difficult fan replacement in conventional designs.

[0023] 4. The heat dissipation floor of the millimeter-wave high-power solid-state amplifier of the present invention adopts heat pipe temperature equalization technology, so that the heat of the power amplifier can be quickly dispersed laterally and evenly distributed on the heat dissipation bottom surface, which plays a role in temperature equalization of the heat dissipation bottom surface and realizes efficient heat dissipation of the power amplifier.

[0024] 5. The millimeter wave high-power solid-state amplifier of the present invention adopts the form of reduced height fins and equal height fins according to the heat consumption distribution of the circuit unit, thereby ensuring the heat dissipation capacity while effectively reducing the weight of the equipment.

[0025] 6. The millimeter-wave high-power solid-state amplifier heat dissipation fins of the present invention adopt the form of interlaced U-shaped heat pipes to guide heat from the top end of the fin to the bottom end, thereby achieving efficient heat exchange of the heat dissipation fins. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is an exploded view of the present invention in the axial direction

[0027] Figure 2 It is an exploded view of the main viewing direction of the present invention;

[0028] Figure 3 It is an exploded view of the present invention from the left side;

[0029] Figure 4 It is an exploded view of the present invention from the right side;

[0030] Figure 5 It is a schematic diagram of the structure of the circuit functional unit;

[0031] Figure 6 It is a schematic diagram of the structure of the fan assembly;

[0032] Figure 7 It is a structural schematic diagram of a high-efficiency heat dissipation duct.

[0033] In the figure: 1-upper cover; 2-heat sink; 21-input RF connector; 22-panel indicator light; 23-monitoring connector; 24-power supply connector; 25-panel switch; 26-output RF port; 27-output RF test port; 3-circuit function unit; 31-power supply unit; 32-RF pre-distortion drive unit; 33-final power amplifier unit; 34-monitoring unit; 4-fan assembly; 41-DC waterproof fan; 42-waterproof power connector; 43-fan assembly installation board; 5-high-efficiency heat dissipation duct; 51-reduced height fins; 52-equal height fins; 53-bottom heat pipe; 54-U-shaped heat pipe; 6-bottom frame. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0036] like Figure 1 and Figure 2 As shown, the air-cooled millimeter-wave high-power solid-state amplifier of this embodiment includes an upper cover plate 1, a heat sink 2 and a bottom frame 6 connected in sequence from top to bottom, a circuit functional unit 3 is installed in the heat sink 2, and the bottom of the heat sink 2 is connected to an efficient heat dissipation duct 5, which is arranged in the bottom frame 6, and a fan assembly 4 is also connected between one side of the bottom frame 6 and the heat sink 2.

[0037] The air-cooled miniaturized millimeter-wave high-power solid-state amplifier in this example adopts a three-layer design, with the upper layer being a waterproof upper cover plate 1, the middle being a heat sink 2, a circuit functional unit 3, and a fan assembly 4, and the lower layer being an efficient heat dissipation duct 5 and a bottom frame 6. The overall layout is compact, the device is small in size, and has good maintainability and reliability.

[0038] The upper cover plate 1 plays a sealing and shielding role.

[0039] Wherein, the heat sink 2 includes a front panel and a rear panel. Figure 3 As shown, the front panel of the air-cooled millimeter-wave high-power solid-state power amplifier of this example includes an input RF connector 21, a panel indicator light 22, a monitoring connector 23, a power supply connector 24, and a panel switch 25. The input RF connector 21, the monitoring connector 23, the power supply connector 24, and the panel switch 25 are all located on the same surface, which is convenient for connection and operation with the front-end equipment. The panel indicator light 22 is used to indicate the working status of the power amplifier and monitor the working status of the power amplifier in real time.

[0040] like Figure 4 As shown, the rear panel diagram of the air-cooled millimeter-wave high-power solid-state power amplifier of this example includes an output RF port 26 and an output RF test port 27. The output RF port 26 is the RF signal output port of the power amplifier, which is connected to the rear antenna feed source at the back end to output the amplified RF signal to the antenna. The output RF test port 27 is a part of the signal coupled out by the output end of the power amplifier, which is used for daily routine power and spectrum testing of the power amplifier.

[0041] like Figure 5 As shown, the circuit functional unit 3 of the air-cooled millimeter-wave high-power solid-state power amplifier of this example includes a power supply unit 31, a RF pre-distortion driving unit 32, a final power amplifier unit 33, and a monitoring unit 34. The overall layout is compact, and all circuit functional units 3 are located on the same plane. The heat source of each unit is located on the bottom surface, which is convenient for heat dissipation design. This layout realizes a high-density integrated design, which is beneficial to reducing the size and weight of the equipment, and is convenient for disassembly and subsequent maintenance.

[0042] like Figure 6As shown, the fan assembly 4 of the air-cooled millimeter-wave high-power solid-state amplifier of this example includes a DC waterproof fan 41, a waterproof power connector 42 and a fan assembly mounting plate 43. The DC waterproof fan 41 is installed on the fan assembly mounting plate 43 by exhausting air, and the waterproof power connector 42 is installed on the lower left side of the fan assembly 4. The cable of the waterproof power connector 42 and the cable of the DC waterproof fan 41 are connected to form a complete fan assembly 4. The fan assembly 4 is installed between the front panel heat sink 2 and the bottom frame 6, and uses exhausting air to bring the heat from the high-temperature area to the low-temperature area and exchange heat with the outside world. During later maintenance, the fan assembly 4 can be directly removed as a whole for replacement, which greatly improves the maintainability of the power amplifier.

[0043] like Figure 7 As shown, the efficient heat dissipation duct 5 of the air-cooled millimeter-wave high-power solid-state amplifier of this example includes buckled fins and efficient heat pipes. Among them, the buckled fins are stepped. According to the heat consumption distribution of the circuit functional unit 3, the low heat consumption area adopts wide-spaced reduced-height fins 51 to ensure the heat dissipation capacity while reducing the weight of the equipment. The high heat consumption area adopts high-density equal-height fins 52 to increase the heat exchange area. The efficient heat pipe is composed of a bottom heat pipe 53 and a U-shaped heat pipe 54. The bottom heat pipe 53 is welded to the bottom surface of the heat sink 2 by lead-tin soldering, and the heat is guided from the high-temperature area of ​​the circuit functional unit 3 to the low-temperature area to achieve a horizontal temperature equalization effect. The U-shaped heat pipe 54 is inserted into the heat dissipation fins by welding, and the heat is guided from the top of the fin to the bottom, so as to achieve efficient heat exchange of the fins.

[0044] The present invention is not limited to the above-mentioned optional implementation modes. Anyone can derive other various forms of products under the inspiration of the present invention. However, no matter what changes are made in the shape or structure, all technical solutions that fall within the scope defined by the claims of the present invention fall within the protection scope of the present invention.

Claims

1. An air-cooled millimeter-wave high-power solid-state amplifier, characterized in that: The invention comprises an upper cover plate (1), a heat sink (2) and a bottom frame (6) which are connected in sequence from top to bottom; a circuit function unit (3) is installed in the heat sink (2); a high-efficiency heat dissipation duct (5) is connected to the bottom of the heat sink (2); the high-efficiency heat dissipation duct (5) is arranged in the bottom frame (6); and a fan assembly (4) is also connected between one side of the bottom frame (6) and the heat sink (2).

2. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 1, characterized in that: The heat sink (2) comprises a front panel and a rear panel; the front panel is provided with an input radio frequency connector (21), a panel indicator light (22), a monitoring connector (23), a power supply connector (24) and a panel switch (25).

3. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 2, characterized in that: The rear panel is provided with an output radio frequency port (26) and an output radio frequency test port (27).

4. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 1, characterized in that: The circuit functional unit (3) comprises a power supply unit (31), a radio frequency predistortion driving unit (32), a final-stage power amplifier unit (33) and a monitoring unit (34).

5. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 4, characterized in that: The power supply unit (31), the radio frequency predistortion driving unit (32), the final stage power amplifier unit (33), and the monitoring unit (34) are located on the same plane, and the heat sources are all located on the bottom surface.

6. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 1, characterized in that: The fan assembly (4) comprises a fan assembly mounting plate (43), on which a fan waterproof power connector (42) and a plurality of DC waterproof fans (41) are mounted, and the plurality of DC waterproof fans (41) are electrically connected to the fan waterproof power connector (42) respectively.

7. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 6, characterized in that: The fan assembly (4) is mounted on the front end surface of the heat sink (2).

8. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 1, characterized in that: The high-efficiency heat dissipation duct (5) comprises height-reducing fins (51) and equal-height fins (52) welded thereto, the height-reducing fins (51) being thinner than the equal-height fins (52), the height-reducing fins (51) being arranged at the bottom of a low heat consumption area of ​​the circuit functional unit (3), and the equal-height fins (52) being arranged at the bottom of a high heat consumption area of ​​the circuit functional unit (3); the bottom frame (6) encloses the height-reducing fins (51) and the equal-height fins (52) to form a heat dissipation duct.

9. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 8, characterized in that: A plurality of bottom surface heat pipes (53) are fixed to the upper side of the height-reducing fins (51) and the upper side of the equal-height fins (52), and the bottom surface heat pipes (53) are welded to the bottom of the circuit functional unit (3).

10. The air-cooled millimeter-wave high-power solid-state amplifier according to claim 9, characterized in that: A plurality of U-shaped heat pipes (54) are also arranged on the fins (52) of equal height, the middle section of the U-shaped heat pipe (54) is welded to the bottom of the circuit functional unit (3), and the two ends of the U-shaped heat pipe (54) are welded and inserted into the fins (52) of equal height.

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