Phase change heat dissipation device with micro-tube heating component adopting spiral coil structure

Abstract

The invention relates to the technical field of heat dissipation of microelectronic components, in particular to a phase-change heat dissipation device with a spiral coil structure for a microtube heating component, which comprises a base tube, an inner-layer heat dissipation assembly and an outer-layer heat dissipation assembly, and is characterized in that the inner-layer heat dissipation assembly comprises a phase-change heat dissipation layer arranged in a tube shell and a heat source micro-pipeline embedded in the phase-change heat dissipation layer; comprising an outer-layer heat dissipation component inserted into a phase change heat dissipation layer, a heat removal component arranged on a tube shell, an air inlet component arranged on the heat removal component and a driving component arranged on the tube shell, through the arrangement of the outer-layer heat dissipation component, a heat dissipation plate conducts heat dissipation on the phase change heat dissipation layer, the heat dissipation area is increased, and through the arrangement of a heat dissipation cover, the heat dissipation effect is improved. Passive heat dissipation and active heat dissipation are combined, and the efficiency of passive heat dissipation is improved.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation of microelectronic components, and in particular to a phase change heat dissipation device of a microtube heating component adopting a spiral coil structure. Background Art

[0002] With the development of 5G technology, microelectronic components have been widely used in intelligent robots, industrial automation, data servers and other fields. However, the high heat flux density characteristics of microelectronic components cause them to generate a lot of heat in design and application, increasing the risk of thermal runaway of electronic equipment. In recent years, the use of air cooling, liquid cooling and phase change material cooling in the phase change heat dissipation layer has become an effective measure for thermal control of microelectronic components. Although air cooling has the advantages of simple structure and low cost, its heat transfer efficiency is relatively low due to the low specific heat capacity of air. Although liquid cooling provides a more flexible spatial layout, there is a risk of liquid leakage, which may cause environmental pollution. Phase change material cooling in the phase change heat dissipation layer has the characteristics of low cost, high latent heat and small size, and has gradually become a major research focus of major universities.

[0003] However, the phase change materials in the phase change heat dissipation layer generally have the problem of low thermal conductivity, which leads to low thermal conductivity efficiency. Therefore, in view of the low thermal conductivity of the phase change materials in the phase change heat dissipation layer, it is particularly important to explore suitable means of enhancing heat exchange to improve the heat dissipation efficiency of the system. At present, the common methods of enhancing heat exchange mainly start from two aspects: one is to improve the performance of the phase change materials in the phase change heat dissipation layer, and the other is to optimize the device structure. At present, in terms of improving the performance of the phase change materials in the phase change heat dissipation layer, there are methods of adding metals, graphite, carbon fibers and nanomaterials to the phase change materials in the phase change heat dissipation layer. However, these methods of adding materials generally have the disadvantages of high manufacturing cost, complex processing technology and high environmental burden. In terms of optimizing the device structure, the common heat source structure currently often uses ordinary straight microtubes. This method makes the heat source relatively concentrated, which is not conducive to the uniform distribution of heat. At the same time, the efficiency of ordinary straight microtubes in fluid flow and heat conduction is low, which limits the overall heat exchange performance of the phase change materials in the phase change heat dissipation layer. Summary of the invention

[0004] The object of the present invention is to provide a phase change heat dissipation device with a spiral coil structure for a micro-tube heating element, so as to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A phase change heat dissipation device with a micro-tube heating element adopting a spiral coil structure, comprising:

[0007] A base pipe, the base pipe includes a heat insulation layer and a pipe shell from outside to inside;

[0008] An inner heat dissipation component, the inner heat dissipation component comprises a phase change heat dissipation layer arranged in the tube shell, a heat source micro-pipeline buried in the phase change heat dissipation layer, and end covers arranged at both ends of the tube shell, and the heat source pipeline is spiral; and

[0009] The outer heat dissipation component includes an outer heat dissipation component inserted into the phase change heat dissipation layer, a heat dissipation component arranged on the tube shell, an air intake component arranged on the heat dissipation component, and a driving component arranged on the tube shell. After the phase change heat dissipation layer absorbs the heat generated by the heat source micro-pipes, the outer heat dissipation component absorbs the heat in the phase change heat dissipation layer, and the driving component drives the air intake component to rotate to blow air into the air intake component, thereby blowing on the heat dissipation component, and the heat dissipation component driven by the air intake component discharges the air after absorbing heat.

[0010] Preferably, the outer heat dissipation component includes a heat pipe inserted through the base tube into the phase change heat dissipation layer, a heat dissipation plate arranged on the heat pipe, and a heat dissipation groove opened on the heat dissipation plate, and the heat dissipation plate is provided with a guide slope.

[0011] Preferably, the heat dissipation component includes a partition plate arranged on the tube shell, a mounting groove and a heat dissipation hole opened on the partition plate, a bearing arranged in the mounting groove, and a heat dissipation blade arranged on the bearing.

[0012] Preferably, the air inlet component includes an air inlet hood mounted on the partition, a heat dissipation slot arranged in the air inlet hood, a slider arranged on the partition, an air inlet block arranged on the air inlet hood, an air inlet duct opened in the air inlet block, and a connecting rod arranged on the air inlet hood and connected to the heat exhaust blades.

[0013] Preferably, the driving component includes a heat pipe cover arranged on the end cover, a mounting plate arranged on the heat pipe cover, a motor arranged on the mounting plate, and a U-shaped rod arranged on the air inlet cover and connected to the motor.

[0014] Preferably, the motor is used to drive the air inlet hood to rotate, so that the air enters the heat dissipation groove through the air inlet duct, thereby blowing onto the heat dissipation plate and flowing along the guide slope to the heat exhaust hole. The heat exhaust blades rotate under the drive of the air inlet hood, and the air on the guide slope is extracted through the heat exhaust hole.

[0015] Preferably, the heat insulation layer is made of 10 mm heat insulation cotton, the tube shell is made of cylindrical transparent quartz glass with a diameter of 40 mm, a wall thickness of 2 mm, and a length of 100 mm; the material of the phase change heat dissipation layer is paraffin, and the heat source micro-pipe is made of copper material.

[0016] Preferably, the heat source micro-pipe is set to an equal diameter and equal pitch type, with a diameter of 32 mm, a pitch of 25 mm, a height of the spiral line of 90 mm, and a total length of 399 mm.

[0017] Preferably, the heat source micro-pipe is set to a constant diameter variable pitch type, with a diameter of 32 mm, a pitch size that changes linearly, a maximum pitch of 32 mm, a minimum pitch of 20 mm, and a spiral line height of 89 mm.

[0018] Preferably, the heat source micro-pipe is set to a variable diameter and equal pitch type, and its diameter size changes linearly, with a maximum diameter of 32mm, a minimum diameter of 8mm, a pitch of 16mm, and a height of the spiral line of 89.6mm, presenting a spiral shape with large diameters at both ends and a small diameter in the middle.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. Miniaturization, low manufacturing cost and compliance with green environmental protection concepts: The present invention belongs to the field of heat dissipation technology for microelectronic components, and has high requirements for the space utilization rate of the device. Copper tubes are used as microtube materials. Copper tubes have high ductility and plasticity, which makes them more flexible in processing and application. This characteristic enables copper tubes to be designed into a variety of shapes, such as the spiral shape in the present invention. Its high ductility can also achieve smaller size control and complex modeling. This miniaturized design is particularly important in the application of microelectronic components such as integrated circuits and sensors. It can effectively improve the utilization rate of space and reduce the overall weight of the equipment. In addition, the spiral micro-pipe design can also help reduce the overall volume of the equipment. Compared with straight tubes, the spiral structure can achieve higher heat exchange efficiency in a limited space. In terms of economy, the copper tube has rich materials, simple processing methods and short production cycle, which makes its manufacturing cost relatively low, reducing the manufacturing cost of the present invention. At the same time, it is also an environmentally friendly material with good recyclability, which meets the requirements of sustainable development;

[0021] 2. High heat exchange efficiency: Compared with the traditional micro-tube heating element with a straight tube structure of the phase change heat dissipation device, the micro-tube with a spiral structure design can more effectively transfer heat to every corner of the phase change material in the tube shell in a limited space, forming a dual heat dissipation mechanism combining thermal convection and thermal conduction of the phase change material, which greatly shortens the melting time of the phase change material. At the same time, it enriches the flow path of the phase change material melted into liquid in a limited space, shortens the distance of heat transfer, expands the natural convection heat exchange area, and improves the heat dissipation efficiency of the phase change material;

[0022] 3. The temperature uniformity of the heat exchange area of ​​the phase change material is good: The present invention optimizes the arrangement of the heat source microtubes, and optimizes ordinary straight microtubes and spiral tubes with equal spiral diameters and equal pitches into spiral tubes with variable spiral diameters and equal pitches. The spiral tubes with variable spiral diameters can effectively improve the flow characteristics of the phase change material. Compared with the traditional structure, the structural optimization of the variable spiral diameter allows the liquid phase change material to present different convection environments in different diameter sections. This design can effectively improve the mode of natural convection formed from a single branch heat source. By changing the spiral diameter of the spiral tube in the melting blind area that is easily formed due to the temperature gradient during the heat exchange process, the natural convection in the area is enhanced, so that it can transfer heat quickly and evenly, reducing the temperature difference in the heat exchange area of ​​the phase change material. This optimization can ensure the uniformity of the temperature distribution of the phase change material during heat exchange, and improve the stability and safety of the overall heat dissipation effect;

[0023] 4. By setting the outer heat dissipation component, the heat dissipation plate dissipates heat from the phase change heat dissipation layer to increase the heat dissipation area, and by setting the heat dissipation cover, passive heat dissipation and active heat dissipation are combined to improve the efficiency of passive heat dissipation.

[0024] In summary, the phase change heat dissipation device based on micro-channel enhanced heat dissipation proposed in the present invention has significant advantages in terms of miniaturization, low manufacturing cost, compliance with the concept of green environmental protection, high heat exchange efficiency, and good temperature uniformity in the heat exchange area of ​​the phase change material. These advantages can provide greater flexibility and feasibility in the field of electronic component heat dissipation technology, promote its wide application in this field, and have important scientific and engineering value. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of Embodiment 1 of the present invention;

[0026] Figure 2 It is a cross-sectional structural schematic diagram of the first embodiment of the present invention;

[0027] Figure 3 It is a cross-sectional structural schematic diagram of the heat exhaust component of the present invention;

[0028] Figure 4 It is a structural schematic diagram of an inner heat dissipation component of the second embodiment of the present invention;

[0029] Figure 5 It is a schematic structural diagram of an inner heat dissipation component of Embodiment 3 of the present invention;

[0030] Figure 6 This is a graph comparing the liquid phase ratio of the phase change material when heat is dissipated by Example 1, Example 2 and Example 3 of the present invention and the traditional four-straight tube microstructure.

[0031] In the figure: 1. Heat insulation layer; 2. Pipe shell; 3. Phase change heat dissipation layer; 4. Heat source micro-pipe; 5. Heat conduction pipe; 6. Heat dissipation plate; 7. Heat dissipation through groove; 8. Partition board; 9. Installation groove; 10. Heat exhaust hole; 11. Bearing; 12. Heat exhaust blade; 13. Air inlet hood; 14. Heat dissipation groove; 15. Slide block; 16. Air inlet block; 17. Air inlet duct; 18. Connecting rod; 19. Heat pipe cover; 20. Installation plate; 21. Motor; 22. C-shaped rod; 23. End cover. Specific implementation manner

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Please refer to Figures 1 to 6 , the present invention provides a technical solution:

[0034] Embodiment 1:

[0035] A phase change heat dissipation device for a microtube heating component with a spiral coil structure, comprising:

[0036] A base pipe, the base pipe includes a heat insulation layer 1 and a pipe shell 2 from outside to inside. The heat insulation layer 1 is sleeved on the pipe shell 2 so that the heat insulation layer 1 wraps the outer wall of the pipe shell 2. The heat insulation layer 1 is 10 mm thick heat insulation cotton, and the pipe shell 2 is a cylindrical transparent quartz glass, which has good high temperature resistance and low thermal conductivity, with a diameter of 40 mm, a wall thickness of 2 mm, and a length of 100 mm. The heat insulation layer 1 is used for installation during the experiment of detecting the heat dissipation effect to exclude the influence of natural heat dissipation of the outside air on the experiment. The heat insulation layer 1 can be removed during actual use.

[0037] An inner layer heat dissipation component, the inner layer heat dissipation component includes a phase change heat dissipation layer 3, a heat source micro-pipe 4 and an end cover 23. The end cover 23 is arranged at both ends of the pipe shell 2, and the surface of the end cover 23 can also be provided with a heat insulation layer 1. The end cover 23 is fixedly connected to the openings at both ends of the pipe shell 2 by means of gluing, etc. The heat source micro-pipe 4 passes through the end cover 23 and is inserted into the pipe shell 2. The heat source micro-pipe 4 is fixedly connected to the pipe shell 2 by means of gluing, etc. The phase change heat dissipation layer 3 is arranged in the pipe shell 2. The phase change heat dissipation layer 3 fills the pipe shell 2 and completely wraps the heat source micro-pipe 4 located in the pipe shell 2. The heat source pipe is spiral. The heat source micro-pipe 4 is a copper pipe with good electrical conductivity, with a diameter of only 0.4 mm and a wall thickness of 0.2 mm. A controllable DC regulated power supply device is used to heat it. The phase change material in the phase change heat dissipation layer 3 of the phase change heat dissipation layer 3 selects the paraffin wax of Shanghai Laibxing Technology Co., Ltd.

[0038] The heat source micro-pipe 4 is a spiral structure, the center line of the spiral coincides with the axis of the shell, and it is arranged horizontally. The micro-pipe is inserted into and passes through the tube shell 2. The micro-pipe outside the tube shell 2 is connected to a controllable DC voltage-stabilized power supply device for heating to simulate the heating of microelectronic components. The heat source micro-pipe 4 is set to an equal diameter and equal pitch type, with a spiral diameter of 32mm, a pitch of 25mm, a spiral line height of 90mm, and a total length of 399mm.

[0039] By optimizing the arrangement of the heat source micro-tubes, the traditional straight micro-tubes are optimized into a spiral structure. The spiral structure design can be adjusted according to specific application requirements, and the distribution of the phase change material in the phase change heat dissipation layer 3 can be flexibly improved to meet the equipment with different heat dissipation requirements. The spiral structure can effectively enhance the flow characteristics of the phase change material in the phase change heat dissipation layer 3, improve the melting "blind area" formed by the temperature gradient in the phase change heat dissipation layer 3 during the melting process, enhance the natural convection in the melting area, so that the heat can be quickly and evenly transferred in the phase change material in the phase change heat dissipation layer 3, and reduce the temperature difference in the heat exchange area of ​​the phase change material in the phase change heat dissipation layer 3. This optimization can ensure the uniformity of the temperature distribution of the phase change material in the phase change heat dissipation layer 3 during heat exchange and improve the heat dissipation efficiency of the device.

[0040] Since the phase change heat dissipation device with a straight tube structure of the traditional micro-tube heating element has the disadvantage of concentrated heat source, the larger single tube is miniaturized and designed as a micro-tube with a diameter of 0.4mm while ensuring that the heat exchange area of ​​the micro-tube remains unchanged. The heat source arrangement of the micro-tube is optimized to present a spiral structure, with a total of 1 micro-tube 1 distributed in the center of the tube shell 2 to ensure that the total length is about 400mm. On this basis, the heat source micro-tube 44 is an equal pitch spiral structure, and the spiral diameters Ri of the three groups of heat exchange devices are 8, 16, and 32mm respectively. It is found that the larger the spiral diameter Ri is, the less the total melting time of the phase change material 3 paraffin in the phase change heat dissipation layer 3 is. Therefore, the optimal spiral diameter size Ri of 32mm can be found in these three distribution methods, and its total melting time is the shortest.

[0041] (1) When the heat source micro-pipe 4 is a straight tube, a constant pitch micro-coil with a small spiral diameter (D1=8mm) and a medium spiral diameter (D2=16mm), the heat source is too concentrated, so that the melting layers of the phase change material in the phase change heat dissipation layer 3 are interconnected, forming a relatively concentrated melting area. In the late stage of melting, a residual melting "blind area" will be formed at the bottom of the tube shell 2, resulting in uneven temperature distribution in the melting area of ​​the phase change material in the phase change heat dissipation layer 3, which prolongs the heat dissipation efficiency per unit time.

[0042] (2) When the heat source micro-channel 4 is a constant pitch micro coiled pipe with a relatively large coil diameter (D3 = 32 mm), due to its relatively large coil diameter, a relatively dispersed heat source is formed and the heat source is close to the bottom of the tube shell 2, which can effectively expand the natural convection area of the phase change material in the liquid phase change heat dissipation layer 3 and improve the "blind zone" of the phase change material melting in the phase change heat dissipation layer 3, realizing the absorption of energy from the heat source in a relatively short time and improving the heat dissipation performance of the device.

[0043] In summary, the over-concentration of the heat source micro-channel 4 is not conducive to the melting of the paraffin wax, which is the phase change material in the phase change heat dissipation layer 3. Therefore, it is necessary to reasonably optimize the arrangement mode of the heat source micro-channel 4. In this embodiment, the best arrangement mode of the heat source micro-channel 4 is a spiral structure with a coil diameter of 32 mm, which can effectively shorten the melting time of the paraffin wax, which is the phase change material in the phase change heat dissipation layer 3.

[0044] Although the heat dissipation time of this structure is the shortest, for the phase change heat dissipation device with a spiral coiled pipe structure for the three groups of micro-tube heating components, only the influence of different coil diameters on the heat dissipation efficiency is discussed on the premise that the total bus length remains unchanged, without fully considering the influence of the pitch on its heat dissipation efficiency. It is necessary to discuss the influence of the variable pitch structure on the heat dissipation system under the condition of the best equal coil diameter.

[0045] The outer heat dissipation component includes an outer heat dissipation member inserted into the phase change heat dissipation layer 3, a heat exhaust member arranged on the tube shell 2, an air inlet member arranged on the heat exhaust member, and a driving member arranged on the tube shell 2. The outer heat dissipation member includes a heat conduction tube 5, a heat dissipation plate 6, and a heat dissipation through groove 7. The heat exhaust member includes a partition plate 8, a mounting groove 9, a heat exhaust hole 10, a bearing 11, and a heat exhaust blade 12. The air inlet member includes an air inlet cover 13, a heat dissipation groove 14, a slider 15, an air inlet block 16, an air inlet channel 17, and a connecting rod 18. The driving member includes a heat pipe cover 19, a mounting plate 20, a motor 21, and a C-shaped rod 22. The heat conduction tube 5 passes through the heat insulation layer 1 and the tube shell 2 and is inserted into the phase change heat dissipation layer 3. The heat conduction tube 5 is fixedly connected to the tube shell 2 by means of gluing or the like. The heat dissipation plate 6 is arranged on the heat conduction tube 5 and sleeved on the heat insulation layer 1. The heat dissipation plate 6 is fixedly connected to the heat conduction tube 5 by means of welding or the like. The heat dissipation plate 6 is in the shape of a hollow cylinder. A diversion inclined surface is provided on the outer surface of the heat dissipation plate 6, so that the middle part of the heat dissipation plate 6 protrudes, and the protruding part in the middle of the heat dissipation plate 6 is higher than the two ends of the heat dissipation plate 6. The heat dissipation through groove 7 is opened on the surface of the heat dissipation plate 6. The partition plate 8 is arranged on the tube shell 2. The partition plate 8 is fixedly connected to the tube shell 2 by means of gluing or the like. The partition plate 8 is in a circular ring shape. The mounting groove 9 is opened on the partition plate 8. The mounting groove 9 is opened along the radial direction of the partition plate 8, so that the mounting groove 9 is also in a circular ring shape. The heat exhaust hole 10 axially penetrates through the partition plate 8. The bearing 11 is arranged in the mounting groove 9. The inner ring of the bearing 11 is fixedly clamped in the mounting groove 9 by means of interference fit or the like. The heat exhaust blade 12 is arranged on the bearing 11. The heat exhaust blade 12 can be set by sleeving a ring on the bearing 11 and then welding the heat exhaust blade 12 on the ring.

[0046] The air inlet hood 13 is sleeved on the partition plate 8, with both ends of the air inlet hood 13 sleeved on the partition plate 8, enabling the air inlet hood 13 to rotate on the partition plate 8. The slider 15 is arranged on the partition plate 8 and is fixedly connected to the partition plate 8 by welding or other means. The slider 15 is circular ring-shaped and is used to guide the rotation of the air inlet hood 13. The heat dissipation slots 14 are arranged in the air inlet hood 13 and together with the empty slot surrounded by the air inlet hood 13 and the partition plate 8 form a heat dissipation cavity. The air inlet block 16 is arranged on the air inlet hood 13 and is fixedly connected to the air inlet hood by welding or other means. The air inlet block 16 protrudes from the outer surface of the air inlet hood. The air inlet channel 17 is opened in the air inlet block, and the air inlet channel 17 is opened on the side wall of the air inlet block 16, connecting the heat dissipation cavity with the outside. The connecting rod 18 is arranged on the air inlet hood 13 and is connected to the heat dissipation blades 12. The connecting rod 18 is connected to the air inlet hood by welding or other means, and the other end of the connecting rod 18 is fixedly connected to the heat dissipation blades by welding or other means. The heat pipe cover 19 is arranged on the end cover 23 and is fixedly connected to the end cover 23 by welding or other means, covering the part of the heat source micro-pipe 4 outside the tube shell 2. The mounting plate 20 is arranged on the heat pipe cover 19 and is fixedly connected to the heat pipe cover 19 by welding or other means. The motor 21 is arranged on the mounting plate 20 and is fixedly connected to the mounting plate 20 by setting bolts or other means. The C-shaped rod 22 is arranged on the air inlet hood 13 and is connected to the motor 21. The C-shaped rod 22 is fixedly connected to the air inlet hood 13 by welding or other means, and the C-shaped rod 22 is fixedly connected to the motor 21 by interference fit and setting keys or other means. After the phase change heat dissipation layer 3 absorbs the heat generated by the heat source micro-pipe 4, the heat conduction pipe 5 absorbs the heat in the phase change heat dissipation layer 3 and transfers the heat to the heat dissipation plate 6. The motor 21 is used to drive the air inlet hood 13 to rotate, enabling air to enter the heat dissipation through slots 7 through the air inlet channel 17, so as to blow on the heat dissipation plate 6 and flow along the guiding inclined surface to the heat discharge holes 10. The heat discharge blades 12 rotate driven by the air inlet hood, and the air on the guiding inclined surface is extracted through the heat discharge holes 10.

[0047] Embodiment 2: The only structural difference from Embodiment 1 is that the heat source micro-pipe 4 is set as an equal-diameter variable-pitch type, with a pipe diameter of 32 mm, the pitch size changing linearly, the maximum pitch being 32 mm, the minimum pitch being 20 mm, and the height of the spiral being 89 mm. In the phase change heat dissipation device, compared with the phase change heat dissipation device with a straight pipe structure for traditional micro-tube heating components, the pitch structure of the spiral coil is optimized. The gradual expansion of its spiral makes its appearance show a shape that increases layer by layer, forming a layout from compact to loose. It enhances the natural convection of the phase change material in the liquid phase change heat dissipation layer 3 in different regions of the device, accelerates the melting efficiency of the phase change material in the phase change heat dissipation layer 3, and thus improves the heat dissipation efficiency of the device.

[0048] Embodiment 3: The only difference from Embodiment 1 is that the source micro-pipe is configured as a variable diameter equal pitch type, and its diameter size changes linearly, with a maximum diameter of 32 mm, a minimum diameter of 8 mm, a pitch of 16 mm, and a height of the spiral line of 89.6 mm, presenting a spiral shape with large diameters at both ends and a small diameter in the middle. This improves the melting blind area existing in the late stage of melting of the phase change material in the phase change heat dissipation layer 3 in a targeted manner, shortens the melting time of the phase change material in the phase change heat dissipation layer 3, and improves the heat dissipation performance of the heat dissipation device.

[0049] The enhanced heat transfer process is as follows:

[0050] (1) Since heat conduction is the main process before melting, as time goes by, heat conduction weakens and natural convection increases in the middle and late stages of melting. Since the heat source presents a spiral structure with large spiral diameters at both ends and a small spiral diameter in the middle, it enhances the natural convection effect of the phase change material in the liquid phase change heat dissipation layer 3 in different areas.

[0051] (2) Since the arrangement of the heat source of the micro-channel 1 is a spiral structure with large spiral diameters at both ends and small spiral diameters in the middle, the spiral diameter of the heat source is increased in the areas where melting "blind areas" are easily formed at both ends, improving the melting blind areas formed due to the existence of temperature gradients during the heat exchange process, and enhancing the natural convection in this area, so that it can quickly and evenly transfer heat, reducing the temperature difference in the heat exchange area of ​​the phase change material in the phase change heat dissipation layer 3. This optimization can ensure the uniformity of the temperature distribution of the phase change material in the phase change heat dissipation layer 3 during heat exchange and improve the heat exchange efficiency.

[0052] like Figure 6 As shown, the liquid phase rate changes of the phase change heat dissipation layer 3 of the inner heat dissipation component in Example 1, Example 2 and Example 3 at different times and the total melting time required when the liquid phase rate reaches 1 are shortened by 22.05%, 21.5% and 23.24% respectively compared with the total melting time of the traditional four-straight microtubes.

[0053] Working principle: When in use, after the heat source micro-pipe 4 is energized, the phase change heat dissipation layer 3 absorbs the heat generated by the heat source micro-pipe 4, the phase change heat dissipation layer 3 gradually melts and absorbs heat, the heat pipe 5 absorbs the heat in the phase change heat dissipation layer 3 and transfers the heat to the heat dissipation plate 6, the motor 21 is used to drive the air inlet cover 13 to rotate, so that the air enters the heat dissipation groove 7 through the air inlet duct 17. The existence of the heat dissipation groove 7 increases the heat dissipation area, so that the air is blown on the heat dissipation plate 6 and flows along the guide slope to the heat exhaust hole 10. The heat exhaust blades 12 rotate under the drive of the air inlet cover to extract the air on the guide slope through the heat exhaust hole 10.

[0054] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A phase change heat dissipation device with a spiral coil structure for micro-tube heating components, characterized in that: include: A base pipe, the base pipe comprising a heat insulation layer and a pipe shell from outside to inside; An inner heat dissipation component, the inner heat dissipation component comprising a phase change heat dissipation layer arranged in the tube shell, a heat source micro-pipeline buried in the phase change heat dissipation layer, and end covers arranged at both ends of the tube shell, the heat source pipe being spiral; and An outer heat dissipation component, the outer heat dissipation component includes an outer heat dissipation component inserted into the phase change heat dissipation layer, a heat dissipation component arranged on the tube shell, an air intake component arranged on the heat dissipation component, and a driving component arranged on the tube shell. After the phase change heat dissipation layer absorbs the heat generated by the heat source micro-pipe, the outer heat dissipation component absorbs the heat in the phase change heat dissipation layer, and the driving component drives the air intake component to rotate to blow air into the air intake component, thereby blowing on the heat dissipation component, and the heat dissipation component driven by the air intake component discharges the air after absorbing heat.

2. According to claim 1, a phase change heat dissipation device with a spiral coil structure for a micro-tube heating element, characterized in that: The outer heat dissipation component includes a heat conducting pipe passing through the base tube and inserted into the phase change heat dissipation layer, a heat dissipation plate arranged on the heat conducting pipe, and a heat dissipation groove opened on the heat dissipation plate, wherein the heat dissipation plate is provided with a flow guiding inclined surface.

3. According to claim 2, a phase change heat dissipation device with a spiral coil structure for a micro-tube heating element, characterized in that: The heat dissipation component includes a partition plate arranged on the tube shell, a mounting groove and a heat dissipation hole opened on the partition plate, a bearing arranged in the mounting groove, and a heat dissipation blade arranged on the bearing.

4. The phase change heat dissipation device of the micro-tube heating element adopting the spiral coil structure according to claim 3, characterized in that: The air intake component includes an air intake cover mounted on the partition, a heat dissipation slot arranged in the air intake cover, a slider arranged on the partition, an air intake block arranged on the air intake cover, an air intake duct opened in the air intake block, and a connecting rod arranged on the air intake cover and connected to the heat exhaust blade.

5. The phase change heat dissipation device of the micro-tube heating element adopting the spiral coil structure according to claim 4, characterized in that: The driving component includes a heat pipe cover arranged on the end cover, a mounting plate arranged on the heat pipe cover, a motor arranged on the mounting plate, and a U-shaped rod arranged on the air inlet cover and connected to the motor.

6. The phase change heat dissipation device of the micro-tube heating element adopting the spiral coil structure according to claim 5, characterized in that: The motor is used to drive the air inlet cover to rotate, so that air enters the heat dissipation groove through the air inlet duct, thereby blowing on the heat dissipation plate and flowing along the guide slope to the heat exhaust hole. The heat exhaust blades rotate under the drive of the air inlet cover to extract the air on the guide slope through the heat exhaust hole.

7. The phase change heat dissipation device of the micro-tube heat generating component adopting the spiral coil structure according to claim 6, characterized in that: The heat insulation layer is made of 10mm heat insulation cotton, the tube shell is made of cylindrical transparent quartz glass with a diameter of 40mm, a wall thickness of 2mm and a length of 100mm; the material of the phase change heat dissipation layer is paraffin, and the heat source micro-pipe is made of copper material.

8. The phase change heat dissipation device of the micro-tube heating element adopting the spiral coil structure according to claim 7, characterized in that: The heat source micro-pipe is configured to be of equal diameter and equal pitch, with a diameter of 32 mm, a pitch of 25 mm, a height of the spiral line of 90 mm, and a total length of 399 mm.

9. The phase change heat dissipation device of the micro-tube heating element adopting the spiral coil structure according to claim 7, characterized in that: The heat source micro-pipe is set to a constant diameter variable pitch type, with a diameter of 32 mm and a pitch size that changes linearly, with a maximum pitch of 32 mm, a minimum pitch of 20 mm, and a spiral line height of 89 mm.

10. The phase change heat dissipation device of the micro-tube heat generating component adopting the spiral coil structure according to claim 7, characterized in that: The heat source micro-pipe is set to a variable diameter and equal pitch type, and its diameter size changes linearly, with a maximum diameter of 32mm, a minimum diameter of 8mm, a pitch of 16mm, and a height of the spiral line of 89.6mm, presenting a spiral shape with large diameters at both ends and a small diameter in the middle.

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