Simulation method for reflow soldering thermal deformation of microwave assembly

Abstract

The invention provides a method for simulating reflow soldering thermal deformation of a microwave component, which comprises the following steps of: customizing a contact gap tolerance smaller than a three-dimensional model gap of the microwave component according to a product form of the microwave component, deleting a contact pair automatically generated by software, and regenerating a reflow soldering contact pair according to the custom contact gap tolerance; dividing grids, setting transient simulation boundary conditions, and then starting transient thermal simulation calculation to obtain microwave component temperature field distribution; boundary conditions of transient force simulation are set, a contact pair is set to be dead in the heating melting stage and the welding heat preservation stage, and the contact pair is set to be green in the cooling solidification stage; and starting transient force simulation calculation and solving to obtain reflow soldering thermal deformation distribution of the microwave assembly. According to the microwave assembly reflow soldering thermal deformation simulation method based on contact pair'life and death 'setting, on the basis of ensuring simulation accuracy, reflow soldering thermal deformation of the microwave assembly can be quickly and efficiently predicted through simulation, and therefore the reliability design capacity of the microwave assembly is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of measurement and testing, and in particular to a simulation method for thermal deformation of microwave components during reflow soldering. Background Art

[0002] As microwave components continue to develop in the direction of miniaturization and high integration, the difficulty of assembling microwave components is increasing. The assembly of microwave components generally includes reflow soldering of microwave composite boards, RF soft substrates, RF connectors and DC connectors. For complex products such as double-sided microwave components, reflow soldering has good reliability and heat dissipation performance. However, due to the thermal mismatch between the box and the printed circuit board, thermal deformation is prone to occur after reflow soldering, affecting the subsequent assembly quality and reliability of the product. How to accurately evaluate thermal deformation is an urgent problem that needs to be solved in the industry. Summary of the invention

[0003] The present invention aims to solve the problem of how to accurately evaluate thermal deformation after reflow soldering, and provides a simulation method for thermal deformation of microwave component reflow soldering. The method is based on the simulation method for thermal deformation of microwave component reflow soldering with contact "life and death" settings. On the basis of ensuring the simulation accuracy, the method can quickly and efficiently predict the thermal deformation of microwave component reflow soldering through simulation, thereby greatly improving the reliability design capability of microwave components.

[0004] The present invention provides a method for simulating thermal deformation of a microwave component during reflow soldering, comprising the following steps:

[0005] S1. Importing the three-dimensional model of the microwave component into the model processing software for simplification;

[0006] S2. assigning material properties to the parts to be analyzed of the microwave assembly;

[0007] S3. Customize the contact gap tolerance K according to the product form of the microwave component, and the contact gap tolerance K is smaller than the gap of the three-dimensional model of the microwave component; delete the contact pairs automatically generated by the software, and regenerate the reflow soldering contact pairs according to the customized contact gap tolerance K;

[0008] S4, dividing the grid and encrypting the grids at key locations;

[0009] S5. Setting the analysis and solution control of transient thermal simulation and transient case simulation, and setting the transient simulation boundary conditions of reflow soldering;

[0010] S6, starting transient thermal simulation calculation to obtain the temperature field distribution of the microwave component;

[0011] S7, setting the boundary conditions of transient force simulation, the boundary conditions of transient force simulation include the temperature field distribution of microwave components and the life and death setting of reflow soldering contact pairs, the reflow soldering contact pairs are set to "dead" in the heating melting stage and the welding insulation stage, and are set to "alive" in the cooling solidification stage;

[0012] S8, starting transient force simulation calculation to obtain the distribution of thermal deformation of microwave component reflow soldering;

[0013] S9, verifying the mesh independence of the temperature field distribution of the microwave component and the thermal deformation distribution of the microwave component during reflow soldering. When the verification result is convergent, proceed to step S10; when the verification result is not convergent, optimize the three-dimensional mesh of the microwave component and return to step S1;

[0014] S10, judging whether the temperature field distribution and reflow soldering thermal deformation of the microwave component meet the design and reliability requirements; if not, modifying the microwave component design and returning to step S1; if yes, a simulation method for reflow soldering thermal deformation of a microwave component is completed.

[0015] The method for simulating thermal deformation of a microwave component during reflow soldering of the present invention is preferably as follows: in step S1, the microwave component includes a printed circuit board, a reflow solder and a housing arranged in sequence from top to bottom;

[0016] In step S2, the parts to be analyzed include a printed circuit board, reflow solder and a housing;

[0017] Material properties include density, thermal conductivity, specific heat, elastic model, Poisson's ratio, and thermal expansion coefficient;

[0018] The visco-plastic properties of reflow solder are characterized by the Anand visco-plastic model.

[0019] In the method for simulating thermal deformation of microwave component reflow soldering described in the present invention, as a preferred embodiment, the material of the shell is any one of the following: aluminum alloy, copper alloy, silicon aluminum alloy, Kovar alloy, molybdenum copper alloy and aluminum-based silicon carbide;

[0020] The material of the printed circuit board is any of the following: FR4 laminate, LTCC ceramic substrate, HTCC ceramic substrate, 4350 printed circuit board and 5880 printed circuit board;

[0021] Reflow soldering solder is Sn63Pb37 or SAC305;

[0022] The parameters of the Anand viscoplastic model include initial deformation impedance, activation energy, pre-exponential factor, stress multiplier, strain rate sensitivity coefficient, strain hardening constant, deformation impedance coefficient, strain rate sensitivity exponent and strain hardening sensitivity coefficient.

[0023] The method for simulating thermal deformation of reflow soldering of a microwave component described in the present invention is, as a preferred embodiment, in step S1, the software for establishing a three-dimensional model of the microwave component is CAD software, the model processing software is DesignModeler or SpaceClaim, and the simplified processing is to remove tiny features of the three-dimensional model of the microwave component, and the tiny features include threaded holes and lettering.

[0024] The method for simulating thermal deformation of microwave component reflow soldering described in the present invention is, as a preferred embodiment, in step S3, the reflow soldering contact pair includes a contact pair between a printed circuit board and a reflow solder, and a contact pair between the reflow solder and a housing;

[0025] In step S7, during the heating and melting stage and the welding insulation stage of reflow soldering, the reflow soldering solder has no constraint on the printed circuit board and the shell, so it is set to "dead"; during the cooling and solidification stage, the reflow soldering solder solidifies and constrains the printed circuit board and the shell, so it is set to "live".

[0026] The method for simulating thermal deformation of microwave components during reflow soldering described in the present invention is, as a preferred embodiment, in step S3, K is 0.03, and the gap of the three-dimensional model of the microwave component is 0.05.

[0027] The method for simulating thermal deformation of microwave components during reflow soldering described in the present invention is, as a preferred embodiment, in step S4, the key part is the soldering contact part.

[0028] The method for simulating thermal deformation of microwave components during reflow soldering described in the present invention is, as a preferred embodiment, in step S5, the weak spring is turned on and the large deformation is turned off in the solution control of the transient case simulation.

[0029] The method for simulating thermal deformation of reflow soldering of a microwave component described in the present invention is, as a preferred embodiment, in step S7, Source Time is set to "All" in the temperature field distribution of the microwave component, and Contace Step Control is inserted to perform the "life and death" setting of the reflow soldering contact pair.

[0030] The simulation method for thermal deformation of microwave component reflow soldering described in the present invention is, as a preferred embodiment, in step S9, when the change in the calculation result before and after the mesh refinement is less than 5%, the calculation is considered to be converged;

[0031] In step S10, when the maximum residual stress of the microwave component is less than the material strength and the maximum thermal deformation meets the design and reliability requirements, a simulation method for reflow soldering thermal deformation of a microwave component is completed.

[0032] This method can accurately predict the thermal deformation of microwave components during reflow soldering, with high simulation accuracy and small calculation amount, and can greatly improve the first-time design qualification rate and product reliability of the product.

[0033] The technical solution of the present invention is: a simulation method for thermal deformation of microwave component reflow soldering, comprising the following steps:

[0034] Step 1: According to the initial design plan of the product, a 3D model of the product is established and imported into the simulation software for simplification;

[0035] Step 2: Assign corresponding material properties to each part;

[0036] Step 3: Define the contact relationship between each part;

[0037] Step 4: Divide the grid and use functions such as Sizing to encrypt the grid in key areas.

[0038] Step 5: Complete the analysis settings for transient thermal simulation and transient force simulation;

[0039] Step 6: Set transient thermal simulation boundary conditions;

[0040] Step 7: Start transient thermal simulation calculation to obtain the temperature field distribution of the product;

[0041] Step 8: Set the boundary conditions for transient force simulation;

[0042] Step 9: Start transient force simulation calculation and solution, and after the solution is completed, start grid independence verification;

[0043] Step 10: Determine whether the design solution is feasible based on the simulation results. If not, modify the design solution and repeat steps 1-9.

[0044] In step 1, the three-dimensional model of the product is established and imported into the simulation software for simplification, which includes the following steps:

[0045] Step 1a: Create a 3D model of the product in CAD software such as Cero or NX based on the initial design of the product;

[0046] Step 1b, import the 3D model into model processing software such as DesignModeler or SpaceClaim;

[0047] Step 1c: Simplify the 3D model and remove small features that have little impact on the simulation results, such as threaded holes and lettering.

[0048] In step 2, corresponding material properties are assigned to each part, including shell material, printed circuit board material and solder. The shell material generally includes aluminum alloy, copper alloy, silicon aluminum alloy, Kovar alloy, molybdenum copper alloy and aluminum-based silicon carbide, etc. The printed circuit board material generally includes FR4 laminate, LTCC or HTCC ceramic substrate, 4350 and 5880 printed circuit board, etc. The solder includes Sn63Pb37 and SAC305, etc.

[0049] Material properties include density, thermal conductivity, specific heat, elasticity model, Poisson's ratio, thermal expansion coefficient, etc.

[0050] The elastic modulus of solder changes with temperature, and solder is also a viscoplastic material, so the Anand viscoplastic model should be used to characterize its viscoplastic properties.

[0051] In step 3, the contact relationship between the parts is defined, including the following steps:

[0052] Step 3a: Customize the contact gap tolerance according to the product shape. The contact gap tolerance should be smaller than the gap of the 3D model to avoid the erroneous generation of redundant contact pairs.

[0053] Step 3b, delete the contact pairs automatically generated by the software, and regenerate the contact pairs according to the user-defined contact gap tolerance;

[0054] Step 3c: Rename the contact pairs between the solder and the adjacent parts to facilitate the subsequent “life and death” setting of the contact pairs.

[0055] The key areas that need to be meshed in step 4 mainly include the welding contact parts. The overall mesh should be checked to ensure that the mesh quality meets the requirements of thermodynamic coupling simulation.

[0056] The analysis settings in step 5 include the analysis step and solution control settings of the thermal-mechanical coupling simulation. The analysis step and analysis time of the transient thermal simulation and transient force simulation should be consistent.

[0057] Weak Springs and Large Deflection should be set in the transient force simulation solution control. In order to make the simulation process consistent with the actual welding situation and ensure the calculation convergence, Weak Springs should generally be turned on.

[0058] The transient thermal simulation boundary conditions in step 6 include the reflow soldering temperature variation curve and the corresponding thermal convection coefficient, etc.

[0059] The transient force simulation boundary conditions in step 8 include the transient temperature field distribution calculated in the previous step and the “life and death” settings of the contact pair.

[0060] The "life and death" setting of the contact pair should be based on the product form. The contact pair here refers to the contact pair between the solder and the connected parts. It needs to be set according to the welding stage of the product. Generally, the welding process is divided into three main stages, namely the heating and melting stage, the welding insulation stage and the cooling and solidification stage. The contact pair is set to "Dead" in the heating and melting stage and the welding insulation stage, and is set to "Alive" in the cooling and solidification stage, thereby completing the "life and death" setting of the contact pair.

[0061] The grid independence verification in step 9 is to evaluate whether the calculation has converged by measuring the change in the calculation results before and after the grid is refined. Generally, after the grid is refined by one time, if the change in the calculation results is less than 5%, the calculation is considered to have converged.

[0062] The simulation results in step 10 include the final thermal deformation and thermal stress of the microwave component after reflow soldering. The simulation results are used to determine whether the design scheme meets the assembly and reliability design requirements. If not, the design scheme is modified and steps 1-9 are repeated until the assembly and reliability design requirements are met.

[0063] The present invention has the following advantages:

[0064] (1) The present invention simulates and analyzes the thermal deformation of microwave component reflow soldering based on material property parameters that change with temperature and transient thermal-mechanical coupling simulation. The material parameters and simulation process are more consistent with actual soldering.

[0065] (2) The present invention divides the welding process into three main stages: a heating and melting stage, a welding insulation stage, and a cooling and solidification stage. The present invention also simulates the dynamic change process in which the solder has no constraint on the welded parts during heating and insulation, and the solder solidifies and constrains the welded parts during cooling and solidification through the "life and death" setting of the contact pair.

[0066] (3) Through precise material parameters, transient thermal-mechanical coupling simulation and precise simulation of the contact "life and death" setting of welding constraints, the simulation method proposed in this invention can perfectly match the actual welding process, the error between the simulation results and the actual welding effect is small, and the simulation accuracy is higher.

[0067] (4) The present invention is universal and can be applied to the reflow soldering thermal deformation simulation of various microwave components and other similar products through corresponding simple modifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 A flow chart of a simulation method for thermal deformation of microwave component reflow soldering;

[0069] Figure 2 A method for simulating thermal deformation of a microwave component during reflow soldering is shown in Example 1, which is a schematic diagram of the structure of a microwave component;

[0070] Figure 3 A schematic diagram of three stages in a soldering process of an embodiment of a method for simulating thermal deformation of microwave component reflow soldering;

[0071] Figure 4 A residual stress simulation result diagram of an embodiment of a simulation method for thermal deformation of microwave component reflow soldering;

[0072] Figure 5 A thermal deformation simulation result diagram of an embodiment of a method for simulating thermal deformation of a microwave component during reflow soldering;

[0073] Figure 6 It is a diagram of the X-direction thermal deformation simulation result of an embodiment of a method for simulating thermal deformation of microwave component reflow soldering;

[0074] Figure 7 It is a Y-direction thermal deformation simulation result diagram of an embodiment of a method for simulating thermal deformation of microwave component reflow soldering;

[0075] Figure 8 This is a diagram of the Z-direction thermal deformation simulation results of an embodiment of a method for simulating thermal deformation of microwave component reflow soldering.

[0076] Reference numerals:

[0077] 1. Printed circuit board; 2. Reflow soldering; 3. Shell. DETAILED DESCRIPTION

[0078] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0079] Example 1

[0080] like Figures 1 to 3 As shown, a method for simulating thermal deformation of microwave component reflow soldering includes the following steps:

[0081] Step 1: According to the initial design plan of the product, a 3D model of the product is established and imported into the simulation software for simplification;

[0082] In step 1, according to the initial design of the product, a three-dimensional model of the product is established and imported into the simulation software for simplification, including the following steps:

[0083] Step 1a: Form the initial design of the product based on the product's application conditions and task input. The schematic diagram of the microwave component is as follows: Figure 2 As shown, from Figure 2It can be seen that the microwave assembly is mainly composed of a shell 3, a printed circuit board 1, a cover plate and solder 2. Because the reflow soldering is performed before the product is covered, the cover plate is not considered during the reflow soldering;

[0084] Step 1b: according to the initial design plan, create a three-dimensional model of the microwave component in CAD software such as Cero or NX;

[0085] Step 1c: Import the 3D model created in the previous step into the model processing software DesignModeler;

[0086] Step 1d: Simplify the 3D model in DesignModeler and remove small features that have little impact on the simulation results, such as threaded holes and lettering.

[0087] Step 2: Assign corresponding material properties to each part;

[0088] In the step 2, corresponding material properties are assigned to each part, including the shell 3 material, the printed circuit board 1 material and the solder 2, wherein the shell 3 material is a molybdenum-copper alloy, the printed circuit board 1 material is a LTCC ceramic substrate, the solder 2 is Sn63Pb37, and the part material properties include density, thermal conductivity, specific heat capacity, elastic model, Poisson's ratio, thermal expansion coefficient, etc.

[0089] The elastic modulus of solder 2 changes with temperature, and solder 2 is also a viscoplastic material. The Anand viscoplastic model should be used to characterize its viscoplastic properties. The specific material parameters are shown in Tables 1 and 2.

[0090] Table 1 Material parameters

[0091]

[0092] Table 2Sn63Pb37 solder Anand parameter table

[0093]

[0094]

[0095] Step 3: Define the contact relationship between each part;

[0096] In step 3, the contact relationship between the various parts is defined, including the following steps:

[0097] Step 3a: According to the product shape, the custom contact gap tolerance is 0.03. The contact gap tolerance should be smaller than the gap of the 3D model of 0.05 to avoid the erroneous generation of redundant contact pairs.

[0098] Step 3b, delete the contact pairs automatically generated by the software, and regenerate the contact pairs according to the user-defined contact gap tolerance;

[0099] Step 3c: rename the contact pair between solder 2 and the adjacent parts to facilitate the subsequent setting of the “life and death” of the contact pair.

[0100] Step 4: Divide the grid and use functions such as Sizing to encrypt the grid in key areas.

[0101] The key parts that need to be meshed in step 4 mainly include the welding contact parts. The overall mesh should be checked to ensure that the mesh quality meets the requirements of thermodynamic coupling simulation.

[0102] Step 5: Complete the analysis settings for transient thermal simulation and transient force simulation;

[0103] The analysis setting in step 5 includes setting the analysis step and solution control. The analysis steps of transient thermal simulation and transient force simulation are uniformly set to 3 analysis steps, each analysis step contains 10 sub-steps, and the analysis step time is also consistent;

[0104] In the transient force simulation solution control, turn on the weak springs (Weak Springs) and turn off the large deformation (LargeDeflection) to make the simulation process converge as quickly as possible.

[0105] Step 6: Set transient thermal simulation boundary conditions;

[0106] The transient thermal simulation boundary conditions in step 6 include the reflow soldering temperature change curve and the corresponding thermal convection coefficient, etc. Figure 3 Shown is a schematic diagram of the three stages in the microwave component welding process.

[0107] Step 7: Start transient thermal simulation calculation to obtain the temperature field distribution of the product;

[0108] Step 8: Set the boundary conditions for transient force simulation;

[0109] The transient force simulation boundary conditions in step 8 include the transient temperature field distribution calculated in the previous step and the "life and death" setting of the contact pair. In the transient temperature field distribution, Source Time is set to "All", and Contace StepControl is inserted to perform the "life and death" setting of the contact pair. The contact pair is set to "Dead" in the heating and melting stage and the welding insulation stage, and is set to "Alive" in the cooling and solidification stage.

[0110] Step 9: Start transient force simulation calculation and solution, and perform grid independence verification after the solution is completed;

[0111] The grid independence verification in step 9 is to evaluate whether the calculation has converged by comparing the change in the calculation results before and after the grid is refined. Generally, after the grid is refined by one time, if the change in the calculation results is less than 5%, the calculation is considered to have converged.

[0112] Step 10: Determine whether the design solution is feasible based on the simulation results. If not, modify the design solution and repeat steps 1-9.

[0113] The simulation results in step 10 include the final thermal deformation and thermal stress of the microwave component after reflow soldering. Figure 4-8 As shown, from the simulation results, it can be found that the maximum residual stress of the product is about 124MPa, which is less than the material strength. The thermal deformation in the Z direction is the largest, which is 0.108mm. Both the thermal residual stress and thermal deformation meet the design and reliability requirements. At this point, the simulation process of this simulation method ends.

[0114] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for simulating thermal deformation of microwave components during reflow soldering, characterized in that: The following steps are involved: S1. Importing the three-dimensional model of the microwave component into the model processing software for simplification; S2. assigning material properties to the parts to be analyzed of the microwave component; S3. Customize a contact gap tolerance K according to the product form of the microwave component, and the contact gap tolerance K is smaller than the gap of the three-dimensional model of the microwave component; delete the contact pairs automatically generated by the software, and regenerate the reflow soldering contact pairs according to the customized contact gap tolerance K; S4, dividing the grid and encrypting the grids at key locations; S5. Setting the analysis and solution control of transient thermal simulation and transient case simulation, and setting the transient simulation boundary conditions of reflow soldering; S6, starting transient thermal simulation calculation to obtain the temperature field distribution of the microwave component; S7, setting boundary conditions for transient force simulation, wherein the boundary conditions for transient force simulation include the temperature field distribution of the microwave component and the life and death settings of the reflow soldering contact pair, wherein the reflow soldering contact pair is set to "dead" in the heating melting stage and the welding heat preservation stage, and is set to "alive" in the cooling solidification stage; S8, starting transient force simulation calculation to obtain the reflow soldering thermal deformation distribution of the microwave component; S9, verifying the mesh independence of the temperature field distribution of the microwave component and the reflow soldering thermal deformation distribution of the microwave component, and when the verification result is convergent, proceeding to step S10; when the verification result is not convergent, optimizing the three-dimensional mesh of the microwave component and returning to step S1; S10, judging whether the temperature field distribution and reflow soldering thermal deformation of the microwave component meet the design and reliability requirements, if not, modifying the microwave component design scheme and returning to step S1; If yes, a simulation method for thermal deformation of microwave component reflow soldering is completed.

2. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 1, characterized in that: In step S1, the microwave component comprises a printed circuit board (1), a reflow solder (2) and a housing (3) which are arranged in sequence from top to bottom; In step S2, the parts to be analyzed include the printed circuit board (1), the reflow solder (2) and the housing (3); The material properties include density, thermal conductivity, specific heat capacity, elastic model, Poisson's ratio, and thermal expansion coefficient; The visco-plastic properties of the reflow solder (2) are characterized by the Anand visco-plastic model.

3. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 2, characterized in that: The material of the shell (3) is any one of the following: aluminum alloy, copper alloy, silicon aluminum alloy, Kovar alloy, molybdenum copper alloy and aluminum-based silicon carbide; The material of the printed board (1) is any one of the following: FR4 laminate, LTCC ceramic substrate, HTCC ceramic substrate, 4350 printed board and 5880 printed board; The reflow solder (2) is Sn63Pb37 or SAC305; The parameters of the Anand viscoplastic model include initial deformation impedance, activation energy, pre-exponential factor, stress multiplier, strain rate sensitivity coefficient, strain hardening constant, deformation impedance coefficient, strain rate sensitivity index and strain hardening sensitivity coefficient.

4. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 1, characterized in that: In step S1, the software for establishing the three-dimensional model of the microwave component is CAD software, the model processing software is DesignModeler or SpaceClaim, and the simplification process is to remove the tiny features of the three-dimensional model of the microwave component, and the tiny features include threaded holes and lettering.

5. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 1, characterized in that: In step S3, the reflow soldering contact pairs include a contact pair between a printed circuit board and reflow soldering material, and a contact pair between the reflow soldering material and a housing; In step S7, during the temperature rise and melting stage and the welding heat preservation stage of the reflow soldering, the reflow soldering has no constraint on the printed circuit board (1) and the shell (3), and is therefore set to "dead"; during the temperature drop and solidification stage, the reflow soldering solder (2) solidifies and exerts constraints on the printed circuit board and the shell, and is therefore set to "live".

6. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 1, characterized in that: In step S3, K is 0.03, and the gap of the three-dimensional model of the microwave component is 0.

05.

7. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 1, characterized in that: In step S4, the key part is the welding contact part.

8. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 1, characterized in that: In step S5, the weak spring is turned on and the large deformation is turned off in the solution control of the transient case simulation.

9. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 1, characterized in that: In step S7, the Source Time is set to "All" in the temperature field distribution of the microwave component, and the Contact StepControl is inserted to perform the "life and death" setting of the reflow soldering contact pair.

10. The method for simulating thermal deformation of microwave components during reflow soldering according to claim 1, characterized in that: In step S9, when the change in the calculation results before and after mesh refinement is less than 5%, the calculation is considered to have converged; In step S10, when the maximum residual stress of the microwave component is less than the material strength and the maximum thermal deformation meets the design and reliability requirements, a simulation method for reflow soldering thermal deformation of a microwave component is completed.

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