Circuit board detection system and detection method

Abstract

The invention relates to the technical field of automatic detection. The circuit board detection system comprises a feeding mechanism, a detection mechanism, a discharging mechanism, a material moving device and a control module, and the feeding mechanism, the detection mechanism, the discharging mechanism and the material moving device are all connected with the control module; wherein the feeding mechanism is used for moving a to-be-detected circuit board to the feeding end of the detection mechanism and performing defect detection on the to-be-detected circuit board; the detection mechanism is used for conducting detection on the circuit board to be detected; the discharging mechanism is used for moving the circuit board subjected to conduction detection from the discharging end of the detection mechanism to the next station; and the material moving device is used for transferring the circuit board to be detected from the feeding mechanism to the detection mechanism and transferring the circuit board which is qualified in conduction detection to the discharging mechanism. The problems that an existing circuit board automatic detection system is single in function, multiple performance indexes of the circuit board cannot be comprehensively detected, and the overall detection efficiency is low due to the fact that efficient coordination is lacked in the feeding, detection and discharging processes are solved.

Description

Technical Field

[0001] The present invention relates to the field of automated detection technology, and in particular to a circuit board detection system and a detection method. Background Art

[0002] In the electronics manufacturing industry, circuit boards (also called circuit boards) are basic components of electronic equipment, and their quality and reliability are directly related to the performance of the final product and user satisfaction. With the advancement of science and technology and the miniaturization and complexity of electronic products, the design and production of circuit boards are becoming more and more sophisticated, which puts higher requirements on the quality inspection of circuit boards. Traditional circuit board inspection methods often rely on manual operation, which is not only inefficient, but also easily affected by human factors, making it difficult to ensure the accuracy and consistency of the inspection results. In order to improve the efficiency and accuracy of circuit board inspection, automated inspection technology came into being. The automated inspection system integrates mechanical, electronic, computer and sensor technologies to achieve fast and accurate inspection of circuit boards.

[0003] The existing automated circuit board inspection systems still have some shortcomings. For example, some systems can only perform single defect inspection or continuity inspection, and cannot meet the comprehensive inspection requirements for multiple performance indicators of circuit boards at the same time; some systems lack efficient coordination in the feeding, inspection and discharging processes, resulting in low overall inspection efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a circuit board detection system and detection method, aiming to solve the problems of low overall detection efficiency caused by the existing circuit board automatic detection system, such as single function, inability to comprehensively detect multiple performance indicators of the circuit board, and lack of efficient coordination in the feeding, detection and discharging processes.

[0005] The present invention is achieved through the following technical solutions: A circuit board detection system comprises: a feeding mechanism, a detection mechanism, a discharging mechanism, a material moving device and a control module, wherein the feeding mechanism, the detection mechanism and the discharging mechanism are arranged in sequence, and the feeding mechanism, the detection mechanism, the discharging mechanism and the material moving device are all connected to the control module; Among them, the feeding mechanism is used to move the circuit board to be tested to the feeding end of the testing mechanism, and perform defect detection on the circuit board to be tested; the testing mechanism is used to perform conductivity detection on the circuit board to be tested; the discharging mechanism is used to move the circuit board after the conductivity detection from the discharging end of the testing mechanism to the next workstation; the material moving device is used to transfer the circuit board to be tested from the feeding mechanism to the testing mechanism, and transfer the circuit board that passes the conductivity detection to the discharging mechanism.

[0006] Optionally, the feeding mechanism comprises: a first conveyor and a first screening component, wherein the first screening component is arranged on the first conveyor; wherein the first screening component is used to perform defect detection on the circuit board to be inspected.

[0007] Optionally, the detection mechanism includes: a detection mechanism body, a limit component and a continuity detection component, the detection mechanism body and the limit component are arranged on the detection mechanism body, the limit component is provided with a limit groove corresponding to the circuit board to be detected, and the continuity detection component is provided with an interface corresponding to the circuit board to be detected; wherein, the continuity detection component is used to perform continuity detection on the circuit board to be detected.

[0008] Optionally, the discharging mechanism includes: a second conveyor and a second screening component, and the second screening component is arranged on the second conveyor; wherein the second screening component is used to re-inspect the circuit boards that have passed the conduction test.

[0009] Optionally, the material transfer device includes a loading mechanism and a unloading mechanism, the loading mechanism is arranged at the feeding end of the detection mechanism, and the unloading mechanism is arranged at the discharging end of the detection mechanism; wherein the loading mechanism is used to transfer the circuit board to be detected from the feeding mechanism to the detection mechanism; the unloading mechanism is used to transfer the circuit board that passes the conduction test to the discharging mechanism.

[0010] Optionally, the feeding mechanism includes: a first supporting assembly, a first guiding assembly and a first moving assembly, the first supporting assembly is arranged at the feeding end of the detection mechanism, the first guiding assembly is arranged on the first supporting assembly, and the first moving assembly is slidably connected to the first guiding assembly; wherein, the first moving assembly is used to transfer the circuit board to be detected from the feeding mechanism to the detection mechanism.

[0011] Optionally, the unloading mechanism includes a second supporting assembly, a second guiding assembly and a second moving assembly, the second supporting assembly is arranged at the discharging end of the detection mechanism, the second guiding assembly is arranged on the second supporting assembly, and the second moving assembly is slidably connected to the second guiding assembly; wherein, the second moving assembly is used to transfer the circuit boards that pass the conduction test to the discharging mechanism, or to remove the circuit boards that fail the conduction test.

[0012] Optionally, a material return mechanism is further included, which is arranged on the side of the material transfer device; the material return mechanism is used to transport circuit boards with defects or that fail the conduction inspection to a defective area.

[0013] Optionally, it further includes a base, and the feeding mechanism, the detecting mechanism, the discharging mechanism and the material moving device are all on the base.

[0014] The present invention also provides a circuit board detection method, which is applied to the circuit board detection system, and comprises the steps of: Build a defect recognition model based on machine learning algorithm and set the defect recognition model in the control module; The circuit board to be inspected is transported to a designated location through a feeding mechanism, and a preliminary defect inspection is performed on the circuit board to be inspected through the feeding mechanism; The circuit boards that have passed the preliminary defect detection are transferred to the feeding end of the detection mechanism by the material transfer device, and the circuit boards are subjected to a continuity test by the detection mechanism; The circuit boards that have passed the continuity test are transferred to the discharging mechanism through the material transfer device, and the circuit boards that have failed the continuity test are removed; The circuits that have passed the continuity test are re-inspected for defects through the discharging mechanism, and the circuit boards that pass or fail the re-inspection are transferred to the next workstation.

[0015] The technical solution of the present invention has at least the following advantages and beneficial effects: Improved comprehensive detection capabilities: By integrating the feeding mechanism, detection mechanism, discharging mechanism and material transfer device, the entire process of circuit board from feeding to discharging is automatically detected; it not only has defect detection function, but also can perform conduction detection, thus comprehensively covering the main performance indicators of the circuit board, ensuring the accuracy and completeness of the detection results, and effectively solving the problem of single function and inability to conduct comprehensive detection in the existing system.

[0016] Efficient coordination and improved efficiency: The various mechanisms can coordinate efficiently to achieve a fast and accurate flow of circuit boards to be tested; the feeding mechanism performs preliminary defect detection before sending the circuit boards to the testing mechanism, reducing the possibility of unqualified products entering subsequent testing links, thereby improving the overall testing efficiency; at the same time, the material transfer device can quickly and accurately transfer qualified circuit boards from the testing mechanism to the discharging mechanism, avoiding delays and errors in manual operations and further improving testing efficiency.

[0017] Reduce human interference: Greatly reduce the need for manual operation, thereby reducing the impact of human factors on test results, helping to ensure the accuracy and consistency of test results, and improving product quality and user satisfaction.

[0018] Flexibility and scalability: The detection system of the present invention is flexibly designed and can be easily expanded and upgraded according to actual needs. Other types of detection mechanisms can be further added to meet the detection needs of more performance indicators of circuit boards, so that the system can adapt to the miniaturization and complexity trend of future electronic products and ensure the continued leadership of detection technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1It is a schematic diagram of the overall structure of a circuit board detection system according to an embodiment of the present invention; Figure 2 A schematic diagram of a partial structure of a circuit board detection system according to an embodiment of the present invention; Figure 3 A schematic diagram of a top view of a circuit board detection system according to an embodiment of the present invention; Figure 4 A schematic diagram of a flow chart of a circuit board detection method according to an embodiment of the present invention; Illustration: 1-base, 2-feeding mechanism, 201-first screening component, 3-loading mechanism, 301-first moving component, 4-detection mechanism, 5-unloading mechanism, 501-second moving component, 6-discharging mechanism, 601-second screening component, 7-returning mechanism. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Example 1 Reference Figure 1 , Figure 2 , Figure 3 A circuit board detection system includes: a feeding mechanism 2, a detection mechanism 4, a discharging mechanism 6, a material moving device and a control module, wherein the feeding mechanism 2, the detection mechanism 4 and the discharging mechanism 6 are arranged in sequence, and the feeding mechanism 2, the detection mechanism 4, the discharging mechanism 6 and the material moving device are all connected to the control module; wherein the feeding mechanism 2 is used to move the circuit board to be detected to the feeding end of the detection mechanism 4, and perform defect detection on the circuit board to be detected; the detection mechanism 4 is used to perform conduction detection on the circuit board to be detected; the discharging mechanism 6 is used to move the circuit board after the conduction detection from the discharging end of the detection mechanism 4 to the next station; the material moving device is used to transfer the circuit board to be detected from the feeding mechanism 2 to the detection mechanism 4, and transfer the circuit board that passes the conduction detection to the discharging mechanism 6.

[0022] In this embodiment, the feeding mechanism 2 includes: a first conveyor and a first screening component 201, and the first screening component 201 is arranged on the first conveyor; wherein the first screening component 201 is used to perform defect detection on the circuit board to be inspected. The first conveyor is used to continuously and smoothly transmit the circuit board to be inspected. The first conveyor can be a belt conveyor, a roller conveyor or a chain conveyor, etc., and the specific type is selected according to the size, weight and transmission requirements of the circuit board. The first screening component 201 is arranged on the first conveyor and is used to perform preliminary defect detection on the circuit board to be inspected. The first screening component 201 may include an image acquisition device (such as a camera), a light source and an image processing algorithm, etc., for capturing an image of the circuit board, and identifying defects on the circuit board, such as scratches, breakage, missing components, etc., through the image processing algorithm. The circuit board to be inspected is placed at the starting position of the first conveyor, and the conveyor is started to transfer the circuit board to the direction of the inspection mechanism 4; when the circuit board is transferred to the bottom of the first screening component 201, the image acquisition device captures the image of the circuit board. At this time, the light source provides sufficient illumination to ensure that the image is clear and without shadows; the image processing algorithm processes the captured image to identify the defects on the circuit board. This process can be achieved through machine learning algorithms (such as convolutional neural networks) to improve the accuracy and efficiency of defect identification; according to the results of defect detection, the first screening component 201 will continue to transfer the circuit board that is initially judged to be qualified to the feeding end of the inspection mechanism 4. The feeding mechanism 2 receives the control instruction and feeds back the detection result through the connection with the control module; when the first screening component 201 determines that the circuit board is initially qualified, the control module controls the material transfer device to transfer the circuit board from the feeding mechanism 2 to the inspection mechanism 4.

[0023] In this embodiment, the detection mechanism 4 includes: a detection mechanism body, a limit component and a conduction detection component. The limit component of the detection mechanism body is arranged on the detection mechanism body, and a limit groove corresponding to the circuit board to be detected is arranged on the limit component. The conduction detection component is provided with an interface corresponding to the circuit board to be detected, and can be connected to the test point or pin on the circuit board through the interface, and whether the circuit connection on the circuit board is correct is detected by applying voltage or current; wherein, the conduction detection component is used to perform conduction detection on the circuit board to be detected. The detection mechanism body provides structural support and protection for the detection mechanism 4 to ensure the safety and stability of the detection process. The limit component is arranged on the detection mechanism body, and is used to fix the position of the circuit board to be detected to prevent it from moving or shaking during the detection process. The limit groove corresponding to the circuit board to be detected is provided on the limit component to ensure that the circuit board can be accurately and stably placed on the detection mechanism. The circuit board that has passed the preliminary defect detection is placed on the limit component of the detection mechanism 4 through the material moving device to ensure that the circuit board is accurately aligned with the limit slot; the interface of the conduction detection component is connected to the test point or pin on the circuit board to establish an electrical connection; the control module sends a detection instruction to the conduction detection component, and the conduction detection component starts working to detect the circuit connection on the circuit board by applying voltage or current; during the detection process, the conduction detection component will record the electrical connection status between each test point or pin, and transmit it to the control module for processing; the control module determines whether the circuit connection on the circuit board is correct based on the data returned by the conduction detection component; if all circuit connections are correct, it is judged that the conduction detection is qualified; if there is a circuit connection error or abnormality, it is judged that the conduction detection is unqualified; the control module feeds back the result of the conduction detection to the material moving device, so that the qualified circuit board can be transferred to the discharging mechanism 6 for subsequent processing, and the unqualified circuit board is removed by the material moving device, that is, the unqualified circuit board is transferred to the designated position by the material moving device for recycling.

[0024] In this embodiment, the conduction detection component is mainly composed of the following parts: Test interface module: contains a series of interfaces corresponding to the test points or pins on the circuit board to be tested; the interface can be a needle, spring needle or other form of electrical contact element, used to establish electrical connection with the test points or pins on the circuit board.

[0025] Signal generation and reception module: responsible for generating test signals, such as voltage or current signals, and applying the test signals to the test interface module, while receiving the test signals returned from the test interface module; by comparing the applied and received signals, it can be determined whether the circuit connection on the circuit board is correct.

[0026] Control and processing module: responsible for controlling the overall workflow of the conduction detection component, including the generation, application, reception and processing of test signals; it can also communicate with the control module of the detection mechanism 4, receive detection instructions and feedback detection results.

[0027] Electrical connection and insulation module: Ensure that the electrical connection between the test interface module and the signal generation and receiving module is reliable and well-insulated to prevent electrical interference and damage during the test process In this embodiment, before the detection begins, the control and processing module will initialize and calibrate the conduction detection component to ensure that the test interface module, signal generation and receiving module and other components are in normal working state; the control and processing module sends instructions to the signal generation and receiving module to generate and apply test signals to the test interface module, and these test signals can be DC or AC signals with different voltage or current levels; the signal generation and receiving module receives the test signal returned from the test interface module and transmits it to the control and processing module; the control and processing module processes and analyzes the received signal to determine whether the circuit connection on the circuit board is correct; based on the result of signal processing, the control and processing module determines whether the circuit connection on the circuit board is qualified. If all circuit connections are correct, it is judged that the conduction detection is qualified; if there is a circuit connection error or abnormality, it is judged that the conduction detection is unqualified. The control and processing module feeds back the detection results to the control module of the detection mechanism 4 for subsequent processing.

[0028] In this embodiment, the discharging mechanism 6 includes: a second conveyor and a second screening component 601, and the second screening component 601 is arranged on the second conveyor; wherein the second screening component 601 is used to re-inspect the circuit board that has passed the conduction test. The second conveyor 602 can adopt a continuous conveyor belt or chain structure, with a stable conveying speed and precise conveying position control. The second conveyor 602 receives the circuit board transmitted from the discharging end of the detection mechanism 4, and continuously and stably conveys it to the second screening component 601 for re-inspection. The second screening component 601 includes an image acquisition unit, an image processing unit and a classification execution unit. The image acquisition unit is used to capture the image information of the circuit board; the image processing unit uses a preset image processing algorithm to process the captured image to identify defects on the circuit board; the classification execution unit classifies the circuit board according to the results of the image processing unit. When the circuit board is conveyed by the second conveyor 602 to the bottom of the second screening component 601, the image acquisition unit captures its image information; the image processing unit processes the captured image to identify defects on the circuit board, such as cracks, open circuits, short circuits, etc.; according to the recognition result of the image processing unit, the classification execution unit continues to convey the circuit boards that have passed the conduction test and the re-inspection to the next workstation; and the circuit boards that have passed the conduction test but failed the re-inspection are removed to the defective area by the sorting machine.

[0029] In this embodiment, the material transfer device includes a loading mechanism 3 and a unloading mechanism 5, the loading mechanism 3 is arranged at the feeding end of the detection mechanism 4, and the unloading mechanism 5 is arranged at the discharging end of the detection mechanism 4; wherein, the loading mechanism 3 is used to transfer the circuit board to be detected from the feeding mechanism 2 to the detection mechanism 4; the unloading mechanism 5 is used to transfer the circuit board that has passed the conduction test to the discharging mechanism 6.

[0030] In this embodiment, the feeding mechanism 3 includes: a first supporting assembly, a first guiding assembly and a first moving assembly 301, the first supporting assembly is arranged at the feeding end of the detection mechanism 4, the first guiding assembly is arranged on the first supporting assembly, and the first moving assembly 301 is slidably connected to the first guiding assembly; wherein, the first moving assembly 301 is used to transfer the circuit board to be detected from the feeding mechanism 2 to the detection mechanism 4.

[0031] In this embodiment, the first support assembly is firmly arranged at the feeding end of the detection mechanism 4 to provide a solid support foundation for the entire feeding mechanism. It is usually made of high-strength, corrosion-resistant materials to ensure stability and reliability for long-term use. The first guide assembly is arranged on the first support assembly to guide the movement trajectory of the first moving assembly 301. The first guide assembly can be a slide rail structure, and the guide assembly ensures that the moving assembly can move accurately and smoothly along a predetermined path, thereby avoiding damage or dislocation to the circuit board. The first moving assembly 301 is slidably connected to the first guide assembly and can move accurately under the guidance of the guide assembly. The first moving assembly 301 includes a driving device (such as a motor, a cylinder, etc.), a transmission mechanism (such as a lead screw, a guide rail, etc.) and a grasping device (such as a suction cup, a clamp, etc.). The grasping device is used to reliably grasp and release the circuit board to be detected to adapt to circuit boards of different sizes and weights.

[0032] In this embodiment, the unloading mechanism 5 includes a second supporting assembly, a second guiding assembly and a second moving assembly 501. The second supporting assembly is arranged at the discharging end of the detection mechanism 4, the second guiding assembly is arranged on the second supporting assembly, and the second moving assembly 501 is slidably connected with the second guiding assembly; wherein, the second moving assembly 501 is used to transfer the circuit boards that have passed the conduction test to the discharging mechanism 6, or to remove the circuit boards that have failed the conduction test.

[0033] In this embodiment, the second support assembly is made of high-strength, corrosion-resistant materials to ensure stability and durability under long-term use. The second guide assembly guides the sliding path of the second moving assembly 501 to ensure the accuracy and stability of the circuit board during the transfer process. The second moving assembly 501 includes a drive motor, a transmission mechanism (such as a belt, a chain or a lead screw) and a clamping mechanism. The drive motor provides power, the transmission mechanism converts the power into linear or rotational motion, and the clamping mechanism is responsible for clamping and releasing the circuit board. When the detection mechanism 4 completes the conduction detection, the clamping mechanism of the second moving assembly 501 moves to the discharge end of the detection mechanism 4 under the instruction of the control module, and accurately clamps the circuit board; after the clamping mechanism clamps the circuit board, the second moving assembly 501 is driven by the drive motor and the transmission mechanism, and slides along the guide rail of the second guide assembly to the specified position of the discharge mechanism 6; after reaching the specified position, the clamping mechanism releases the circuit board under the instruction of the control module to complete the transfer operation. If the circuit board fails the continuity test, the second moving component 501 will not transfer it to the discharge mechanism 6, but will transfer it to a designated defective area, or to a corresponding conveying mechanism, and then convey it to the defective area through the corresponding conveying mechanism.

[0034] In this embodiment, a material return mechanism 7 is also included. The material return mechanism 7 is arranged on the side of the material transfer device; the material return mechanism 7 is used to transport the circuit boards with defects or those that fail the conduction inspection to the defective area.

[0035] In this embodiment, the material return mechanism 7 is mainly composed of the following key components: The third conveyor: As the core transmission component of the return mechanism, it is responsible for conveying unqualified circuit boards from the detection mechanism 4 or the material transfer device to the defective area; it adopts wear-resistant and corrosion-resistant conveyor belts and is equipped with a precise drive system to ensure the stability and safety of the circuit boards during the conveying process.

[0036] The third screening component: During the conveying process, the circuit boards are screened again to ensure that only unqualified circuit boards are conveyed to the defective area to avoid misjudgment or missed judgment; it can be a screening device based on image recognition, weight detection or other physical characteristics, which is closely connected with the control module to realize automatic screening.

[0037] Guiding and positioning device: ensure that the circuit board maintains the correct position and direction during transportation, and avoids deviation or flipping during transportation; use precise guide rails and positioning blocks, as well as necessary sensors and control systems to achieve accurate positioning and guiding of the circuit board.

[0038] Defective area collection device: Receive and store unqualified circuit boards for subsequent manual inspection or processing. It can be one or more collection boxes, collection racks or automatic sorting systems, designed and configured according to actual needs.

[0039] In this embodiment, a base 1 is also included, and a feeding mechanism 2, a detection mechanism 4, a discharging mechanism 6 and a material transfer device are all on the base 1. The main frame of the base 1 is made of high-strength, corrosion-resistant metal materials (such as aluminum alloy, stainless steel, etc.) to ensure the stability and load-bearing capacity of the overall structure. The frame design adopts a modular structure to facilitate subsequent maintenance and upgrades. On the main frame, several support platforms are set for installing and fixing key components such as the feeding mechanism 2, the detection mechanism 4, the discharging mechanism 6 and the material transfer device; the surface of the support platform is anti-slip treated to ensure the stability and safety of each component on the base. The base 1 is equipped with a fine-tuning mechanism, such as a height adjustment bolt, a level adjuster, etc., which is used to adjust the relative position and level between the components to ensure the accuracy and stability of the system operation. Protective structures such as guardrails and protective covers are set at the edges and key parts of the base 1 to prevent operators from accidentally touching or causing accidents. The protective structure is made of transparent or translucent materials to facilitate observation of the system operation status.

[0040] Example 2 Based on Example 1, refer to Figure 4 In this embodiment, a circuit board detection method is provided, which is applied to a circuit board detection system, and includes the steps of: Step 1: Build a defect recognition model based on the machine learning algorithm and set the defect recognition model in the control module.

[0041] In this embodiment, a large amount of annotated circuit board image data is collected from the production line or historical data. These image data include various types of defects, such as scratches, breakages, missing components, etc. The collected image data is preprocessed, including image enhancement (such as contrast adjustment, noise removal), image cropping and scaling, etc., to ensure the quality and consistency of the image data. Image processing techniques (such as edge detection, texture analysis, shape analysis, etc.) are used to extract defect features from the preprocessed images. The defect features can reflect the defect conditions on the circuit board; deep learning techniques (such as convolutional neural networks CNN) can also be used to automatically learn feature representations from images without manually designing feature extraction algorithms. Select appropriate machine learning algorithms (such as support vector machines (SVM), random forests, neural networks, etc.) or deep learning frameworks (such as TensorFlow, PyTorch, etc.) to build defect recognition models; use labeled image data to train the model. During the training process, the model will learn how to identify defects on the circuit board based on the extracted features; improve the recognition performance of the model through cross-validation, adjustment of model parameters (such as learning rate, number of iterations, etc.) and optimizer selection; use independent test sets to evaluate the recognition performance of the model, and the evaluation indicators include accuracy, recall rate, F1 score, etc.; optimize the model based on the evaluation results, including adjusting the model structure, adding data enhancement strategies, using ensemble learning methods, etc.; integrate the trained defect recognition model into the control module of the circuit board inspection system. Convert the defect recognition model to a format that can run on the target hardware (such as TensorFlow Lite, ONNX, etc.); configure the control module to call the defect recognition model for real-time detection, including setting the preprocessing steps of the input image data, the trigger conditions for model inference, and the parsing and processing of the output results.

[0042] Step 2: The circuit board to be inspected is transported to a designated location by the feeding mechanism 2, and a preliminary defect inspection is performed on the circuit board to be inspected by the feeding mechanism 2.

[0043] In this embodiment, the circuit board to be inspected is placed at the starting position of the first conveyor. After the conveyor is started, the circuit board will be automatically transferred to the bottom of the first screening component 201; when the circuit board is transferred to the bottom of the first screening component 201, the image acquisition device (such as an industrial camera) starts to capture the image of the circuit board; the light source provides sufficient illumination to ensure that the image is clear and without shadows, and the brightness and angle of the light source can be adjusted according to actual conditions to obtain the best image quality; the captured image is transmitted to the control module and processed by a pre-trained defect recognition model; after the defect recognition model processes the image, it will output a judgment result, that is, whether the circuit board has defects; according to the result of defect recognition, the first screening component 201 will continue to transfer the circuit board that is initially judged to be qualified to the feeding end of the detection mechanism 4; if the circuit board is judged to be unqualified, an instruction can be sent through the control module to stop the first conveyor from transmitting the circuit board, or remove it from the transmission path by other means (such as a sorting mechanism); at the same time, the control module will record and store the results of each defect detection for subsequent analysis and improvement. The feeding mechanism 2 will continuously transfer new circuit boards to be inspected to the bottom of the first screening component 201 for preliminary defect detection; the entire process is automated and does not require human intervention, greatly improving detection efficiency and accuracy.

[0044] Step three: transfer the circuit boards that have passed the preliminary defect detection to the feeding end of the detection mechanism 4 through the material transfer device, and perform a continuity test on the circuit boards through the detection mechanism 4.

[0045] In this embodiment, when the first screening component 201 of the feeding mechanism 2 completes the preliminary defect detection of the circuit board to be inspected and judges it as qualified, the control module will receive a corresponding signal; the control module sends an instruction to the feeding mechanism 3 of the material transfer device according to the received signal, and prepares to transfer the circuit board; the first supporting component of the feeding mechanism 3 is firmly arranged at the feeding end of the detection mechanism 4 to provide support for the transfer of the circuit board; the first guiding component ensures that the first moving component 301 can move accurately and smoothly along a predetermined path; the grasping device (such as a suction The first guide assembly 301 is controlled by the control module to adjust the size and weight of the circuit board to be tested to ensure that the circuit board can be reliably grasped; under the command of the control module, the driving device (such as a motor, a cylinder, etc.) of the first moving assembly 301 is started, and the grasping device is driven to move to the specified position of the feeding mechanism 2 through the transmission mechanism (such as a lead screw, a guide rail, etc.); the grasping device accurately grasps the circuit board that has passed the preliminary defect detection, and under the command of the control module, it moves smoothly along the guide rail of the first guide assembly to the feeding end of the testing mechanism 4; during the movement process, the control module monitors the position and speed of the moving assembly in real time. degree to ensure that the circuit board can be accurately placed on the limit component of the detection mechanism 4; when the circuit board is accurately placed on the limit component of the detection mechanism 4, the limit component will fix the position of the circuit board to prevent it from moving or shaking during the detection process; the interface of the conduction detection component is connected to the test point or pin on the circuit board to establish an electrical connection. The control module sends a detection instruction to the conduction detection component, and the conduction detection component starts to work and detects the circuit connection on the circuit board by applying voltage or current; during the detection process, the conduction detection component records the electrical connection status between each test point or pin and transmits it to the control module for processing; the control module determines whether the circuit connection on the circuit board is correct based on the data returned by the conduction detection component and generates corresponding detection results; the control module feeds back the results of the conduction detection to the unloading mechanism 5 of the material transfer device, so that the qualified circuit board can be transferred to the discharging mechanism 6 for subsequent processing, and the unqualified circuit board can be removed by the material transfer device; if the circuit board fails the conduction detection, the unloading mechanism 5 will transfer it to the designated defective area or the corresponding conveying mechanism under the instruction of the control module for subsequent processing or recycling.

[0046] Step 4: The circuit boards that have passed the continuity test are transferred to the discharging mechanism 6 by the material transfer device, and the circuit boards that have failed the continuity test are removed.

[0047] In this embodiment, after the detection mechanism 4 completes the conduction detection, it transmits the detection result (qualified or unqualified) to the control module; the control module sends an instruction to the material transfer device according to the detection result, and marks the circuit board to be transferred as "qualified" or "unqualified"; when receiving the "qualified" mark instruction, the drive motor of the unloading mechanism 5 is started, and the transmission mechanism starts to work; under the action of the driving force, the clamping mechanism slides smoothly along the guide rail of the second guide assembly to the discharge end of the detection mechanism 4; the clamping mechanism accurately clamps the circuit board that has passed the conduction detection to ensure that it will not be damaged during the transfer process; the clamping mechanism clamps the circuit board The board continues to slide along the guide rail to the specified position of the discharge mechanism 6; after reaching the specified position, the clamping mechanism releases the circuit board under the command of the control module to complete the transfer operation; after receiving the instruction of the "unqualified" mark, the material transfer device (or a special rejection mechanism) transfers the unqualified circuit board to the return mechanism 7; the third conveyor of the return mechanism 7 is started to transport the unqualified circuit board to the defective area; during the transportation process, the third screening component screens the circuit boards again to ensure that only unqualified circuit boards are transported to the defective area; the unqualified circuit boards are transported to the defective area collection device for storage and subsequent processing.

[0048] Step 5: The circuits that have passed the continuity test are re-inspected for defects by the discharging mechanism 6, and the circuit boards that have passed or failed the re-inspection are transferred to the next station.

[0049] In this embodiment, when the circuit board that has passed the conduction test is conveyed to the receiving area of ​​the discharging mechanism 6 by the material moving device, the second conveyor 602 of the discharging mechanism 6 is started, ready to receive and continuously and stably convey the circuit board; the second screening component 601 enters a standby state, ready to re-inspect the received circuit board for defects; when the circuit board is conveyed to the bottom of the second screening component 601 by the second conveyor 602, the image acquisition unit (such as an industrial camera) captures the image information of the circuit board. At this time, the light source (such as an LED light) provides sufficient lighting to ensure that the image is clear and shadow-free; the image processing unit processes the captured image through a preset image processing algorithm to identify potential defects on the circuit board, such as cracks, open circuits, short circuits, missing or misaligned components, etc.; according to the recognition result of the image processing unit, the classification execution unit performs classification processing on the circuit board ; If the circuit board is judged to be qualified in the re-inspection (i.e., no new defects are detected or the original defects do not affect its function), the classification execution unit controls the second conveyor 602 to continue to convey the circuit board to the next workstation, which may be for further processing, assembly or packaging; if the circuit board is judged to be unqualified in the re-inspection (i.e., new defects are detected or the original defects affect its function), the classification execution unit will trigger the sorting mechanism to remove the unqualified circuit board from the conveyor line and convey it to the defective area for collection and processing through the return material mechanism 7 (such as the third conveyor); the result of the re-inspection (qualified or unqualified) is fed back to the control module of the discharging mechanism 6, and is further recorded in the system log for subsequent analysis and tracking; the system is configured with a database or data management system, and the re-inspection results can be automatically stored in the database for quality traceability and statistical analysis.

[0050] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A circuit board detection system, characterized in that: include: A feeding mechanism (2), a detection mechanism (4), a discharging mechanism (6), a material moving device and a control module, wherein the feeding mechanism (2), the detection mechanism (4) and the discharging mechanism (6) are arranged in sequence, and the feeding mechanism (2), the detection mechanism (4), the discharging mechanism (6) and the material moving device are all connected to the control module; The feeding mechanism (2) is used to move the circuit board to be tested to the feeding end of the testing mechanism (4) and to perform defect detection on the circuit board to be tested; the testing mechanism (4) is used to perform a conduction test on the circuit board to be tested; the discharging mechanism (6) is used to move the circuit board after the conduction test from the discharging end of the testing mechanism (4) to the next workstation; and the material transfer device is used to transfer the circuit board to be tested from the feeding mechanism (2) to the testing mechanism (4), and to transfer the circuit board that has passed the conduction test to the discharging mechanism (6).

2. The circuit board detection system according to claim 1, characterized in that: The feeding mechanism (2) comprises: a first conveyor and a first screening component (201), wherein the first screening component (201) is arranged on the first conveyor; wherein the first screening component (201) is used to perform defect detection on a circuit board to be detected.

3. The circuit board detection system according to claim 1, characterized in that: The detection mechanism (4) comprises: a detection mechanism body, a limit assembly and a conduction detection assembly, wherein the limit assembly is arranged on the detection mechanism body, the limit assembly is provided with a limit groove corresponding to the circuit board to be detected, and the conduction detection assembly is provided with an interface corresponding to the circuit board to be detected; wherein the conduction detection assembly is used to perform conduction detection on the circuit board to be detected.

4. The circuit board detection system according to claim 1, characterized in that: The discharging mechanism (6) comprises: a second conveyor and a second screening component (601), wherein the second screening component (601) is arranged on the second conveyor; wherein the second screening component (601) is used to re-inspect circuit boards that have passed the conduction test.

5. The circuit board detection system according to claim 1, characterized in that: The material transfer device comprises a loading mechanism (3) and a unloading mechanism (5), wherein the loading mechanism (3) is arranged at the feeding end of the detection mechanism (4), and the unloading mechanism (5) is arranged at the discharging end of the detection mechanism (4); wherein the loading mechanism (3) is used to transfer the circuit board to be detected from the feeding mechanism (2) to the detection mechanism (4); and the unloading mechanism (5) is used to transfer the circuit board that has passed the conduction test to the discharging mechanism (6).

6. The circuit board detection system according to claim 5, characterized in that: The feeding mechanism (3) comprises: a first supporting assembly, a first guiding assembly and a first moving assembly (301); the first supporting assembly is arranged at the feeding end of the detection mechanism (4); the first guiding assembly is arranged on the first supporting assembly; the first moving assembly (301) is slidably connected to the first guiding assembly; wherein the first moving assembly (301) is used to transfer the circuit board to be detected from the feeding mechanism (2) to the detection mechanism (4).

7. The circuit board detection system according to claim 5, characterized in that: The unloading mechanism (5) comprises a second supporting assembly, a second guiding assembly and a second moving assembly (501), wherein the second supporting assembly is arranged at the unloading end of the detection mechanism (4), the second guiding assembly is arranged on the second supporting assembly, and the second moving assembly (501) is slidably connected to the second guiding assembly; wherein the second moving assembly (501) is used to transfer a circuit board that has passed the conduction test to the unloading mechanism (6), or to remove a circuit board that has failed the conduction test.

8. The circuit board detection system according to claim 1, characterized in that: It also comprises a material return mechanism (7), which is arranged on the side of the material transfer device; the material return mechanism (7) is used to transport circuit boards with defects or that fail the conduction inspection to a defective area.

9. The circuit board detection system according to claim 1, characterized in that: It also comprises a base (1), and the feeding mechanism (2), the detecting mechanism (4), the discharging mechanism (6) and the material moving device are all on the base (1).

10. A circuit board detection method, applied to the circuit board detection system according to any one of claims 1 to 9, characterized in that: Includes steps: Build a defect recognition model based on machine learning algorithm and set the defect recognition model in the control module; The circuit board to be inspected is transported to a designated location by means of a feeding mechanism (2), and a preliminary defect inspection is performed on the circuit board to be inspected by means of the feeding mechanism (2); The circuit boards that have passed the preliminary defect detection are transferred to the feeding end of the detection mechanism (4) by means of a material transfer device, and the circuit boards are subjected to a continuity test by means of the detection mechanism (4); The circuit boards that have passed the continuity test are transferred to the discharging mechanism (6) by means of a material transfer device, and the circuit boards that have failed the continuity test are discarded; The circuits that have passed the conduction test are re-inspected for defects by the discharging mechanism (6), and the circuit boards that have passed or failed the re-inspection are transferred to the next workstation.

Images