A wafer positioning mechanism for a quartz wafer arrangement machine

Abstract

The invention relates to the technical field of semiconductor processing equipment, and discloses a wafer positioning mechanism of a quartz wafer arrangement machine, comprising a feeding module, a loading module, a detection module, a sorting module and a receiving module, the sorting module comprising a mechanical arm, a suction head and an ejector pin; the receiving module comprises a receiving tray, a wafer groove is provided on the top surface of the receiving tray, a wafer positioning device is arranged on the periphery of the wafer groove, the wafer positioning device comprises a pressurized airbag and a positioning member, and a telescopic airbag is fixedly connected to the inner wall of the pressurized airbag on all sides; the telescopic airbag is configured to extend into the wafer groove and abut against the side elevation of the wafer when the ejector pin moves downward to press the pressurized airbag; the wafer groove is a semi-enclosed groove with an open top or a through groove that runs through from top to bottom; through the cooperation of the receiving module and the sorting module, wafers of the same sorting type can be positioned in the wafer groove of the same receiving module, and wafers of different sorting types can also be positioned in different groups of wafer grooves of the same receiving module, so as to facilitate the removal of the wafers.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor processing equipment, in particular to a wafer positioning mechanism for a quartz wafer arrangement machine. Background Art

[0002] The sorting of quartz wafers can effectively improve the qualified rate of wafers. In the existing sorting methods, such as the quartz wafer thickness sorting machine with wafer sorting function and the sorting and sorting method with publication number CN103128057A, different wafers are placed in different material boxes during the sorting process, but there is no obvious distinction between the material boxes, which is not convenient for effective visual display of the sorting results, resulting in confusion during transportation, and then secondary sorting; if different material boxes are used to hold different wafers, the types of material boxes will increase with the increase of sorting types, increasing the manufacturing cost of the sorting equipment. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a wafer positioning mechanism for a quartz wafer arrangement machine, which can effectively solve the problems raised in the background technology.

[0004] To achieve the above object, the present invention provides the following technical solutions: a wafer positioning mechanism for a quartz wafer arrangement machine, comprising a workbench, a feeding module, a loading module, a detection module, a sorting module and a receiving module; the detection module is used to detect the thickness of the wafer, and the sorting module is used to place the detected wafer into the receiving module;

[0005] The detection module includes a driving unit 2 and two electrodes distributed in an upper and lower manner, the upper electrode is fixedly connected to the active end of the driving unit 2, and the driving unit 2 and the lower electrode are both fixedly connected to the workbench;

[0006] The sorting module includes a mechanical arm and a driving unit 1 arranged at the sliding end of the mechanical arm, a linkage mechanism and an ejector pin are installed at the movable end of the driving unit 1 through a connecting seat, and a suction head is installed at the linkage mechanism through a sliding table;

[0007] The receiving module comprises a receiving tray, a plurality of wafer slots are provided on the top surface of the receiving tray, a frame-shaped slot for accommodating a wafer positioning device is provided on the periphery of each wafer slot, and a positioning piece which can be elastically rotated is provided on the receiving tray and on one side of the wafer positioning device;

[0008] The wafer positioning device includes a pressing frame matched with the frame-shaped groove, a pressurized airbag accommodated in the frame-shaped groove is arranged at the bottom of the pressing frame, and a telescopic airbag is fixedly connected to the inner wall of the pressurized airbag all around, and the telescopic airbag is arranged in a connecting port reserved between the frame-shaped groove and the wafer groove;

[0009] The positioning member comprises a positioning shaft which is elastically arranged on the receiving tray through a second elastic member, and an unlocking plate and a braking plate are sleeved on the positioning shaft.

[0010] Preferably, the linkage mechanism includes a transmission plate 1 fixed on the upper surface of the connecting seat, a transmission plate 2 fixed on the upper surface of the slide and a spring column, the transmission plate 2 is provided with a vertically distributed guide groove, the spring column is embedded in the transmission plate 2, and the sliding end of the spring column is located in the guide groove, part of the transmission plate 1 extends into the guide groove and is detachably mounted on the movable end surface of the spring column, and the connecting seat and the slide are slidably connected.

[0011] Preferably, the sorting module further comprises a stopper; the stopper is fixed on the adsorption head, and the stopper can contact and cooperate with the receiving tray.

[0012] Preferably, the sorting module further comprises a reset member; the reset member is fixed on the housing of the driving unit 1, and the bottom surface of the reset member can be in contact with and cooperate with the transmission plate 2.

[0013] Preferably, the height of the brake plate is equal to the sum of the height of the press frame and the downward travel of the press frame.

[0014] Preferably, the plurality of wafer slots are evenly divided into a plurality of rows; and the wafer slots run through the bottom surface of the receiving tray.

[0015] Preferably, a carrier plate capable of moving up and down in the wafer slot is arranged in the wafer slot, and a shaft rod is arranged below the carrier plate, and the downward movement stroke of the carrier plate is indicated by the angle of rotation of the shaft rod around its own central axis.

[0016] Preferably, the wafer slots in the same row are penetrated by a shaft.

[0017] Compared with the prior art, the present invention provides a quartz wafer arrangement machine wafer positioning mechanism, which has the following beneficial effects:

[0018] 1. When inspecting and sorting quartz wafers, the automatic transportation and thickness inspection of quartz wafers can be realized, and the inspection efficiency is high; through the cooperation of two electrodes, the thickness of quartz wafers can be inspected by electrical measurement, and the inspection accuracy is high.

[0019] 2. The wafers are stored through the wafer slots in the receiving tray, and the depths of the wafer slots on different receiving trays are made inconsistent, so that wafers of different sorting types can be placed in the wafer slots of different receiving trays; through the multiple wafer slots on the receiving tray, the orderly storage of multiple wafers is achieved.

[0020] 3. On the same receiving tray, the distance from the upper surface of each wafer to the upper surface of the receiving tray is consistent; on different receiving trays, the distance from the upper surface of the wafer to the upper surface of the tray is consistent; this makes it easy to remove the wafer from the receiving tray, providing convenience for the next step of processing the wafer.

[0021] 4. The wafer is clamped and positioned in the wafer slot; the wafer is kept positioned in the wafer slot by the cooperation of the positioning member with braking state and unlocking state and the wafer positioning device; the wafer clamping and positioning is released by the cooperation of the positioning member with braking state and unlocking state and the ejector pin on the sorting module to facilitate the removal of the wafer; the arrangement and positioning of the wafer are realized, the transportation of the wafer is convenient, and the wafer can be directly taken out.

[0022] 5. By setting the wafer slot as a through slot that runs through from top to bottom, and setting a carrier plate in the wafer slot that can move downward as the wafer moves downward, and setting an indicating structure for indicating the downward movement of the carrier plate, the wafer sorting type in the wafer slot can be displayed, so that the same receiving tray can be used to collect wafers of the same sorting type, and can also be used to collect different types of wafers, that is, different types of wafers are collected in different columns of wafer slots on the same receiving tray, thereby achieving the versatility of the receiving tray, reducing the production cost, and effectively avoiding confusion during transportation, thereby reducing the occurrence of sorting situations. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention;

[0024] Figure 2 This is a partial structural diagram of Embodiment 1 of the present invention;

[0025] Figure 3 It is a schematic diagram of the coordination between the sorting module and the receiving module;

[0026] Figure 4 It is a partial structural diagram of the sorting module;

[0027] Figure 5 It is a partial structural schematic diagram of the material receiving module;

[0028] Figure 6 This is a schematic diagram of the internal structure of the receiving module;

[0029] Figure 7 It is a schematic diagram of the structure when the brake plate abuts against the side of the pressure frame;

[0030] Figure 8 This is a schematic diagram of the internal structure of a material receiving module according to Embodiment 2 of the present invention;

[0031] Fig. 9 This is a schematic diagram of the external structure of the material receiving module according to Embodiment 2 of the present invention;

[0032] Fig.10 Another schematic diagram of the external structure of the material receiving module of Example 2 of the present invention.

[0033] Among them: 1. workbench; 2. feeding module; 21. loading bin; 22. top block; 23. lifting block; 24. fixing plate; 25. driving device; 3. loading module; 4. detection module; 41. swing arm; 42. bottom platform; 43. driving unit 2; 44. electrode; 5. sorting module; 6. receiving module; 51. mechanical arm; 52. suction head; 53. ejector pin; 54. driving unit 1; 55. connecting seat; 56. slide; 57. linkage mechanism; 571. transmission plate 1; 572. transmission Movable plate 2; 573, guide groove; 574, spring column; 58, stopper; 59, reset member; 61, receiving tray; 62, wafer slot; 621, carrier plate; 622, shaft; 623, indicator device; 624, elastic member 1; 63, wafer positioning device; 631, pressurized airbag; 632, pressure frame; 6321, reset spring; 633, telescopic airbag; 64, positioning member; 641, positioning shaft; 642, unlocking plate; 643, brake plate; 644, elastic member 2; 65, cover plate. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example 1, please refer to Figures 1 to 7 A wafer positioning mechanism for a quartz wafer arrangement machine is used for sorting and classifying wafers and collecting wafers of different categories separately, including a workbench 1, a feeding module 2, a loading module 3, a detection module 4, a sorting module 5 and a receiving module 6; wherein the feeding module 2 is installed below the workbench 1, and part of the feeding module 2 extends above the workbench 1, the loading module 3, the detection module 4 and the sorting module 5 are all installed above the workbench 1, and the receiving module 6 is placed flat on the upper surface of the workbench 1.

[0036] The quartz wafer is transported to the loading station through the feeding module 2; the free end of the loading module 3 switches between the loading station and the detection station, and moves the wafer at the loading station to the detection station in a single piece; the detection module 4 performs thickness detection on the wafer at the detection station; the sorting module 5 sorts the wafer into the wafer slot 62 of different receiving modules 6 according to the detection result of the detection module 4.

[0037] The loading module 3 is a robot with a negative pressure suction head, which sucks the single wafer by negative pressure adsorption.

[0038] It should be noted that although Figure 1In the figure, only one receiving module 6 is shown, but in actual application, multiple receiving modules 6 are provided.

[0039] The material receiving module 6 includes a material receiving tray 61, and at least one wafer groove 62 is formed on the top surface of the material receiving tray 61. At least one wafer positioning device 63 is installed on the material receiving tray 61. The periphery of each wafer groove 62 is provided with a frame-shaped groove for accommodating the wafer positioning device 63. The wafer positioning devices 63 correspond to the wafer grooves 62 one by one, and the wafer positioning devices 63 are arranged around the wafer grooves 62; the wafer positioning devices 63 cooperate with the ejector pins 53 to position the wafer in the wafer groove 62.

[0040] In the above technical scheme, a large number of chips to be sorted are pre-stored in the feeding module 2 and are stacked up and down, and the number of chips in each layer is greater than or equal to one; the feeding module 2 moves the chips to the top of the workbench 1 in layers, and the loading module 3 transfers the chips at the feeding module 2 to the detection module 4 in pieces.

[0041] As a further explanation of the above technical solution, Figure 2 As shown, the feeding module 2 includes a fixed plate 24 connected and fixed below the workbench 1 through a column rod, a loading bin 21 for accommodating wafers is slidably installed on the upper part of the fixed plate 24, a top block 22 is slidably arranged inside the loading bin 21, a lifting block 23 is pluggably installed on the top block 22, part of the lifting block 23 extends outside the loading bin 21 and is connected to a driving device 25, and the driving device 25 is installed on the fixed plate 24; the lifting block 23 is driven by the driving device 25 to move from bottom to top, so that the top block 22 moves up to push the wafer to the outside of the loading bin 21 and above the workbench 1. It should be noted that a slot for the lifting block 23 to move is provided on the loading bin 21.

[0042] As a further description of the feeding module 2, this embodiment provides an example of a driving device 25, which includes a servo motor, two synchronous wheels, a synchronous belt, a screw and a moving seat, the servo motor is fixed below the fixed plate 24, the two synchronous wheels are respectively fixedly sleeved on the output end surface of the servo motor and the surface of the moving seat, the moving seat penetrates and rotates to connect the fixed plate 24 from top to bottom, the moving seat is sleeved on the surface of the screw, and the moving seat is connected to the screw in a transmission manner, the upper part of the screw is fixedly connected to the lifting block 23, the servo motor drives the synchronous wheel connected thereto to rotate, the synchronous belt is actuated and drives another synchronous wheel to rotate, so that the moving seat rotates and drives the screw to move from bottom to top, and the lifting block 23 is moved from bottom to top. In other examples, the driving device 25 can be a power machine that directly outputs linear motion, such as an electric push rod, a hydraulic rod, etc., and the power machine housing is fixed on the fixed plate 24, the output end of the power machine is fixedly connected to the lifting block 23, and the lifting block 23 is directly driven by the power machine to move up and down.

[0043] As a further illustration of the above technical solution, the detection module 4 measures the thickness of the wafer by electrical measurement. Figure 2 As shown, the detection module 4 includes a base 42 and a driving unit 2 43 installed on the upper surface of the workbench 1. The output end surface of the driving unit 2 43 is fixedly sleeved with a swing arm 41, and electrodes 44 are installed on the swing arm 41 and the base 42; the wafer is placed between two electrodes 44 distributed above and below, and the upper and lower electrodes 44 cooperate to detect the thickness of the wafer. The driving unit 2 43 is used to drive the swing arm 41 to swing so that the upper electrode 44 can be relative to the lower electrode 44. When the upper electrode 44 moves and swings to the side of the lower electrode 44 in the horizontal direction, it is convenient for the negative pressure suction head of the feeding module 3 and the working end of the sorting module 5 to move to the top of the base 42. It should be noted that this embodiment provides an example of the driving unit 2 43. In this example, the driving unit 2 43 is a servo motor. In other examples, the driving unit 2 43 can be a rotary cylinder or other device that directly outputs rotary motion.

[0044] Through the above structural setting, the loading station is when the negative pressure suction head of the loading module 3 moves to above the loading bin 21; the detection station is when the negative pressure suction head of the loading module 3 moves to above the lower electrode 44.

[0045] As a further explanation of the above technical solution, Figure 2 , Figure 3 and Figure 4 As shown, the sorting module 5 includes a mechanical arm 51, an adsorption head 52, an ejector pin 53, a drive unit 54, a connecting seat 55 and a slide 56. The moving end of the mechanical arm 51 is fixedly connected to the housing of the drive unit 54, and the output end of the drive unit 54 is vertically downward and connected and fixed to the connecting seat 55. The connecting seat 55 has a through opening that passes through from top to bottom, and the slide 56 is located in the through opening. The connecting seat 55 and the slide 56 are configured to slide relative to each other through the through opening; the lower end of the connecting seat 55 is fixedly connected to the ejector pin 53, and the slide 56 is fixedly sleeved on the outer surface of the adsorption head 52; the adsorption head 52 and the ejector pin 53 are driven to reciprocate up and down by the drive unit 54. It should be noted that this embodiment provides an example of the drive unit 54, in which the drive unit 54 is a cylinder. In other examples, the drive unit 54 can be an electric push rod, a hydraulic rod or other device that can directly output linear motion.

[0046] As a further illustration of the sorting module 5, Figure 4 As shown, the sorting module 5 further includes a linkage mechanism 57 , a stopper 58 and a reset member 59 .

[0047] The linkage mechanism 57 is arranged between the connection seat 55 and the slide 56. The linkage mechanism 57 has a first state in which the connection seat 55 and the slide 56 move downward together before the wafer moves downward to a specified depth in the wafer slot 62, and a second state in which the connection seat 55 and the slide 56 have relative motion after the wafer moves downward to a specified depth in the wafer slot 62. Specifically, the linkage mechanism 57 includes a transmission plate 1 571, a transmission plate 2 572 and a spring column 574. The transmission plate 1 571 is fixed on the upper surface of the connection seat 55, the transmission plate 2 572 is fixed on the upper surface of the slide 56, and a vertically distributed long elliptical guide groove 573 is provided on the end surface of the transmission plate 2 572 facing the transmission plate 1 571. The spring column 574 is embedded in the transmission plate 2 572, and the sliding end of the spring column 574 is located in the guide groove 573. A part of the transmission plate 1 571 extends into the guide groove 573 and is detachably sleeved on the movable end surface of the spring column 574.

[0048] When the output end of the driving unit 1 54 is pushed out and drives the connecting seat 55 to move downward, the sleeve connection between the transmission plate 1 571 and the movable end of the spring column 574 causes the slide 56 to move downward together with the connecting seat 55, thereby causing the ejector pin 53 and the wafer adsorbed on the adsorption head 52 to move downward together; when the wafer moves down to a specified depth in the wafer groove 62, as the output end of the driving unit 1 54 is further pushed out, the slide 56 stops moving downward, and the connecting seat 55 moves downward further, causing the transmission plate 1 571 to move downward relative to the transmission plate 2 572 and disengage from the spring column 574, until the ejector pin 53 pushes the wafer positioning device 63 to clamp and position the wafer.

[0049] After the wafer is positioned in the wafer slot 62 , the adsorption head 52 desorbs the wafer, and the output end of the driving unit 1 54 is retracted, so that the connecting seat 55 and the slide 56 move upward, and the ejector pin 53 and the adsorption head 52 are pulled up.

[0050] The stopper 58 is fixed on the suction head 52, and is configured to contact and cooperate with the receiving tray 61 when the chip moves down to a specified depth in the chip slot 62, so as to prevent the suction head 52 from continuing to move downward and press the chip when the driving unit 1 54 drives the ejector pin 53 to continue to move downward, thereby switching the linkage mechanism 57 from the first state to the second state.

[0051] It should be noted that, in the present embodiment, the wafer slot 62 is a semi-closed slot, and the wafer enters and exits the wafer slot 62 from the upper opening of the wafer slot 62, and for multiple receiving trays 61, different receiving trays 61 are respectively used to collect wafers of different sorting categories, that is, the depths of the wafer slots 62 of different receiving trays 61 are inconsistent.

[0052] The specified downward movement depth of the chip in the chip slot 62 refers to the depth when the stopper 58 contacts the receiving tray 61. Therefore, although chips of different sorting types are collected in different receiving trays 61, the distance from the upper surface of each chip to the lower surface of the receiving tray 61 will remain consistent, so that the pushing stroke of the output end of the drive unit 54 will remain consistent when it is pushed out multiple times. When the robot is subsequently used to take out chips from different receiving trays 61, the longitudinal movement stroke of the robot relative to the chip can remain consistent, which simplifies the convenience of setting the robot movement parameters, thereby improving the convenience of chip removal.

[0053] The reset member 59 is fixed on the housing of the driving unit 54. The reset member 59 cooperates with the output end of the driving unit 54 to switch the linkage mechanism 57 from the second state to the first state. That is, when the output end of the driving unit 54 is retracted and drives the connecting seat 55 to move upward, after the transmission plate 2 572 contacts the bottom surface of the reset member 59, as the output end of the driving unit 54 is further retracted, the transmission plate 2 572 and the transmission plate 1 571 slide relative to each other, so that the transmission plate 1 571 is again clamped on the active end surface of the spring column 574.

[0054] As a further explanation of the above technical solution, Figure 3 , Figure 5 and Figure 6 As shown, the wafer positioning device 63 further includes a pressurized airbag 631, a pressure frame 632, a positioning member 64 and a cover plate 65. The positioning member 64 is disposed on the receiving tray 61 and is located on one side of the wafer positioning device 63. The cover plate 65 is detachably fixed to the upper surface of the receiving tray 61.

[0055] The pressurized airbag 631 and the pressure frame 632 are both embedded in the receiving tray 61 and are both arranged around the wafer groove 62. The pressure frame 632 is fixed on the upper part of the pressurized airbag 631. The pressure frame 632 matches the frame-shaped groove. The pressurized airbag 631 is accommodated in the frame-shaped groove. The horizontal cross-sectional area of ​​the inner cavity of the pressure frame 632 is larger than the horizontal cross-sectional area of ​​the wafer groove 62. The upper surface of the pressure frame 632 is configured to be able to contact and cooperate with the lower surface of the ejector pin 53, so that when the ejector pin 53 contacts the upper surface of the pressure frame 632 and moves downward, the pressurized airbag 631 can be compressed; the inner wall of the pressurized airbag 631 is fixedly connected with a telescopic airbag 633 all around, and the telescopic airbag 633 is arranged in a connecting port reserved between the frame-shaped groove and the wafer groove 62. The telescopic airbag 633 is configured to extend into the wafer groove 62 and contact the side elevation of the wafer when the ejector pin 53 and the pressure frame 632 cooperate to press down the pressurized airbag 631, so as to clamp the wafer in place.

[0056] Part of the positioning member 64 has a braking state in which it moves to the upper surface of the pressure frame 632 when the telescopic airbag 633 clamps the positioning wafer, and an unlocking state in which it detaches from the pressure frame 632 before the wafer is moved out of the wafer slot 62. Specifically, the positioning member 64 includes a positioning shaft 641, the lower end of which is embedded in the receiving tray 61 and rotatably cooperates with the receiving tray 61, the upper end of the positioning shaft 641 passes through the cover plate 65 and is fixedly connected with an unlocking plate 642, and a braking plate 643 and an elastic member 2 644 are fixedly sleeved on the surface of the positioning shaft 641 between the receiving tray 61 and the cover plate 65; the height of the braking plate 643 is equal to the sum of the height of the pressure frame 632 and the downward travel of the pressure frame 632, and part of the elastic member 2 644 is embedded in the receiving tray 61. When the pressure frame 632 does not pressurize the pressurized airbag 631, the braking plate 643 contacts the side elevation of the pressure frame 632, such as Figure 7 As shown, the second elastic member 644 is in an elastic deformation state; after the pressing frame 632 moves downward to pressurize the pressurized airbag 631, the second elastic member 644 releases energy, pushes the positioning shaft 641 to rotate, and moves the brake plate 643 to the upper surface of the pressing frame 632, so that the pressing frame 632 is held and enters a braking state. It should be noted that the second elastic member 644 is any one of a coil spring and a torsion spring.

[0057] It should be noted that the unlocking plate 642 is configured to rotate around the positioning shaft 641 to drive the positioning shaft 641 to rotate, so that the brake plate 643 rotates away from the pressing frame 632 and enters the unlocking state. The unlocking plate 642 is also configured to cooperate with the ejector pin 53, and the ejector pin 53 moves horizontally to drive the unlocking plate 642 to rotate, so as to achieve automatic unlocking, so that when taking out the wafer, the sorting module 5 can be installed at the taking out station to take out the wafer.

[0058] A return spring 6321 is arranged between the pressing frame 632 and the receiving tray 61. When the pressing frame 632 presses down the pressurized airbag 631, the return spring 6321 is compressed to accumulate elastic potential energy for the pressing frame 632 to move upward and reset, so that when the positioning piece 64 is unlocked, the pressurized airbag 631 can be quickly reset to release the clamping positioning of the chip.

[0059] The cover plate 65 is provided with holes for the ejector pins 53 to pass through and holes for the wafer to pass through.

[0060] In this embodiment, when performing wafer thickness detection and wafer arrangement positioning, the driving device 25 first drives the lifting block 23 to move upward in a step-by-step manner, so that the top block 22 moves upward and the wafer is pushed above the workbench 1. Then, the driving device 25 is paused, and the negative pressure suction head in the loading module 3 moves to the top of the loading bin 21 and absorbs a wafer by negative pressure adsorption. After that, the negative pressure suction head moves to one side of the bottom platform 42 together with the wafer. At the same time, the driving unit 2 43 drives the swing arm 41 to swing, so that the upper electrode 44 swings to one side, so that the negative pressure suction head and the wafer are It can move to the top of the base 42; after the negative pressure suction head and the chip move to the top of the base 42 and face the lower electrode 44 up and down, the negative pressure suction head desorbs, so that the chip is placed horizontally on the base 42, and then, the negative pressure suction head moves to the side of the upper silo 21 to suck and transfer the second chip, and the driving unit 243 drives the swing arm 41 to swing back, so that the upper electrode 44 moves back to above the lower electrode 44, so that the chip is located between the upper and lower electrodes 44; then, the upper and lower electrodes 44 cooperate to measure the thickness of the chip by point measurement.

[0061] After measuring the thickness of the wafer, the second driving unit 43 drives the swing arm 41 to swing again, so that the upper electrode 44 swings to one side, and then the mechanical arm 51 drives the adsorption head 52 to move, so that the adsorption head 52 moves to the top of the bottom table 42, and the adsorption head 52 adsorbs the wafer whose thickness has been measured on the bottom table 42 by negative pressure adsorption, and then the mechanical arm 51 drives the adsorption head 52 and the wafer to move to one side of the receiving module 6;

[0062] After the suction head 52 and the wafer move to above the corresponding wafer slot 62, the robot 51 pauses, and the driving unit 1 54 drives the connecting seat 55 to move downward, driving the wafer, the ejector pin 53 and the suction head 52 to move toward the wafer slot 62, so that the lower part of the wafer moves downward through the cover plate 65 and enters the inner side of the pressurized airbag 631, and then the ejector pin 53 moves downward through the cover plate 65 and contacts the upper surface of the pressing frame 632, pushing the pressing frame 632 downward to squeeze the pressurized airbag 631, pushing the gas in the pressurized airbag 631 into the telescopic airbag 633, so that the telescopic airbag 633 stretches to contact the side of the wafer, and the wafer is clamped and positioned;

[0063] After the pressure frame 632 moves down to below the brake plate 643, the elastic member 644 drives the positioning shaft 641 to swing, and swings the brake plate 643 to above the pressure frame 632, so that the pressure frame 632 does not move up, and the pressurized airbag 631 remains in a compressed state, and the telescopic airbag 633 remains in an extended state to contact the side of the chip, thereby realizing the positioning of the chip in the chip slot 62.

[0064] Example 2, please refer to Figures 8 to 10, a wafer positioning mechanism for a quartz wafer arrangement machine, which is different from Example 1 in that the wafer slots 62 on the same receiving tray 61 are divided into multiple columns, and the sorting module 5 can also sort the wafers into the wafer slots 62 of different columns of the same receiving module 6 according to the detection results of the detection module 4.

[0065] The wafer slot 62 is a through slot that runs through from top to bottom, that is, the wafer slot 62 passes through the bottom surface of the receiving tray 61. A carrier plate 621 is provided in the wafer slot 62. The carrier plate 621 is used to carry the wafer and moves down as the wafer moves down in the wafer slot 62. When no wafer is carried, the distance from the upper surface of the carrier plate 621 to the upper surface of the receiving tray 61 is less than the minimum thickness of the wafer and is an integer. A shaft rod 622 is provided below the carrier plate 621. The two ends of the shaft rod 622 pass through the two end surfaces of the receiving tray 61 respectively, and the shaft rod 622 rotates in cooperation with the receiving tray 61; the carrier plate 621 is configured to be able to move back and forth up and down in the wafer slot 62, and the downward movement of the carrier plate 621 drives the shaft rod 622 to deflect around its own axis.

[0066] An indicating device 623 for indicating the deflection angle of the shaft 622 is arranged between one end of the shaft 622 and the receiving tray 61. The indicating device 623 is composed of a pointer fixed on the shaft 622 and an angle plate fixed on the receiving tray 61. The zero scale line of the angle plate is set in the center, and the angle areas on both sides of the zero scale line are respectively a positive angle area and a negative angle area. When the carrier 621 does not carry a wafer or the thickness of the wafer carried is less than the standard value, the pointer points to the negative angle area of ​​the angle plate; when the thickness of the wafer on the carrier 621 is the standard value, the pointer points to the zero scale line, such as Figure 8 and Fig. 9 As shown; when the thickness of the wafer carried on the carrier 621 is greater than the standard value, the pointer points to the positive angle area of ​​the angle plate.

[0067] An elastic member 624 is provided between the other end of the shaft 622 and the receiving tray 61 to drive the shaft 622 to reset. The elastic member 624 is kept in an elastically deformed state, and the elastic potential energy of the elastic member 624 is used to drive the shaft 622 to rotate, so that the carrier 621 has a tendency to move upward when no wafer is loaded. It should be noted that the elastic member 624 is any one of a coil spring and a torsion spring.

[0068] It should be noted that, in the present embodiment, the number of the shafts 622 is the same as the number of the rows of the wafer slots 62 , and a plurality of wafer slots 62 in the same row are penetrated by one shaft 622 .

[0069] Through the above-mentioned structural design, the material receiving module 6 in this embodiment can be used to collect chips of the same sorting type, and can also collect chips of different sorting types, that is, chips of different sorting types are placed in chip slots 62 in different columns, and the corresponding sorting type is displayed through the cooperation of the pointer and the angle plate, so that the material receiving module 6 has universality.

[0070] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer positioning mechanism for a quartz wafer arrangement machine, comprising a workbench (1), a feeding module (2) and a loading module (3), characterized in that: It also comprises a detection module (4), a sorting module (5) and a receiving module (6); the detection module (4) is used to detect the thickness of the wafer, and the sorting module (5) is used to place the detected wafer into the receiving module (6); The detection module (4) comprises a second drive unit (43) and two electrodes (44) distributed in an upper and lower manner, wherein the upper electrode (44) is fixedly connected to the movable end of the second drive unit (43), and the second drive unit (43) and the lower electrode (44) are both fixedly connected to the workbench (1); The sorting module (5) comprises a mechanical arm (51) and a driving unit (54) arranged at a sliding end of the mechanical arm (51); a linkage mechanism (57) and a ejector pin (53) are installed at the movable end of the driving unit (54) via a connecting seat (55); and a suction head (52) is installed at the linkage mechanism (57) via a sliding platform (56); The receiving module (6) comprises a receiving tray (61), a top surface of which is provided with a plurality of wafer slots (62), a frame-shaped slot for accommodating a wafer positioning device (63) being arranged at the periphery of each wafer slot (62), and a positioning member (64) which can be elastically rotated is arranged on the receiving tray (61) and located on one side of the wafer positioning device (63); The wafer positioning device (63) comprises a pressing frame (632) matched with the frame-shaped groove, a pressurized airbag (631) accommodated in the frame-shaped groove is arranged at the bottom of the pressing frame (632), and a telescopic airbag (633) is fixedly connected to the inner wall of the pressurized airbag (631) on all sides, and the telescopic airbag (633) is arranged in a connecting port reserved between the frame-shaped groove and the wafer groove (62); The positioning member (64) comprises a positioning shaft (641) elastically arranged on the material receiving tray (61) via a second elastic member (644), and an unlocking plate (642) and a braking plate (643) are sleeved on the positioning shaft (641).

2. A quartz wafer arrangement machine wafer positioning mechanism according to claim 1, characterized in that: The linkage mechanism (57) comprises a transmission plate 1 (571) fixed on the upper surface of the connecting seat (55), a transmission plate 2 (572) fixed on the upper surface of the slide (56), and a spring column (574); the transmission plate 2 (572) is provided with a vertically distributed guide groove (573); the spring column (574) is embedded in the transmission plate 2 (572), and the sliding end of the spring column (574) is located in the guide groove (573); a portion of the transmission plate 1 (571) extends into the guide groove (573) and is detachably sleeved on the movable end surface of the spring column (574); the connecting seat (55) and the slide (56) are slidably connected.

3. A quartz wafer arrangement machine wafer positioning mechanism according to claim 2, characterized in that: The sorting module (5) further comprises a stopper (58); the stopper (58) is fixed on the adsorption head (52), and the stopper (58) is capable of contacting and cooperating with the receiving tray (61).

4. A wafer positioning mechanism for a quartz wafer arrangement machine according to claim 3, characterized in that: The sorting module (5) further comprises a reset member (59); the reset member (59) is fixed on the housing of the first drive unit (54), and the bottom surface of the reset member (59) is capable of contacting and cooperating with the second transmission plate (572).

5. A quartz wafer arrangement machine wafer positioning mechanism according to claim 4, characterized in that: The height of the brake plate (643) is equal to the sum of the height of the pressing frame (632) and the downward travel of the pressing frame (632).

6. The wafer positioning mechanism of a quartz wafer arrangement machine according to claim 1, characterized in that: The plurality of wafer slots (62) are evenly divided into a plurality of rows; the wafer slots (62) penetrate the bottom surface of the receiving tray (61).

7. A wafer positioning mechanism for a quartz wafer arrangement machine according to claim 6, characterized in that: A carrier plate (621) capable of moving up and down in the wafer slot (62) is arranged in the wafer slot (62), and a shaft rod (622) is arranged below the carrier plate (621), and the downward movement stroke of the carrier plate (621) is indicated by the angle at which the shaft rod (622) rotates around its own central axis.

8. The wafer positioning mechanism of a quartz wafer arrangement machine according to claim 7, characterized in that: The wafer slots (62) in the same row are penetrated by a shaft (622).

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