Intelligent position error correction method and system for realizing SMT (Surface Mount Technology) based on automation

Abstract

The invention relates to the field of electronic engineering, and provides an intelligent position error correction method and system based on automatic SMT patching, and the method comprises the steps: firstly obtaining a to-be-corrected circuit board welding spot image and position data, carrying out the image enhancement and description marking, associating the welding spot description data with the preset SMT patching equipment historical operation data, and carrying out the image enhancement and description marking; potential abnormal data are inquired, deviation degree values of the potential abnormal data to real-time operation parameters are calculated, equipment fault types are analyzed according to the deviation degree values, abnormal parts and specific fault points are positioned, then an error correction planning target is formulated, error correction measures are analyzed, error correction standards are inquired, an error correction operation instruction is generated and sent to equipment to execute error correction operation, and an error correction circuit board is obtained; and finally, obtaining an error correction welding spot image for position verification, and generating a position error correction report based on verification data. According to the invention, the accuracy of the SMT position can be improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic engineering, and in particular to a method and system for realizing intelligent position error correction of SMT patches based on automation. Background Art

[0002] In today's society, the level of automation in the manufacturing industry continues to improve, and the importance of science and technology in industrial production has become increasingly prominent. Among them, surface mount technology (SMT), as one of the key technologies in the field of electronic manufacturing, has received widespread attention.

[0003] At present, SMT patch is an important production link in the electronic manufacturing industry. The mainstream SMT patch methods are mainly divided into three categories: manual patch, semi-automatic patch and fully automatic patch. Among them, fully automatic patch has obvious advantages over manual patch and semi-automatic patch due to its high efficiency and high precision, and has become the first choice of electronic manufacturing companies. However, in the patch process, the fully automated SMT equipment on the market will have patch position deviation problems due to various factors. These deviations will not only affect product quality, but may also cause problems in subsequent production links. Therefore, a method and system for intelligent error correction of SMT patch position based on automation is needed to improve the accuracy of SMT patch position. Summary of the invention

[0004] The present invention provides a method and system for realizing intelligent error correction of the position of SMT patches based on automation, the main purpose of which is to improve the accuracy of the position of SMT patches.

[0005] Acquire a solder joint image corresponding to the circuit board to be corrected, collect solder joint position data corresponding to the solder joint image, perform image enhancement processing on the solder joint image based on the solder joint position data to obtain a solder joint enhanced image, and describe and annotate the solder joint enhanced image to obtain solder joint description data;

[0006] The solder joint description data is associated with the historical operation data of the preset SMT patch equipment to obtain operation-associated data, potential abnormal data in the operation-associated data is queried, abnormal solder joint parameters corresponding to the potential abnormal data are screened, and real-time operation parameters of the preset SMT patch equipment are detected in real time, and the deviation degree value of the abnormal solder joint parameters to the real-time operation parameters is calculated;

[0007] Based on the deviation degree value, analyzing the fault type corresponding to the preset SMT patch equipment, locating the abnormal component in the preset SMT patch equipment based on the fault type, performing status detection on the abnormal component to obtain the actual status of the component, and querying the specific fault point in the actual status of the component;

[0008] Based on the specific fault point, formulate an error correction planning target corresponding to the circuit board to be corrected, analyze the error correction measures in the error correction planning target, query the error correction standard corresponding to the error correction measure, and generate an error correction operation instruction corresponding to the circuit board to be corrected based on the error correction standard;

[0009] After the error correction operation instruction is sent to the preset SMT patch equipment, the error correction operation is performed on the circuit board to be corrected to obtain the error correction circuit board, the error correction solder point image corresponding to the error correction circuit board is obtained, the solder point position verification is performed on the error correction solder point image to obtain position verification data, and based on the position verification data, a position correction report corresponding to the circuit board to be corrected is generated.

[0010] Optionally, the step of describing and annotating the weld enhancement image to obtain weld description data includes:

[0011] Performing feature extraction on the solder joint enhanced image to obtain a feature set;

[0012] Classifying and arranging the feature set to obtain classified data;

[0013] Performing quantitative evaluation on the classified data to obtain quantitative indicators;

[0014] Based on the quantitative index, determining a description annotation dimension corresponding to the weld spot enhanced image;

[0015] Based on the description and annotation dimension, the weld enhancement image is described and annotated to obtain weld description data.

[0016] Optionally, the step of associating the solder joint description data with historical operation data of a preset SMT patch device to obtain operation association data includes:

[0017] Deconstructing the solder joint description data to obtain deconstruction parameters;

[0018] extracting deconstruction factors from the deconstruction parameters;

[0019] Effectively screening the historical operation data of the preset SMT patch equipment to obtain effective historical data;

[0020] Calculating the correlation matching degree between the deconstruction factor and the operation factor in the valid historical data;

[0021] Based on the correlation matching degree, the solder joint description data is data-correlated with the historical operation data of a preset SMT patch equipment to obtain operation correlation data.

[0022] Optionally, the calculating the correlation matching degree between the deconstruction factor and the operation factor in the valid historical data includes:

[0023] The correlation matching degree between the deconstruction factor and the operation factor in the valid historical data is calculated using the following formula:

[0024]

[0025] Wherein, GD represents the correlation matching degree between the deconstruction factor and the operation factor in the valid historical data, N represents the total number of samples corresponding to the deconstruction factor and the operation factor in the valid historical data, i represents the sample index, m represents the number of features corresponding to the deconstruction factor and the operation factor in the valid historical data, j represents the feature index, and D ij represents the deconstructed value of the jth feature in the i-th sample, E ij Represents the running value of the running factor in the j-th valid historical data in the ith sample.

[0026] Optionally, the calculating the deviation degree value of the abnormal welding point parameter from the real-time operation parameter includes:

[0027] The deviation degree of the abnormal welding point parameters from the real-time operating parameters is calculated using the following formula:

[0028]

[0029] Wherein, PD represents the deviation degree value of the abnormal solder joint parameter to the real-time operation parameter, n′ represents the number of the abnormal solder joint parameter, i′ represents the number index of the abnormal solder joint parameter, E i′ represents the expected value of the parameter of the i′th abnormal solder joint, R i′ represents the actual value of the i′th real-time solder joint parameter, σ i′ represents the standard deviation of the i′th solder joint parameter, k represents the number of real-time monitoring data when calculating the real-time operating parameters of the equipment, m′ represents the number of parameters of the real-time operating parameters, j′ represents the number index of the real-time operating parameters, and A j′ Represents the relevant value of the j′th real-time operating parameter.

[0030] Optionally, analyzing the fault type corresponding to the preset SMT patch equipment based on the deviation degree value includes:

[0031] Constructing a deviation sequence corresponding to the deviation degree value;

[0032] Performing sequence classification on the deviation sequence to obtain classification deviation data;

[0033] Querying the type performance characteristics corresponding to the classification deviation data;

[0034] Based on the type performance characteristics, determine the fault type range corresponding to the preset SMT patch equipment;

[0035] Based on the fault type range, the fault type corresponding to the preset SMT patch equipment is analyzed.

[0036] Optionally, performing status detection on the abnormal component to obtain an actual status of the component includes:

[0037] Performing a preliminary visual inspection on the abnormal component to obtain preliminary inspection data;

[0038] Based on the preliminary inspection data, a comprehensive inspection is performed on the abnormal component to obtain comprehensive inspection parameters;

[0039] Performing data analysis on the comprehensive detection parameters to obtain a component performance index;

[0040] Based on the component performance index, analyzing the state characteristics corresponding to the abnormal component;

[0041] Classify and summarize the state characteristics to obtain summarized characteristics;

[0042] Based on the summarized features, the state of the abnormal component is detected to obtain the actual state of the component.

[0043] Optionally, formulating an error correction planning target corresponding to the circuit board to be corrected based on the specific fault point includes:

[0044] Identify the component fault point and the line fault point corresponding to the specific fault point;

[0045] Removing interference factors from the component fault point and the line fault point, and accurately analyzing the component fault point and the line fault point after the interference factors are removed to obtain accurate component fault information and accurate line fault information;

[0046] Extracting key fault features from the precise component fault information and the precise line fault information;

[0047] Based on the key fault characteristics and preset error correction planning criteria, an error correction planning target corresponding to the circuit board to be corrected is formulated.

[0048] Optionally, the generating, based on the error correction standard, an error correction operation instruction corresponding to the circuit board to be corrected includes:

[0049] Identify the fault type serial number corresponding to the error correction standard;

[0050] Based on the fault type serial number, the error correction standard is classified to obtain a classification standard;

[0051] Analyze the operation difficulty index corresponding to the classification standard;

[0052] Based on the operation difficulty index, determining an operation priority corresponding to the error correction operation;

[0053] Based on the operation priority, an error correction operation instruction corresponding to the circuit board to be corrected is generated.

[0054] Optionally, in order to solve the above problem, the present invention provides an intelligent position error correction system for SMT patches based on automation, the system comprising:

[0055] A description and annotation module is used to obtain a solder joint image corresponding to the circuit board to be corrected, collect solder joint position data corresponding to the solder joint image, perform image enhancement processing on the solder joint image based on the solder joint position data to obtain a solder joint enhanced image, and describe and annotate the solder joint enhanced image to obtain solder joint description data;

[0056] A deviation degree value calculation module is used to associate the solder joint description data with the historical operation data of the preset SMT patch equipment to obtain operation association data, query the potential abnormal data in the operation association data, filter the abnormal solder joint parameters corresponding to the potential abnormal data, and detect the real-time operation parameters of the preset SMT patch equipment in real time, and calculate the deviation degree value of the abnormal solder joint parameters to the real-time operation parameters;

[0057] A fault query module is used to analyze the fault type corresponding to the preset SMT patch equipment based on the deviation degree value, locate the abnormal component in the preset SMT patch equipment based on the fault type, perform status detection on the abnormal component, obtain the actual status of the component, and query the specific fault point in the actual status of the component;

[0058] An instruction generation module is used to formulate an error correction planning target corresponding to the circuit board to be corrected based on the specific fault point, analyze the error correction measures in the error correction planning target, query the error correction standard corresponding to the error correction measure, and generate an error correction operation instruction corresponding to the circuit board to be corrected based on the error correction standard;

[0059] A report generation module is used to send the error correction operation instruction to a preset SMT patch device, perform an error correction operation on the circuit board to be corrected, obtain the error correction circuit board, obtain the error correction solder point image corresponding to the error correction circuit board, perform solder point position verification on the error correction solder point image to obtain position verification data, and generate a position correction report corresponding to the circuit board to be corrected based on the position verification data.

[0060] Firstly, the present invention acquires the solder joint image corresponding to the circuit board to be corrected and collects the solder joint position data corresponding to the solder joint image, so as to intuitively present the actual status of the solder joint on the circuit board, provide a visual basis for subsequent analysis and correction, and can more clearly observe the shape, size, color and other characteristics of the solder joint, so as to quickly determine whether there is a problem. Collecting the solder joint position data can realize the precise positioning of the solder joint, which is helpful to accurately analyze whether the solder joint deviates from the preset position, and determine the degree and direction of the deviation. At the same time, the present invention associates the solder joint description data with the historical operation data of the preset SMT patch equipment to obtain the operation association data, so as to fully understand the performance of the current solder joint problem in the historical production, and can compare the shape, size, color and other characteristics of the current solder joint with the situation when similar problems occurred in history, so as to improve the stability of the equipment and the patch quality. Based on the deviation degree value, the present invention analyzes the fault type corresponding to the preset SMT patch equipment. The type can accurately judge the severity of the problem of the equipment, can take relatively simple measures to correct it in time, avoid the problem from further expanding, can carry out targeted troubleshooting and repair, greatly improve the maintenance efficiency, reduce the equipment downtime, and thus reduce production losses. The present invention is based on the specific fault point, formulates the error correction planning target corresponding to the circuit board to be corrected, can accurately focus on the core of the problem, make the error correction action more targeted, can directly design for the fault, avoid unnecessary waste of resources and time consumption, and greatly improve the error correction efficiency. Further, the present invention sends the error correction operation instruction to the preset SMT patch equipment, performs the error correction operation on the circuit board to be corrected, obtains the error correction circuit board, can quickly restore the normal operation of the equipment, can solve the circuit board fault problem in time, put the SMT patch equipment back into production, avoid production stagnation caused by equipment failure, improve production efficiency, and reduce economic losses. Therefore, the intelligent error correction method and system for realizing the position of SMT patches based on automation proposed by the present invention can improve the accuracy of the position of SMT patches. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 A schematic flow chart of a health management method under adjustment of a skeletal tubular structure provided by an embodiment of the present invention;

[0062] Figure 2 A schematic diagram of a module of an SMT patch position intelligent error correction system based on automation provided in one embodiment of the present invention.

[0063] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0064] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0065] The embodiment of the present application provides a health management method under the adjustment of the skeletal tubular structure. The execution subject of the health management method under the adjustment of the skeletal tubular structure includes but is not limited to at least one of the electronic devices such as the server and the terminal that can be configured to execute the method provided by the embodiment of the present application. In other words, the health management method under the adjustment of the skeletal tubular structure can be executed by software or hardware installed on the terminal device or the server device, and the software can be a blockchain platform. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc. The server can be an independent server, or it can be a cloud server that provides cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN), and basic cloud computing services such as big data and artificial intelligence platforms.

[0066] Reference Figure 1 FIG. 1 is a flow chart of a health management method under the adjustment of a skeletal tubular structure provided by an embodiment of the present invention. In this embodiment, the health management method under the adjustment of a skeletal tubular structure includes:

[0067] S1. Obtain a solder joint image corresponding to a circuit board to be corrected, collect solder joint position data corresponding to the solder joint image, perform image enhancement processing on the solder joint image based on the solder joint position data to obtain a solder joint enhanced image, and describe and annotate the solder joint enhanced image to obtain solder joint description data.

[0068] The present invention obtains the solder point image corresponding to the circuit board to be corrected and collects the solder point position data corresponding to the solder point image, so as to intuitively present the actual status of the solder points on the circuit board, provide a visual basis for subsequent analysis and correction, and can more clearly observe the shape, size, color and other characteristics of the solder points so as to quickly determine whether there is a problem. Collecting the solder point position data can achieve precise positioning of the solder points, which helps to accurately analyze whether the solder points have deviated from the preset positions, and determine the degree and direction of the deviation.

[0069] Among them, the circuit board to be corrected refers to a circuit board that needs to be corrected due to position deviation and other problems during the SMT patch process; the solder joint image refers to a visualized image of the solder joint on the circuit board to be corrected obtained by a specific image acquisition device, and the image can present the appearance, shape, color and other characteristics of the solder joint; the solder joint position data refers to the specific position information of each solder joint on the circuit board to be corrected in a specific coordinate system obtained by measurement or calculation, including data such as the horizontal coordinate, the vertical coordinate and the height. Optionally, the acquisition of the solder joint image corresponding to the circuit board to be corrected can be achieved by a high-resolution industrial camera, such as: a CMOS or CCD industrial camera with high pixels and low noise can be used, installed in a suitable position, and the circuit board can be photographed from multiple angles to ensure that a clear and comprehensive solder joint image is obtained; the acquisition of the solder joint position data corresponding to the solder joint image can be achieved by a template matching algorithm, such as: using a template matching algorithm to find an area similar to the template in the solder joint image, so as to determine the position of the solder joint.

[0070] Furthermore, the present invention performs image enhancement processing on the solder joint image based on the solder joint position data to obtain a solder joint enhanced image, which can more specifically enhance the specific solder joint area and make the less clear solder joints more prominent in the image, so that technicians can more accurately observe the detailed features of the solder joints, such as shape, edge conditions, and connection status with surrounding components. The enhanced solder joint image helps to improve the accuracy of subsequent analysis and error correction.

[0071] Among them, the solder joint enhanced image refers to an image obtained by performing specific image enhancement processing on the acquired solder joint image of the circuit board to be corrected according to the solder joint position data, and its contrast, clarity, brightness, etc. are significantly improved, making the characteristics of the solder joint more obvious and prominent. Optionally, the image enhancement processing of the solder joint image can be achieved through histogram equalization, such as: by adjusting the grayscale distribution of the image to make the grayscale histogram of the image more uniform, thereby enhancing the contrast of the image.

[0072] Furthermore, the present invention obtains solder joint description data by describing and annotating the solder joint enhanced image, and can convert the complex information in the solder joint enhanced image into a more understandable processing form, so that the characteristics and status of the solder joint can be understood more intuitively, and the specific characteristics of the solder joint such as shape, size, color, brightness, etc. can be clarified, providing an accurate basis for subsequent analysis and error correction.

[0073] The solder joint description data refers to data obtained after detailed description and annotation of the solder joint enhanced image based on the description annotation dimension, including specific description information of each feature of the solder joint in different dimensions.

[0074] As an embodiment of the present invention, the describing and annotating the weld enhanced image to obtain weld description data includes: extracting features from the weld enhanced image to obtain a feature set; classifying and arranging the feature set to obtain classified data; quantitatively evaluating the classified data to obtain quantitative indicators; determining the description and annotation dimensions corresponding to the weld enhanced image based on the quantitative indicators; and describing and annotating the weld enhanced image based on the description and annotation dimensions to obtain weld description data.

[0075] Among them, the feature set refers to the summary of various solder joint features extracted from the solder joint enhanced image, including but not limited to the shape, size, color, brightness, contrast, edge clarity and other features of the solder joint; the classified data refers to the data obtained after classifying the various features in the feature set according to certain standards, for example, the shape features are divided into categories such as round, square, irregular, etc.; the color features are divided into categories such as red, blue, green, etc.; the quantitative index refers to the specific value or index obtained after quantitative evaluation of the classified data, for example, for a solder joint with a circular shape, its quantitative index can be the roundness value; for a solder joint with a red color, its quantitative index can be the chromaticity value range of red; the description and annotation dimensions refer to the different aspects or angles used to describe and annotate the solder joint enhanced image, for example, shape dimension, color dimension, size dimension, brightness dimension, etc.

[0076] Furthermore, the feature extraction of the weld enhanced image can be achieved through feature detection technology, such as edge detection, corner detection, etc.; the classification and organization of the feature set can be achieved through a clustering algorithm, such as K-Means clustering, DBSCAN clustering, etc.; the quantitative evaluation of the classified data can be achieved through a weighted average algorithm, such as: for welds with multiple classification features, a certain weight can be assigned to each feature, and then numerical assignment is performed according to the classification situation, and finally a comprehensive quantitative value is calculated by weighted average; the determination of the description and annotation dimensions corresponding to the weld enhanced image can be achieved through a hierarchical analysis method, such as: hierarchical division of the weld features, construction of a hierarchical structure model, and determination of the weights of each dimension by pairwise comparison, thereby determining the main description and annotation dimensions; the description and annotation of the weld enhanced image can be achieved through image annotation tools, such as: LabelImg and other tools.

[0077] S2. Associate the solder joint description data with the historical operation data of the preset SMT patch equipment to obtain operation association data, query the potential abnormal data in the operation association data, filter the abnormal solder joint parameters corresponding to the potential abnormal data, and detect the real-time operation parameters of the preset SMT patch equipment in real time, and calculate the deviation degree value of the abnormal solder joint parameters from the real-time operation parameters.

[0078] The present invention obtains operation correlation data by correlating the solder joint description data with the historical operation data of a preset SMT patch equipment, so as to fully understand the performance of the current solder joint problem in historical production, and compare the shape, size, color and other characteristics of the current solder joint with the situations when similar problems occurred in history, thereby improving the stability of the equipment and the patch quality.

[0079] Among them, the preset SMT patch equipment refers to a pre-set device for performing surface mount technology patch operations, usually with specific models, specifications and performance parameters; the historical operation data refers to various data records generated by the preset SMT patch equipment during its past operation, including equipment operating parameters, patch result data, fault records, etc.; the operation association data refers to a new data set obtained by associating the solder joint description data with the historical operation data of the preset SMT patch equipment, which reflects the relationship between the solder joint description data and the historical operation data.

[0080] As an embodiment of the present invention, the solder joint description data is data-associated with the historical operation data of a preset SMT patch device to obtain operation-associated data, including: data deconstructing the solder joint description data to obtain deconstruction parameters; extracting deconstruction factors in the deconstruction parameters; effectively screening the historical operation data of the preset SMT patch device to obtain effective historical data; calculating the correlation matching degree corresponding to the deconstruction factor and the operation factor in the effective historical data; based on the correlation matching degree, data-associating the solder joint description data with the historical operation data of the preset SMT patch device to obtain operation-associated data.

[0081] Among them, the deconstruction parameters refer to a series of specific parameters obtained after deconstructing the solder joint description data, which reflect different aspects and characteristics of the solder joint description data, such as the shape parameters, color parameters, size parameters, etc. of the solder joint; the deconstruction factors refer to representative and key factors extracted from the deconstruction parameters, which can more concentratedly reflect the core characteristics of the solder joint description data, such as key size parameters corresponding to solder joints of specific shapes; the valid historical data refers to data with actual reference value and availability obtained after effective screening from historical operating data, and invalid, erroneous or redundant data is removed; the correlation matching degree refers to a quantitative indicator of the similarity or correlation between the deconstruction factors and the operating factors in the valid historical data, which is used to measure the matching degree between the two.

[0082] Furthermore, the data deconstruction of the solder joint description data can be achieved through a principal component analysis algorithm, such as: multiple features of the solder joint description data can be decomposed by dimensionality reduction, and the main components can be extracted as deconstruction parameters; the extraction of deconstruction factors in the deconstruction parameters can be achieved through a decision tree algorithm, such as: branch judgment can be made according to the importance of different features, and key deconstruction factors can be extracted; the effective screening of the historical operation data of the preset SMT patch equipment can be achieved through an anomaly detection algorithm, such as: a statistical method or an isolation forest algorithm in machine learning; the calculation of the correlation matching degree between the deconstruction factor and the operation factor in the effective historical data can be achieved by utilizing the following algorithm; the data association of the solder joint description data with the historical operation data of the preset SMT patch equipment can be achieved through data integration tools, such as: Talend, Informatica and other tools.

[0083] As an embodiment of the present invention, the calculating the correlation matching degree between the deconstruction factor and the operation factor in the valid historical data includes:

[0084] The correlation matching degree between the deconstruction factor and the operation factor in the valid historical data is calculated using the following formula:

[0085]

[0086] Wherein, GD represents the correlation matching degree between the deconstruction factor and the operation factor in the valid historical data, N represents the total number of samples corresponding to the deconstruction factor and the operation factor in the valid historical data, i represents the sample index, m represents the number of features corresponding to the deconstruction factor and the operation factor in the valid historical data, j represents the feature index, and D ij represents the deconstructed value of the jth feature in the i-th sample, E ij Represents the running value of the running factor in the j-th valid historical data in the ith sample.

[0087] The present invention queries the potential abnormal data in the operation-related data, screens the abnormal solder joint parameters corresponding to the potential abnormal data, and detects the real-time operation parameters of the preset SMT patch equipment in real time, so as to timely discover the problem points that may affect the quality of the SMT patch, and help to take measures to correct the problem before it further deteriorates, thereby avoiding serious product quality problems caused by the accumulation of small problems.

[0088] Among them, the potential abnormal data refers to those data that are different from the normal data pattern in the operation-related data and can indicate problems in the SMT patch process. These data can be significantly different from normal data in terms of numerical value, change trend, etc.; the abnormal solder joint parameters refer to specific parameters corresponding to solder joints that are different from normal solder joint characteristics, such as the irregularity of the shape of the solder joint, the size beyond the normal range, the color abnormality and other parameters, which can clarify the specific problems of the abnormal solder joints; the real-time operation parameters refer to the preset SMT temperature, pressure, current, voltage and other parameters. Optionally, the query of the potential abnormal data in the operation-related data can be achieved through data analysis tools, such as: Tableau can perform more complex data analysis and visualization to help discover potential abnormal data; the screening of abnormal solder joint parameters corresponding to the potential abnormal data can be achieved through data mining tools, such as: RapidMiner can perform data processing and feature extraction to help screen abnormal solder joint parameters; the real-time detection of the real-time operation parameters of the preset SMT patch equipment can be achieved through a sliding window algorithm, such as: by performing statistical analysis on the data within a certain time window, the change trend of the parameters can be monitored in real time.

[0089] By calculating the deviation degree of the abnormal solder joint parameters from the real-time operating parameters, the present invention can intuitively understand the impact of the abnormal solder joints on the equipment operation, provide an accurate basis for assessing the severity of the problem, help to quickly locate the root cause of the problem, and help determine whether it is a problem with the solder joint itself or caused by improper equipment operating parameters, so as to make targeted adjustments and repairs.

[0090] The deviation degree value refers to the quantitative value of the difference between the abnormal solder joint parameters and the preset real-time operating parameters of the SMT patch equipment, which reflects the degree of deviation of the abnormal solder joint from the normal operation of the equipment.

[0091] As an embodiment of the present invention, the calculating of the deviation degree of the abnormal welding point parameter from the real-time operation parameter includes:

[0092]

[0093] Wherein, PD represents the deviation degree value of the abnormal solder joint parameter to the real-time operation parameter, n′ represents the number of the abnormal solder joint parameter, i′ represents the number index of the abnormal solder joint parameter, E i′ represents the expected value of the parameter of the i′th abnormal solder joint, R i′ represents the actual value of the i′th real-time solder joint parameter, σ i′represents the standard deviation of the i′th solder joint parameter, k represents the number of real-time monitoring data when calculating the real-time operating parameters of the equipment, m′ represents the number of parameters of the real-time operating parameters, j′ represents the number index of the real-time operating parameters, and A j′ Represents the relevant value of the j′th real-time operating parameter.

[0094] S3. Based on the deviation degree value, analyze the fault type corresponding to the preset SMT patch equipment, locate the abnormal component in the preset SMT patch equipment based on the fault type, perform status detection on the abnormal component to obtain the actual status of the component, and query the specific fault point in the actual status of the component.

[0095] The present invention analyzes the fault type corresponding to the preset SMT patch equipment based on the deviation degree value, can accurately judge the severity of the problem of the equipment, can take relatively simple measures to correct it in time to avoid further expansion of the problem, can carry out targeted fault detection and repair, greatly improves maintenance efficiency, reduces equipment downtime, and thus reduces production losses.

[0096] The fault type refers to the specific fault type of the preset SMT patch equipment that is finally determined.

[0097] As an embodiment of the present invention, the fault type corresponding to the preset SMT patch equipment is analyzed based on the deviation degree value, including: constructing a deviation sequence corresponding to the deviation degree value; performing sequence classification on the deviation sequence to obtain classified deviation data; querying the type performance characteristics corresponding to the classified deviation data; based on the type performance characteristics, determining the fault type range corresponding to the preset SMT patch equipment; based on the fault type range, analyzing the fault type corresponding to the preset SMT patch equipment.

[0098] Among them, the deviation sequence refers to a sequence formed by arranging different deviation degree values ​​in a certain order. For example, the deviation degree values ​​calculated at different times can be arranged in chronological order, or sorted according to the size of the deviation degree values, etc.; the classified deviation data refers to a data set obtained after classifying the deviation sequence, which can be classified according to different classification standards, such as the size range of the deviation degree, the change trend of the deviation, etc.; the type performance characteristics refer to the specific characteristics of different fault types in the operation of the equipment. For example, a mechanical fault may manifest as abnormal equipment vibration, increased noise, etc.; an electrical fault may manifest as unstable current, voltage fluctuation, etc.; the fault type range refers to a set of possible fault types that may occur in a preset SMT patch device determined according to the type performance characteristics.

[0099] Furthermore, the construction of the deviation sequence corresponding to the deviation degree value can be achieved through a data sorting algorithm, such as quick sort, merge sort and other algorithms; the sequence classification of the deviation sequence can be achieved through a decision tree algorithm, such as building a decision tree to classify the deviation sequence; the query of the type performance characteristics corresponding to the classified deviation data can be achieved through a pattern matching algorithm, such as matching the classified deviation data with a known fault type pattern to determine the type performance characteristics; the determination of the fault type range corresponding to the preset SMT patch equipment can be achieved through a fuzzy logic method, such as determining the approximate fault type range through fuzzy reasoning; the analysis of the fault type corresponding to the preset SMT patch equipment can be achieved through a Bayesian network, such as constructing a Bayesian network model, using the classified deviation data, type performance characteristics, etc. as evidence nodes, calculating the posterior probabilities of different fault types through Bayesian reasoning, and determining the most likely fault type.

[0100] The present invention locates abnormal components in the preset SMT patch equipment based on the fault type, which can avoid blind inspection of the entire equipment, save a lot of time and labor costs, and help to accurately evaluate the severity and impact scope of the fault, and then judge the impact of the fault on the overall operation of the equipment and product quality, providing a basis for formulating reasonable maintenance strategies.

[0101] Among them, the abnormal component refers to a specific equipment component that exhibits an abnormal state due to the influence of the fault type in the preset SMT patch equipment. These components assume key functions during the normal operation of the equipment, such as a patch head, a conveying device, a visual inspection system, etc. Optionally, the positioning of the abnormal component in the preset SMT patch equipment can be achieved through a sensor device. For example, if the data from the sensor shows that the actual position of the patch head has a large deviation from the set position, then it can be preliminarily determined that the patch head is an abnormal component.

[0102] Furthermore, the present invention performs status detection on the abnormal component to obtain the actual status of the component, and can clarify detailed information such as the degree of damage and performance changes of the abnormal component, so as to determine whether to perform repair, replacement or adjustment, avoid blind measures, reduce maintenance costs, and accurately grasp the specific situation of the abnormal component to provide a reliable basis for subsequent maintenance decisions.

[0103] The actual status of the component refers to the real status of the abnormal component finally determined after a series of tests and analyses on the abnormal component, including specific status descriptions such as normal, minor fault, major fault, and need for replacement.

[0104] As an embodiment of the present invention, the state detection of the abnormal component to obtain the actual state of the component includes: performing a preliminary appearance inspection on the abnormal component to obtain preliminary inspection data; based on the preliminary inspection data, performing a comprehensive inspection on the abnormal component to obtain comprehensive inspection parameters; performing data analysis on the comprehensive inspection parameters to obtain a component performance index; based on the component performance index, analyzing the state characteristics corresponding to the abnormal component; classifying and summarizing the state characteristics to obtain summarized characteristics; based on the summarized characteristics, performing a state detection on the abnormal component to obtain the actual state of the component.

[0105] Among them, the preliminary inspection data refers to the data obtained when conducting a preliminary appearance inspection on the abnormal parts, including but not limited to whether there are obvious wear, scratches, deformation, corrosion, etc. on the surface of the parts, and whether the connection parts are loose, whether there is abnormal odor, and other intuitive information; the comprehensive detection parameters refer to various specific parameters obtained in the process of comprehensive detection of abnormal parts, which may include electrical parameters (such as voltage, current, resistance, etc.), mechanical parameters (such as dimensional accuracy, motion accuracy, vibration amplitude, etc.), optical parameters (such as transmittance, reflectivity, etc.) and other aspects of data; the component performance index refers to a comprehensive indicator obtained by analyzing and calculating the comprehensive detection parameters, which is used to quantify the performance level of the abnormal parts; the state characteristics refer to the specific state characteristics exhibited by the abnormal parts obtained according to the analysis of the component performance index, such as performance degradation, functional abnormality, unstable operation, etc.; the inductive characteristics refer to a more general feature description obtained after classifying and summarizing the state characteristics, such as summarizing multiple similar state characteristics into the same category, so as to better understand the overall state pattern of the abnormal parts.

[0106] Furthermore, the preliminary appearance inspection of the abnormal component can be achieved through a magnifying glass-assisted inspection, such as using a magnifying glass to magnify the local area of ​​the abnormal component so as to observe subtle defects more clearly; the comprehensive inspection of the abnormal component can be achieved through professional inspection equipment, such as an oscilloscope, a multimeter, a spectrum analyzer, etc.; the data analysis of the comprehensive inspection parameters can be achieved through data analysis tools, such as Excel, R, SPSS and other tools; the analysis of the state characteristics corresponding to the abnormal component can be achieved through a pattern recognition algorithm, such as determining the state characteristics of the abnormal component by performing pattern recognition on the inspection data; the classification and induction of the state characteristics can be achieved through a clustering analysis algorithm, such as classifying similar state characteristics into one category to achieve classification and induction; the state detection of the abnormal component can be achieved through a comprehensive detection method, such as appearance inspection, electrical detection, mechanical detection, etc., to perform state detection on the abnormal component.

[0107] By querying the specific fault point in the actual state of the component, the present invention can focus on repairing the point, avoiding blind investigation and trial, greatly improving maintenance efficiency, shortening equipment downtime, and reducing the impact on production progress.

[0108] Among them, the specific fault point refers to the specific location where the fault actually occurs or the specific problem in the actual state of the abnormal component of the preset SMT patch equipment. It may be the place where a specific fault phenomenon such as damage to an electronic component, deformation of a mechanical structure, open circuit or poor contact of a connecting line occurs. Optionally, the query of the specific fault point in the actual state of the component can be achieved through a logical reasoning algorithm, such as: using a logical reasoning algorithm to gradually analyze the status of each part, find out the illogical places, and determine the specific fault point.

[0109] S4. Based on the specific fault point, formulate the error correction planning target corresponding to the circuit board to be corrected, analyze the error correction measures in the error correction planning target, query the error correction standard corresponding to the error correction measure, and generate the error correction operation instruction corresponding to the circuit board to be corrected based on the error correction standard.

[0110] The present invention formulates the error correction planning target corresponding to the circuit board to be corrected based on the specific fault point, which can accurately focus on the core of the problem, make the error correction action more targeted, and can be designed directly for the fault, avoiding unnecessary waste of resources and time consumption, and greatly improving the error correction efficiency.

[0111] Among them, the error correction planning goal refers to the specific fault of the circuit board to be corrected, and the specific error correction direction and the results to be achieved are determined by analyzing the key fault characteristics and based on the preset error correction planning criteria, such as replacing the faulty components and repairing the line faults within a certain period of time to ensure the normal operation of the circuit board.

[0112] As an embodiment of the present invention, the error correction planning target corresponding to the circuit board to be corrected is formulated based on the specific fault point, including: identifying the component fault point and the line fault point corresponding to the specific fault point; removing interference factors in the component fault point and the line fault point, and accurately analyzing the component fault point and the line fault point after removing the interference factors to obtain accurate component fault information and accurate line fault information; extracting key fault features in the accurate component fault information and the accurate line fault information; based on the key fault features and preset error correction planning criteria, formulating the error correction planning target corresponding to the circuit board to be corrected.

[0113] The component fault point refers to the location of the electronic component that specifically fails on the circuit board to be corrected, for example, where a specific component problem such as a resistor is damaged or a capacitor is leaking; the line fault point refers to the location where the line on the circuit board has a problem, which may include the location where the line is broken, short-circuited, poor contact, etc.; the interference factor refers to the factor that may affect the accurate judgment in the process of identifying the fault point, such as external electromagnetic interference, measurement error, environmental factors, etc.; the precise component fault information refers to the detailed information about the faulty component obtained after removing the interference factors and accurately analyzing the component fault point, including the specific model of the component, the form of the fault, the possible cause of the fault, etc.; the precise line fault information refers to the detailed information about the faulty line obtained after removing the interference factors and accurately analyzing the line fault point, such as the specific direction of the line, the electrical characteristics of the fault location, the potential cause of the fault, etc.; the key fault feature refers to the feature that can represent the essence of the fault extracted from the precise component fault information and the precise line fault information, such as specific electrical parameter changes, component appearance damage features, etc.; the preset error correction planning criteria refers to the pre-set rules and standards for formulating error correction planning goals, including criteria in terms of cost control, time limit, error correction effect requirements, etc.

[0114] Furthermore, the identification of the component fault point and the line fault point corresponding to the specific fault point can be achieved through a circuit schematic analysis method, such as: combining the circuit schematic of the circuit board to analyze the components and line locations where faults may occur; the removal of interference factors in the component fault point and the line fault point can be achieved through shielding technology, such as: using shielding materials to reduce the impact of external electromagnetic interference on fault detection; the precise analysis of the component fault point and the line fault point after removing the interference factors can be achieved through a logic analyzer, such as: used to analyze the logical state of the digital circuit and detect the fault point; the extraction of key fault features in the precise component fault information and the precise line fault information can be achieved through a feature extraction algorithm, such as: PCA, ICA and other algorithms; the formulation of the error correction planning goals corresponding to the circuit board to be corrected can be achieved through a project management tool, such as: using a project management tool to decompose the error correction task into specific steps and time nodes, and formulate clear error correction planning goals.

[0115] By analyzing the error correction measures in the error correction planning objectives and querying the error correction standards corresponding to the error correction measures, the present invention can fully understand the working principle and applicable scope of each measure, so as to select the most appropriate error correction method according to the specific fault situation. Querying the error correction standards can provide clear specifications and requirements for error correction actions, thereby ensuring the consistency and high quality of the error correction process.

[0116] Among them, the error correction measures refer to the specific actions and methods taken for the specific faults on the error correction circuit board. For example, for the component fault point, the measure of replacing the faulty component may be taken; for the line fault point, the measures such as re-welding, repairing the open circuit or short circuit may be taken; the error correction standard refers to the specifications and requirements that should be followed in the error correction process, including but not limited to the quality standards for component replacement (such as the specifications, models, performance parameters and other requirements of the components), the process standards for line repair (such as the quality standards for welding, the reliability standards for line connections, etc.) and the acceptance standards for the entire error correction process (such as the functional test standards for the circuit board after error correction, the electrical performance index requirements, etc.). Optionally, the error correction measures in the error correction planning target can be analyzed by a cause-effect diagram analysis method, such as: using the cause-effect diagram analysis method, analyzing the reasons for the overheating of a component on the circuit board, which may be excessive current, poor heat dissipation, etc., and then determining the corresponding error correction measures based on these reasons; the error correction standard corresponding to the error correction measure can be queried by a database query method, such as: establishing a database containing various circuit board error correction measures and corresponding standards, and when the specific error correction measures are determined, the corresponding error correction standards are obtained by database query.

[0117] Furthermore, the present invention generates error correction operation instructions corresponding to the circuit board to be corrected based on the error correction standard, which helps to improve the quality and reliability of error correction and ensure that each error correction action can achieve the expected effect. Secondly, it is conducive to improving the error correction efficiency. Clear operation instructions can allow maintenance personnel to quickly and accurately understand the task requirements and reduce the impact of failures on production.

[0118] The error correction operation instructions refer to detailed instructions and steps generated based on the operation priority to specifically guide maintenance personnel to perform error correction operations, including but not limited to the model and steps of replacing specific components, methods and precautions for repairing circuits, etc.

[0119] As an embodiment of the present invention, the error correction operation instructions corresponding to the circuit board to be corrected are generated based on the error correction standard, including: identifying the fault type serial number corresponding to the error correction standard; based on the fault type serial number, performing standard classification on the error correction standard to obtain a classification standard; analyzing the operation difficulty index corresponding to the classification standard; based on the operation difficulty index, determining the operation priority corresponding to the error correction operation; based on the operation priority, generating the error correction operation instructions corresponding to the circuit board to be corrected.

[0120] Among them, the fault type serial number refers to a specific number used to identify different types of faults. For example, component faults can be divided into different categories, and each category is assigned a specific serial number; the classification standard refers to different standard sets obtained after classifying the error correction standards according to the fault type serial number. For example, for different types of component faults and line faults, there are corresponding specific error correction standard sets; the operation difficulty index refers to a numerical value obtained by quantitatively evaluating the difficulty of error correction operations under different classification standards. The index can take into account factors such as the required technical level, operation complexity, required time, etc.; the operation priority refers to the order of error correction operations determined according to the operation difficulty index and other factors (such as the impact of the fault on the function of the circuit board, the urgency, etc.).

[0121] Furthermore, the identification of the fault type serial number corresponding to the error correction standard can be achieved through a pattern recognition algorithm, such as: analyzing the fault performance of the circuit board (such as the damage characteristics of a specific component, the abnormal electrical parameters of the circuit, etc.), matching it with the pre-stored fault pattern, and determining the fault type serial number; the standard classification of the error correction standard can be achieved through a clustering analysis algorithm, such as: analyzing the parameters of multiple error correction standards (such as the type of faulty component, the severity of the fault, etc.), and clustering similar standards into one category; the analysis of the operation difficulty index corresponding to the classification standard can be achieved through a hierarchical analysis method, such as: using the hierarchical analysis method to determine the factors affecting the operation difficulty (such as technical requirements, required time, tool complexity, etc.), and compare these factors pairwise to determine the weight; the determination of the operation priority corresponding to the error correction operation can be achieved through a priority sorting algorithm, such as: sorting according to the combination rule of the severity of the fault and the difficulty of operation; the generation of the error correction operation instruction corresponding to the circuit board to be corrected can be achieved through a template generation method, such as: pre-designing operation instruction templates for different types of faults, and filling in the content to generate instructions according to the specific situation.

[0122] S5. After sending the error correction operation instruction to the preset SMT patch equipment, perform the error correction operation on the circuit board to be corrected to obtain the error correction circuit board, obtain the error correction solder point image corresponding to the error correction circuit board, perform solder point position verification on the error correction solder point image to obtain position verification data, and generate a position correction report corresponding to the circuit board to be corrected based on the position verification data.

[0123] The present invention sends the error correction operation instruction to a preset SMT patch device, and then performs an error correction operation on the circuit board to be corrected to obtain an error correction circuit board. The normal operation of the equipment can be quickly restored, the circuit board failure problem can be solved in time, and the SMT patch device can be put back into production, thereby avoiding production stagnation caused by equipment failure, improving production efficiency, and reducing economic losses.

[0124] Among them, the error correction circuit board refers to a circuit board that successfully eliminates faults and restores normal functions after a series of error correction operations are performed on the error correction circuit board. It meets the preset performance indicators and functional requirements and can be put into use again to ensure the normal operation of the equipment.

[0125] As an embodiment of the present invention, the performing of the error correction operation on the circuit board to be corrected to obtain the error correction circuit board includes: querying the fault severity corresponding to the circuit board to be corrected; grading the fault severity to obtain a fault severity level; determining the error correction operation sequence corresponding to the circuit board to be corrected based on the severity level; performing the error correction operation on the circuit board to be corrected according to the error correction operation sequence to obtain the error correction circuit board;

[0126] Among them, the fault severity refers to a quantitative description of the impact of the fault on the circuit board to be corrected, including but not limited to the scope of the impact of the fault on the overall function of the circuit board, the degree of performance degradation caused by the fault, whether it will cause other chain failures, etc. For example, a component is completely damaged and the circuit board cannot work at all, which is a serious fault; while a component performance is slightly reduced but the circuit board can still basically operate, which is a minor fault; the fault severity level refers to the classification of faults into different levels based on the evaluation results of the fault severity, which can be expressed by digital levels (such as level 1, level 2, level 3, etc.) or text description levels (such as minor, medium, severe, etc.); the error correction operation sequence refers to the order of execution of various error correction operations determined according to factors such as the fault severity level, resource constraints, time requirements, etc. when performing error correction operations on the circuit board to be corrected. For example, serious faults may need to be handled first to restore key functions as soon as possible; while minor faults can be handled later without affecting the overall operation.

[0127] Furthermore, the query of the fault severity corresponding to the circuit board to be corrected can be achieved through a fault simulation analysis method, such as: using the fault simulation analysis method, simulating the performance of a specific fault on the circuit board in software, and observing its impact on different circuit modules. If a component failure causes multiple functional modules to fail, it can be judged as a serious fault; the degree grading of the fault severity can be achieved through a fuzzy clustering algorithm, such as: fuzzifying multiple characteristics of the fault (such as the degree of performance degradation, the number of functions affected, etc.), and then classifying the fault into different levels according to fuzzy rules. For example, a fault with a performance degradation of less than 30% and affecting 1-2 functions is classified as a mild level; a fault with a performance degradation of more than 50% and affecting multiple functions is classified as a severe level; the determination of the error correction operation sequence corresponding to the circuit board to be corrected can be achieved through a multi-objective optimization algorithm, such as a genetic algorithm, taking the fault severity, maintenance time, required resources, etc. as optimization goals, and finding the optimal error correction operation sequence through continuous iteration.

[0128] The present invention obtains the error correction solder joint image corresponding to the error correction circuit board, verifies the solder joint position of the error correction solder joint image, and obtains position verification data, so as to timely find out whether the solder joint position is correct, avoid problems such as solder joint offset, missed soldering or wrong soldering that may cause the circuit board to fail in subsequent use, and improve the reliability of error correction.

[0129] Among them, the error-correcting solder joint image refers to an image obtained by photographing or scanning the solder joint area involved in the correction on the circuit board after the error-correcting circuit board is corrected. This image can clearly show the appearance, position, shape and other characteristics of the solder joint after correction; the position verification data refers to the relevant data on whether the solder joint position is accurate after analyzing and processing the error-correcting solder joint image, which may include the deviation value between the actual coordinates of the solder joint and the design coordinates, whether the relative position relationship between the solder joint and the surrounding components meets the requirements and other information. Optionally, the acquisition of the error-correcting solder joint image corresponding to the error-correcting circuit board can be achieved through an optical scanner, such as: using an optical scanner to scan the error-correcting circuit board with high precision to obtain the image of the entire circuit board, and then extracting the image of the solder joint area through image processing software; the solder joint position verification of the error-correcting solder joint image can be achieved through a coordinate measurement algorithm, such as: measuring the coordinates of the center of the solder joint through image processing software, and performing difference calculation with the design coordinates to determine whether the solder joint position is accurate.

[0130] Furthermore, the present invention generates a position correction report corresponding to the circuit board to be corrected based on the position verification data, which helps to timely discover potential problems and take targeted measures. By analyzing the position verification data and generating a report, it is possible to quickly identify the situation where the solder joint position deviation is large or unqualified, so that maintenance personnel can make secondary corrections or adjustments in time to avoid further expansion of the problem during subsequent use, reducing the risk of circuit board failure due to solder joint position problems.

[0131] Among them, the position error correction report refers to a written or electronic document generated after sorting and analyzing the solder joint position verification data on the circuit board to be corrected. The report contains the basic information of the circuit board (such as model, batch, etc.), the method and process description of the solder joint position verification, the specific position verification data (such as the solder joint coordinate deviation value, the comparison with the standard position, etc.), the evaluation of the verification results (qualified or not, the severity of the problem, etc.) and the proposed measures for the problem (such as secondary error correction methods, improvement suggestions for preventing similar problems, etc.), optionally, the generation of the position error correction report corresponding to the circuit board to be corrected based on the position verification data can be achieved through an automated report generation tool, such as: importing the position verification data into the software, and the software automatically generates a position error correction report containing charts, text descriptions, etc. according to the pre-set format and logic.

[0132] Firstly, the present invention acquires the solder joint image corresponding to the circuit board to be corrected and collects the solder joint position data corresponding to the solder joint image, so as to intuitively present the actual status of the solder joint on the circuit board, provide a visual basis for subsequent analysis and correction, and can more clearly observe the shape, size, color and other characteristics of the solder joint, so as to quickly determine whether there is a problem. Collecting the solder joint position data can realize the precise positioning of the solder joint, which is helpful to accurately analyze whether the solder joint deviates from the preset position, and determine the degree and direction of the deviation. At the same time, the present invention associates the solder joint description data with the historical operation data of the preset SMT patch equipment to obtain the operation association data, so as to fully understand the performance of the current solder joint problem in the historical production, and can compare the shape, size, color and other characteristics of the current solder joint with the situation when similar problems occurred in history, so as to improve the stability of the equipment and the patch quality. Based on the deviation degree value, the present invention analyzes the fault type corresponding to the preset SMT patch equipment. The type can accurately judge the severity of the problem of the equipment, can take relatively simple measures to correct it in time, avoid the problem from further expanding, can carry out targeted troubleshooting and repair, greatly improve the maintenance efficiency, reduce the equipment downtime, and thus reduce production losses. The present invention is based on the specific fault point, formulates the error correction planning target corresponding to the circuit board to be corrected, can accurately focus on the core of the problem, make the error correction action more targeted, can directly design for the fault, avoid unnecessary waste of resources and time consumption, and greatly improve the error correction efficiency. Further, the present invention sends the error correction operation instruction to the preset SMT patch equipment, performs the error correction operation on the circuit board to be corrected, obtains the error correction circuit board, can quickly restore the normal operation of the equipment, can solve the circuit board fault problem in time, put the SMT patch equipment back into production, avoid production stagnation caused by equipment failure, improve production efficiency, and reduce economic losses. Therefore, the intelligent error correction method and system for realizing the position of SMT patches based on automation proposed by the present invention can improve the accuracy of the position of SMT patches.

[0133] like Figure 2 1 is a functional module diagram of an SMT patch position intelligent error correction system based on automation provided by an embodiment of the present invention.

[0134] The intelligent error correction system 200 for realizing the position of SMT patches based on automation of the present invention can be installed in an electronic device. According to the functions implemented, the intelligent error correction system 200 for realizing the position of SMT patches based on automation can include a description and annotation module 201, a deviation degree value calculation module 202, a fault query module 203, an instruction generation module 204 and a report generation module 205. The module of the present invention can also be called a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0135] In this embodiment, the functions of each module / unit are as follows:

[0136] The description and annotation module 201 is used to obtain a solder joint image corresponding to the circuit board to be corrected, collect solder joint position data corresponding to the solder joint image, perform image enhancement processing on the solder joint image based on the solder joint position data to obtain a solder joint enhanced image, and describe and annotate the solder joint enhanced image to obtain solder joint description data;

[0137] The deviation degree value calculation module 202 is used to associate the solder joint description data with the historical operation data of the preset SMT patch equipment to obtain operation association data, query the potential abnormal data in the operation association data, filter the abnormal solder joint parameters corresponding to the potential abnormal data, and detect the real-time operation parameters of the preset SMT patch equipment in real time, and calculate the deviation degree value of the abnormal solder joint parameters to the real-time operation parameters;

[0138] A fault query module 203 is used to analyze the fault type corresponding to the preset SMT patch equipment based on the deviation degree value, locate the abnormal component in the preset SMT patch equipment based on the fault type, perform status detection on the abnormal component, obtain the actual status of the component, and query the specific fault point in the actual status of the component;

[0139] The instruction generation module 204 is used to formulate the error correction planning target corresponding to the circuit board to be corrected based on the specific fault point, analyze the error correction measures in the error correction planning target, query the error correction standard corresponding to the error correction measure, and generate the error correction operation instruction corresponding to the circuit board to be corrected based on the error correction standard;

[0140] The report generation module 205 is used to send the error correction operation instruction to the preset SMT patch equipment, perform the error correction operation on the circuit board to be corrected, obtain the error correction circuit board, obtain the error correction solder point image corresponding to the error correction circuit board, verify the solder point position of the error correction solder point image to obtain position verification data, and generate a position correction report corresponding to the circuit board to be corrected based on the position verification data.

[0141] In detail, the modules described in the system 200 for intelligent position correction of SMT patches based on automation described in the embodiment of the present invention adopt the same technical means as the method for intelligent position correction of SMT patches based on automation described in the accompanying drawings when used, and can produce the same technical effects, which will not be repeated here.

[0142] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. An intelligent error correction method for the position of SMT patches based on automation, characterized in that: The method comprises: Acquire a solder joint image corresponding to the circuit board to be corrected, collect solder joint position data corresponding to the solder joint image, perform image enhancement processing on the solder joint image based on the solder joint position data to obtain a solder joint enhanced image, and describe and annotate the solder joint enhanced image to obtain solder joint description data; The solder joint description data is associated with the historical operation data of the preset SMT patch equipment to obtain operation-associated data, potential abnormal data in the operation-associated data is queried, abnormal solder joint parameters corresponding to the potential abnormal data are screened, and real-time operation parameters of the preset SMT patch equipment are detected in real time, and the deviation degree value of the abnormal solder joint parameters to the real-time operation parameters is calculated; Based on the deviation degree value, analyzing the fault type corresponding to the preset SMT patch equipment, locating the abnormal component in the preset SMT patch equipment based on the fault type, performing status detection on the abnormal component to obtain the actual status of the component, and querying the specific fault point in the actual status of the component; Based on the specific fault point, formulate an error correction planning target corresponding to the circuit board to be corrected, analyze the error correction measures in the error correction planning target, query the error correction standard corresponding to the error correction measure, and generate an error correction operation instruction corresponding to the circuit board to be corrected based on the error correction standard; After the error correction operation instruction is sent to the preset SMT patch equipment, the error correction operation is performed on the circuit board to be corrected to obtain the error correction circuit board, the error correction solder point image corresponding to the error correction circuit board is obtained, the solder point position verification is performed on the error correction solder point image to obtain position verification data, and based on the position verification data, a position correction report corresponding to the circuit board to be corrected is generated.

2. The method for realizing intelligent error correction of SMT patch position based on automation as claimed in claim 1, characterized in that: The step of describing and labeling the solder joint enhanced image to obtain solder joint description data includes: Performing feature extraction on the solder joint enhanced image to obtain a feature set; Classifying and arranging the feature set to obtain classified data; Performing quantitative evaluation on the classified data to obtain quantitative indicators; Based on the quantitative index, determining a description annotation dimension corresponding to the weld spot enhanced image; Based on the description and annotation dimension, the weld enhancement image is described and annotated to obtain weld description data.

3. The method for realizing intelligent error correction of SMT patch position based on automation as claimed in claim 1, characterized in that: The step of associating the solder joint description data with the historical operation data of the preset SMT patch equipment to obtain operation association data includes: Deconstructing the solder joint description data to obtain deconstruction parameters; extracting deconstruction factors from the deconstruction parameters; Effectively screening the historical operation data of the preset SMT patch equipment to obtain effective historical data; Calculating the correlation matching degree between the deconstruction factor and the operation factor in the valid historical data; Based on the correlation matching degree, the solder joint description data is data-correlated with the historical operation data of a preset SMT patch equipment to obtain operation correlation data.

4. The method for realizing intelligent error correction of SMT patch position based on automation as claimed in claim 3, characterized in that: The calculating the correlation matching degree between the deconstruction factor and the operation factor in the valid historical data includes: The correlation matching degree between the deconstruction factor and the operation factor in the valid historical data is calculated using the following formula: Wherein, GD represents the correlation matching degree between the deconstruction factor and the operation factor in the valid historical data, N represents the total number of samples corresponding to the deconstruction factor and the operation factor in the valid historical data, i represents the sample index, m represents the number of features corresponding to the deconstruction factor and the operation factor in the valid historical data, j represents the feature index, and D ij represents the deconstructed value of the jth feature in the i-th sample, E ij Represents the running value of the running factor in the j-th valid historical data in the ith sample.

5. The method for realizing intelligent error correction of SMT patch position based on automation as claimed in claim 1, characterized in that: The calculating the deviation degree value of the abnormal welding point parameter from the real-time operation parameter includes: The deviation degree of the abnormal welding point parameters from the real-time operating parameters is calculated using the following formula: Wherein, PD represents the deviation degree value of the abnormal solder joint parameter to the real-time operation parameter, n′ represents the number of the abnormal solder joint parameter, i′ represents the number index of the abnormal solder joint parameter, E i′ represents the expected value of the parameter of the i′th abnormal solder joint, R i′ represents the actual value of the i′th real-time solder joint parameter, σ i′ represents the standard deviation of the i′th solder joint parameter, k represents the number of real-time monitoring data when calculating the real-time operating parameters of the equipment, m′ represents the number of parameters of the real-time operating parameters, j′ represents the number index of the real-time operating parameters, and A j′ Represents the relevant value of the j′th real-time operating parameter.

6. The method for realizing intelligent error correction of SMT patch position based on automation as claimed in claim 1, characterized in that: The analyzing, based on the deviation degree value, the fault type corresponding to the preset SMT patch equipment includes: Constructing a deviation sequence corresponding to the deviation degree value; Performing sequence classification on the deviation sequence to obtain classification deviation data; Querying the type performance characteristics corresponding to the classification deviation data; Based on the type performance characteristics, determine the fault type range corresponding to the preset SMT patch equipment; Based on the fault type range, the fault type corresponding to the preset SMT patch equipment is analyzed.

7. The method for realizing intelligent error correction of SMT patch position based on automation as claimed in claim 1, characterized in that: The performing status detection on the abnormal component to obtain the actual status of the component includes: Performing a preliminary visual inspection on the abnormal component to obtain preliminary inspection data; Based on the preliminary inspection data, a comprehensive inspection is performed on the abnormal component to obtain comprehensive inspection parameters; Performing data analysis on the comprehensive detection parameters to obtain a component performance index; Based on the component performance index, analyzing the state characteristics corresponding to the abnormal component; Classify and summarize the state characteristics to obtain summarized characteristics; Based on the summarized features, the state of the abnormal component is detected to obtain the actual state of the component.

8. The method for realizing intelligent error correction of SMT patch position based on automation as claimed in claim 1, characterized in that: The formulating the error correction planning target corresponding to the circuit board to be corrected based on the specific fault point includes: Identify the component fault point and the line fault point corresponding to the specific fault point; Removing interference factors from the component fault point and the line fault point, and accurately analyzing the component fault point and the line fault point after the interference factors are removed to obtain accurate component fault information and accurate line fault information; Extracting key fault features from the precise component fault information and the precise line fault information; Based on the key fault characteristics and preset error correction planning criteria, an error correction planning target corresponding to the circuit board to be corrected is formulated.

9. The method for realizing intelligent error correction of SMT patch position based on automation as claimed in claim 1, characterized in that: The generating, based on the error correction standard, an error correction operation instruction corresponding to the circuit board to be corrected includes: Identify the fault type serial number corresponding to the error correction standard; Based on the fault type serial number, the error correction standard is classified to obtain a classification standard; Analyze the operation difficulty index corresponding to the classification standard; Based on the operation difficulty index, determining an operation priority corresponding to the error correction operation; Based on the operation priority, an error correction operation instruction corresponding to the circuit board to be corrected is generated.

10. Based on automation, the intelligent error correction system for the position of SMT patches is realized, characterized in that: The system is used to implement the method for realizing intelligent position error correction of SMT patches based on automation as described in any one of claims 1 to 9, and comprises: A description and annotation module is used to obtain a solder joint image corresponding to the circuit board to be corrected, collect solder joint position data corresponding to the solder joint image, perform image enhancement processing on the solder joint image based on the solder joint position data to obtain a solder joint enhanced image, and describe and annotate the solder joint enhanced image to obtain solder joint description data; A deviation degree value calculation module is used to associate the solder joint description data with the historical operation data of the preset SMT patch equipment to obtain operation association data, query the potential abnormal data in the operation association data, filter the abnormal solder joint parameters corresponding to the potential abnormal data, and detect the real-time operation parameters of the preset SMT patch equipment in real time, and calculate the deviation degree value of the abnormal solder joint parameters to the real-time operation parameters; A fault query module is used to analyze the fault type corresponding to the preset SMT patch equipment based on the deviation degree value, locate the abnormal component in the preset SMT patch equipment based on the fault type, perform status detection on the abnormal component, obtain the actual status of the component, and query the specific fault point in the actual status of the component; An instruction generation module is used to formulate an error correction planning target corresponding to the circuit board to be corrected based on the specific fault point, analyze the error correction measures in the error correction planning target, query the error correction standard corresponding to the error correction measure, and generate an error correction operation instruction corresponding to the circuit board to be corrected based on the error correction standard; A report generation module is used to send the error correction operation instruction to a preset SMT patch device, perform an error correction operation on the circuit board to be corrected, obtain the error correction circuit board, obtain the error correction solder point image corresponding to the error correction circuit board, perform solder point position verification on the error correction solder point image to obtain position verification data, and generate a position correction report corresponding to the circuit board to be corrected based on the position verification data.

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