Ultrathin single-flow-channel liquid cooling plate capable of realizing multi-chip temperature consistency and power amplifier provided with ultrathin single-flow-channel liquid cooling plate

Abstract

The invention relates to the field of power amplifier heat dissipation, in particular to an ultra-thin single-channel liquid cooling plate capable of achieving multi-chip temperature consistency and a power amplifier provided with the ultra-thin single-channel liquid cooling plate. Comprising a supporting piece, a plurality of last-stage modules and a liquid cooling plate, the supporting piece is provided with a groove, the liquid cooling plate is arranged in the groove, and the last-stage modules are arranged on the two faces of the liquid cooling plate; the liquid cooling plate comprises a single flow channel and a plurality of groups of heat dissipation teeth, the single flow channel is arranged at the position of the last-stage module, and the plurality of groups of heat dissipation teeth are distributed in the single flow channel at intervals corresponding to the position of the last-stage module; the method is used for reducing heat accumulation of a power amplifier in a limited space, so that the temperature of chips in the power amplifier is kept consistent, and the service life of the chips is prolonged. The efficiency that the liquid cooling plate takes away accumulated heat in the last-stage module is improved, so that the temperatures of chips in all the last-stage modules are kept consistent, heat dissipation of a small-space and high-power power amplifier is achieved, the temperatures of the chips in the power amplifier are kept consistent, and the service life of the power amplifier is prolonged.

Description

Technical Field

[0001] The present invention relates to the field of power amplifier heat dissipation, and more specifically, to an ultra-thin single-channel liquid cooling plate for achieving temperature consistency of multiple chips and a power amplifier provided with the same. Background Art

[0002] With the continuous development of radar technology, millimeter-wave active phased arrays are widely used in military and civilian fields due to their small size, light weight, flexible scanning, and anti-interference. With the development and progress of microelectronics technology, the system integration of millimeter-wave phased arrays is getting higher and higher, and the power consumption and heat flux density of millimeter-wave power amplifier components in the array are also increasing. The heat dissipation integration of components in millimeter-wave phased arrays has gradually become a bottleneck problem in the design and implementation of array structure. In order to ensure that the millimeter-wave phased array antenna has the scalability of the array and the maintainability of the phased array, the millimeter-wave power amplifier components usually need to be designed into a thin blade structure. However, due to the high operating frequency and short wavelength of the millimeter-wave frequency band antenna, the array spacing of the antenna array is usually less than 10mm. The millimeter-wave power amplifier components need to realize the liquid cooling and heat dissipation integration of the components within a very small height dimension. Therefore, the difficulty of its structural design and heat dissipation design far exceeds the design difficulty of general power amplifier components.

[0003] The power amplifier chip and transceiver multifunctional chip in the millimeter wave power amplifier component are small in size and have a large heat flux density. Their thermal failure problem seriously affects the operating efficiency and service life of the phased array. At the same time, the millimeter wave phased array usually requires multiple millimeter wave power amplifier components. The power of different components in a single array is also inconsistent. The components have very high requirements for the consistency of working temperature. The uneven temperature distribution has a significant impact on electrical performance. And because the chip is often placed in a closed sealed housing, it cannot be in direct contact with the outside air. Therefore, the commonly used heat dissipation method is to install a heat sink on the power amplifier housing. To ensure efficient heat dissipation, it is necessary to transfer heat through an interface material that can conduct heat quickly, or to increase the area of ​​the heat dissipation surface of the heat sink to achieve heat dissipation of the power amplifier with a higher output power.

[0004] At present, liquid cooling is a good heat dissipation method in the structural design of millimeter wave power amplifier components. It can not only solve the problem of large heat transfer and is suitable for closed environments, but also increase the heat dissipation area by optimizing the heat dissipation teeth. However, on a very small liquid cooling plate, the total weight of the components is relatively large, and the liquid cooling plate is the only supporting mounting part for each heat source. Its thickness is relatively thin, and it is difficult to meet the flatness requirements. In addition, how to design the flow channel in the liquid cooling plate to achieve temperature consistency among many chips is also a difficulty.

[0005] Therefore, in an ultra-small space and ultra-high output power amplifier, how to reduce the heat accumulation of the amplifier within a limited space so that the chip in the amplifier maintains a consistent temperature to increase its service life is a technical problem that needs to be urgently solved in this field. Summary of the invention

[0006] The present invention aims to overcome at least one defect (shortcoming) of the above-mentioned prior art and provide an ultra-thin single-channel liquid cooling plate for achieving temperature consistency of multiple chips and a power amplifier provided with the same, which is used to solve the problem of reducing heat accumulation in the power amplifier in a limited space, so that the chips in the power amplifier maintain a consistent temperature and thus increase their service life.

[0007] The technical solution adopted by the present invention is to provide an ultra-thin single-channel liquid cooling plate for achieving temperature consistency of multiple chips, wherein the ultra-thin single-channel liquid cooling plate includes a support member, a plurality of final-stage modules and a liquid cooling plate, the support member is provided with a groove, the liquid cooling plate is arranged in the groove, and the plurality of final-stage modules are arranged on both sides of the liquid cooling plate; the liquid cooling plate includes a single channel and a plurality of groups of heat dissipation teeth, the single channel is arranged at the position where the final-stage module is located, and the plurality of groups of heat dissipation teeth are distributed in the single channel at intervals corresponding to the positions of the final-stage modules, and the abutment surfaces formed by the heat dissipation teeth and the single channel include a variety of shapes, and the cooling liquid flows unidirectionally in the single channel and flows through the heat dissipation teeth to cool the final-stage module.

[0008] It is beneficial to provide supporting force for the whole machine through the supporting parts, realize ultra-high power output by assembling multiple final-stage modules in one supporting part, take away the heat accumulated in the final-stage modules through the liquid cooling plate, so that the chip temperature in each final-stage module remains consistent; the liquid cooling plate is placed in the groove to share the bearing capacity, so that it is sufficient to bear the weight of the final-stage modules on both sides; the unidirectional flow of the coolant is realized through the single flow channel to speed up the heat exchange speed of the coolant, and the heat exchange area is increased through the heat dissipation teeth to improve the cooling efficiency.

[0009] Furthermore, the liquid cooling plate also includes a liquid inlet and a liquid outlet, and the single flow channel is in a "S" shape, including a straight section with heat dissipation teeth, an access section connected to the liquid inlet, and an outlet section connected to the liquid outlet. The coolant flows from the liquid inlet to the access section, exchanges heat with the heat dissipation teeth through the straight section, and then flows from the outlet section to the liquid outlet.

[0010] It is beneficial to occupy a larger area in the whole machine with limited space through the single flow channel in the shape of a "J", so as to improve the heat exchange efficiency with the final module; the flow in and out of the coolant is uniformly managed through the liquid inlet and outlet, the coolant and electronic components are isolated, the flow rate of the coolant in the single flow channel is controlled through the access section and the outlet section, and the coolant is allowed to pass quickly through the straight section, thereby reducing the flow resistance of the coolant.

[0011] Furthermore, the heat dissipation teeth include equal-width teeth near the liquid inlet end and special-shaped teeth near the liquid outlet end. The equal-width teeth include nine groups, each group includes multiple parallel and equal-width heat dissipation strips, and the special-shaped teeth include one group, including parallel heat dissipation strips with widths increasing from small to large.

[0012] It is beneficial to combine equal-width teeth and special-shaped teeth so that the heat dissipation area of ​​the heat dissipation teeth changes with the change of the heat that needs to be taken away in the final module, thereby achieving consistent temperature of each chip in the final module and avoiding the problem of uneven heat of the whole machine caused by excessive temperature difference on the plate surface during heat exchange of the liquid cooling plate.

[0013] Furthermore, the abutment surface of the equal-width teeth is rectangular in shape, the length of each rectangle gradually increases and then gradually decreases along the flow direction of the coolant, and the abutment surface of the special-shaped teeth is trapezoidal in shape.

[0014] The abutment surfaces of the heat dissipation teeth include different shapes to adapt to the different amounts of heat that the coolant needs to take away during the unidirectional flow process. When the coolant contacts the first heat dissipation tooth, its abutment surface is the narrowest rectangle, so that the turbulence of the coolant is small, but it still flows at a faster flow rate; when the coolant gradually flows through the abutment surfaces of the remaining heat dissipation teeth, its abutment surface reaches the widest rectangle at the rear of the central axis. Since the heat dissipated by the final module located at the central axis of the liquid cooling plate and the heat accumulated in the front that has not yet dissipated accumulate at the rear of the central axis of the liquid cooling plate, the widest rectangle of the abutment surface is set at the rear of the central axis of the liquid cooling plate to increase the turbulence of the coolant here and speed up the heat exchange rate between the coolant and the accumulated heat; when the coolant continues to flow to the position at the rear end of the liquid cooling plate, in order to keep the flow rate and liquid supply pressure of the coolant, the rectangle of the abutment surface begins to narrow again, controlling the coolant to reduce turbulence; and the abutment surface of the special-shaped tooth is trapezoidal, which reduces the stagnant turbulence of the coolant on the one hand, and expands the heat dissipation area to take away the heat of the final module at the rear end on the other hand.

[0015] Furthermore, the length of the heat dissipation strip of the equal-width tooth closest to the liquid inlet end is x, and the lengths of the heat dissipation strips of the other equal-width teeth are (x+n*a)±b respectively; the length of the heat dissipation strip with the largest width in the special-shaped tooth is x+n*a; where n is an integer, a=2, and b ranges from 0 to 1.

[0016] It is beneficial to meet the different heat dissipation requirements of each final-stage module through a specific calculation formula for the length of the heat dissipation strip in the heat dissipation teeth.

[0017] Furthermore, the single flow channel also includes a plurality of evenly distributed reinforcing columns, which connect the single flow channel to the groove and provide supporting force for the abutment between the final-stage module and the heat dissipation teeth.

[0018] It is beneficial to increase the structural strength of the liquid cooling plate by reinforcing the columns, so that it can be sufficient to bear the weight of the final modules on both sides in an ultra-thin case, and avoid vibration when the coolant flows quickly through the heat dissipation teeth.

[0019] Furthermore, the thickness of the liquid cooling plate ranges from 5 mm to 9 mm.

[0020] It is beneficial to realize the effect of small space, high power, fast heat dissipation, consistent chip temperature and long service life of the power amplifier through the ultra-thin characteristics of the liquid cooling plate.

[0021] Furthermore, the temperature of the corresponding final-stage modules on both sides is consistent, which is below 75°C when the working environment is 60°C, and the temperature difference between the contact surfaces of each final-stage module and the liquid cooling plate is below 5°C.

[0022] It is beneficial to ensure that the temperature rise of the final-stage module does not exceed 15°C in a working environment of 60°C, and the temperature consistency of each chip does not exceed 5°C. At the same time, the temperature of the final-stage modules on the front and back sides of the same position of the liquid cooling plate is always consistent, achieving the effect of maintaining consistent heat dissipation temperature of multiple chips in a straight line.

[0023] Furthermore, the supply pressure of the coolant is 1.3-1.7 MPa, the supply flow rate of the coolant is 3.1-3.3 L / min, and the heat dissipation of the liquid cooling plate is 1400W.

[0024] It is beneficial to control the liquid supply pressure and liquid supply flow rate within a certain numerical range so that the coolant can maintain a sufficient flow velocity in a wider single flow channel and the flow rate can take away enough heat dissipation.

[0025] A power amplifier provided with a single-channel liquid cooling plate, including the ultra-thin single-channel liquid cooling plate for achieving temperature consistency of multiple chips, and also including a driving module, a power module, a power divider, and a filtering power divider module, wherein the driving module sends a driving instruction to the power module, the power module supplies power to the power divider, the power divider divides the input signal into multiple output signals to the final module, and the final module outputs the signal to the filtering power divider module to maintain the stability of the output signal.

[0026] It is beneficial to use a power amplifier provided with the above-mentioned liquid cooling plate to achieve rapid heat dissipation of a small-sized, high-power power amplifier, thereby increasing the service life of the power amplifier.

[0027] Compared with the prior art, the beneficial effects of the present invention are: ultra-high power output is achieved by connecting multiple final-stage modules in series through supporting parts; through the combined functions of the single flow channel and the heat dissipation teeth in the liquid cooling plate, the heat exchange speed is improved while the heat exchange area is increased, so as to improve the efficiency of the liquid cooling plate in taking away the heat accumulated in the final-stage module, so that the chip temperature in each final-stage module remains consistent, and the heat dissipation of a small space and high-power amplifier is achieved, and the chip temperature in the amplifier is kept consistent, so as to improve its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a front view of the overall structure of the present invention.

[0029] Figure 2 It is the back view of the overall structure of the present invention.

[0030] Figure 3 It is a front view of the liquid cooling plate on the support member of the present invention.

[0031] Figure 4 It is a back view of the liquid cooling plate on the support member of the present invention.

[0032] Figure 5 It is an enlarged schematic diagram of the heat dissipation teeth of the present invention.

[0033] Figure 6 It is a schematic diagram of another preferred embodiment of the heat dissipation tooth of the present invention.

[0034] Figure 7 It is a partially enlarged schematic diagram of another preferred embodiment of the heat dissipation tooth of the present invention.

[0035] Description of the symbols in the accompanying drawings: final stage module 100, support member 200, liquid cooling plate 210, liquid inlet end 220, liquid outlet end 230, driving module 300, power supply control module 400, power divider 500, filtering power division module 600. DETAILED DESCRIPTION

[0036] The drawings of the present invention are only for illustrative purposes and should not be construed as limiting the present invention. In order to better illustrate the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; it is understandable to those skilled in the art that some well-known structures and their descriptions in the drawings may be omitted. Example 1

[0037] like Figure 1-5 As shown, this embodiment provides an ultra-thin single-channel liquid cooling plate 210 for achieving temperature consistency of multiple chips, which includes a support member 200, a plurality of final-stage modules 100 and a liquid cooling plate 210, the support member 200 is provided with a groove, the liquid cooling plate 210 is arranged in the groove, and the plurality of final-stage modules 100 are arranged on both sides of the liquid cooling plate 210; the liquid cooling plate 210 includes a single channel and a plurality of groups of heat dissipation teeth, the single channel is arranged at the position where the final-stage module 100 is located, and the plurality of groups of heat dissipation teeth are distributed in the single channel at intervals corresponding to the positions of the final-stage module 100, and the abutment surfaces formed by the heat dissipation teeth and the single channel include a variety of shapes, and the cooling liquid flows unidirectionally in the single channel, and flows through the heat dissipation teeth to cool the final-stage module 100.

[0038] In this embodiment, the size of the support member 200 is 600mm*300mm*7mm (length*width*thickness), the weight is controlled below 1.8kg, the processing flatness reaches 0.2mm on both sides, and there are 10 final modules 100 on the upper and lower sides of the support member 200. The final module 100 is a core heat source device. There are 10 final modules 100 on the front and back sides of the liquid cooling plate 210, and the heat of each final module 100 is 70W. The material of the liquid cooling plate 210 is aluminum alloy with a thickness of 7mm. The coolant supply flow rate in the liquid cooling plate is 3.2L / min. The heat dissipation power consumption of the liquid cooling plate reaches 1400W. After the liquid cooling plate 210 is assembled with 20 final modules 100, the total weight reaches 5.8kg. In order to make the liquid cooling plate 210 meet the weight reduction requirements, various forms of local reinforcement ribs are designed to ensure its strength and precision. A cross-shaped water channel, i.e., a single flow channel, is designed on the liquid cooling plate 210 for unidirectional flow of coolant, and flow channel heat dissipation teeth are arranged in the single flow channel to increase the heat dissipation turbulence and heat exchange area of ​​the liquid cooling plate 210, thereby achieving a heat dissipation effect of maintaining a consistent temperature for each final-stage module 100.

[0039] In this embodiment, the abutting surface includes a rectangle and a trapezoid, and the sizes and shapes of the rectangles are different. Since the heat dissipation strips in all heat dissipation teeth are of uniform thickness, the heat dissipation area can be changed by adjusting the length of the heat dissipation teeth.

[0040] The liquid cooling plate 210 also includes a liquid inlet 220 and a liquid outlet 230. The single flow channel is in the shape of a "J", including a straight section with heat dissipation teeth, an access section connected to the liquid inlet 220, and an outlet section connected to the liquid outlet 230. The coolant flows from the liquid inlet 220 to the access section, exchanges heat with the heat dissipation teeth through the straight section, and then flows from the outlet section to the liquid outlet 230.

[0041] In this embodiment, the coolant is fed in from the left and out from the right. The liquid cooling plate 210 and the single channel are processed by CNC machine, and microchannel heat dissipation teeth with special size differences are milled out. The liquid cooling plate 210 and the cover plate are then welded by friction stir welding, and finally fine processing is performed to achieve the desired size and requirements.

[0042] In this embodiment, the liquid cooling plate 210 combines the heat dissipation effects of the coolant and the heat dissipation teeth, so that when the coolant passes under the final-stage module 100, it not only performs heat exchange through the low temperature of the coolant, but also increases the contact area between the coolant and the liquid cooling plate 210 through the heat dissipation teeth, thereby increasing the turbulence of the coolant and enabling it to fully exchange heat, thereby improving the heat dissipation effect.

[0043] The heat dissipation teeth include equal-width teeth near the liquid inlet end 220 and special-shaped teeth near the liquid outlet end 230. The equal-width teeth include nine groups, each group includes a plurality of parallel and equal-width heat dissipation strips, and the special-shaped teeth include one group, including parallel heat dissipation strips with increasing widths.

[0044] In this embodiment, the equal-width teeth include 9 groups and the special-shaped teeth include 1 group, which is determined based on the heat dissipation of 70W for each final module and the need for the heat to accumulate to the maximum after the 7th group of equal-width teeth and then gradually decrease.

[0045] In this embodiment, the heat sources corresponding to the equal-width teeth from left to right are chip 1, chip 2, chip 3, chip 4, chip 5, chip 6, chip 7, chip 8, and chip 9, and the heat source corresponding to the special-shaped teeth is chip 10. In the direction of the flow of the coolant as the length direction and the direction perpendicular to the flow as the width direction, the length of the heat dissipation strip of the equal-width teeth corresponding to chip 1 is the shortest, and the length of the heat dissipation strip of the equal-width teeth corresponding to chip 7 is the longest. The length of the heat dissipation strip of the equal-width teeth corresponding to chip 8 is consistent with the length of the longest heat dissipation strip of the special-shaped teeth corresponding to chip 10.

[0046] The abutment surface of the equal-width teeth is rectangular in shape, and the length of each rectangle gradually increases and then decreases along the flow direction of the coolant. The abutment surface of the special-shaped teeth is trapezoidal in shape.

[0047] In this embodiment, the length of the equal-width teeth near the liquid inlet end 220 is the shortest, the length of the equal-width teeth located at the rear of the central axis of the liquid cooling plate 210 is the longest, and the length of the heat dissipation strip of the equal-width teeth near the liquid outlet end 230 is between the first two. The heat dissipation strip of the special-shaped teeth and the cover plate abutting surface of the liquid cooling plate 210 are trapezoidal, and the front and rear sides of the final module 100 are respectively connected to the power divider 500 and the filter amplifier module. The heat dissipation strip of the special-shaped teeth near the power divider 500 is the longest, and the heat dissipation strip of the special-shaped teeth near the filter amplifier module is the shortest.

[0048] In this embodiment, when the coolant contacts the first heat dissipation tooth, its abutment surface is the narrowest rectangular shape, so that the turbulence of the coolant is small, and it still flows at a faster flow rate; when the coolant gradually flows through the abutment surfaces of the remaining heat dissipation teeth, its abutment surface is the largest at the position of the seventh heat dissipation tooth. Since the heat dissipated by the fifth final-stage module 100 located on the liquid cooling plate 210 and the heat accumulated by the first four final-stage modules 100 have not yet dissipated, the heat accumulates at the position of the seventh heat dissipation tooth. Therefore, the widest rectangle of the abutment surface is set on the seventh heat dissipation tooth. By increasing the width of the abutment surface, the turbulence of the coolant here is increased, thereby improving the heat exchange efficiency between the coolant and the accumulated heat; when the coolant continues to flow to the ninth heat dissipation tooth, the heat accumulation has been alleviated at this time. In order to keep the coolant flow rate and liquid supply pressure, the rectangular width of the abutment surface begins to narrow again compared to the previous one. The narrowed heat dissipation tooth can control the coolant to reduce turbulence to increase the flow rate of the coolant. When the coolant contacts the tenth heat dissipation tooth, its abutment surface is trapezoidal in shape, which reduces stagnation and turbulence of the coolant on the one hand, thereby accelerating the outflow of the coolant; on the other hand, the trapezoidal shape formed by the different widths of the heat dissipation strips of the heat dissipation teeth maintains the expansion of the heat dissipation area, thereby taking away the heat of the final module located at the very end.

[0049] The length of the heat dissipation strip of the equal-width tooth closest to the liquid inlet end 220 is x, and the lengths of the heat dissipation strips of the other equal-width teeth are (x+n*a)±b respectively; the length of the heat dissipation strip with the largest width among the special-shaped teeth is x+n*a; where n is an integer, a=2, and b ranges from 0 to 1.

[0050] In this embodiment, the heat dissipation teeth in the single flow channel are arranged directly below the chip in the final module 100, increasing the flow area of ​​the coolant under the chip to achieve the effect of locally increasing heat dissipation. In the above formula, the values ​​of the second chip are n=0, a=2, b=1, the values ​​of the third chip are n=1, a=2, b=0.1, the values ​​of the fourth chip are n=2, a=2, b=0.3, the values ​​of the fifth chip are n=3, a=2, b=0.5, the values ​​of the sixth chip are n=4, a=2, b=0.8, the values ​​of the seventh chip are n=5, a=2, b=-0.8, the values ​​of the eighth chip are n=4, a=2, b=0, the values ​​of the ninth chip are n=4, a=2, b=-1, and the values ​​of the tenth chip are n=4, a=2. The left-in and right-out flow channel is designed through simulation and empirical calculation. The length of the flow channel heat dissipation tooth under the first chip on the left is x, and the others are x+1, x+2.1, x+4.3, x+6.5, x+8.8, x+9.2, x+8, x+7, and x+8 respectively. Through this form of design, the temperature consistency of each chip can be accurately guaranteed.

[0051] In this embodiment, through the actual measurement platform test, the temperature of the bottom shell of the chip is statistically shown in the following table:

[0052] Table 1 Chip case temperature data (from left to right) Chip serial number Case temperature(℃) Chip 1 66.2 Chip 2 66.6 Chip 3 66.9 Chip 4 67.4 Chip 5 67.6 Chip 6 68.2 Chip 7 68.9 Chip 8 69.4 Chip 9 70.2 Chip 10 71.0

[0053] From the data in the table, we can see that the chip shell temperature is relatively low, which meets the design and reliability requirements, and the temperature consistency of chip 1 to chip 10 does not differ by more than 5°C, which meets the temperature consistency design requirements. The temperature of the symmetrical part of chip 11-chip 20 below is consistent with the temperature of chip 1-10. Through this special design, the heat dissipation and temperature consistency problems of multiple chips on a line can be well solved. In addition, the special design of weight reduction and reinforcement ribs is made in the structural design, so that the weight also meets the design requirements of the cold plate assembly.

[0054] The above experimental data table can also be used to simulate the chip array on the liquid cooling plate 210, and then use the BP neural network to establish a direct mapping relationship between the design variables and the objective function. On the basis of considering the multi-objective functions of heat dissipation efficiency and pressure difference, the NGSA-2 algorithm is used to optimize the design of the heat dissipation tooth fin size in the flow channel to obtain the Pareto solution set distribution. The relationship between the maximum temperature of the final module 100 and the liquid inlet and outlet liquid difference of the liquid cooling plate 210 is obtained through result analysis. It is found that the width parameter of the heat dissipation tooth has a more significant effect on the maximum temperature. Then, a group of solutions with the best heat dissipation efficiency and concentrated within the allowable range of pressure difference are selected as engineering implementation parameters.

[0055] Both the actual platform test data and the simulation calculation data can verify that in this embodiment, the width parameter values ​​of the heat dissipation teeth at the corresponding positions of the 20 final-stage modules 100 are a set of values ​​with the highest temperature consistency for each final-stage module 100 on a liquid cooling plate 210 with a thickness of 7 mm under the conditions of a supply pressure of 1.5 MPa and an operating temperature of 60°C.

[0056] The single flow channel further includes a plurality of evenly distributed reinforcing columns, which connect the single flow channel to the groove and provide supporting force for the abutment between the final-stage module 100 and the heat dissipation teeth.

[0057] In this embodiment, since the single flow channel is relatively wide, in order to meet the requirement of a liquid supply pressure of 1.5 MPa, reinforcing columns of a specific shape are designed at intervals in the middle of the single flow channel to increase the cover tension of the liquid cooling plate 210 .

[0058] The thickness of the liquid cooling plate 210 is in the range of 5 mm to 9 mm.

[0059] In this embodiment, the thickness of the liquid cooling plate 210 is in the range of 7 mm.

[0060] In this embodiment, the reliability of the component will decrease by 50% for every 10°C increase in the temperature of a single component. Liquid cooling technology mainly uses a refrigerant with high thermal conductivity and high specific heat capacity to efficiently exchange heat with the heat source in a circulation manner to reduce the system temperature. Liquid cooling has a high heat transfer coefficient, good fluidity and system stability, making it the preferred solution for high-temperature system heat dissipation. In the system-level liquid cooling design, the matching of the flow resistance of the liquid cooling plate and the system distribution flow resistance is also critical. If the local flow resistance is poorly matched, it will lead to instability of the entire liquid cooling system. The thickness of the liquid cooling plate, that is, the flow cross-sectional area of ​​the single flow channel, has a direct impact on the flow resistance of the coolant.

[0061] The temperature of the corresponding final-stage modules 100 on both sides is consistent, which is below 75° C. when the working environment is 60° C., and the temperature difference between the contact surfaces of each final-stage module 100 and the liquid cooling plate 210 is below 5° C.

[0062] In this embodiment, the temperature consistency of the chips of 20 final-stage modules 100 with a heat consumption of 70 W is less than 5°C.

[0063] In this embodiment, 20 final modules 100 are arranged in a straight line, in order to ensure that the flow rate of the coolant in each final module 100 is consistent, so as to be reliably and accurately distributed to each heat sink. The flow-resistance response characteristics of the coolant can also be numerically analyzed, and the minimum / maximum flow rate in the component is obtained by numerically solving the maximum / minimum allowable flow resistance, and the temperature distribution of each final module is analyzed.

[0064] In this embodiment, the chip temperature difference of 5°C in each final module 100 can be used as a design basis for the temperature compensation circuit. The temperature compensation circuit is set for the power amplifier chip in the millimeter wave power amplifier assembly, and the gain value of the corresponding chip is adjusted according to the power amplifier chip position and the calculated temperature value to achieve the effect of temperature compensation. The temperature compensation circuit can also be used to perform temperature compensation on the power amplifier chips at different positions, reducing the impact of uneven temperature caused by the flow channel design and chip position layout, so that the gain difference of different power amplifier chips on the entire phased array array does not exceed a constant value.

[0065] The supply pressure of the coolant is 1.3-1.7 MPa, the supply flow rate of the coolant is 3.1-3.3 L / min, and the heat dissipation of the liquid cooling plate 210 is 1400W.

[0066] In this embodiment, the coolant is AF65# antifreeze, the supply temperature is 60°C, the supply pressure of the coolant is 1.5MPa, the supply flow rate of the coolant is 3.2L / min, and the heat dissipation of the liquid cooling plate 210 is 1400W.

[0067] In this embodiment, the heat dissipation teeth in the liquid cooling plate 210 form a microchannel. How to obtain the best cooling effect and heat exchange performance with the minimum pressure drop in the microchannel is a key research issue. In the microchannel, the load of the coolant is constantly changing with the change of flow resistance during the process of filling the coolant, and the change of the heat dissipation at the location of each final module 100. In this embodiment, in order to maintain the coolant flow rate flowing through the microchannel in each heat dissipation tooth at a set value of 3.2L / min, it is necessary to set the liquid supply pressure at a constant value of 1.5MPa to prevent insufficient flow of the coolant below the final module 100. In order to adapt to the dynamically changing load, a pressure regulator can be added to the liquid inlet end 220, in which a pressure sensor, a valve and a PID controller are integrated, and a flow sensor is added to each heat dissipation tooth; thereby achieving precise adjustment and control of the coolant pressure of the liquid supply in the closed liquid cooling plate. Example 2

[0068] A power amplifier provided with a single-channel liquid cooling plate 210 is also provided, which includes the ultra-thin single-channel liquid cooling plate 210 for achieving multi-chip temperature consistency as described in Example 1, and also includes a driving module 300, a power module, a power divider 500, and a filtering power divider module 600. The driving module 300 sends a driving instruction to the power module, the power module supplies power to the power divider 500, the power divider 500 divides the input signal into multiple output signals to the final module 100, and the final module 100 outputs the signal to the filtering power divider module 600 to maintain the stability of the output signal.

[0069] In this embodiment, the power amplifier is composed of 20 high heat consumption planar final stage modules 100, 4 power dividers 500, 4 power control modules 400 and an ultra-thin liquid cooling plate 210. On the basis of ensuring the miniaturization and lightweight of the overall structure, the heat dissipation problems of various power amplifier modules, drive modules 300, power control modules 400, and filter power divider modules 600, as well as the strength and precision problems after assembly and locking are solved, ensuring that the high temperature environment is 60°C, the bottom surface temperature of the final stage module 100 on the liquid cooling plate 210 does not exceed 75°C, and the temperature consistency between the final stage modules 100 does not exceed 5°C.

[0070] In this embodiment, the power amplifier is a millimeter wave power amplifier component structure, which not only integrates the functional chips and circuits in the component, but also needs to realize the liquid cooling and heat dissipation integration of the component within a very small height dimension to ensure that the millimeter wave phased array antenna has the scalability of the array surface and the maintainability of the phased array. In order to realize the rapid blind plug structure integration of the millimeter wave phased array, a blind plug interface for the coolant inlet and outlet is set in the millimeter power amplifier component structure, while reducing the antenna switching insertion loss and improving the overall performance of the millimeter wave phased array antenna.

[0071] In this embodiment, the key indicators of the power amplifier include gain, efficiency, linearity, output power and bandwidth. Gain refers to the amplification factor of the power amplifier to the input signal, which is usually between 20-30dB. Efficiency refers to the energy of the power amplifier converting DC power into RF power. High-efficiency amplifiers can minimize power loss and are usually used in mobile communication devices. Linearity is a measure of the fidelity of the amplifier output signal and the input signal. The higher the linearity, the smaller the signal distortion. Output power refers to the maximum RF power that the amplifier can output, usually expressed in dBm or W, and bandwidth refers to the frequency range that the amplifier can effectively amplify. Power amplifiers are divided into linear power amplifiers, switching power amplifiers, and bandwidth power amplifiers according to their working principles and application scenarios.

[0072] In this embodiment, the installation positions of various modules in the model of the power amplifier are cut in proportion, and each module is pasted at the installation position, and each module is connected to the test circuit according to the designed route, so as to facilitate the experiment of the real working environment of the power amplifier; transparent rubber hoses are clamped at the liquid inlet and outlet ends to facilitate the observation of the flow direction of the coolant; temperature test sensors are connected around the final module and at the liquid inlet end to monitor the temperature of the coolant when it is flowing in to maintain accuracy and record whether the temperature change of the chip in the final module is too different. Example 3

[0073] like Figure 6 , 7 As shown, unlike embodiments 1 and 2, the final module 100 in this embodiment is still arranged in a straight line, but the abutting surface of the heat dissipation teeth in the liquid cooling plate 210 is not rectangular or trapezoidal, but wavy. In the middle section between chip 6 and chip 7, the abutting surface of the heat dissipation teeth is in the shape of a crossed double wavy line, and hollow perforations are provided on the cross surface to facilitate the flow of the coolant. The three heat dissipation strips above the chip 10 are in the shape of a wavy line, and the four heat dissipation strips below are in the shape of a crossed double wavy line. Wavy heat dissipation teeth can reduce flow resistance compared to straight lines. Therefore, the wavy heat dissipation teeth can increase the length to expand the heat dissipation area, so as to achieve sufficient heat exchange of the coolant without losing its flow rate, thereby avoiding affecting the flow of the coolant in the rear-positioned chip.

[0074] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the technical solution of the present invention, and are not intended to limit the specific implementation methods of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the claims of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. An ultra-thin single-channel liquid cooling plate for achieving temperature consistency among multiple chips, characterized in that: It includes a support member, a plurality of final-stage modules and a liquid cooling plate. The support member is provided with a groove. The liquid cooling plate is arranged in the groove. The plurality of final-stage modules are arranged on both sides of the liquid cooling plate. The liquid cooling plate includes a single flow channel and a plurality of groups of heat dissipation teeth. The single flow channel is arranged at the position where the final-stage module is located. The plurality of groups of heat dissipation teeth are distributed in the single flow channel at intervals corresponding to the positions of the final-stage modules. The abutment surfaces formed by the heat dissipation teeth and the single flow channel include a variety of shapes. Cooling liquid flows unidirectionally in the single flow channel and flows through the heat dissipation teeth to cool the final-stage module.

2. The ultra-thin single-channel liquid cooling plate for achieving temperature consistency among multiple chips according to claim 1, characterized in that: The liquid cooling plate also includes a liquid inlet and a liquid outlet. The single flow channel is in a "S" shape, including a straight section with heat dissipation teeth, an access section connected to the liquid inlet, and an outlet section connected to the liquid outlet. The coolant flows from the liquid inlet to the access section, exchanges heat with the heat dissipation teeth through the straight section, and then flows from the outlet section to the liquid outlet.

3. The ultra-thin single-channel liquid cooling plate for achieving temperature consistency among multiple chips according to claim 2, characterized in that: The heat dissipation teeth include equal-width teeth near the liquid inlet end and special-shaped teeth near the liquid outlet end. The equal-width teeth include nine groups, each group includes multiple parallel and equal-width heat dissipation strips, and the special-shaped teeth include one group, including parallel heat dissipation strips with increasing widths.

4. The ultra-thin single-channel liquid cooling plate for achieving temperature consistency among multiple chips according to claim 2, characterized in that: The abutment surface of the equal-width teeth is rectangular in shape, and the length of each rectangle gradually increases and then decreases along the flow direction of the coolant. The abutment surface of the special-shaped teeth is trapezoidal in shape.

5. The ultra-thin single-channel liquid cooling plate for achieving temperature consistency among multiple chips according to claim 2, characterized in that: The length of the heat dissipation strip of the equal-width tooth closest to the liquid inlet end is x, and the lengths of the heat dissipation strips of the other equal-width teeth are (x+n*a)±b respectively; the length of the heat dissipation strip with the largest width among the special-shaped teeth is x+n*a; where n is an integer, a=2, and the value range of b is 0-1.

6. The ultra-thin single-channel liquid cooling plate for achieving temperature consistency among multiple chips according to claim 1, characterized in that: The single flow channel also includes a plurality of evenly distributed reinforcing columns, which connect the single flow channel to the groove and provide supporting force for the abutment between the final-stage module and the heat dissipation teeth.

7. The ultra-thin single-channel liquid cooling plate for achieving temperature consistency of multiple chips according to any one of claims 1 to 6, characterized in that: The thickness of the liquid cooling plate ranges from 5 mm to 9 mm.

8. The ultra-thin single-channel liquid cooling plate for achieving temperature consistency among multiple chips according to any one of claims 1 to 6, characterized in that: The temperature of the corresponding final modules on both sides is consistent, which is below 75°C when the working environment is 60°C, and the temperature difference between the contact surfaces of each final module and the liquid cooling plate is below 5°C.

9. The ultra-thin single-channel liquid cooling plate for achieving temperature consistency among multiple chips according to claim 8, characterized in that: The supply pressure of the coolant is 1.3-1.7 MPa, the supply flow rate of the coolant is 3.1-3.3 L / min, and the heat dissipation of the liquid cooling plate is 1400 W.

10. A power amplifier provided with a single-channel liquid cooling plate, characterized in that: It includes the ultra-thin single-channel liquid cooling plate for achieving multi-chip temperature consistency as described in claim 9, and also includes a driving module, a power module, a power divider, and a filtering power divider module. The driving module sends a driving instruction to the power module, the power module supplies power to the power divider, the power divider divides the input signal into multiple output signals to the final module, and the final module outputs the signal to the filtering power divider module to maintain the stability of the output signal.

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