Laminated alloy frame and manufacturing method thereof
By designing the protrusions and grooves on the surface of the alloy frame and embedding corresponding grooves during the pressing process, the problem of easy dislocation of the double-layer alloy frame during the packaging process is solved, achieving higher accuracy and efficiency.
Patent Information
- Application Number
- CN202411800245.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-02-28
AI Technical Summary
The existing double-layer alloy frames are prone to misalignment during packaging, resulting in inaccurate bonding, which in turn affects the cutting accuracy and efficiency.
By designing that the upper surface of the first alloy frame has a positioning protrusion, the lower surface of the second alloy frame has a corresponding positioning groove, and the positioning protrusion is embedded in the positioning groove during the pressing process to improve positioning accuracy and overlapping degree and prevent misalignment.
It effectively prevents the risk of misalignment of the laminated alloy frame during the pressing process, improves the packaging accuracy and cutting efficiency, and avoids the situation of miscutting.
Smart Images
Figure CN119546163A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor packaging, and in particular to a laminated alloy frame and a manufacturing method thereof. Background Art
[0002] Ultrasonic transducers are used to convert electrical energy into ultrasonic energy, or vice versa. Their working principle is to convert high-frequency electrical signals into mechanical vibrations through the piezoelectric effect of piezoelectric ceramics, thereby generating ultrasonic waves. Ultrasonic transducers are widely used in medical, industrial, and communications fields. In the medical field, ultrasonic transducers are often used in ultrasonic medical imaging equipment to generate ultrasonic images for diagnosis. In the industrial field, ultrasonic transducers are used in ultrasonic cleaning, welding, cutting and other processes. In the field of communications, ultrasonic transducers are used in ultrasonic sensors to detect distance, liquid level and other information.
[0003] During the packaging process of ultrasonic transducers, double-layer alloy frames are applied, which generally include a lower alloy frame and an upper alloy frame located on the surface of the lower alloy frame. The double-layer alloy frame can not only meet the specific functional requirements of the ultrasonic transducer (such as a smaller warping requirement), but also provide support and fixation for the ultrasonic transducer, and at the same time protect the circuit board of the ultrasonic transducer from mechanical damage and environmental influences. Due to the large structural differences of the existing double-layer alloy frames (such as the hollow structure in the lower alloy frame or the upper alloy frame), when making the double-layer alloy frame, it is necessary to bond the separate lower alloy frame and the upper alloy frame through a high-temperature pressing process after they are formed separately. However, during the bonding process, there is a risk of misalignment between the lower alloy frame and the upper alloy frame, resulting in an offset between the lower alloy frame and the upper alloy frame. After the packaging is completed, when cutting (or splitting) is performed, there is a risk of mistakenly cutting the main body of the lower alloy frame, which is not conducive to cutting. Summary of the invention
[0004] The technical problem to be solved by the present application is to provide a laminated alloy frame and a manufacturing method thereof to prevent the risk of misalignment of the laminated alloy frame.
[0005] To this end, an embodiment of the present application provides a method for manufacturing a laminated alloy frame, comprising: Providing a first alloy frame, the first alloy frame comprising an upper surface and a lower surface opposite to each other, the upper surface of the first alloy frame having at least two positioning protrusions; Providing a second alloy frame, the second alloy frame comprising an upper surface and a lower surface opposite to each other, the lower surface of the second alloy frame having at least two positioning grooves, the positions of the positioning grooves corresponding to the positions of the positioning protrusions; The lower surface of the second alloy frame is pressed onto the upper surface of the first alloy frame, and during the pressing, the positioning protrusions are embedded in the corresponding positioning grooves.
[0006] In an optional embodiment, the first alloy frame includes a first middle area and a first edge area surrounding the first middle area, the second alloy frame includes a second middle area and a second edge area surrounding the second middle area, the positioning protrusion is located on the upper surface of the first edge area of the first alloy frame, and the positioning groove is located on the lower surface of the second edge area of the second alloy frame.
[0007] In an optional embodiment, it also includes: forming a first positioning hole in the first edge region of the first alloy frame, penetrating the upper surface and the lower surface of the first edge region; forming a second positioning hole in the second edge region of the second alloy frame, penetrating the upper surface and the lower surface of the second edge region, the positions of the second positioning hole and the first positioning hole correspond to each other, and when the pressing is performed, the second positioning hole in the second alloy frame is located directly above the first positioning hole in the first alloy frame.
[0008] In an optional embodiment, the first middle area of the first alloy frame includes a plurality of discrete first main body areas and a first connecting block that fixedly connects adjacent first main body areas, the thickness of the first connecting block is less than the thickness of the first main body area, and the upper surface of the first connecting block is flush with the upper surface of the first main body area, and the lower surface of the first connecting block is higher than the lower surface of the first main body area; the second middle area of the second alloy frame includes a plurality of discrete second main body areas and a second connecting block that fixedly connects adjacent second main body areas, the shape, size and position of the second main body areas correspond to the shape, size and position of the first main body areas, the shape, size and position of the second connecting block correspond to the shape, size and position of the first connecting block, the thickness of the second connecting block is less than the thickness of the second main body area, the upper surface of the second connecting block is lower than the upper surface of the second main body area, and the lower surface of the second connecting block is flush with the lower surface of the second main body area.
[0009] In an optional embodiment, it also includes: forming a plurality of alignment holes on the upper surface of the second edge area of the second alloy frame, the depth of the alignment holes is less than the thickness of the second alloy frame, and the alignment holes are used to locate the position of the second main area when cutting the laminated alloy frame.
[0010] In an optional embodiment, the alignment hole, the positioning protrusion, the positioning groove, the first connecting block and the second connecting block are formed by a mold stamping process and / or an etching process.
[0011] In an optional embodiment, the second main body area of the second alloy frame has a hollow pattern, and the first main body area of the first alloy frame does not have a hollow pattern; and the further embodiment includes: mounting a semiconductor chip on the lower surface of the first main body area.
[0012] In an optional embodiment, after mounting the semiconductor chip, the cutting is performed to cut off the second connection blocks between adjacent second main body regions and the first connection blocks between adjacent first main body regions to form a plurality of discrete packaging structures.
[0013] In an optional embodiment, the shape, size and position of the positioning protrusion correspond to the shape, size and position of the positioning groove.
[0014] In an optional embodiment, during the pressing, the lower surface of the second alloy frame is pressed onto the upper surface of the first alloy frame by adhesive, and the temperature during the pressing is 80 degrees Celsius to 180 degrees Celsius.
[0015] Another embodiment of the present application further provides a laminated alloy frame, comprising: A first alloy frame, the first alloy frame comprising an upper surface and a lower surface opposite to each other, the upper surface of the first alloy frame having at least two positioning protrusions; A second alloy frame, the second alloy frame comprising an upper surface and a lower surface opposite to each other, the lower surface of the second alloy frame having at least two positioning grooves, the positions of the positioning grooves corresponding to the positions of the positioning protrusions; The lower surface of the second alloy frame is pressed onto the upper surface of the first alloy frame, and the positioning protrusions are embedded in the corresponding positioning grooves during the pressing.
[0016] In an optional embodiment, the first alloy frame includes a first middle area and a first edge area surrounding the first middle area, the second alloy frame includes a second middle area and a second edge area surrounding the second middle area, the positioning protrusion is located on the upper surface of the first edge area of the first alloy frame, and the positioning groove is located on the lower surface of the second edge area of the second alloy frame.
[0017] In an optional embodiment, the first edge area of the first alloy frame also has a first positioning hole that passes through the upper and lower surfaces of the first edge area; the second edge area of the second alloy frame also has a second positioning hole that passes through the upper and lower surfaces of the second edge area, and the second positioning hole is located directly above the first positioning hole.
[0018] In an optional embodiment, the first middle area of the first alloy frame includes a plurality of discrete first main body areas and a first connecting block that fixedly connects adjacent first main body areas, the thickness of the first connecting block is less than the thickness of the first main body area, and the upper surface of the first connecting block is flush with the upper surface of the first main body area, and the lower surface of the first connecting block is higher than the lower surface of the first main body area; the second middle area of the second alloy frame includes a plurality of discrete second main body areas and a second connecting block that fixedly connects adjacent second main body areas, the shape, size and position of the second main body areas correspond to the shape, size and position of the first main body areas, the shape, size and position of the second connecting block correspond to the shape, size and position of the first connecting block, the thickness of the second connecting block is less than the thickness of the second main body area, the upper surface of the second connecting block is lower than the upper surface of the second main body area, and the lower surface of the second connecting block is flush with the lower surface of the second main body area.
[0019] In an optional embodiment, it also includes: a plurality of alignment holes located on the upper surface of the second edge area of the second alloy frame, the depth of the alignment holes is less than the thickness of the second alloy frame, and the alignment holes are used to locate the position of the second main area when cutting the laminated alloy frame.
[0020] In an optional embodiment, the second main body area of the second alloy frame has a hollow pattern, and the first main body area of the first alloy frame does not have a hollow pattern; further comprising: a semiconductor chip mounted on the lower surface of the first main body area.
[0021] In an optional embodiment, the semiconductor chip includes an ultrasonic transducer.
[0022] In an optional embodiment, the shape, size and position of the positioning protrusion correspond to the shape, size and position of the positioning groove.
[0023] In an optional embodiment, there is adhesive between the lower surface of the second alloy frame and the upper surface of the first alloy frame.
[0024] The advantages of the technical solution of this application are: The laminated alloy frame and its manufacturing method mentioned above in the present application, in one embodiment, the manufacturing method includes: providing a first alloy frame, the first alloy frame includes a relative upper surface and a lower surface, the upper surface of the first alloy frame has at least two positioning protrusions; providing a second alloy frame, the second alloy frame includes a relative upper surface and a lower surface, the lower surface of the second alloy frame has at least two positioning grooves, the positions of the positioning grooves correspond to the positions of the positioning protrusions; pressing the lower surface of the second alloy frame onto the upper surface of the first alloy frame, and the positioning protrusions are embedded in the corresponding positioning grooves during the pressing. When the second alloy frame is pressed onto the upper surface of the first alloy frame, the positioning protrusions on the upper surface of the first alloy frame are used to cooperate with the positioning grooves on the lower surface of the second alloy frame (the at least two positioning protrusions are respectively embedded in the corresponding positioning grooves) to improve the position accuracy and overlap of the first alloy frame and the second alloy frame when they are pressed together, and prevent the risk of misalignment when the first alloy frame and the second alloy frame are pressed together, so as to avoid accidental cutting of the main body (first main body area) of the first alloy frame located at the lower layer when the formed laminated alloy frame is subsequently cut (cutting from the upper surface of the second alloy frame downward). BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1-Figure 15 It is a structural schematic diagram of the formation process of the laminated alloy frame in one embodiment of the present application. DETAILED DESCRIPTION
[0026] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present application in detail, for the sake of convenience, the schematic diagrams will not be partially enlarged according to the general proportion, and the schematic diagrams are only examples, which should not limit the scope of protection of the present application. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.
[0027] In the embodiment of the present application, a method for manufacturing a laminated alloy frame is first provided, and the manufacturing direction is described in detail below with reference to the accompanying drawings.
[0028] First, refer to Figure 1 and Figure 2 ,in Figure 2 for Figure 1 The schematic cross-sectional structure diagram along the cutting line AB direction provides a first alloy frame 101 , wherein the first alloy frame 101 includes an upper surface and a lower surface opposite to each other, and the upper surface of the first alloy frame 101 has at least two positioning protrusions 104 .
[0029] The first alloy frame 101 is one of the layers in the laminated alloy frame, and the first alloy frame 101 has good thermal and electrical conductivity, low thermal expansion coefficient, sufficient strength, and high flatness. In one embodiment, the material of the first alloy frame 101 is copper alloy or iron-nickel alloy. In a specific embodiment, the copper alloy can be copper-iron alloy, copper-nickel-silicon alloy, copper-chromium alloy, or copper-nickel-tin alloy.
[0030] The upper surface of the first alloy frame 101 has at least two positioning protrusions 104, and the positioning protrusions 104 protrude from the upper surface of the first alloy frame 101. Fig.13 ) when pressed on the upper surface of the first alloy frame 101, the positioning protrusion 104 on the upper surface of the first alloy frame 101 is used to cooperate with the positioning groove 204 on the lower surface of the second alloy frame 201 (the at least two positioning protrusions 104 are respectively embedded in the corresponding positioning grooves 204) to improve the position accuracy and overlap of the first alloy frame 101 and the second alloy frame 201 when they are pressed together, and prevent the risk of misalignment when the first alloy frame 101 and the second alloy frame 201 are pressed together, so as to avoid accidental cutting of the main body (first main body area) of the first alloy frame 101 located at the lower layer when the formed laminated alloy frame is subsequently cut (cutting from the upper surface of the second alloy frame 201 downwards).
[0031] In one embodiment, the number of the positioning protrusions 104 may be two or more than two, and the at least two positioning protrusions 104 are respectively located at different positions on the upper surface of the first alloy frame 101 .
[0032] In one embodiment, the positioning protrusion 104 is made of the same material as the first alloy frame 101. The positioning protrusion 104 and the first alloy frame 101 are an integral structure.
[0033] In other embodiments, the positioning protrusion 104 and the first alloy frame 101 may be made of the same or different materials, and the positioning protrusion 104 is welded to the upper surface of the first alloy frame 101 by solder.
[0034] In one embodiment, the first alloy frame 101 includes a first middle area 12 and a first edge area 11 surrounding the first middle area 12. The first middle area 12 of the first alloy frame 101 includes a plurality of discrete first main areas 102 and a first connecting block 103 that fixes adjacent first main areas 102 together. The first edge area 11 is a border of the first alloy frame 101. The first main areas 102 are arranged in rows and columns. The shape of the first main areas 102 is a square. The four sides of each first main area 102 are fixedly connected to one side of the first main area 102 adjacent to the four sides through a first connecting block 103, and the side of the first main area 102 close to the first edge area 11 (or border) is also fixedly connected to the adjacent first edge area 11 (or border) through a first connecting block 103. It should be noted that for the convenience of identification and illustration, Figure 1 and Figure 2 In the following figures, different structures are distinguished by dotted lines, such as Figure 1 and Figure 2 The first main body area 102 and the first connecting block 103 are provided in the embodiment of the present invention.
[0035] In one embodiment, the width of the first connecting block 103 is smaller than the width of the first main body area 102, and the area of the first intermediate area 12 other than the first connecting block 103 and the first main body area 102 is a gap 107. On the one hand, the first connecting block 103 can better fix the adjacent first main body area 102, and the gap 107 can reduce the stress of the first alloy frame 101 and reduce the weight of the first alloy frame 101. On the other hand, only the first connecting block 103 needs to be cut off during subsequent cutting, thereby improving cutting efficiency.
[0036] In one embodiment, the positioning protrusion 104 is located on the upper surface of the first edge region 11 (or frame) of the first alloy frame 101 and does not occupy the area of the first middle region 12 of the first alloy frame 101 , which facilitates the layout of the positioning protrusion 104 .
[0037] In one embodiment, the shape, size and position of the positioning protrusion 104 on the upper surface of the first alloy frame 101 are consistent with the positioning groove 204 (refer to Fig. 9), specifically, the positioning protrusion 104 on the upper surface of the first alloy frame 101 has the same shape, size and position as the positioning groove 204 formed on the lower surface of the subsequent second alloy frame 201, that is, when the second alloy frame 201 is subsequently pressed onto the upper surface of the first alloy frame 101, the positioning protrusion 104 can be accurately and tightly embedded in the corresponding positioning groove 204, so as to further improve the position accuracy and overlap of the first alloy frame 101 and the second alloy frame 201 when they are pressed together, so as to better prevent the risk of misalignment when the first alloy frame 101 and the second alloy frame 201 are pressed together.
[0038] In one embodiment, the positioning protrusion 104, the first main body area 102, the first connecting block 103 and the frame can be formed by a die stamping process on a whole piece of alloy plate. In another embodiment, the positioning protrusion 104, the first main body area 102, the first connecting block 103 and the frame can be formed by an etching process on a whole piece of alloy plate, and the etching process is a chemical etching process or a wet etching process. In another embodiment, the positioning protrusion 104, the first main body area 102, the first connecting block 103 and the frame can be formed by a die stamping process and an etching process on a whole piece of alloy plate.
[0039] In one embodiment, reference Figure 3 , further comprising: removing a portion of the thickness of the first connecting block 103 from the lower surface of the first alloy frame 101, so that the thickness of the remaining first connecting block 103 is less than the thickness of the first main body area 102, that is, the upper surface of the remaining first connecting block 103 is flush with the upper surface of the first main body area 102, and the lower surface of the remaining first connecting block 103 is higher than the lower surface of the first main body area 102. On the one hand, the upper surface of the first connecting block 103 of the first alloy frame 101 can still be connected with the lower surface of the second connecting block of the subsequent second alloy frame 201. On the other hand, since part of the lower surface of the first connecting block 103 is etched away, the stress in the first alloy frame 101 can be further released and the warping can be improved, which is beneficial to improving the position accuracy of the laminated alloy frame during pressing, reducing the stress of the laminated alloy frame and improving the warping. At the same time, after the laminated alloy frame is subsequently formed and the semiconductor chip is mounted, the thickness of the first connecting block 103 that needs to be cut off becomes thinner during cutting, which reduces the cutting time and difficulty and improves the cutting efficiency.
[0040] In one embodiment, the thickness of the remaining first connection block 103 is 1 / 3-2 / 3 of the thickness of the first main body region 102 .
[0041] In one embodiment, a portion of the thickness of the first connection block 103 is removed by an etching process, and the etching process is a chemical etching process or a wet etching process.
[0042] In one embodiment, reference Figure 4 and Figure 5 , where Figure 5 For the Figure 4 A schematic cross-sectional structure diagram along the cutting line AB direction, in which a first positioning hole 105 penetrating the upper surface and the lower surface of the first edge region 11 is formed in the first edge region 11 of the first alloy frame 101, and the first positioning hole 105 is subsequently placed in the second alloy frame 201 (reference Fig.13 ) when pressed on the upper surface of the first alloy frame 101, cooperates with the second positioning hole 205 in the second alloy frame 201 to further improve the position accuracy and overlap of the first alloy frame 101 and the second alloy frame 201 when they are pressed, thereby better preventing the risk of misalignment when the first alloy frame 101 and the second alloy frame 201 are pressed.
[0043] refer to Figure 6-Figure 9 ,in, Figure 7 for Figure 6 Schematic diagram of the cross-sectional structure along the cutting line CD direction, Fig. 9 for Figure 8 A schematic cross-sectional structure diagram along the cutting line CD direction provides a second alloy frame 201, wherein the second alloy frame 201 includes an upper surface and a lower surface opposite to each other, and the lower surface of the second alloy frame 201 has at least two positioning grooves 204 (refer to Fig. 9 ), the position of the positioning groove 204 is consistent with the positioning protrusion 104 (reference Figure 1 and Figure 2 ) position.
[0044] The second alloy frame 201 is another layer in the laminated alloy frame. The second alloy frame 201 has good thermal and electrical conductivity, low thermal expansion coefficient, sufficient strength, and high flatness. In one embodiment, the material of the second alloy frame 201 can be the same as or different from the material of the first alloy frame 101. In one embodiment, the material of the second alloy frame 201 is a copper alloy or an iron-nickel alloy. In a specific embodiment, the copper alloy can be a copper-iron alloy, a copper-nickel-silicon alloy, a copper-chromium alloy, or a copper-nickel-tin alloy.
[0045] The lower surface of the second alloy frame 201 has at least two positioning grooves 204, and the positioning grooves 204 are recessed in the lower surface of the second alloy frame 201. Fig.13), the positioning groove 204 on the lower surface of the second alloy frame 201 is used to cooperate with the positioning protrusion 104 on the upper surface of the first alloy frame 101 (the at least two positioning protrusions 104 are respectively embedded in the corresponding positioning grooves 204) to improve the position accuracy and overlap of the first alloy frame 101 and the second alloy frame 201 when they are pressed together, and prevent the risk of misalignment when the second alloy frame 201 and the first alloy frame 101 are pressed together, so as to avoid accidental cutting of the main body of the first alloy frame 101 located at the lower layer when the formed laminated alloy frame is subsequently cut (cutting from the upper surface of the second alloy frame 201 downwards).
[0046] In one embodiment, the number of the positioning grooves 204 may be two or more than two, and the at least two positioning grooves 204 are respectively located at different positions on the lower surface of the second alloy frame 201 .
[0047] In one embodiment, the second alloy frame 201 includes a second middle region 22 and a second edge region 21 surrounding the second middle region 22. The second middle region 22 of the second alloy frame 201 includes a plurality of discrete second main regions 202 and a second connection block 203 that fixes and connects adjacent second main regions 202. The second edge region 21 is a frame of the second alloy frame 201. The second main regions 202 are arranged in rows and columns, and the shape of the second main regions 202 is a square. The four sides of each second main region 202 are fixedly connected to one side of the second main region 202 adjacent to the surroundings through a second connection block 203, and the side of the second main region 202 close to the second edge region 21 (or frame) is also fixedly connected to the adjacent second edge region 21 (or frame) through a second connection block 203.
[0048] In one embodiment, the width of the second connecting block 203 is smaller than the width of the second main body area 202, and the area of the second intermediate area 22 other than the second connecting block 203 and the second main body area 202 is a gap 207. On the one hand, the second connecting block 203 can better fix the adjacent second main body area 202, and the gap 207 can reduce the stress of the second alloy frame 201 and reduce the weight of the second alloy frame 201. On the other hand, during subsequent cutting, only the second connecting block 203 needs to be cut off, thereby improving cutting efficiency.
[0049] In one embodiment, the positioning groove 204 is located on the lower surface of the second edge region 21 (or frame) of the second alloy frame 201 and does not occupy the area outside the second middle region 22 of the second alloy frame 201 , which facilitates the layout of the positioning groove 204 .
[0050] In one embodiment, the shape, size and position of the second main body area 202 correspond to those of the first main body area 102, and the shape, size and position of the second connecting block 203 correspond to those of the first connecting block 103. Specifically, the second main body area 202 has the same shape, size and position as the first main body area 102, and the second connecting block 203 has the same shape, size and position as the first connecting block 103.
[0051] In one embodiment, the shape, size and position of the positioning groove 204 on the lower surface of the second alloy frame 201 correspond to the shape, size and position of the positioning protrusion 104 formed on the upper surface of the first alloy frame 101. Specifically, the positioning groove 204 on the lower surface of the second alloy frame 201 has the same shape, size and position as the positioning protrusion 104 formed on the upper surface of the first alloy frame 101. That is, when the second alloy frame 201 is subsequently pressed onto the upper surface of the first alloy frame 101, the positioning protrusion 104 can be accurately and tightly embedded in the corresponding positioning groove 204, so as to further improve the position accuracy and the overlap between the first alloy frame 101 and the second alloy frame 201 when they are pressed together, so as to better prevent the risk of misalignment when the second alloy frame 201 and the first alloy frame 101 are pressed together.
[0052] In one embodiment, the positioning groove 204, the second main body area 202, the second connecting block 203 and the frame can be formed by a die stamping process on a whole piece of alloy plate. In another embodiment, the positioning groove 204, the second main body area 202, the second connecting block 203 and the frame can be formed by an etching process on a whole piece of alloy plate, and the etching process is a chemical etching process or a wet etching process. In another embodiment, the positioning groove 204, the second main body area 202, the second connecting block 203 and the frame can be formed by a die stamping process and an etching process on a whole piece of alloy plate.
[0053] In one embodiment, continue to refer to Figure 6, the second main area 202 of the second alloy frame 201 has a hollow pattern 212, and the second alloy frame 201 with the hollow pattern 212 is subsequently pressed together with the first alloy frame 101 without the hollow pattern to form a laminated alloy frame, and a semiconductor chip is mounted on the lower surface of the first main area 102 of the first alloy frame 101. On the one hand, while ensuring the mechanical stability of the laminated alloy frame, the weight of the laminated alloy frame can be further reduced; on the other hand, in one embodiment, when the mounted semiconductor chip is an ultrasonic transducer, the hollow pattern 212 can improve the acoustic radiation efficiency, widen the frequency band, improve heat dissipation and improve stability. In one embodiment, the hollow pattern 212 can be one or more, and the hollow pattern 212 can be designed into different shapes as needed, such as square, circular or irregular shapes.
[0054] In one embodiment, reference Figure 8 and Fig. 9 , further comprising: removing a portion of the thickness of the second connecting block 203 from the upper surface of the second alloy frame 201, so that the thickness of the remaining second connecting block 203 is less than the thickness of the second main body area 202, that is, the upper surface of the remaining second connecting block 203 is lower than the upper surface of the second main body area 202, and the lower surface of the remaining second connecting block 203 is flush with the lower surface of the second main body area 202, on the one hand, the lower surface of the second connecting block 203 of the subsequent second alloy frame 201 can still be pressed with the upper surface of the first connecting block 103 of the subsequent first alloy frame 101 (refer to Fig.13 ), ensuring the firmness and position accuracy of the laminated alloy frame pressing; on the other hand, since part of the upper surface of the second connecting block 203 is etched away, the stress in the second alloy frame 201 can be further released and the warping can be improved, which is beneficial to improving the position accuracy of the laminated alloy frame during pressing, and reducing the stress of the laminated alloy frame and improving the warping. At the same time, after the laminated alloy frame is subsequently formed and the semiconductor chip is mounted, the thickness of the second connecting block 203 that needs to be cut off becomes thinner during cutting, which reduces the cutting time and difficulty of cutting and improves the cutting efficiency.
[0055] In one embodiment, the thickness of the remaining second connection block 203 is 1 / 3-2 / 3 of the thickness of the second main body region 202 .
[0056] In one embodiment, a portion of the thickness of the second connection block 203 is removed by an etching process, and the etching process is a chemical etching process or a wet etching process.
[0057] In one embodiment, reference Figure 8 and Fig.10 ,in Fig.10 for Figure 8The schematic diagram of the cross-sectional structure along the cutting line EF also includes: a plurality of alignment holes 206 are formed on the upper surface of the second edge area 21 of the second alloy frame 201, the depth of the alignment holes 206 is less than the thickness of the second alloy frame 201, and the alignment holes 206 are used to locate the position of the second main area 202 when cutting the laminated alloy frame.
[0058] Since the relative positions of the second main body area 202 and the second connecting block 203 and the alignment hole 206 are fixed, when cutting, the cutting equipment can accurately know the position of the second main body area 202 and the position of the second connecting block 203 between adjacent second main body areas 202 based on the identified position of the alignment hole 206, and can then cut off the second connecting block at the corresponding position.
[0059] The opening of the alignment hole 206 is located on the upper surface of the second alloy frame 201, and the bottom of the alignment hole 206 is closed, that is, the alignment hole 206 is not a through hole. Therefore, when the lower surface of the second alloy frame 201 is subsequently pressed onto the upper surface of the first alloy frame 101, the adhesive between the lower surface of the second alloy frame 201 and the upper surface of the first alloy frame 101 will not overflow into the alignment hole 206, thereby improving the grayscale when the cutting device recognizes the alignment hole 206 (the presence of overflowing adhesive in the alignment hole will reduce the grayscale when the cutting device recognizes the alignment hole), thereby improving the accuracy of the cutting device in identifying the alignment hole 206, thereby improving the accuracy of the cutting device in knowing the positions of the second main area 202 and the second connecting block 203, and further improving the accuracy of cutting.
[0060] In one embodiment, the alignment holes 206 are formed on the upper surface of the second edge region 21 of the second alloy frame 201 by an etching process, and the etching process is a chemical etching process or a wet etching process.
[0061] In one embodiment, reference Fig.11 and Fig.12 , where Fig.12 For the Fig.11 A schematic cross-sectional structure diagram along the cutting line AB direction, in which a second positioning hole 205 penetrating the upper surface and the lower surface of the second edge region 21 is formed in the second edge region 21 of the second alloy frame 201, and the second positioning hole 205 is used to press the second alloy frame 201 onto the upper surface of the first alloy frame 101 (refer to Fig.13 ), cooperates with the first positioning hole 105 in the first alloy frame 101 to further improve the position accuracy and overlap degree of the first alloy frame 101 and the second alloy frame 201 when they are pressed together.
[0062] refer to Fig.13 , the lower surface of the second alloy frame 201 is pressed onto the upper surface of the first alloy frame 101 , and during the pressing, the positioning protrusions 104 are embedded in the corresponding positioning grooves 204 .
[0063] In one embodiment, during the pressing, the second positioning hole 205 in the second alloy frame 201 is located directly above the first positioning hole 105 in the first alloy frame 101 .
[0064] In one embodiment, during the pressing, the lower surface of the second alloy frame 201 is pressed onto the upper surface of the first alloy frame 101 by adhesive (not shown in the figure), and the temperature during the pressing is lower than 300 degrees Celsius.
[0065] In one embodiment, after the laminated alloy frame is formed, a semiconductor chip is mounted on the surface of the side without the hollow pattern.
[0066] In a specific embodiment, in conjunction with reference Fig.14 When the second main area 202 of the second alloy frame 201 in the laminated alloy frame has a hollow pattern 212 and the first main area 102 of the first alloy frame 101 does not have a hollow pattern, it also includes: mounting a semiconductor chip 301 on the lower surface of the first main area 101.
[0067] In a specific embodiment, the semiconductor chip 301 may be an ultrasonic transducer. In other embodiments, the semiconductor chip 301 may be a semiconductor chip having other functions, such as a logic chip, a memory chip, or a sensor having other functions (such as a sound sensor, etc.). Fig.15 After mounting the semiconductor chip 301, the cutting is performed to cut off the second connecting blocks 203 between the adjacent second main body regions 202 (refer to Fig.14 ) and the first connecting block 103 between the adjacent first main body regions 102 (reference Fig.14 ), forming several discrete packaging structures.
[0068] Another embodiment of the present application further provides a laminated alloy frame, Fig.13 ,include: A first alloy frame 101, wherein the first alloy frame 101 comprises an upper surface and a lower surface opposite to each other, and the upper surface of the first alloy frame 101 has at least two positioning protrusions 104; A second alloy frame 201, wherein the second alloy frame 201 comprises an upper surface and a lower surface opposite to each other, and the lower surface of the second alloy frame 201 has at least two positioning grooves 204, and the positions of the positioning grooves 204 correspond to the positions of the positioning protrusions 104; The lower surface of the second alloy frame 201 is pressed onto the upper surface of the first alloy frame 101 , and the positioning protrusions 104 are embedded in the corresponding positioning grooves 204 .
[0069] In one embodiment, the first alloy frame 101 includes a first middle area 12 and a first edge area 11 surrounding the first middle area 12, the second alloy frame 201 includes a second middle area 22 and a second edge area 21 surrounding the second middle area 22, the positioning protrusion 104 is located on the upper surface of the first edge area 11 of the first alloy frame 101, and the positioning groove 204 is located on the lower surface of the second edge area 21 of the second alloy frame 201.
[0070] In one embodiment, the first edge region 11 of the first alloy frame 101 also has a first positioning hole 105 passing through the upper surface and the lower surface of the first edge region 11; the second edge region 21 of the second alloy frame 201 also has a second positioning hole 205 passing through the upper surface and the lower surface of the second edge region 21, and the second positioning hole 205 is located directly above the first positioning hole 105.
[0071] In one embodiment, the shape, size and position of the positioning protrusion 104 correspond to the shape, size and position of the positioning groove 204 .
[0072] In one embodiment, there is adhesive between the lower surface of the second alloy frame 201 and the upper surface of the first alloy frame 101 .
[0073] In one embodiment, the first middle region 12 of the first alloy frame 101 includes a plurality of separate first main body regions 102 and a first connecting block 103 that fixes and connects adjacent first main body regions 102 (see reference 1). Fig.13 as well as Figure 4-Figure 5 ), the thickness of the first connecting block 103 is less than the thickness of the first main body area 102, and the upper surface of the first connecting block 103 is flush with the upper surface of the first main body area 102, and the lower surface of the first connecting block 103 is higher than the lower surface of the first main body area 102; the second middle area 22 of the second alloy frame 201 includes a plurality of separate second main body areas 202 and second connecting blocks 203 that fix adjacent second main body areas 202 (combined with reference Fig.13 as well as Figure 11-Figure 12), the shape, size and position of the second main body area 202 correspond to the shape, size and position of the first main body area 102, the shape, size and position of the second connecting block 203 correspond to the shape, size and position of the first connecting block 103, the thickness of the second connecting block 203 is less than the thickness of the second main body area 202, and the upper surface of the second connecting block 203 is lower than the upper surface of the second main body area 202, and the lower surface of the second connecting block 203 is flush with the lower surface of the second main body area 202.
[0074] In one embodiment, reference Figure 8 and Fig.10 , also includes: a plurality of alignment holes 206 located on the upper surface of the second edge area of the second alloy frame 201, the depth of the alignment holes 206 is less than the thickness of the second alloy frame 201, and the alignment holes 206 are used to locate the position of the second main area 202 when cutting the laminated alloy frame.
[0075] In one embodiment, in conjunction with reference Fig.11 and Fig.14 The second main area 202 of the second alloy frame 201 has a hollow pattern 212, and the first main area 102 of the first alloy frame 101 does not have a hollow pattern; and also includes: a semiconductor chip 301 mounted on the lower surface of the first main area 102 of the first alloy frame 101.
[0076] In one embodiment, the semiconductor chip includes an ultrasonic transducer. In other embodiments, the semiconductor chip includes a semiconductor chip having other functions.
[0077] Although the present application has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field can use the methods and technical contents disclosed above to make possible changes and modifications to the technical solution of the present application without departing from the spirit and scope of the present application. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are within the protection scope of the technical solution of the present application.
Claims
1. A method for manufacturing a laminated alloy frame, characterized in that: include: Providing a first alloy frame, the first alloy frame comprising an upper surface and a lower surface opposite to each other, the upper surface of the first alloy frame having at least two positioning protrusions; Providing a second alloy frame, the second alloy frame comprising an upper surface and a lower surface opposite to each other, the lower surface of the second alloy frame having at least two positioning grooves, the positions of the positioning grooves corresponding to the positions of the positioning protrusions; The lower surface of the second alloy frame is pressed onto the upper surface of the first alloy frame, and during the pressing, the positioning protrusions are embedded in the corresponding positioning grooves.
2. The method for manufacturing a laminated alloy frame according to claim 1, characterized in that: The first alloy frame includes a first middle area and a first edge area surrounding the first middle area, the second alloy frame includes a second middle area and a second edge area surrounding the second middle area, the positioning protrusion is located on the upper surface of the first edge area of the first alloy frame, and the positioning groove is located on the lower surface of the second edge area of the second alloy frame.
3. The method for manufacturing a laminated alloy frame according to claim 2, characterized in that: Also includes: forming a first positioning hole in a first edge region of the first alloy frame, penetrating through an upper surface and a lower surface of the first edge region; A second positioning hole is formed in the second edge area of the second alloy frame, passing through the upper surface and the lower surface of the second edge area. The positions of the second positioning hole and the first positioning hole correspond to each other. During the pressing, the second positioning hole in the second alloy frame is located directly above the first positioning hole in the first alloy frame.
4. The method for manufacturing a laminated alloy frame according to claim 2, characterized in that: The first middle area of the first alloy frame includes a plurality of discrete first main body areas and a first connecting block that fixedly connects adjacent first main body areas, the thickness of the first connecting block is less than the thickness of the first main body area, and the upper surface of the first connecting block is flush with the upper surface of the first main body area, and the lower surface of the first connecting block is higher than the lower surface of the first main body area; the second middle area of the second alloy frame includes a plurality of discrete second main body areas and a second connecting block that fixedly connects adjacent second main body areas, the shape, size and position of the second main body area correspond to the shape, size and position of the first main body area, the shape, size and position of the second connecting block correspond to the shape, size and position of the first connecting block, the thickness of the second connecting block is less than the thickness of the second main body area, the upper surface of the second connecting block is lower than the upper surface of the second main body area, and the lower surface of the second connecting block is flush with the lower surface of the second main body area.
5. The method for manufacturing a laminated alloy frame according to claim 4, characterized in that: Also includes: A plurality of alignment holes are formed on the upper surface of the second edge region of the second alloy frame. The depth of the alignment holes is less than the thickness of the second alloy frame. The alignment holes are used to locate the second main body region when cutting the laminated alloy frame.
6. The method for manufacturing a laminated alloy frame according to claim 5, characterized in that: The alignment hole, the positioning protrusion, the positioning groove, the first connecting block and the second connecting block are formed by a mold stamping process and / or an etching process.
7. The method for manufacturing a laminated alloy frame according to claim 5, characterized in that: The second main body area of the second alloy frame has a hollow pattern, and the first main body area of the first alloy frame does not have a hollow pattern; and further comprising: mounting a semiconductor chip on the lower surface of the first main body area.
8. The method for manufacturing a laminated alloy frame according to claim 7, characterized in that: After mounting the semiconductor chip, the cutting is performed to cut off the second connection blocks between the adjacent second main body regions and the first connection blocks between the adjacent first main body regions to form a plurality of discrete packaging structures.
9. The method for manufacturing a laminated alloy frame according to claim 1, characterized in that: The shape, size and position of the positioning protrusion correspond to the shape, size and position of the positioning groove.
10. The method for manufacturing a laminated alloy frame according to claim 1, characterized in that: When the pressing is performed, the lower surface of the second alloy frame is pressed onto the upper surface of the first alloy frame by adhesive, and the temperature during the pressing is lower than 300 degrees Celsius.
11. A laminated alloy frame, characterized in that: include: A first alloy frame, the first alloy frame comprising an upper surface and a lower surface opposite to each other, the upper surface of the first alloy frame having at least two positioning protrusions; A second alloy frame, the second alloy frame comprising an upper surface and a lower surface opposite to each other, the lower surface of the second alloy frame having at least two positioning grooves, the positions of the positioning grooves corresponding to the positions of the positioning protrusions; The lower surface of the second alloy frame is pressed onto the upper surface of the first alloy frame, and the positioning protrusions are embedded in the corresponding positioning grooves during the pressing.
12. The laminated alloy frame according to claim 11, characterized in that The first alloy frame includes a first middle area and a first edge area surrounding the first middle area, the second alloy frame includes a second middle area and a second edge area surrounding the second middle area, the positioning protrusion is located on the upper surface of the first edge area of the first alloy frame, and the positioning groove is located on the lower surface of the second edge area of the second alloy frame.
13. The laminated alloy frame according to claim 12, characterized in that: The first edge area of the first alloy frame also has a first positioning hole that passes through the upper and lower surfaces of the first edge area; the second edge area of the second alloy frame also has a second positioning hole that passes through the upper and lower surfaces of the second edge area, and the second positioning hole is located directly above the first positioning hole.
14. The laminated alloy frame according to claim 12, characterized in that The first middle area of the first alloy frame includes a plurality of discrete first main body areas and a first connecting block that fixedly connects adjacent first main body areas, the thickness of the first connecting block is less than the thickness of the first main body area, and the upper surface of the first connecting block is flush with the upper surface of the first main body area, and the lower surface of the first connecting block is higher than the lower surface of the first main body area; the second middle area of the second alloy frame includes a plurality of discrete second main body areas and a second connecting block that fixedly connects adjacent second main body areas, the shape, size and position of the second main body area correspond to the shape, size and position of the first main body area, the shape, size and position of the second connecting block correspond to the shape, size and position of the first connecting block, the thickness of the second connecting block is less than the thickness of the second main body area, the upper surface of the second connecting block is lower than the upper surface of the second main body area, and the lower surface of the second connecting block is flush with the lower surface of the second main body area.
15. The laminated alloy frame according to claim 14, characterized in that Also includes: A plurality of alignment holes are located on the upper surface of the second edge region of the second alloy frame, wherein the depth of the alignment holes is less than the thickness of the second alloy frame, and the alignment holes are used to locate the position of the second main body region when cutting the laminated alloy frame.
16. The laminated alloy frame according to claim 15, characterized in that The second main body area of the second alloy frame has a hollow pattern, and the first main body area of the first alloy frame does not have a hollow pattern; and further includes: a semiconductor chip mounted on the lower surface of the first main body area.
17. The laminated alloy frame according to claim 16, characterized in that The semiconductor chip includes an ultrasonic transducer.
18. The laminated alloy frame according to claim 11, characterized in that The shape, size and position of the positioning protrusion correspond to the shape, size and position of the positioning groove.
19. The laminated alloy frame according to claim 11, characterized in that There is adhesive between the lower surface of the second alloy frame and the upper surface of the first alloy frame.