Substrate of circuit board, circuit board, head-up display and vehicle

Abstract

The invention relates to the technical field of circuit boards, in particular to a substrate of a circuit board, the circuit board, a head-up display and a vehicle. Wherein the substrate is provided with a plurality of backlight lamp installation positions, at least part of the backlight lamp installation positions are provided with first heat dissipation holes, and the first heat dissipation holes penetrate through the circuit board. When the backlight lamp is installed on the substrate, heat can be discharged from the first heat dissipation holes, the ventilation and heat dissipation effects of the backlight lamp are improved, and then the overall heat dissipation performance of the circuit board is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of circuit boards, and in particular to a substrate of a circuit board, a circuit board, a head-up display, and a vehicle. Background Art

[0002] HUD (head up display) is also called a head-up display. By projecting the light emitted by the HUD image source onto the imaging window (rear-mounted imaging board or vehicle windshield, etc.), the user can directly see the image without lowering his head, thereby improving the user experience. For example, in some cases, the driver can avoid being distracted by looking down at the dashboard while driving, thereby improving the driving safety factor and also providing a better driving experience.

[0003] However, the display screens of existing HUDs (such as TFT screens) are generally small in size. If a large number of LEDs are arranged, it may cause great pressure on the heat dissipation design. Summary of the invention

[0004] In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides a substrate of a circuit board, a circuit board, a head-up display and a vehicle.

[0005] The present disclosure provides a substrate of a circuit board, which is used as an image source of a head-up display. The substrate is provided with a plurality of backlight mounting positions, at least some of the backlight mounting positions are provided with first heat dissipation holes, and the first heat dissipation holes penetrate the circuit board.

[0006] Optionally, each of the backlight installation positions is provided with at least one of the first heat dissipation holes.

[0007] Optionally, when one of the first heat dissipation holes is provided on each of the backlight installation positions, the first heat dissipation hole is located at the center of the backlight installation position;

[0008] When a plurality of the first heat dissipation holes are provided on each of the backlight installation positions, the plurality of the first heat dissipation holes are evenly distributed in the corresponding backlight installation positions.

[0009] Optionally, a heat conducting member is provided in the first heat dissipation hole, and the heat conducting member transfers heat from one side of the circuit board to the other side of the circuit board.

[0010] Optionally, the heat conductive member fills the first heat dissipation hole, and the heat conductive member is configured to be formed by filling copper paste, tin paste or silver paste in the first heat dissipation hole.

[0011] Optionally, the first heat dissipation hole does not interfere with the circuit of the circuit board.

[0012] Optionally, the first heat dissipation hole is a circular hole, and a diameter of the first heat dissipation hole is 0.1 mm to 1 mm.

[0013] Optionally, diameters of any two of the first heat dissipation holes provided on the circuit board are the same or different.

[0014] Optionally, it is characterized in that, in one of the backlight installation positions, the distance between two adjacent first heat dissipation holes is 0.5 mm to 2 mm.

[0015] Optionally, a functional element mounting position is further provided on the circuit board, and a second heat dissipation hole is provided on the functional element mounting position. The second heat dissipation hole passes through the circuit board, and the diameter of the second heat dissipation hole is the same as or different from that of the first heat dissipation hole.

[0016] Optionally, the circuit board includes a circuit substrate, and the circuit substrate is configured as a non-conductive material plate.

[0017] The present disclosure also provides a circuit board, comprising a backlight and a substrate as described in any one of the above items, wherein the backlights are mounted one-to-one at the backlight mounting positions of the substrate, and the brightness of at least some of the backlights of the circuit board can be independently controlled.

[0018] The present disclosure also provides a head-up display, comprising the circuit board as described above.

[0019] The present disclosure also provides a vehicle, comprising the head-up display as described above.

[0020] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:

[0021] The disclosed embodiment provides a substrate of a circuit board, wherein a plurality of backlight mounting positions are provided on the substrate, and at least a first heat dissipation hole is provided on the backlight mounting position, and the first heat dissipation hole is provided through the substrate. When the backlight is installed on the substrate, heat can be discharged from the first heat dissipation hole, thereby improving the ventilation and heat dissipation effect of the backlight, and further improving the overall heat dissipation performance of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a schematic structural diagram of a substrate of a circuit board described in an embodiment of the present disclosure.

[0025] Figure 2 A schematic diagram of the structure of a head-up display provided in an embodiment of the present disclosure.

[0026] Among them, 1. substrate; 101. backlight mounting position; 102. first heat dissipation hole; 103. functional element mounting position; 104. second heat dissipation hole; 10. image source; 20. reflective imaging part; 30. eye box area; 40. imaging position; 50. exit port; 60. plane reflector; 70. curved reflector. DETAILED DESCRIPTION

[0027] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0029] The inventors of the present disclosure have found that in order to solve at least one of the problems of insufficient brightness of the existing HUD, excessive power consumption due to meeting the brightness requirements, and damage to the liquid crystal display due to excessive temperature in the HUD, the image source of the HUD is provided with a backlight control capability, that is, when multiple backlights are provided, the backlights can be regionally controlled. For example, the image source includes a backlight unit and a display screen, wherein the backlight unit includes at least a lamp board and a collimation structure. For example, the lamp board includes a backlight and a backlight circuit board, and there are multiple backlights, which are arranged on the backlight circuit board. In this way, intelligent adjustment of the backlight of the image source is achieved, and while meeting the brightness requirements of each display content in the virtual image, power consumption is minimized, thereby reducing the heat received by the display screen, thereby avoiding damage to the display screen due to excessive temperature. However, since the display screen of the HUD (such as a TFT screen) is generally small in size, if a large number of LEDs are arranged, it may cause relatively large pressure on the heat dissipation design.

[0030] like Figure 1As shown, the embodiment of the present disclosure provides a substrate 1 of a circuit board, and the circuit board is used for an image source of a head-up display. The thermal conductivity of the substrate 1 is poor. For example, the substrate 1 is a non-metallic plate, and a plurality of backlight mounting positions 101 are provided on the substrate 1. At least some of the backlight mounting positions 101 are provided with first heat dissipation holes 102, and the first heat dissipation holes 102 penetrate the substrate 1. The first heat dissipation holes 102 are provided on the backlight mounting positions 101 of the substrate 1, so that the backlight can be dissipated through the first heat dissipation holes 102, thereby reducing the overall heat dissipation performance of the circuit board, facilitating the arrangement of more backlights on the circuit board, and improving the display effects such as the display brightness and clarity of the virtual image displayed by the head-up display (HUD). For example, the opening and closing and / or brightness of at least two backlights on the circuit board can be independently controlled and adjusted separately, thereby realizing the intelligent adjustment of the backlight of the image source. In other words, when more backlights are provided on the circuit board, the substrate 1 can avoid damage to the backlight and other components on the circuit board caused by excessive temperature by providing the first heat dissipation holes 102, thereby improving the working stability and reliability of the circuit board. Furthermore, the first heat dissipation holes 102 can effectively reduce the temperature difference between the two sides of the circuit board, improve the uniformity of the circuit board temperature in the thickness direction, and provide feasibility for heat dissipation on the back side of the circuit board.

[0031] Furthermore, in some embodiments of the present disclosure, each backlight mounting position 101 is provided with at least one first heat dissipation hole 102. After the backlight is installed in place, each backlight mounting position 101 dissipates heat to the backlight and the substrate 1 through the first heat dissipation hole 102, so that the heat generated by each backlight can be transferred to the other side of the substrate 1 through the first heat dissipation hole 102, which not only improves the heat dissipation effect of the backlight and reduces the operating temperature of the backlight, but also effectively reduces the temperature difference on both sides of the substrate 1.

[0032] In some embodiments, when a first heat dissipation hole 102 is provided on each backlight mounting position 101, the first heat dissipation hole 102 is located at the center of the backlight mounting position 101. When the backlight mounting position 101 is on the substrate 1, the temperature at the center of the backlight mounting position 101 is higher, and the first heat dissipation hole 102 opened at the center of the backlight mounting position 101 can effectively and evenly dissipate the heat of the corresponding backlight, thereby improving the heat dissipation effect of the first heat dissipation hole 102.

[0033] In other embodiments, when a plurality of first heat dissipation holes 102 are provided on each backlight installation position 101, the plurality of first heat dissipation holes 102 are evenly distributed in the corresponding backlight installation position 101, that is, in each backlight installation position 101, the distance between two adjacent first heat dissipation holes 102 is equal, and / or the minimum distance between each first heat dissipation hole 102 and the edge of the backlight installation position (101) is equal, and / or the plurality of first heat dissipation holes 102 can be distributed in an array. The heat generated by the backlight is transferred to the back of the backlight through the plurality of first heat dissipation holes 102, which can not only improve the heat dissipation efficiency of the backlight, but also further improve the uniformity of the temperature thickness direction of the substrate 1.

[0034] It should be noted that when the first heat dissipation hole 102 is opened, it is necessary to avoid the circuit on the substrate 1 to avoid damaging the function of the substrate 1 .

[0035] Furthermore, in some embodiments of the present disclosure, a heat conductor is provided in the first heat dissipation hole 102, and the heat conductor is used to transfer the heat on one side of the substrate 1 to the other side of the substrate 1. After the backlight is installed, the backlight fits with one end of the heat conductor, and the heat conductor has a good heat transfer effect. Under the action of the heat conductor, the heat conduction efficiency of the first heat dissipation hole 102 can be improved, and the heat can be quickly transferred to the other side of the substrate 1, thereby improving the heat dissipation effect and improving the temperature difference problem on both sides of the substrate 1.

[0036] Further, in some embodiments of the present disclosure, the first heat dissipation hole 102 is filled with a heat conductive member, and the heat conductive member is configured to be formed by filling copper paste, tin paste or silver paste in the first heat dissipation hole 102 to improve the heat dissipation efficiency of the heat dissipation hole. The heat conductive member may fill the entire first heat dissipation hole 102, or be attached to the side wall of the first heat dissipation hole 102, or fill part of the space of the first heat dissipation hole 102. The configuration of the heat conductive member can greatly improve the thermal conductivity, thereby improving the heat dissipation effect of the substrate 1.

[0037] Furthermore, in some embodiments of the present disclosure, the first heat dissipation hole 102 does not interfere with the circuit of the substrate 1. In other words, the position of the first heat dissipation hole 102 needs to avoid the internal circuit of the substrate 1 to avoid damage to the substrate 1 and to avoid problems such as short circuit or leakage that affect the normal use of the substrate 1.

[0038] Further, in some embodiments of the present disclosure, the first heat dissipation hole 102 is a circular hole, for example, the hole opening process is a plated through hole process. This facilitates the processing and manufacturing of the first heat dissipation hole 102, and the diameter of the first heat dissipation hole 102 is 0.1mm to 1mm. In some embodiments, the diameter of the first heat dissipation hole 102 can be 0.25mm to 0.3mm, such as the diameter of the first heat dissipation hole 102 is 0.25mm or 0.3mm, and the diameter of the first heat dissipation hole 102 is within this range. The heat dissipation improvement effect of the substrate 1 is obvious. The opening on the substrate 1 can effectively reduce the temperature difference on both sides of the substrate 1, improve the uniformity of the temperature thickness direction of the substrate 1, and provide feasibility for heat dissipation on the back of the substrate 1. If the aperture of the first heat dissipation hole 102 continues to increase, it may bring risks such as unstable welding of the backlight. If the aperture of the first heat dissipation hole 102 is too small, it may bring risks of poor heat dissipation effect.

[0039] It should be noted that the diameter of the first heat dissipation hole 102 is related to factors such as the type and quantity of the backlight and the size of the circuit board, and can be flexibly selected. For example, in other embodiments of the present disclosure, the diameter of the first heat dissipation hole 102 can also be selected from 0.3 mm to 0.5 mm, such as the diameter of the first heat dissipation hole 102 is selected to be 0.4 mm, so that the temperature difference on the back side of the substrate 1 is more balanced.

[0040] Further, in some embodiments of the present disclosure, the diameters of any two first heat dissipation holes 102 provided on the substrate 1 are the same or different. The diameters of the first heat dissipation holes 102 on different backlight installation positions 101 may be the same or different, and the diameters of the first heat dissipation holes 102 at different positions in the same backlight installation position 101 may also be the same or different. The diameters of the first heat dissipation holes 102 at different positions may be selected according to actual needs.

[0041] Further, in some embodiments of the present disclosure, one or more first heat dissipation holes 102 may be provided in a backlight installation position 101. When multiple first heat dissipation holes 102 are provided, the distance between two adjacent first heat dissipation holes 102 is 0.5 mm to 2 mm. Specifically, the distance between two adjacent first heat dissipation holes 102 may be 1 mm, which not only facilitates the provision of multiple first heat dissipation holes 102, but also ensures the structural strength and reliability of the substrate 1 at the backlight installation position 101, and ensures the reliable installation and setting of the backlight.

[0042] Furthermore, in some embodiments of the present disclosure, other functional element mounting positions 103 are further provided on the substrate 1, and second heat dissipation holes 104 are provided on the functional element mounting positions 103. The second heat dissipation holes 104 penetrate the substrate 1, and the diameter of the second heat dissipation holes 104 is the same as or different from the diameter of the first heat dissipation holes 102. The heat dissipation effect of other functional elements is improved by providing the second heat dissipation holes 104, and the phenomenon of higher temperature on one side of the circuit board due to the heat generated by other functional elements is avoided.

[0043] Likewise, a heat-conducting member may be filled in the second heat-dissipating hole 104 to enhance the heat-dissipating effect of the second heat-dissipating hole 104 .

[0044] It should be noted that, for example, the material of the substrate 1 of the circuit board is non-metal, such as a PCB printed circuit board. A backlight is installed on the circuit board, which can be used as the backlight of the image source of the vehicle's head-up display. The on / off and brightness of at least two backlights on the circuit board are independently controlled, and the backlights can be adjusted individually, thereby achieving regional adjustment of the backlight of the image source.

[0045] In summary, the substrate of the circuit board provided by the embodiment of the present disclosure increases the ventilation and heat dissipation effect of the backlight, etc., and enhances the ability of Z-direction heat conduction by opening the first heat dissipation hole and the second heat dissipation hole at appropriate positions on the substrate, which can effectively reduce the junction temperature of the device and improve the temperature uniformity in the thickness direction of the single board, and provides the possibility of adopting other heat dissipation methods on the back of the PCB. Thereby, the heat dissipation performance of the circuit board is improved, the damage of the electrical components caused by the excessive temperature of the circuit board is avoided, and the stability and reliability of the circuit board are avoided.

[0046] Furthermore, an embodiment of the present disclosure also provides a circuit board, including a backlight and the substrate 1 as described above, the backlights are installed one by one at the backlight installation positions 101 of the substrate 1, and the brightness of at least some of the backlights on the substrate 1 can be independently controlled.

[0047] For example, the circuit board includes a substrate 1, multiple backlights and a driving board. The backlight is installed on the substrate, and the driving board is electrically connected to the backlight. The driving board or the substrate 1 is provided with a wiring circuit, and the multiple backlights are respectively connected to the corresponding wiring circuits so that the brightness of each backlight can be independently controlled through the driving board.

[0048] Furthermore, in some embodiments of the present disclosure, a head-up display is provided, comprising the circuit board in the above embodiment.

[0049] For example, the head-up display includes a display panel, and the display panel includes multiple display areas, and the multiple display areas correspond to multiple backlights one by one. The control module determines the brightness information corresponding to each display area according to the image to be displayed on the display panel; determines the target brightness corresponding to each backlight according to the brightness information corresponding to each display area; and controls each backlight based on the target brightness corresponding to each backlight. When the head-up display provided by the present disclosure is displaying, the target brightness corresponding to each backlight in the image source is determined according to the image to be displayed, and the backlight is controlled according to the target brightness. By controlling each backlight individually, the light waste caused by lighting all the backlights is avoided, the power consumption is reduced, and the light utilization rate and image contrast are improved.

[0050] For example, according to the distribution of the display content in each display area in the image to be displayed, the display area of ​​the display panel can be divided into a dark area and a brightness area. The dark area is a display area with low display brightness (or no display content), and the bright area is a display area with high display brightness (or display content). The brightness information corresponding to the bright area and the dark area is different, and the target brightness of the backlight determined according to the brightness information is also different, so as to achieve the backlight control of the dark area and the bright area of ​​the image respectively. Since the backlight brightness of the dark area and the brightness is different, the effect of improving the image contrast can be achieved, and then the contrast of the virtual image formed by the head-up display is also improved. At the same time, reducing the brightness of the backlight corresponding to the dark area or turning off the backlight in the dark area can also reduce the backlight power consumption, thereby reducing the overall power consumption of the display panel.

[0051] For example, according to the image to be displayed on the display panel, a pixel group corresponding to each display area is determined, and the pixel group includes multiple pixels. Specifically, the image to be displayed is composed of multiple pixels, each pixel displays a color, and the pixel group in the image to be displayed corresponding to each display area can be determined according to the distribution of the display content in the image to be displayed in each display area, that is, the multiple pixels in the image to be displayed corresponding to each display area. Among them, the display panel includes multiple pixel units, each pixel unit corresponds to a group of three primary color filters, and one pixel in the image to be displayed corresponds to one pixel unit on the display panel.

[0052] For example, Figure 2 As shown, the head-up display system includes a head-up display and a reflective imaging unit 20. The reflective imaging unit 20 is located on the light-emitting side of an image source 10 of the head-up display and is configured to reflect the imaging light emitted by the image source 10 to an eye box area 30 of the head-up display, so that the user can view a virtual image formed at an imaging position 40 outside the reflective imaging unit 20 when both eyes of the user are located in the eye box area 3.

[0053] For example, the head-up display uses the reflective imaging unit 20 to reflect the outgoing light of the image source 10, so that the observer can simultaneously observe the virtual image formed outside the reflective imaging unit 20 and the object outside the reflective imaging unit 20 in the eye box area 30. When the head-up display provided by the embodiment of the present disclosure is displayed, each backlight can be individually controlled for the image to be displayed, thereby avoiding turning on all the backlights, and only turning on part of the backlights, and the luminous brightness of each backlight can also be independently controlled. By controlling the backlight of different areas corresponding to the image to be displayed, it is possible to turn off some backlights and light up other backlights, thereby improving the image contrast, thereby improving the contrast of the virtual image imaged by the head-up display, and at the same time, the power consumption of the head-up display can be reduced by turning off some backlights or reducing the brightness of some backlights.

[0054] For example, Figure 2 As shown, the head-up display further includes an amplifying component, which includes, for example, a curved reflector 70, or includes a curved reflector 70 and a flat reflector 60. The amplifying component is used to reflect the image light emitted by the image source 10 to the reflective imaging unit 20 to amplify the image displayed in the image source 10 into a virtual image, wherein the image light is emitted through the exit port 50 of the head-up display.

[0055] For example, the reflective imaging unit 20 may be a windshield of a vehicle, and the eye box area may be an area where the observer needs to view the imaging according to actual needs, namely, the eye box area (eyebox). The eye box area refers to the area where the observer's eyes are located and where the image displayed by the display device can be seen, such as a plane area or a three-dimensional area.

[0056] Furthermore, some embodiments of the present disclosure also provide a means of transportation, comprising the above-mentioned head-up display.

[0057] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0058] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board substrate, the circuit board being used as an image source of a head-up display, characterized in that: A plurality of backlight installation positions (101) are provided on the substrate (1), and at least some of the backlight installation positions (101) are provided with first heat dissipation holes (102), wherein the first heat dissipation holes (102) penetrate the circuit board.

2. The circuit board substrate according to claim 1, characterized in that: Each of the backlight installation positions (101) is provided with at least one of the first heat dissipation holes (102).

3. The circuit board substrate according to claim 2, characterized in that: When one of the first heat dissipation holes (102) is provided on each of the backlight installation positions (101), the first heat dissipation hole (102) is located at the center of the backlight installation position (101); When a plurality of the first heat dissipation holes (102) are provided on each of the backlight installation positions (101), the plurality of the first heat dissipation holes (102) are evenly distributed in the corresponding backlight installation positions (101).

4. The substrate of the circuit board according to any one of claims 1 to 3, characterized in that: A heat conducting element is arranged in the first heat dissipation hole (102), and the heat conducting element transfers heat from one side of the circuit board to the other side of the circuit board.

5. The substrate of the circuit board according to claim 4, characterized in that: The heat conducting member fills the first heat dissipation hole (102), and the heat conducting member is configured to be formed by filling copper paste, tin paste or silver paste in the first heat dissipation hole (102).

6. The substrate of the circuit board according to any one of claims 1 to 3, characterized in that: The first heat dissipation hole (102) does not interfere with the circuit of the circuit board.

7. The circuit board substrate according to any one of claims 1 to 3, characterized in that: The first heat dissipation hole (102) is a circular hole, and the diameter of the first heat dissipation hole (102) is 0.1 mm to 1 mm.

8. The substrate of the circuit board according to claim 7, characterized in that The diameters of any two of the first heat dissipation holes (102) arranged on the circuit board are the same or different.

9. The substrate of the circuit board according to claim 1, characterized in that In one of the backlight installation positions (101), the distance between two adjacent first heat dissipation holes (102) is 0.5 mm to 2 mm.

10. The circuit board substrate according to any one of claims 1 to 9, characterized in that: The circuit board is also provided with a functional element mounting position (103), and the functional element mounting position (103) is provided with a second heat dissipation hole (104), the second heat dissipation hole (104) passes through the circuit board, and the diameter of the second heat dissipation hole (104) is the same as or different from that of the first heat dissipation hole (102).

11. The circuit board substrate according to any one of claims 1 to 9, characterized in that: The circuit board comprises a circuit substrate (1), and the circuit substrate (1) is configured as a non-conductive material plate.

12. A circuit board, characterized in that: It comprises a backlight and a substrate (1) as claimed in any one of claims 1 to 11, wherein the backlights are mounted one by one at backlight mounting positions (101) of the substrate (1), and the brightness of at least part of the backlights of the circuit board can be independently controlled.

13. A head-up display, characterized in that: Comprising the circuit board as claimed in claim 12.

14. A means of transport, characterized in that: Comprising a heads-up display as claimed in claim 13.

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