Tweezers for eutectic sintering of small photoelectric device chip

Abstract

The invention relates to the technical field of photoelectric device processing, in particular to a pair of tweezers for eutectic sintering of small photoelectric device chips, which comprises a clamping structure, a high-temperature-resistant adapter and a tip structure, the clamping structure comprises a first clamping arm and a second clamping arm, and each of the first clamping arm and the second clamping arm comprises a connecting end, a handheld end and a fixed end; the upper end face and the lower end face of the handheld end are connected with the connecting ends and the fixing end respectively, and the two connecting ends are attached and fixed to each other. The tip structure comprises a first tweezers head and a second tweezers head; the fixed end of the first clamping arm is fixedly connected with a first tweezers head through a high-temperature-resistant adapter, and the fixed end of the second clamping arm is fixedly connected with a second tweezers head; the first tweezers head and the second tweezers head are of the same structure and each comprise a tip part and a flat part connected with one end of the tip part. The tool can effectively prevent a chip and a tube shell gold layer from being scratched.

Description

Technical Field

[0001] The invention relates to the technical field of optoelectronic device processing, and in particular to a pair of tweezers used for eutectic sintering of a small optoelectronic device chip. Background Art

[0002] In the manufacturing process of small ceramic metallized packaged optoelectronic devices, the eutectic sintering process is often used to assemble the chip. The main process includes placing an appropriate amount of gold-tin solder (containing flux) between the chip and the carrier (ceramic metallized tube or substrate). In a specific sintering space with an ambient temperature of 320°C, the carrier quickly transfers the high temperature of 280°C to the gold-tin solder due to the influence of the ambient temperature. The gold-tin solder reaches the melting point and is in a flowing state when the flux is boiling. At this time, metal tweezers are needed to adjust the displacement of the chip caused by the boiling flow of the solder. At the same time, the top of the chip needs to be pressed down to exhaust the gas to reduce the void rate of the gold-tin solder at the bottom of the chip after sintering and solidification, so as to achieve the shear strength of the chip welding. The greater the void rate of the solder at the bottom of the chip, the smaller the shear strength, and the smaller the adhesion of the chip on the substrate. After sintering, use tweezers to clamp and remove the ceramic metallized tube.

[0003] Since the sintering temperature is as high as 320℃ and the sintering process lasts about 2 minutes, the solder melts into a boiling liquid state and produces bubbles. The chip is easy to move in the boiling liquid state. During the sintering process, the operator needs to hold high-temperature resistant metal tweezers to correct the displaced chip and press down on the chip surface. The metal tweezers transfer temperature quickly, and it is difficult for the operator to complete the displacement correction and pressing exhaust operation of the chip before the metal tweezers reach high temperature. The metal tweezers cannot hold the chip for high-precision operation due to the high temperature, resulting in a high proportion of circuit scratches on the chip surface, poor chip position process consistency, and poor product quality consistency. In addition, in order to improve operating efficiency, the same metal tweezers are used to clamp the ceramic metallized tube shell for insertion and removal under the existing technology, which makes the metal tweezers easily damage the metallized area of ​​the tube shell. When the metal tweezers clamp the tube shell, there is a certain amount of wear on the tweezers, which causes a certain amount of damage to the chip when the tweezers contact the chip again, causing damage to the chip circuit. At the same time, in order to solve the problem of high temperature, gloves are worn during operation to slow down the transfer of temperature, causing the fiber part of the gloves to fall around the chip, affecting the control of excess matter and contamination of the product. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a pair of tweezers for eutectic sintering of small optoelectronic device chips, including a clamping structure, a high-temperature resistant adapter and a tip structure; the clamping structure includes a first clamping arm and a second clamping arm, and the first clamping arm and the second clamping arm both include a connecting end, a hand-held end and a fixed end; the upper end face and the lower end face of the hand-held end are respectively connected to the connecting end and the fixed end, and the two connecting ends are fitted and fixed to each other; the tip structure includes a first tweezer head and a second tweezer head; the fixed end of the first clamping arm is fixedly connected to the first tweezer head through a high-temperature resistant adapter, and the fixed end of the second clamping arm is fixedly connected to the second tweezer head; the first tweezer head and the second tweezer head have the same structure, and both include a tip and a flat portion connected to one end of the tip.

[0005] Furthermore, a first threaded hole is provided on the fixed end of the first clamp arm; a second threaded hole is provided on the flat part of the first tweezers head; the high temperature resistant adapter includes a first adapter surface and a second adapter surface, the first adapter surface is provided with a first fixed threaded hole corresponding to the first threaded hole, and the second adapter surface is provided with a second fixed threaded hole corresponding to the second threaded hole; the first adapter surface is located on the inner side of the fixed end of the first clamp arm, and the second adapter surface is located on the outer side of the flat part of the first tweezers head, and is fixed by screws.

[0006] Furthermore, the fixed end of the second clamp arm is longer than the fixed end of the first clamp arm, and a third threaded hole is provided on the end of the fixed end of the second clamp arm away from the hand-held end, and a fourth threaded hole corresponding to the third threaded hole is provided on the flat part of the second tweezers head. The flat part of the second tweezers head is located on the inner side of the fixed end of the second clamp arm and is fixed by screws passing through the threaded holes.

[0007] Furthermore, the tip portion gradually tapers from an end close to the flat portion to an end far away from the flat portion.

[0008] Furthermore, the first tweezers head is made of metal material, and the second tweezers head is made of polyimide material.

[0009] Furthermore, the clamping structure is made of metal material.

[0010] Furthermore, the high temperature resistant adapter is made of polyimide material.

[0011] Beneficial effects of the present invention:

[0012] The present invention provides a tool for a high-temperature sintering chip process of a small optoelectronic device, which can effectively prevent the chip and the gold layer of the tube shell from being scratched. When the present invention is operated, the qualified product efficiency can reach 98%. The two tweezer heads of the present invention are respectively made of polyimide material and metal material. The tweezer heads made of polyimide material can effectively avoid scratches on the chip and the gold layer of the peripheral pins of the tube shell; the tweezer heads made of metal material can effectively increase the degree of refinement of refined operation and time and retention operation.

[0013] The present invention can prevent burns caused by rapid temperature transfer in a high-temperature operating environment during operation, thus leaving sufficient operating time for operators.

[0014] The present invention can effectively complete chip displacement correction and pressure exhaust under high temperature conditions, so that the void rate of gold-tin solder is significantly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the connection of the tweezer structure used for eutectic sintering of a small optoelectronic device chip according to the present invention;

[0016] Figure 2 The three views of the clamp arm structure of the present invention;

[0017] Figure 3 Three views of the structural dimensions of the high temperature resistant adapter of the present invention;

[0018] Figure 4 It is a three-view drawing of the tweezer head structure of the present invention; wherein, 1-first clamping arm, 2-second clamping arm, 3-high temperature resistant adapter, 4-first tweezer head, 5-second tweezer head, 11-connecting end, 12-fixed end, 13-hand-held end, 14-tip, 15-flat part. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] The present invention provides a pair of tweezers for eutectic sintering of small optoelectronic device chips, such as Figure 1-4 As shown, it includes a clamping structure, a high temperature resistant adapter 3 and a tip structure; the clamping structure includes a first clamping arm 1 and a second clamping arm 2, and the first clamping arm 1 and the second clamping arm 2 both include a connecting end 11, a hand-held end 13 and a fixed end 12; the upper end surface and the lower end surface of the hand-held end 13 are respectively connected to the connecting end 11 and the fixed end 12, and the two connecting ends 13 are fitted and fixed to each other; the tip structure includes a first tweezer head 4 and a second tweezer head 5; the fixed end 12 of the first clamping arm 1 is fixedly connected to the first tweezer head 4 through the high temperature resistant adapter 3, and the fixed end 12 of the second clamping arm 2 is fixedly connected to the second tweezer head 5; the first tweezer head 4 and the second tweezer head 5 have the same structure, and both include a tip 14, and a flat portion 15 connected to one end of the tip 14.

[0021] Specifically, Figure 1As shown, in the first clamp arm and the second clamp arm, the two connecting ends have the same structure and size, and the two hand-held ends have the same structure and size; while the two fixed ends have the same structure but different lengths, and the fixed end of the second clamp arm is longer than the fixed end of the first clamp arm. The connecting end and the fixed end are not on the same horizontal plane.

[0022] Specifically, Figure 2 As shown, the fixed end 12 of the second clamp arm 2 is provided with two third threaded holes at the end away from the handheld end 13, and the flat portion 15 of the second tweezer head 5 is provided with two fourth threaded holes corresponding to the positions and sizes of the two third threaded holes. The flat portion 15 of the second tweezer head 5 is located on the inner side of the fixed end 12 of the second clamp arm 2, and the fixed end and the flat portion are fixedly connected by two screws passing through the third threaded holes and the fourth threaded holes. In the embodiment of the present invention, the angle between the upper surface of the connecting end and the upper surface of the handheld end is greater than 180°, and the angle between the upper surface of the handheld end and the upper surface of the fixed end is less than 180°.

[0023] Specifically, a first threaded hole is provided on the fixed end of the first clamp arm; a second threaded hole is provided on the flat portion of the first tweezers head; Figure 3 As shown, the high temperature resistant adapter includes a first adapter surface and a second adapter surface, the first adapter surface is provided with a first fixed threaded hole corresponding to the first threaded hole, and the second adapter surface is provided with a second fixed threaded hole corresponding to the second threaded hole; the first adapter surface is located on the inner side of the fixed end of the first clamp arm, and the second adapter surface is located on the outer side of the flat part of the first tweezers head, and is fixed by screws.

[0024] Specifically, in the high temperature resistant adapter 3, the first adapter surface and the second adapter surface are connected by a protrusion, and the two are not on the same horizontal plane. Figure 3 As shown, the high temperature resistant adapter 3 is a quadrangular prism with an isosceles trapezoidal bottom surface, the upper side of the isosceles trapezoid is 6.16 mm long and the lower side is 8.25 mm long; on the upper bottom surface side of the bottom end of the quadrangular prism, the first transfer surface is formed by flattening downward at 13 mm from the lower side, and the second transfer surface is formed by flattening upward at 14 mm from the upper side. The center spacing of the two first fixing threaded holes on the first transfer surface is 8 mm, and the center spacing of the two second fixing threaded holes on the second transfer surface is 8 mm.

[0025] Specifically, Figure 4 As shown, the tip gradually tapers from an end close to the flat portion to an end away from the flat portion.

[0026] In one embodiment of the present invention, the tweezer head structure has a total length of 40.50 mm, the length of the flat portion is 14 mm, and the thickness is 1.8 mm; the width and thickness of the tip gradually decrease from one end close to the flat portion to the end far from the flat portion.

[0027] Specifically, the second tweezer head is made of polyimide material, which has the characteristics of high temperature resistance and good thermal stability. The chip eutectic sintering process needs to be carried out in a high temperature environment of 320°C, while the polyimide material can withstand temperatures up to 400°C, and has a slow heat transfer rate and is wear-resistant. It will not cause scratches when in contact with the chip, and will not cause damage to the gold layer of the tube shell. It is conducive to squeezing the chip downward for a longer time, so that the bubbles in the gold-tin solder can be fully discharged and the operation is simple. The discharge of bubbles in the gold-tin solder will cause the chip to shift. The first tweezer head is made of metal material, which is conducive to retaining the fine correction displacement operation of small chips, and adding a high-temperature blocking design to this structure to increase the refined operation time in a high-temperature environment.

[0028] Specifically, the clamping structure is made of metal material, retaining the flexibility of the metal material, so that the invention is suitable for a wider range of product sizes for high-temperature processes, can operate objects of different sizes, can effectively and quickly adjust the width, and has a wider range of applications.

[0029] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "rotation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pair of tweezers for eutectic sintering of small optoelectronic device chips, characterized in that: It comprises a clamping structure, a high temperature resistant adapter and a tip structure; the clamping structure comprises a first clamping arm and a second clamping arm, and both the first clamping arm and the second clamping arm comprise a connecting end, a hand-held end and a fixed end; the upper end face and the lower end face of the hand-held end are respectively connected to the connecting end and the fixed end, and the two connecting ends are fitted and fixed to each other; the tip structure comprises a first tweezer head and a second tweezer head; the fixed end of the first clamping arm is fixedly connected to the first tweezer head through the high temperature resistant adapter, and the fixed end of the second clamping arm is fixedly connected to the second tweezer head; the first tweezer head and the second tweezer head have the same structure, and both comprise a tip and a flat portion connected to one end of the tip.

2. A pair of tweezers for eutectic sintering of small optoelectronic device chips according to claim 1, characterized in that: A first threaded hole is provided on the fixed end of the first clamp arm; a second threaded hole is provided on the flat part of the first tweezers head; the high temperature resistant adapter includes a first adapter surface and a second adapter surface, the first adapter surface is provided with a first fixed threaded hole corresponding to the first threaded hole, and the second adapter surface is provided with a second fixed threaded hole corresponding to the second threaded hole; the first adapter surface is located on the inner side of the fixed end of the first clamp arm, and the second adapter surface is located on the outer side of the flat part of the first tweezers head, and is fixed by screws.

3. The tweezers for eutectic sintering of small optoelectronic device chips according to claim 1, characterized in that: The fixed end of the second clamp arm is longer than the fixed end of the first clamp arm. The fixed end of the second clamp arm is provided with a third threaded hole on the end away from the hand-held end. The flat part of the second tweezers head is provided with a fourth threaded hole corresponding to the third threaded hole. The flat part of the second tweezers head is located on the inner side of the fixed end of the second clamp arm and is fixed by screws passing through the threaded holes.

4. The tweezers for eutectic sintering of small optoelectronic device chips according to claim 1, characterized in that: The tip gradually tapers from an end close to the flat portion to an end far away from the flat portion.

5. The tweezers for eutectic sintering of small optoelectronic device chips according to claim 1, characterized in that: The first tweezers head is made of metal material, and the second tweezers head is made of polyimide material.

6. The tweezers for eutectic sintering of small optoelectronic device chips according to claim 1, characterized in that: The clamping structure is made of metal.

7. The tweezers for eutectic sintering of small optoelectronic device chips according to claim 1, characterized in that: The high temperature resistant adapter is made of polyimide.

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