Display module and temperature control method thereof

Abstract

The invention discloses a display module and a temperature control method thereof, and relates to the technical field of display devices.The display module comprises a display panel and a backlight assembly, the display panel comprises a substrate, a pixel layer and a driving chip, the pixel layer and the driving chip are arranged on the surface of the substrate, and the driving chip is used for controlling display of the pixel layer; the backlight assembly comprises a light-emitting part and a light guide assembly, the light-emitting part is attached to the surface, away from the driving chip, of the substrate, and the light guide assembly is arranged on the light-emitting side of the light-emitting part and used for receiving light emitted by the light-emitting part and emitting the light towards the display panel. The orthographic projection of the light-emitting part and the orthographic projection of the driving chip on the surface of the substrate are at least partially overlapped, heat generated by the light-emitting part can be conducted to the driving chip through the substrate, the problem that an existing driving chip cannot work normally at the low temperature is solved, and meanwhile heat for heating the driving chip comes from heat of the light-emitting part. No additional heating device is added, so that the processing cost and the power consumption of the display module are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to a display module and a temperature control method thereof. Background Art

[0002] With the development of display technology, the performance of display modules is constantly improving to meet the growing display needs. One of the core components in the display module is the driver IC (Integrated Circuit), which is responsible for driving the pixel units in the display panel. The working performance of the driver IC is greatly affected by the ambient temperature. In a low temperature environment, especially below -40 degrees, the driver IC may not work properly, seriously affecting the display effect or causing the display panel to be unable to display.

[0003] At present, in order to solve this problem, a heating device is usually added near the driver IC to maintain its normal working temperature. However, due to the additional heating device, not only the processing cost of the display module is increased, but also the power consumption of the display module is increased. Summary of the invention

[0004] The main purpose of the present invention is to provide a display module and a temperature control method thereof, aiming to solve the problem of how to ensure that the driver IC works normally under low temperature conditions without increasing the cost and power consumption of the existing display module.

[0005] To achieve the above object, the display module proposed in the present invention includes:

[0006] A display panel, the display panel comprising a substrate, a pixel layer and a driving chip arranged on a surface of the substrate, the driving chip being used to control the display of the pixel layer, and

[0007] A backlight assembly, the backlight assembly comprising a light emitting element and a light guide assembly, the light emitting element being attached to a surface of the substrate facing away from the driver chip, the light guide assembly being arranged on the light emitting side of the light emitting element and being used to receive light emitted by the light emitting element and emit light toward the display panel, the orthographic projections of the light emitting element and the driver chip on the surface of the substrate at least partially overlapping.

[0008] In one embodiment of the present invention, the display module further comprises a circuit control board and a temperature sensor, wherein the temperature sensor is disposed on the surface of the substrate where the driving chip is disposed;

[0009] The circuit control board is provided with a control unit, a first power supply circuit and a second power supply circuit, the first power supply circuit is electrically connected to an end of the light emitting element facing the substrate, and the second power supply circuit is electrically connected to an end of the light emitting element facing away from the substrate;

[0010] Wherein, the control unit controls switching of the electrical conduction between the first power supply circuit or the second power supply circuit and the light-emitting element according to the temperature of the driving chip acquired by the temperature sensor.

[0011] In one embodiment of the present invention, the display module further includes a first voltage regulating module, and the first voltage regulating module is electrically connected to the first power supply circuit;

[0012] When the first power supply circuit is electrically connected to the light-emitting element, the control unit adjusts the input voltage of the light-emitting element through the first voltage regulating module according to the temperature of the driving chip collected by the temperature sensor.

[0013] In one embodiment of the present invention, the display module further comprises a back plate, the back plate is arranged on a side of the light guide component away from the substrate, and the circuit control board is arranged on a side of the back plate away from the light guide component;

[0014] The display module further includes a first flexible circuit board, two ends of which are electrically connected to the circuit control board and the substrate respectively;

[0015] Wherein, the light-emitting component is electrically connected to the first voltage regulating module through the substrate and the first flexible circuit board.

[0016] In one embodiment of the present invention, the first flexible circuit board is electrically connected to a side of the substrate on which the driving chip is provided, a through hole is provided on the surface of the substrate, a conductive part is deposited in the through hole, the conductive part is electrically connected to the first flexible circuit board, and a wiring layer connected to the conductive part is provided on a side of the substrate facing the light-emitting element;

[0017] Wherein, the light emitting element is electrically connected to the first flexible circuit board through the wiring layer and the conductive part.

[0018] In one embodiment of the present invention, the display module further includes a second voltage regulating module, and the second voltage regulating module is electrically connected to the second power supply circuit;

[0019] When the second power supply circuit is electrically connected to the light-emitting element, the control unit adjusts the input voltage of the light-emitting element through the second voltage regulating module according to the temperature of the driving chip collected by the temperature sensor.

[0020] In one embodiment of the present invention, the display module further comprises a second flexible circuit board, and two ends of the second flexible circuit board are respectively electrically connected to an end of the light emitting element away from the substrate and the circuit control board.

[0021] In one embodiment of the present invention, there are a plurality of driving chips, which are arranged at intervals on the surface of the substrate; there are a plurality of temperature sensors, each of which is arranged between two adjacent driving chips; there are a plurality of light-emitting elements, which are arranged at intervals on a side of the substrate away from the driving chip;

[0022] The control unit adjusts the input voltage of the light-emitting element adjacent to the driver chip through the first voltage regulating module or the second voltage regulating module according to the temperatures of the driver chip at different positions collected by different temperature sensors.

[0023] In one embodiment of the present invention, the light guide assembly includes an optical film and a light guide plate, the light guide plate includes a light input section and a light guide section arranged in sequence parallel to the substrate, the light input section is arranged on the light output side of the light emitting component, the longitudinal cross-sectional size of the light input section tends to decrease in the direction away from the light emitting component, and the optical film is arranged between the light guide section and the substrate.

[0024] The present invention also provides a temperature control method for a display module as described above, wherein the display module further comprises a temperature sensor, a circuit control board, a first power supply circuit and a second power supply circuit, and the temperature sensor is arranged on a side of the substrate facing the driving chip; the temperature control method comprises the steps of:

[0025] Controlling the light-emitting element to turn on;

[0026] Receiving the real-time temperature of the driver chip collected by the temperature sensor, and determining whether the temperature is lower than a first preset temperature;

[0027] If yes, controlling the circuit control board to input voltage to one end of the light emitting element toward the substrate through the first power supply circuit;

[0028] If not, the circuit control board is controlled to input a voltage to the end of the light emitting element away from the substrate through the second power supply circuit.

[0029] The display module proposed in the present invention includes a display panel and a backlight assembly, wherein the display panel includes a substrate and a pixel layer and a driver chip arranged on the surface of the substrate. Under the drive of the driver chip, the display effect of the pixel layer can be controlled and adjusted. The backlight assembly includes a back plate, a light-emitting component and a light-guiding component. The light-emitting component is arranged on the side of the substrate away from the driver chip, that is, the light-emitting component and the driver chip are arranged on two opposite surfaces of the substrate, so the heat generated by the light-emitting component when emitting light can be conducted to the driver chip through the substrate, thereby heating the driver chip, solving the problem that the existing driver chip cannot work normally at low temperatures. At the same time, the heat for heating the driver chip comes from the heat of the light-emitting component itself. Therefore, compared with the existing solution of adding a preheating device, the present application can reduce the processing cost of the display module and reduce the power consumption of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0031] Figure 1 A schematic diagram of the internal structure of the display module provided by the present invention;

[0032] Figure 2 A top view of the display module provided by the present invention;

[0033] Figure 3 for Figure 2 A local enlarged schematic diagram at point A;

[0034] Figure 4 A bottom view of a glass substrate in a display module provided by the present invention;

[0035] Figure 5 for Figure 4 A partial enlarged schematic diagram at point B;

[0036] Figure 6 A flow chart of an embodiment of a temperature control method for a display module provided by the present invention;

[0037] Figure 7 A flow chart of another embodiment of the temperature control method of the display module provided by the present invention;

[0038] Figure 8 The present invention is a flow chart of another embodiment of the temperature control method of the display module provided by the present invention.

[0039] Description of Figure Numbers:

[0040] 10. Display panel; 11. Substrate; 12. Driver chip; 13. Conductive part; 14. Routing layer; 15. Temperature sensor; 20. Backlight assembly; 21. Back plate; 22. Light-emitting element; 221. First solder pad; 222. Second solder pad; 23. Light guide assembly; 231. Light guide plate; 232. Optical film; 233. Mounting groove; 30. Circuit control board; 40. First flexible circuit board; 50. Second flexible circuit board.

[0041] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0044] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0045] The invention provides a display module.

[0046] Combination Figure 1As shown, in one embodiment of the present invention, the display module includes a display panel 10 and a backlight assembly 20, the display panel 10 includes a substrate 11 and a pixel layer and a driving chip 12 arranged on the surface of the substrate 11, the driving chip 12 is used to control the display of the pixel layer, the backlight assembly 20 includes a light-emitting element 22 and a light-guiding assembly 23, the light-emitting element 22 is attached to a surface of the substrate 11 away from the driving chip 12, the light-guiding assembly 23 is arranged on the light-emitting side of the light-emitting element 22, and is used to receive the light emitted by the light-emitting element 22 and emit the light toward the display panel 10, and the orthographic projections of the light-emitting element 22 and the driving chip 12 on the surface of the substrate 11 at least partially overlap.

[0047] The present application provides an inventive concept of utilizing the heat of the light-emitting component 22 to heat the driving chip 12, wherein the display module may be a liquid crystal display module, an LED display module, an OLED display module, etc. Here, the present application takes the liquid crystal display module as an example to illustrate the inventive concept.

[0048] In this embodiment, the display substrate 11 can be a glass substrate 11, a plastic substrate 11 or other light-transmitting substrate 11, and the specific selection depends on the application scenario of the display module. The pixel layer and the driver chip 12 are arranged on the display substrate 11, wherein the pixel layer includes a thin film transistor (TFT), an orientation layer, a liquid crystal molecule layer, a color filter layer and a polarizer. The driver chip 12 controls the display state of the pixel by driving the thin film transistor (TFT) and the liquid crystal molecule layer in the liquid crystal display panel 10. Specifically, the driver chip 12 controls the switch of the thin film transistor (TFT), and then controls the electric field acting on the liquid crystal molecule layer. The liquid crystal molecules change their arrangement under the action of the electric field, thereby controlling the amount of light passing through to form an image.

[0049] The light-emitting element 22 can be an LED lamp, an OLED lamp, or other types of light sources, and the specific selection depends on the brightness and color requirements of the display module. For example, for high-brightness applications, a high-power LED lamp can be selected; for high color gamut applications, an OLED lamp can be selected. The light-emitting elements 22 can be evenly distributed on the entire surface of the substrate 11, or the layout can be optimized according to the pixel distribution of the display panel 10 to improve the uniformity and efficiency of the backlight. The connection between the light-emitting element 22 and the substrate 11 can be achieved by bonding, welding, or mechanical fixation. For example, the bonding method is suitable for occasions where good thermal conductivity needs to be ensured; the welding method is suitable for occasions where a higher connection strength needs to be ensured.

[0050] The light guide assembly 23 includes a light guide plate 231 and may also include an optical film 232. The light guide plate 231 may be made of transparent materials such as PMMA and PC, and has good light guide performance. The shape of the light guide plate 231 may be flat, wavy or stepped, and the specific selection depends on the uniformity requirements of the backlight. The optical film 232 may include a variety of films such as a diffusion film, a brightness enhancement film and a reflective film. By combining different types of films, the uniformity and brightness of the backlight can be further improved.

[0051] The present application attaches the light-emitting element 22 to the side of the substrate 11 away from the driver chip 12, and the orthographic projections of the light-emitting element 22 and the driver chip 12 on the surface of the substrate 11 overlap at least partially. This design reduces the distance between the light-emitting element 22 and the driver chip 12, so that the heat generated by the light-emitting element 22 when emitting light can be conducted to the driver chip 12 through the substrate 11 more quickly, thereby heating the driver chip 12, ensuring that the driver chip 12 can quickly reach the normal operating temperature in a low-temperature environment, and solving the problem that the existing driver chip 12 cannot work normally at low temperatures. At the same time, this design makes the structure of the display module more compact, reduces the use of additional heating devices, and reduces the processing cost and power consumption of the display module.

[0052] Further, such as Figure 1 As shown, the light emitting element 22 is disposed directly below the driving chip 12 , which further improves the efficiency of heat conduction to the driving chip 12 .

[0053] In addition, a thermal pad or thermal paste may be provided between the light emitting element 22 and the substrate 11 to enhance the heat conduction effect; or the light emitting element 22 may be soldered to the substrate 11. These optimization measures can enable the driver chip 12 to work stably under low temperature conditions and improve the overall performance and reliability of the display module.

[0054] Combination Figures 1 to 3 As shown, in one embodiment of the present invention, the display module further includes a circuit control board 30 and a temperature sensor 15, and the temperature sensor 15 is disposed on a side of the substrate 11 where the driving chip 12 is disposed;

[0055] A control unit, a first power supply circuit and a second power supply circuit on the circuit control board 30, wherein the first power supply circuit is electrically connected to an end of the light emitting element 22 facing the substrate 11, and the second power supply circuit is electrically connected to an end of the light emitting element 22 facing away from the substrate 11;

[0056] The control unit controls switching of the electrical connection between the first power supply circuit or the second power supply circuit and the light-emitting element 22 according to the temperature of the driving chip 12 collected by the temperature sensor 15 .

[0057] In this embodiment, the temperature sensor 15 can be a thermistor, a thermocouple or an infrared temperature sensor 15, etc. The specific selection depends on the requirements of measurement accuracy and response speed. For example, thermistors are suitable for occasions requiring high-precision measurement, and infrared temperature sensors 15 are suitable for occasions requiring non-contact measurement. The control unit is an MCU (MicroController Unit) or a microprocessor, a single-chip microcomputer, etc., to implement a complex temperature control algorithm.

[0058] The light-emitting element 22 is a double-end input structure, that is, the power supply can provide the light-emitting element 22 with a working voltage through the end of the light-emitting element 22 facing the substrate 11 or the end away from the substrate 11. Since the temperature of the pad of the light-emitting element 22 is relatively high when it is working, that is, when the end of the light-emitting element 22 facing the substrate 11 is connected to the power supply, the heat conducted to the driver chip 12 is greater than the heat conducted to the driver chip 12 when the end of the light-emitting element 22 away from the substrate 11 is connected to the power supply. The temperature sensor 15 is connected to the control unit in communication, and the control unit can dynamically select to supply power to the light-emitting element 22 through the first power supply circuit or the second power supply circuit according to the temperature data collected by the temperature sensor 15, so as to ensure that the optimal temperature control effect can be achieved under different temperature conditions, and further improve the accuracy and reliability of temperature control.

[0059] In one embodiment of the present invention, the display module further includes a first voltage regulating module, and the first voltage regulating module is electrically connected to the first power supply circuit;

[0060] When the first power supply circuit is electrically connected to the light-emitting element 22 , the control unit adjusts the input voltage of the light-emitting element 22 through the first voltage regulating module according to the temperature of the driving chip 12 collected by the temperature sensor 15 .

[0061] In this embodiment, the first voltage regulation module can adopt a switching DC boost circuit (boost circuit) or a linear regulator. The switching DC boost circuit is suitable for occasions requiring high efficiency, and the linear regulator is suitable for occasions requiring low noise. The specific selection depends on the balance between efficiency and cost.

[0062] The MCU has a logic processing function. After the temperature sensor 15 transmits the temperature data to the MCU, the MCU outputs a PWM signal according to the temperature change. The first voltage regulating module receives the PWM (pulse width modulation) signal sent by the MCU and adjusts the power supply voltage of the power supply, thereby achieving the purpose of accurately adjusting the input voltage of the light-emitting component 22. For example, when the temperature is lower than the preset threshold, the MCU increases the input voltage of the light-emitting component 22 through the first voltage regulating module, thereby increasing the heat of the light-emitting component 22 to increase the temperature of the driver chip 12.

[0063] The solution of this embodiment monitors the temperature of the driver chip 12 in real time and dynamically adjusts the input voltage of the light-emitting element 22 according to the temperature, thereby ensuring that the driver chip 12 can heat up quickly under low temperature conditions while avoiding overheating, thereby improving the temperature control accuracy and reliability of the display module.

[0064] Combination Figures 1 to 3 As shown, in one embodiment of the present invention, the display module further includes a back plate 21, the back plate 21 is arranged on a side of the light guide component 23 away from the substrate 11, and the circuit control board 30 is arranged on a side of the back plate 21 away from the light guide component 23;

[0065] The display module further includes a first flexible circuit board 40, two ends of which are electrically connected to the circuit control board 30 and the substrate 11 respectively;

[0066] The light emitting element 22 is electrically connected to the first voltage regulating module through the substrate 11 and the first flexible circuit board 40 .

[0067] In this embodiment, the back plate 21 can not only provide structural support, but also protect the internal components. The back plate 21 can be made of metal materials (such as aluminum or stainless steel) or high-strength plastic materials, and the specific selection depends on the structural strength and weight requirements of the display module. For example, the metal back plate 21 is suitable for occasions that require high structural strength and good heat dissipation performance, and the plastic back plate 21 is suitable for occasions that require lightweight design.

[0068] The circuit control board 30 is arranged on the side of the back plate 21 away from the light guide assembly 23, that is, the circuit control board 30 is arranged outside the display panel 10 and the backlight assembly 20. Since the space inside the display panel 10 and the backlight assembly 20 and the space between the two are the areas where the light path propagates, it is necessary to strictly control the spacing between each film and component to ensure the display effect. Therefore, the circuit control board 30 is arranged outside the back plate 21 to avoid the circuit control board 30 occupying the internal space of the display panel 10 and the backlight assembly 20, thereby improving the integration of the display panel 10 and the backlight assembly 20, the space utilization rate and the convenience of device layout.

[0069] By providing the first flexible circuit board 40, the circuit connection between the substrate 11 and the circuit control board 30 is more flexible, which is convenient for assembly and maintenance. The first flexible circuit board 40 can be made of polyimide (PI) or polyester (PET), and the specific selection depends on the requirements of flexibility and temperature resistance.

[0070] Combination Figure 1As shown, in one embodiment of the present invention, the first flexible circuit board 40 is electrically connected to the side of the substrate 11 provided with the driving chip 12, a through hole is opened on the surface of the substrate 11, a conductive part 13 is deposited in the through hole, the conductive part 13 is electrically connected to the first flexible circuit board 40, and a wiring layer 14 connected to the conductive part 13 is provided on the side of the substrate 11 facing the light emitting element 22;

[0071] The light emitting element 22 is electrically connected to the first flexible circuit board 40 through the wiring layer 14 and the conductive portion 13 .

[0072] In this embodiment, by opening a through hole on the substrate 11 and depositing the conductive part 13, an efficient electrical connection between the light-emitting element 22 and the circuit control board 30 is achieved, ensuring the stability and reliability of signal transmission. The conductive part 13 can be made of materials with good conductive properties such as copper and silver. The diameter and depth of the through hole can be adjusted according to actual needs to ensure reliable connection of the conductive part 13. For example, when applied to occasions of large current transmission, a through hole with a larger diameter is opened on the surface of the substrate 11. When the current is small or applied to the scene of fine wiring, the diameter of the through hole is set to be smaller. The through hole is opened in the non-GOA area of ​​the substrate 11 to prevent the through hole from damaging the circuit of the driver chip 12.

[0073] Before the surface of the substrate 11 is processed by through-hole processing and the conductive part 13 is deposited, the surface of the substrate 11 needs to be cleaned first, and deionized water or organic solvent can be used for cleaning. After cleaning, holes are punched on both sides of the substrate 11 to ensure that the positions of the double-sided holes correspond to each other and are interconnected. The double-sided punching method can reduce the depth of a single punching, thereby reducing the damage to the substrate 11 during the punching process. In addition, since the through-hole size is usually small and is limited by the process level, the shape of the through-hole often presents an inverted trapezoid. By double-sided punching, the change in the through-hole diameter in the depth direction can be reduced to a certain extent, thereby improving the uniformity of the size of the conductive part 13 along the thickness direction of the substrate 11. After the punching is completed, more burrs may be generated on the inner wall of the through-hole, which will hinder the deposition of metal materials. Therefore, before depositing the conductive part 13, it is necessary to use an etching process to clean the burrs on the inner wall of the through-hole, and then deposit the metal conductive material into the through-hole.

[0074] The wiring layer 14 is formed of metal materials such as electroplated copper or aluminum, and the width and spacing of the wiring layer 14 can be optimized according to actual needs to ensure the stability and anti-interference ability of signal transmission. For example, wider wiring is suitable for occasions requiring large current transmission, and narrower wiring is suitable for occasions requiring high-density wiring.

[0075] A first solder pad 221 is provided on the end surface of the light-emitting component 22 facing the substrate 11. The light-emitting component 22 is electrically connected to the wiring layer 14 through the first solder pad 221. The first solder pad 221 is made of a material with good electrical and thermal conductivity such as gold, silver or copper to reduce the thermal resistance between the light-emitting component 22 and the driving chip 12, thereby reducing the power consumption of the light-emitting component 22.

[0076] In one embodiment of the present invention, the display module further includes a second voltage regulating module, and the second voltage regulating module is electrically connected to the second power supply circuit;

[0077] When the second power supply circuit is electrically connected to the light emitting element 22 , the control unit adjusts the input voltage of the light emitting element 22 through the second voltage regulating module according to the temperature of the driving chip 12 collected by the temperature sensor 15 .

[0078] In this embodiment, by providing a second voltage regulating module and using the second voltage regulating module to regulate the input voltage of the light emitting element 22 from the second power supply circuit, the accuracy of controlling the heat transferred from the light emitting element 22 to the driving chip 12 is further improved.

[0079] It can be understood that the control unit selects the first power supply circuit or the second power supply circuit to power the light emitting element 22, so as to implement a primary adjustment of the heat conducted from the light emitting element 22 to the driver chip 12. The control unit adjusts the input voltage of the light emitting element 22 through the first voltage regulating module or the second voltage regulating module, so as to implement a secondary adjustment of the heat conducted from the light emitting element 22 to the driver chip 12. Through the two adjustments, the adjustment range and adjustment accuracy of the heat conducted from the light emitting element 22 to the driver chip 12 can be improved.

[0080] The specific structure of the second voltage regulating module can refer to the first voltage regulating module and will not be described in detail here.

[0081] Combination Figure 1 As shown, in one embodiment of the present invention, the display module further includes a second flexible circuit board 50 , and two ends of the second flexible circuit board 50 are electrically connected to one end of the light emitting element 22 away from the substrate 11 and the circuit control board 30 , respectively.

[0082] In this embodiment, a second pad 222 is provided on the end surface of the light emitting element 22 facing the back plate 21, and the end of the light emitting element 22 facing away from the substrate 11 is electrically connected to the circuit control board 30 through the second pad 222, thereby achieving the purpose of dual-path power supply to the light emitting element 22. The structure and material of the second pad 222 can refer to the above description of the first pad 221, and no further limitation is made here.

[0083] The second flexible circuit board 50 can be made of the same material as the first flexible circuit board 40, such as polyimide (PI) or polyester (PET), and the specific selection depends on the requirements of flexibility and temperature resistance. Since the second pad 222 and the circuit control board 30 are respectively located on both sides of the back plate 21, the second flexible circuit board 50 can improve the convenience of electrical connection between the second pad 222 and the circuit control board 30.

[0084] Combination Figures 2 to 5 As shown, in one embodiment of the present invention, a plurality of driving chips 12 are provided, and the plurality of driving chips 12 are arranged at intervals on the surface of the substrate 11; a plurality of temperature sensors 15 are provided, and each temperature sensor 15 is provided between two adjacent driving chips 12; a plurality of light-emitting elements 22 are provided, and are arranged at intervals on a side of the substrate 11 away from the driving chip 12;

[0085] The control unit adjusts the input voltage of the light emitting element 22 adjacent to the driver chip 12 through the first voltage regulating module or the second voltage regulating module according to the temperatures of the driver chip 12 at different positions collected by different temperature sensors 15 .

[0086] In this embodiment, the driving chip 12 is disposed in the GOA (Gate on Array, integrated gate driving circuit) area of ​​the display panel 10, that is, Figure 2 The plurality of driving chips 12 are used to drive different pixel areas to display. Figure 2 Each temperature sensor 15 is arranged in a horizontal direction at intervals. Each temperature sensor 15 is disposed between two adjacent driving chips 12 to comprehensively monitor the temperature distribution of the driving chips 12 .

[0087] There are also multiple light-emitting components 22, and the arrangement direction of the multiple light-emitting components 22 is the same as the arrangement direction of the multiple driving chips 12, and the positive projections of each light-emitting component 22 and each driving chip 12 on the substrate 11 at least partially overlap. Therefore, under the heat conduction effect of the multiple light-emitting components 22, the temperatures of the multiple driving chips 12 are more uniform, thereby improving the uniformity of the display effects of each display area of ​​the display panel 10.

[0088] At the same time, a plurality of first voltage regulating modules and second voltage regulating modules are also provided, and each first voltage regulating module and each second voltage regulating module are electrically connected to a light emitting element 22, and are used to control the input voltage at both ends of the light emitting element 22. The control unit analyzes the temperature of the driver chip 12 at different positions, and adjusts the input voltage of different light emitting elements 22 through different first voltage regulating modules or second voltage regulating modules, so as to achieve precise control of the temperature of each driver chip 12, thereby improving the uniformity of the temperature of each driver chip 12.

[0089] Combination Figure 1As shown, in one embodiment of the present invention, the light guide component 23 includes an optical film 232 and a light guide plate 231. The light guide plate 231 includes a light input section and a light guide section which are arranged in sequence parallel to the substrate 11. The light input section is arranged on the light output side of the light emitting component 22. The longitudinal cross-sectional size of the light input section tends to decrease in the direction away from the light emitting component 22. The optical film 232 is arranged between the light guide section and the substrate 11.

[0090] In this embodiment, the optical film 232 may include a variety of films such as a diffusion film, a brightness enhancement film, and a reflective film. By combining different types of films, the uniformity and brightness of the backlight can be further improved. For example, a diffusion film can be used to evenly disperse light, a brightness enhancement film can be used to increase the brightness of light, and a reflective film can be used to reduce light loss. The thickness and number of layers of the optical film 232 can be adjusted according to actual needs to optimize the display effect. For example, a thicker optical film 232 is suitable for occasions that require higher brightness, and a thinner optical film 232 is suitable for occasions that require a lighter and thinner design.

[0091] The optical film 232 is arranged between the light guide plate 231 and the substrate 11, and the light guide plate 231 is arranged on one side of the light emitting element 22. In order to make the light guide plate 231 transmit the light emitted by the light emitting element 22 to the optical film as much as possible, one side of the light guide plate 231 needs to be covered on the light outlet of the light emitting element 22. Since the light emitting element 22 is attached to the surface of the substrate 11, the light guide plate 231 is arranged to include a light input section and a structure at both ends of the light guide section. The light input section is designed to be a tapered shape, so that the light input section, the light guide section and the substrate 11 are enclosed to form a mounting groove 233, which provides space for the installation of the optical film, and improves the integration of the display module.

[0092] The side of the light-entering section facing the substrate 11 may be an inclined surface, a curved surface, or partly an inclined surface and partly a curved surface, so as to guide the light emitted by the light-emitting element 22 to the light-guiding section. Furthermore, an emission sheet is provided on the side of the light-entering section facing the substrate 11 to improve the efficiency of the light-entering section in transmitting light to the light-guiding section. The light-guiding section is provided in a flat plate shape, that is, both sides of the light-guiding section facing the back plate 21 and the substrate 11 are flat, so as to facilitate the installation of the light film sheet.

[0093] The light guide plate 231 can be made of transparent materials such as PMMA (polymethyl methacrylate) or PC (polycarbonate), and the thickness and length of the light guide segment can be optimized according to the size and brightness requirements of the display panel 10 to ensure uniform distribution of light in the light guide plate 231.

[0094] The present invention also provides a temperature control method for a display module, the display module further comprising a temperature sensor 15, a circuit control board 30, a first power supply circuit and a second power supply circuit, the temperature sensor 15 is arranged on the side of the substrate 11 facing the driving chip 12; the specific structure of the display module refers to the above embodiment. Figure 6 As shown, the temperature control method comprises the steps of:

[0095] S10: Control the light emitting element 22 to turn on;

[0096] S20: receiving the real-time temperature of the driver chip 12 collected by the temperature sensor 15, and determining whether the temperature is lower than a first preset temperature;

[0097] S30: If yes, the control circuit control board 30 inputs a voltage to the end of the light emitting element 22 facing the substrate 11 through the first power supply circuit;

[0098] S40 : If not, the control circuit control board 30 inputs a voltage to the end of the light emitting element 22 away from the substrate 11 through the second power supply circuit.

[0099] In this embodiment, the temperature sensor 15 transmits the collected temperature data to the MCU (microcontroller unit) through the temperature data line. The MCU receives the temperature data collected by the temperature sensor 15 through the temperature data line and performs logical judgment. The MCU is preset with a first preset temperature. The MCU compares the received temperature data with the first preset temperature and determines whether the driver chip 12 is in a low temperature state.

[0100] Since the temperature at the pad of the light emitting element 22 is relatively high, if the temperature of the driver chip 12 is lower than the first preset temperature, the MCU selects the first power supply circuit through the control circuit board 30, and supplies power through the end of the light emitting element 22 toward the substrate 11. If the temperature of the driver chip 12 is higher than the first preset temperature, the MCU selects the second power supply circuit through the control circuit board 30, and supplies power through the end of the light emitting element 22 away from the substrate 11.

[0101] By selecting a suitable power supply circuit to power the light-emitting element 22, it is ensured that the most suitable path is dynamically selected according to the actual temperature conditions under different temperature conditions to effectively heat the driver chip 12, so that the driver chip 12 can quickly heat up under low temperature conditions, while avoiding overheating, thereby improving the temperature control accuracy and reliability of the display module. This design solves the problem that the driver chip 12 cannot work normally at low temperatures by using the heat of the light-emitting element 22 to heat the driver chip 12, while reducing the processing cost and power consumption of the display module.

[0102] Combination Figure 7As shown, in one embodiment of the present invention, the display module further includes a first voltage regulating module electrically connected to the first power supply circuit;

[0103] S31: receiving the real-time temperature of the driver chip 12 collected by the temperature sensor 15, and determining whether the temperature is lower than a second preset temperature;

[0104] S32: If yes, control the first voltage regulating module to increase the input voltage of the light emitting element 22;

[0105] S33: If not, control the first power supply circuit to maintain the current input voltage.

[0106] In this embodiment, the MCU compares the received temperature data with the second preset temperature. By comparing the temperature data with the second preset temperature, the MCU can further confirm whether the driver chip 12 requires a higher heating power to ensure that it quickly reaches the operating temperature.

[0107] By dynamically adjusting the input voltage of the light emitting component 22 in the first power supply circuit, the heat conducted from the light emitting component 22 to the driver chip 12 is further increased or reduced, ensuring that it can start quickly under low temperature conditions. At the same time, unnecessary energy waste can be avoided, thereby improving the energy efficiency of the system.

[0108] Combination Figure 8 As shown, in one embodiment of the present invention, the display module further includes a second voltage regulating module electrically connected to the second power supply circuit;

[0109] The step of inputting a voltage to the end of the light emitting element 22 away from the substrate 11 through the second power supply circuit by the control circuit control board 30 includes:

[0110] S41: receiving the real-time temperature of the driver chip 12 collected by the temperature sensor 15, and determining whether the temperature is lower than a third preset temperature;

[0111] S42: If yes, control the second voltage regulating module to increase the input voltage of the light emitting element 22;

[0112] S43: If not, control the second power supply circuit to maintain the current input voltage.

[0113] In this embodiment, the MCU compares the received temperature data with the third preset temperature. By comparing the temperature data and the third preset temperature, the MCU can further confirm whether the driver chip 12 requires a higher heating power to ensure its stable operation under normal temperature conditions.

[0114] By dynamically adjusting the input voltage of the light emitting component 22 in the second power supply circuit, the heat conducted from the light emitting component 22 to the driver chip 12 is further increased or reduced, ensuring that it can start quickly under low temperature conditions. At the same time, unnecessary energy waste can be avoided, thereby improving the energy efficiency of the system.

[0115] In order to facilitate understanding of the control method of the display module, the applicant also provides an embodiment of the temperature control method:

[0116] The first preset temperature is 0 degrees, the second preset temperature is -40 degrees, and the third preset temperature is 15 degrees.

[0117] First, the control unit determines whether the current temperature of the driver chip 12 is lower than 0 degrees. If the temperature is lower than 0 degrees, the control unit controls the switching of the first power supply circuit and the end of the driver chip 12 facing the substrate 11 to be electrically connected. After the heat generated by the light-emitting element 22 is conducted to the driver chip 12 for a period of time, the control unit determines whether the current temperature of the driver chip 12 is lower than -40 degrees. If the temperature is lower than -40 degrees, the control unit controls the first voltage regulating module to increase the input voltage of the light-emitting element 22; if the temperature is between -40 degrees and 0 degrees, the control unit controls the circuit control board 30 to maintain the current input voltage of the light-emitting element 22.

[0118] If the temperature is higher than 0 degrees, the control unit controls the switching of the second power supply circuit to be electrically connected to the end of the driver chip 12 away from the substrate 11. After the heat generated by the light-emitting element 22 is conducted to the driver chip 12 for a period of time, the control unit determines whether the current temperature of the driver chip 12 is between 0 degrees and 15 degrees. If the temperature is between 0 degrees and 15 degrees, the control unit controls the second voltage regulating module to increase the input voltage of the light-emitting element 22; if the temperature is higher than 15 degrees, the control unit controls the circuit control board 30 to maintain the current input voltage of the light-emitting element 22.

[0119] The present invention also proposes a display device, which includes a display module. The specific structure of the display module refers to the above embodiment. Since the display device adopts all the technical solutions of all the embodiments of the above display module, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the display device can be a car-mounted liquid crystal display screen, a mobile terminal display screen, etc. By integrating the display module in the display screen, the problem that the driver chip 12 in the display screen cannot work normally due to low temperature, resulting in reduced display effect or no display is solved. At the same time, the heat generated by the operation of the light-emitting component 22 is used to solve this problem. Therefore, compared with the existing solution of adding a preheating device, the present application can reduce the processing cost and power consumption of the display device.

[0120] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising a substrate, a pixel layer and a driving chip arranged on a surface of the substrate, the driving chip being used to control the display of the pixel layer, and A backlight assembly, the backlight assembly comprising a light emitting element and a light guide assembly, the light emitting element being attached to a surface of the substrate away from the driving chip, the light guide assembly being disposed on the light emitting side of the light emitting element and being used to receive light emitted by the light emitting element and emit light toward the display panel; The orthographic projections of the light emitting element and the driving chip on the surface of the substrate at least partially overlap.

2. The display module according to claim 1, wherein: The display module further comprises a circuit control board and a temperature sensor, wherein the temperature sensor is arranged on the surface of the substrate where the driving chip is arranged; The circuit control board is provided with a control unit, a first power supply circuit and a second power supply circuit, the first power supply circuit is electrically connected to an end of the light emitting element facing the substrate, and the second power supply circuit is electrically connected to an end of the light emitting element facing away from the substrate; Wherein, the control unit controls switching of the electrical conduction between the first power supply circuit or the second power supply circuit and the light-emitting element according to the temperature of the driving chip acquired by the temperature sensor.

3. The display module according to claim 2, wherein: The display module further includes a first voltage regulating module, and the first voltage regulating module is electrically connected to the first power supply circuit; When the first power supply circuit is electrically connected to the light-emitting element, the control unit adjusts the input voltage of the light-emitting element through the first voltage regulating module according to the temperature of the driving chip collected by the temperature sensor.

4. The display module according to claim 3, wherein: The display module further comprises a back plate, the back plate is arranged on a side of the light guide assembly away from the substrate, and the circuit control board is arranged on a side of the back plate away from the light guide assembly; The display module further includes a first flexible circuit board, two ends of which are electrically connected to the circuit control board and the substrate respectively; Wherein, the light-emitting component is electrically connected to the first voltage regulating module through the substrate and the first flexible circuit board.

5. The display module according to claim 4, characterized in that: The first flexible circuit board is electrically connected to a side of the substrate on which the driving chip is provided, a through hole is provided on the surface of the substrate, a conductive part is deposited in the through hole, the conductive part is electrically connected to the first flexible circuit board, and a wiring layer connected to the conductive part is provided on a side of the substrate facing the light-emitting element; Wherein, the light emitting element is electrically connected to the first flexible circuit board through the wiring layer and the conductive part.

6. The display module according to any one of claims 3 to 5, characterized in that: The display module further includes a second voltage regulating module, and the second voltage regulating module is electrically connected to the second power supply circuit; When the second power supply circuit is electrically connected to the light-emitting element, the control unit adjusts the input voltage of the light-emitting element through the second voltage regulating module according to the temperature of the driving chip collected by the temperature sensor.

7. The display module according to claim 6, wherein: The display module further includes a second flexible circuit board, and two ends of the second flexible circuit board are respectively electrically connected to an end of the light emitting element away from the substrate and the circuit control board.

8. The display module according to claim 6, wherein: There are a plurality of driving chips, which are arranged at intervals on the surface of the substrate; there are a plurality of temperature sensors, each of which is arranged between two adjacent driving chips; there are a plurality of light-emitting elements, which are arranged at intervals on a side of the substrate away from the driving chips; The control unit adjusts the input voltage of the light-emitting element adjacent to the driver chip through the first voltage regulating module or the second voltage regulating module according to the temperatures of the driver chip at different positions collected by different temperature sensors.

9. The display module according to any one of claims 1 to 5, characterized in that: The light guide assembly includes an optical film and a light guide plate, the light guide plate includes a light input section and a light guide section which are sequentially arranged in parallel with the substrate, the light input section is arranged on the light output side of the light emitting component, and the longitudinal cross-sectional size of the light input section tends to decrease in the direction away from the light emitting component, and the optical film is arranged between the light guide section and the substrate.

10. A temperature control method for a display module according to any one of claims 1 to 9, characterized in that: The display module further includes a temperature sensor, a circuit control board, a first power supply circuit and a second power supply circuit. The temperature sensor is arranged on a side of the substrate facing the driving chip. The temperature control method includes the steps of: Controlling the light-emitting element to turn on; Receiving the real-time temperature of the driver chip collected by the temperature sensor, and determining whether the temperature is lower than a first preset temperature; If yes, controlling the circuit control board to input voltage to one end of the light emitting element toward the substrate through the first power supply circuit; If not, the circuit control board is controlled to input a voltage to the end of the light emitting element away from the substrate through the second power supply circuit.

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