Corrosion equipment for preparing wafer with special-shaped hole structure

Abstract

The invention discloses corrosion equipment for preparing a wafer with a special-shaped hole structure, the corrosion equipment comprises a corrosion container, the front side and the rear side of the corrosion container are both provided with a plurality of slots, the plurality of slots are internally and jointly slidably connected with a switching frame, one side of each switching frame is provided with a placement groove, each placement groove is internally provided with a substrate, and the substrate is provided with a plurality of through holes; and through holes are formed in the multiple base plates, a circulating device and a temperature control device are installed on the right side of the corrosion container, and the liquid outlet end of the circulating device communicates with a second connecting pipe. According to the equipment, through holes in the base plate are machined to have the needed anisotropy by controlling the flow speed of corrosive liquid on the left side and the right side of the base plate, controllability is high, the machining cost is low, the adhesion amount of the corrosive liquid on the base plate can be reduced as much as possible after each time of corrosion is completed through the arrangement of an electromagnet and a hollow plate, and the corrosion efficiency is improved. The influence of the residual corrosion solution on the substrate is avoided, and meanwhile the situation that the corrosion solution drips all around during discharging can be avoided.

Description

Technical Field

[0001] The invention relates to the technical field of laser micro-machining, and in particular to a wafer etching device for preparing a wafer with a special-shaped hole structure. Background Art

[0002] With the development of the semiconductor industry, glass is increasingly being used in the fields of 3D packaging, display, etc., due to its excellent high-frequency electrical properties, low cost, strong mechanical stability and other application advantages. Through glass via (TGV) technology is one of the most effective technologies for achieving 3D integration and high-performance passive substrates, which can significantly improve the connection transmission efficiency and has advantages in cost and performance.

[0003] One of the current methods of forming through holes using TGV technology is laser induced deep etching (LIDE), which uses a pulsed laser to locally modify the glass, changing the properties and molecular structure of the modified area, and then selectively etches it with a corrosive liquid. Since the chemical activity of the modified area is stronger, its corrosion rate is much greater than that of the non-modified area, so the corrosive liquid will remove the modified area faster to form a through hole that penetrates the glass substrate. However, the types of holes that can be formed using TGV technology are relatively single, only straight holes, blind holes, etc., which cannot be applied to more complex application scenarios.

[0004] After searching, it was found that both Chinese invention patents with publication numbers CN118125707A and CN112864026B used laser induction combined with acid corrosion to obtain glass through holes of good quality. However, the types of holes prepared by existing TGV technology are mostly relatively single, with only cylindrical through holes such as straight holes and blind holes, which cannot be applied to more complex application scenarios.

[0005] At the same time, the publication number CN114560634A proposes to use laser combined with ultrasonic guided wet etching to process special-shaped glass through holes. It uses laser induction with a single-sided mask and laser rotary cutting, and cooperates with high-precision ultrasonic equipment to etch to obtain trapezoidal through holes. The process is relatively complicated and the controllability of the taper is unknown.

[0006] Therefore, it is necessary to design a wafer etching device for preparing a wafer with a special-shaped hole structure to solve the above problems. Summary of the invention

[0007] The purpose of the present invention is to solve the shortcomings existing in the prior art, and to propose a wafer etching device for preparing a wafer with an irregular hole structure. The device controls the flow rate of the etching liquid on the left and right sides of the substrate, so as to process the through holes on the substrate into the required irregularities. The device has high controllability and low processing cost. Moreover, through the setting of the electromagnet and the hollow plate, after each etching is completed, the adhesion amount of the etching solution on the substrate can be reduced as much as possible, avoiding the influence of the residual etching solution on the substrate, and at the same time avoiding the etching solution from dripping everywhere when unloading.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions:

[0009] A wafer etching device for preparing a wafer with a special-shaped hole structure comprises a corrosion container, a plurality of slots are provided on the front and rear sides of the corrosion container, a transfer frame is slidably connected in the plurality of slots, a placement slot is provided on one side of the plurality of transfer frames, a substrate is provided in each placement slot, through holes are provided on the plurality of substrates, a circulation device and a temperature control device are installed on the right side of the corrosion container, a second connecting pipe is connected to the liquid outlet end of the circulation device, a first connecting pipe is connected to the liquid inlet end of the circulation device, the second connecting pipe runs through the temperature control device, a plurality of upper branch pipes are connected to the second connecting pipe, the bottom space of the corrosion container is connected to the first connecting pipe through a plurality of lower branch pipes, a first valve is provided on the plurality of upper branch pipes, and a second valve is provided on the plurality of lower branch pipes.

[0010] Preferably, the circulation device is an air bag pump or an electromagnetic pump.

[0011] Preferably, a plurality of said first valves and said second valves are controlled individually.

[0012] Preferably, the four sides of the plurality of adapter frames, namely the top, bottom, left and right sides, are each provided with a T-slot, the inner wall of each T-slot is provided with a threaded layer, and a bolt is threadedly connected in each T-slot.

[0013] Preferably, the upper end of the corrosion container is fixedly connected to a fixing frame, the inner top of the fixing frame is fixedly connected to two pneumatic rods, the telescopic ends of the two pneumatic rods are commonly fixedly connected to a movable plate, the lower end of the movable plate is fixedly connected to a plurality of fixed blocks, the lower ends of the plurality of fixed blocks are each provided with a U-shaped block, the plurality of U-shaped blocks are each provided with a clamping assembly, the clamping assembly comprises a hydraulic rod arranged on the inner walls on the left and right sides of the U-shaped block, and the telescopic ends of the two hydraulic rods are each fixedly connected to a clamping plate.

[0014] Preferably, a movable groove is provided at the lower end of each fixed block, an electromagnet is provided at the inner top of each movable groove, a T-block is slidably connected in each movable groove, the lower end of each T-block is fixedly connected to the upper end of the corresponding U-block, and each T-block is elastically connected to the adjacent side of the electromagnet through a spring.

[0015] Preferably, a pressure block is fixedly connected to the upper end of the movable plate, a pressure sensor is fixedly connected to the inner top of the fixed frame, and a current controller is installed at the upper end of the fixed frame.

[0016] Preferably, a foldable airbag is fixedly connected to the inner top of the fixed frame and the adjacent sides of the movable plate, a plurality of hollow plates are fixedly connected to the front and rear inner walls of the corrosion container, the lower ends of the plurality of hollow plates are connected to high-pressure nozzles, each of the high-pressure nozzles is tilted, the foldable airbag is connected to the plurality of hollow plates through an air outlet pipe, the foldable airbag is connected to the outside through an air inlet pipe, and one-way valves are provided on the air inlet pipe and the air outlet pipe.

[0017] The present invention has the following beneficial effects:

[0018] 1. Compared with the prior art, the circulation device, the upper branch pipe and the lower branch pipe are arranged to control the flow rate of the etching liquid on the left and right sides of the substrate by using the circulation device, thereby controlling the shape of the special-shaped hole on the substrate, with lower processing cost and higher controllability of the through-hole shape;

[0019] 2. Compared with the prior art, the pneumatic rod and the clamping assembly can be used to quickly clamp the substrate and place it in the etching solution. When the etching is completed, the substrate can be quickly taken out of the solution. During the preparation process, the staff can stay away from the etching solution to avoid the etching solution adhering to the human body.

[0020] 3. Compared with the prior art, through the setting of the electromagnet, when the substrate is taken out of the etching solution after preparation, the current controller will run for a period of time, so that the T-block drives the substrate to shake up and down continuously, shaking off the excess etching solution on the substrate, and reducing the residual etching solution on the substrate;

[0021] 4. Compared with the prior art, by setting the hollow plate, when the moving plate moves up, the gas in the folded airbag will be pressed out and sprayed through multiple hollow plates, thereby blowing the excess moisture on the upper end of the substrate downward, thereby reducing the residual corrosive liquid on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a wafer etching device for preparing a wafer with a special-shaped hole structure proposed by the present invention;

[0023] Figure 2for Figure 1 A top view of

[0024] Figure 3 for Figure 1 A schematic diagram of the structure from another perspective;

[0025] Figure 4 It is a schematic diagram of the structure of the transfer frame;

[0026] Figure 5 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0027] Figure 6 for Figure 5 A schematic diagram of the structure from another perspective;

[0028] Figure 7 for Figure 5 A cross-sectional view of

[0029] Figure 8 for Figure 6 Schematic diagram of the enlarged structure at point A in the middle.

[0030] In the figure: 1 corrosion container, 2 circulation device, 3 first connecting pipe, 4 lower branch pipe, 5 vertical pipe, 6 temperature control device, 7 second connecting pipe, 8 upper branch pipe, 9 base plate, 10 adapter frame, 11 slot, 12 T-slot, 13 bolt, 14 fixing frame, 15 pneumatic rod, 16 current controller, 17 outlet pipe, 18 inlet pipe, 19 folding airbag, 20 pressure block, 21 moving plate, 22 fixed block, 23 U-block, 24 electromagnet, 25 spring, 26 T-block, 27 pressure sensor, 28 hydraulic rod, 29 clamping plate, 30 hollow plate, 31 high pressure nozzle. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0032] Example 1

[0033] Reference Figure 1-Figure 4A wafer etching device for preparing a wafer with a special-shaped hole structure includes a corrosion container 1, a plurality of slots 11 are provided on both sides of the corrosion container 1, a transfer frame 10 is slidably connected in the plurality of slots 11, a placement slot is provided on one side of the plurality of transfer frames 10, a substrate 9 is provided in each placement slot, after the plurality of substrates 9 are placed in the corrosion container 1, the space in the corrosion container 1 will be divided into N+1 spaces (N is the number of substrates 9), through holes are provided on the plurality of substrates 9, a circulation device 2 and a temperature control device 6 are installed on the right side of the corrosion container 1, and the circulation device 2 is an air bag A pump or an electromagnetic pump is used, and the circulation device 2 circulates the corrosion liquid in each corrosion cavity; the temperature control device 6 controls the temperature of the corrosion liquid, the liquid outlet end of the circulation device 2 is connected with the second connecting pipe 7, and the liquid inlet end of the circulation device 2 is connected with the first connecting pipe 3, the second connecting pipe 7 runs through the temperature control device 6, and the second connecting pipe 7 is connected with a plurality of upper branch pipes 8, the bottom space of the corrosion container 1 is connected with the first connecting pipe 3 through a plurality of lower branch pipes 4, a first valve is provided on each of the plurality of upper branch pipes 8, a second valve is provided on each of the plurality of lower branch pipes 4, and the plurality of first valves and the second valves are controlled separately.

[0034] The four sides of the multiple adapter frames 10 are each provided with a T-slot 12 , the inner wall of each T-slot 12 is provided with a threaded layer, and each T-slot 12 is threadedly connected with a bolt 13 .

[0035] Among them, the corrosion container 1 is used to store the corrosion liquid; the type of corrosion liquid can be selected according to the material of the substrate 9 to be processed, and is generally divided into two types: alkaline corrosion liquid and acidic corrosion liquid. The alkaline corrosion liquid is any corrosion material based on hydroxide such as potassium hydroxide, sodium hydroxide or tetramethylammonium hydroxide, or the alkaline corrosion liquid is a solution or mixed solution including alkali metal ions and hydroxide ions; the acidic corrosion liquid is such as hydrofluoric acid, hydrochloric acid, sulfuric acid or their mixture; or the acidic corrosion liquid can be two solutions that can generate hydrofluoric acid and other acids after mixing, such as a mixed solution of a fluorine-containing alkaline solution and a hydrogen ion-containing solution. Those skilled in the art can select similar acidic or alkaline corrosion liquids as needed, and can control the amount of corrosion removal of the substrate 9 to be processed, that is, control the aperture of the micropores, according to the composition of the corrosion liquid, the concentration of the corrosion liquid, the temperature of the corrosion liquid and the corrosion time.

[0036] The functional principle of the present invention can be explained through the following operation mode: the substrate 9 is placed in the placement groove, and then the staff rotates multiple bolts 13 to limit the substrate 9, and then the adapter frame 10 with the substrate 9 is inserted into the corresponding slot 11, thereby dividing it into N+1 spaces (N is the number of substrates 9 placed in the corrosion container 1), and then the circulation device 2 and the temperature control device 6 are started, and the flow rate of the multiple upper branch pipes 8 and the lower branch pipes 4 is controlled by adjusting the multiple first valves and the second valves, so that the flow rate of the corrosion solution in the space on the left and right sides of each substrate 9 changes, and the substrate 9 is corroded, so that the required special-shaped holes are generated on the substrate 9.

[0037] Taking five substrates 9 as an example, when the hole type of the product to be processed is required to be a truncated cone hole, the second and fourth first valves and second valves from left to right are opened, and the remaining first valves and second valves are closed. Then, the different flow intensities of the etching liquid in each etching cavity lead to different corrosion rates, thereby forming a truncated cone hole.

[0038] If the hole type of the product to be processed is required to be a straight hole, all the first valves and the second valves are opened, and the circulation flow rates on the left and right sides of each substrate 9 are made consistent, that is, the etching rates of each etching cavity are consistent, thereby forming a straight hole.

[0039] Example 2

[0040] Reference Figure 5-Figure 8The difference between this embodiment and embodiment 1 is that the upper end of the corrosion container 1 is fixedly connected to a fixed frame 14, the inner top of the fixed frame 14 is fixedly connected to two pneumatic rods 15, the telescopic ends of the two pneumatic rods 15 are commonly fixedly connected to a moving plate 21, the lower end of the moving plate 21 is fixedly connected to a plurality of fixed blocks 22, the lower ends of the plurality of fixed blocks 22 are each provided with a U-shaped block 23, the plurality of U-shaped blocks 23 are each provided with a clamping assembly, the clamping assembly includes a hydraulic rod 28 arranged on the inner walls on the left and right sides of the U-shaped block 23, the telescopic ends of the two hydraulic rods 28 are fixedly connected to a clamping plate 29, the lower end of each fixed block 22 is provided with a moving groove, the inner top of each moving groove is provided with an electromagnet 24, each moving groove is slidably connected with a T-block 26, the lower end of each T-block 26 is fixedly connected to the upper end of the corresponding U-shaped block 23, and each T-block 26 is elastically connected to the adjacent side of the electromagnet 24 through a spring 25, a pressure block 20 is fixedly connected to the upper end of the movable plate 21, a pressure sensor 27 is fixedly connected to the inner top of the fixed frame 14, a current controller 16 is installed on the upper end of the fixed frame 14, and a controller is provided. When the pressure sensor 27 is squeezed and generates an electrical signal, it will be transmitted to the controller. The controller controls the current controller 16 to operate, so that a sinusoidal current passes through the electromagnet 24, and the magnetism generated by the electromagnet 24 changes continuously (the current will continuously increase, decrease, and then increase, so that the magnetic plate generated by the electromagnet 24 will continuously increase, decrease, and then increase), and the magnetic change generated by the electromagnet 24 will continuously change the magnetic force generated by the T-block 26, so that the T-block 26 drives the U-block 23 and the substrate 9 to continuously shake up and down, and the T-block 26 is made of iron material.

[0041] Among them, the inner top of the fixed frame 14 and the adjacent side of the movable plate 21 are commonly fixedly connected with a folding airbag 19, and the inner walls on the front and rear sides of the corrosion container 1 are commonly fixedly connected with multiple hollow plates 30. The lower ends of the multiple hollow plates 30 are connected with high-pressure nozzles 31, and each high-pressure nozzle 31 is arranged at an angle. The folding airbag 19 is connected with the multiple hollow plates 30 through the outlet pipe 17, and the folding airbag 19 is connected with the outside through the inlet pipe 18. Both the inlet pipe 18 and the outlet pipe 17 are provided with one-way valves. The outside gas enters the folding airbag 19 in one direction through the inlet pipe 18, and the gas in the folding airbag 19 enters the multiple hollow plates 30 in one direction through the outlet pipe 17.

[0042] In this embodiment, a plurality of transfer frames 10 equipped with substrates 9 are placed between two corresponding clamping plates 29, and the corresponding two hydraulic rods 28 are controlled to stretch so that the two clamping plates 29 move relative to each other, and the transfer frame 10 is clamped. The pneumatic rod 15 is stretched so that the moving plate 21 moves downward, and the plurality of transfer frames 10 are driven to move downward into the corrosion container 1, so that the substrates 9 are immersed in the corrosion solution. When the moving plate 21 moves downward, the folding airbag 19 is stretched, the space in the folding airbag 19 increases, the air pressure decreases, and the external gas enters the folding airbag 19 through the air inlet pipe 18;

[0043] When the etching of the substrate 9 is completed, the pneumatic rod 15 is controlled to contract, and the transfer frame 10 can be driven to move upward through the moving plate 21 to remove the substrate 9 from the etching solution. When the moving plate 21 moves upward, the folding airbag 19 will be squeezed, the space in the folding airbag 19 will be reduced, and the air pressure will increase, so that the gas in the folding airbag 19 is pressed into the multiple hollow plates 30 through the outlet pipe 17, and then sprayed out through the multiple high-pressure nozzles 31. Due to the inclined setting of the high-pressure nozzle 31, the etching solution adhered to the substrate 9 will continuously flow downward, reducing the residual etching solution on the substrate 9;

[0044] After the movable plate 21 moves and resets, the pressing block 20 will squeeze the pressure sensor 27, and the pressure sensor 27 will generate an electrical signal transmitted to the controller. The controller controls the operation of the current controller 16 to make the sinusoidal current flow in the circuit of the electromagnet 24, so that the magnetism generated by the electromagnet 24 will continue to change (the current will continue to increase, decrease, and then increase, so that the magnetic plate generated by the electromagnet 24 will continue to increase, decrease, and then increase). The magnetic change generated by the electromagnet 24 will also continuously change the magnetic force generated by the T-block 26, so that the T-block 26 drives the U-block 23 and the substrate 9 to continuously shake up and down, thereby shaking off the excess corrosion solution on the substrate 9, further reducing the residual corrosion solution on the substrate 9.

[0045] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer etching device for preparing a wafer with a special-shaped hole structure, comprising an etching container (1), characterized in that: The corrosion container (1) is provided with a plurality of slots (11) on both the front and rear sides, and a transfer frame (10) is slidably connected in the plurality of slots (11), and a placement slot is provided on one side of the plurality of transfer frames (10), and a substrate (9) is provided in each placement slot, and through holes are provided on the plurality of substrates (9). A circulation device (2) and a temperature control device (6) are installed on the right side of the corrosion container (1), and the liquid outlet of the circulation device (2) is connected to a second connection pipe (7), and the liquid inlet of the circulation device (2) is connected to a first connection pipe (3), and the second connection pipe (7) passes through the temperature control device (6). The second connection pipe (7) is connected to a plurality of upper branch pipes (8), and the bottom space of the corrosion container (1) is connected to the first connection pipe (3) through a plurality of lower branch pipes (4), and the plurality of upper branch pipes (8) are provided with a first valve, and the plurality of lower branch pipes (4) are provided with a second valve.

2. The etching device for preparing a wafer with a special-shaped hole structure according to claim 1, characterized in that: The circulation device (2) is an air bag pump or an electromagnetic pump.

3. The etching device for preparing a wafer with a special-shaped hole structure according to claim 1, characterized in that: The plurality of first valves and second valves are each controlled individually.

4. The etching device for preparing a wafer with a special-shaped hole structure according to claim 1, characterized in that: The four sides of the plurality of adapter frames (10) are each provided with a T-slot (12), the inner wall of each T-slot (12) is provided with a threaded layer, and each T-slot (12) is threadedly connected with a bolt (13).

5. The etching device for preparing a wafer with a special-shaped hole structure according to claim 1, characterized in that: The upper end of the corrosion container (1) is fixedly connected to a fixing frame (14), the inner top of the fixing frame (14) is fixedly connected to two pneumatic rods (15), the telescopic ends of the two pneumatic rods (15) are commonly fixedly connected to a moving plate (21), the lower end of the moving plate (21) is fixedly connected to a plurality of fixing blocks (22), the lower ends of the plurality of fixing blocks (22) are each provided with a U-shaped block (23), the plurality of U-shaped blocks (23) are each provided with a clamping assembly, the clamping assembly comprises a hydraulic rod (28) arranged on the inner walls on the left and right sides of the U-shaped block (23), and the telescopic ends of the two hydraulic rods (28) are each fixedly connected to a clamping plate (29).

6. The etching device for preparing a wafer with a special-shaped hole structure according to claim 5, characterized in that: A movable groove is provided at the lower end of each fixed block (22), an electromagnet (24) is provided at the inner top of each movable groove, a T-shaped block (26) is slidably connected in each movable groove, the lower end of each T-shaped block (26) is fixedly connected to the upper end of the corresponding U-shaped block (23), and each T-shaped block (26) is elastically connected to the adjacent side of the electromagnet (24) via a spring (25).

7. The etching device for preparing a wafer with a special-shaped hole structure according to claim 5, characterized in that: The upper end of the movable plate (21) is fixedly connected to a pressure block (20), the inner top of the fixed frame (14) is fixedly connected to a pressure sensor (27), and the upper end of the fixed frame (14) is installed with a current controller (16).

8. The etching device for preparing a wafer with a special-shaped hole structure according to claim 5, characterized in that: A folding airbag (19) is fixedly connected to the inner top of the fixed frame (14) and the adjacent side of the movable plate (21); a plurality of hollow plates (30) are fixedly connected to the inner walls on both sides of the front and rear of the corrosion container (1); the lower ends of the plurality of hollow plates (30) are connected to high-pressure nozzles (31); each of the high-pressure nozzles (31) is arranged obliquely; the folding airbag (19) is connected to the plurality of hollow plates (30) via an air outlet pipe (17); the folding airbag (19) is connected to the outside via an air inlet pipe (18); and one-way valves are provided on the air inlet pipe (18) and the air outlet pipe (17).

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