Test system with rapid fixing function for integrated circuit sealing test

Abstract

The invention discloses a test system with a rapid fixing function for integrated circuit sealing test, and relates to the technical field of circuit sealing test, and the test system comprises a detection table, a transmission device is installed in the middle of the detection table, a push plate is arranged above the transmission device, the transmission device is in transmission connection with a carrying table, and an integrated chip is arranged above the carrying table. The device further comprises an adjustable detection mechanism and a buffer control mechanism, the adjustable detection mechanism is arranged below the push plate, and the buffer control mechanism is arranged above the adjustable detection mechanism. The telescopic controller is controlled by a system in a programmed mode to slide at different positions of the control panel, the elastic potential energy of the buffer spring can be flexibly adjusted, the adjusting mechanism enables the punching block to adjust the pressure on the surface of the chip according to needs when the chip is fixed, and therefore the chip is fixed. The pressure adjusting capability not only is favorable for ensuring the stability of the chip in the fixing process, but also can further optimize the fixing effect so as to adapt to chips with different sizes, shapes and materials.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit packaging and testing, and in particular to a testing system with a fast fixing function for integrated circuit packaging and testing. Background Art

[0002] Chip integrated circuit packaging and testing, that is, chip packaging and testing, is an important link in the semiconductor industry chain. It connects chip design and manufacturing and plays a vital bridge role. Testing is the key link to verify whether the packaged chip meets the design specifications and performance requirements. During the test, by inputting specific test vectors into the chip, observe whether the chip's output response meets expectations.

[0003] However, the existing chip testing process still has the following defects:

[0004] 1. Existing chips need to be quickly fixed and positioned in advance before testing to prevent the chip from shaking during the test. However, the pins are an important part of the chip connecting to the external circuit. Their slender and fragile characteristics make them extremely susceptible to external forces during the fixing process. When the chip is fixed on the test device, if the fixing method is improper or the force control is not accurate, the pins may be bent due to squeezing or twisting. This bending may not only cause poor contact between the pins and the test device, thereby affecting the accuracy of the test results, but more seriously, once the pins are bent to an irreversible degree, the chip may be scrapped and can no longer be effectively tested or used.

[0005] 2. In addition, existing detection equipment is often customized based on specific chip silver corner spacing during design, which means that these devices can only test the silver corners of chips that meet their preset spacing standards. However, in actual applications, the silver corner spacing of chips of different models may be different. This results in the existing detection equipment often being unable to accurately judge the silver corner bending when faced with chips with non-standard spacing. This limitation not only affects the accuracy of detection, but also limits the versatility and flexibility of chip detection.

[0006] Therefore, a test system with fast fixing function for integrated circuit packaging and testing is proposed to solve the above problems. Summary of the invention

[0007] In view of this, the technical problem to be solved by the present invention is to propose a test system with a rapid fixing function for integrated circuit packaging and testing, so as to solve the problems of easy deformation of chip pins during positioning and single chip detection in the prior art.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a test system with a rapid fixing function for integrated circuit packaging and testing, comprising a test platform, a transmission device is installed in the middle of the test platform, a push plate is arranged above the transmission device, a loading platform is transmission-connected to the transmission device, an integrated chip is arranged above the loading platform, and an adjustable detection mechanism and a buffer control mechanism are also included, the adjustable detection mechanism is arranged below the push plate, and the buffer control mechanism is arranged above the adjustable detection mechanism;

[0009] The adjustable detection mechanism is used for rapid positioning and detection of integrated circuits;

[0010] The buffer control mechanism is used for pressure regulation and protection during integrated circuit testing.

[0011] As an improvement, an automatic centering positioning mechanism is also provided on the upper surface of the loading platform, and the automatic centering positioning mechanism is used for positioning and fixing the integrated circuit. The automatic centering positioning mechanism includes a limit plate, and the limit plate is evenly fixedly arranged on the upper surface of the loading platform. Positioning grooves are evenly opened on the loading platform, and a pressing block is slidably connected in the loading platform positioning groove. A return spring is fixedly connected to the bottom of the pressing block, and the return spring is fixedly connected to the loading platform positioning groove at one end away from the pressing block, and a pry plate is installed circumferentially on the bottom of the pressing block.

[0012] As an improvement, sliding grooves are provided at both ends of the pry plate, the bottom of the pressing block is slidably connected to the sliding groove provided at one end of the pry plate, the middle part of the pry plate is rotatably connected with a fixed block, the fixed block is fixedly connected to the positioning groove of the loading platform at one end away from the pry plate, and a positioning elastic clamp is slidably connected in the sliding groove at one end of the pry plate away from the pressing block, and the bottom of the positioning elastic clamp is slidably connected to the upper surface of the loading platform.

[0013] As an improvement, the adjustable detection mechanism includes a stamping block, the bottom of the push plate is evenly fixedly connected to the control chamber, the outer surface of the stamping block is slidably connected to the inner wall of the control chamber, and the outer surface of the control chamber is symmetrically fixedly connected to a fixing plate.

[0014] As an improvement, a sliding shaft is symmetrically fixedly connected to the fixed plate, a test pressure pin is evenly slidably connected to the outer surface of the sliding shaft, an extrusion rod is fixedly connected to the test pressure pin, and extrusion grooves are evenly opened on the outer surface of the stamping block, and the extrusion groove is slidably connected to the extrusion rod at one end away from the test pressure pin.

[0015] As an improvement, the buffer control mechanism includes a pressing plate, which is rotatably connected to the upper surface of the stamping block. The pressing plate is rotatably connected to one end of the pressing plate away from the stamping block, and the upper surface of the multifunctional buffer slider is slidably connected to the inner wall of the control chamber. The multifunctional buffer slider is symmetrically arranged on the inner wall of the control chamber, and the middle part of the multifunctional buffer slider is slidably connected to a buffer shaft.

[0016] As an improvement, a buffer spring is sleeved on the outer surface of the middle part of the buffer shaft, and both ends of the buffer spring are fixedly connected to the multifunctional buffer slider. An arc groove is opened at one end of the buffer shaft, and a control plate is slidably connected in the arc groove.

[0017] As an improvement, the control panel is slidably connected to one end of the control panel away from the multifunctional buffer slider with a telescopic controller, the telescopic controller is installed on the inner wall of the control compartment, a compression spring is sleeved on the outer surface of the control panel, one end of the compression spring is fixedly connected to the control panel, and the other end of the compression spring is fixedly connected to the telescopic controller.

[0018] Compared with the prior art, the test system with fast fixing function for integrated circuit packaging and testing provided by the present invention has the following beneficial effects:

[0019] 1. When the chip is placed in the middle of the limiting plate, the bottom of the integrated chip is just placed in the limiting plate, and the pins of the integrated chip are located above the limiting plate. When the integrated chip is pressed downward, the integrated chip will drive the pressing block to slide downward, and the pressing block will drive the pry plate to drive the positioning elastic clamp to squeeze the bottom of the integrated chip. When the integrated chip continues to be squeezed downward, the integrated chip pins are attached to the upper surface of the limiting plate due to the blocking of the integrated chip by the loading platform. Compared with the traditional fixing method, it does not require complicated fixing devices or additional operating steps. Only a light press can quickly fix the chip in a predetermined position; secondly, the fixing process of the present invention can provide evenly distributed pressure, which is beneficial to protect the fragile parts of the chip, such as pins, etc., so as to avoid chip damage caused by improper fixing and improve the yield and reliability of the product.

[0020] 2. Compared with the traditional press fixation, the setting of the buffer control mechanism of the present invention can effectively relieve and disperse the pressure while applying pressing force to the chip, thereby preventing the chip from being damaged due to direct pressure. The present invention is crucial to protecting the integrity of the chip, especially when dealing with chips with fragile structures or sensitive components. In addition, by systematically controlling the sliding of the telescopic controller at different positions of the control board, we can flexibly adjust the elastic potential energy of the buffer spring itself. This adjustment mechanism enables the stamping block to adjust the pressure on the chip surface as needed when fixing the chip. This pressure adjustment capability is not only conducive to ensuring the stability of the chip during the fixing process, but also can further optimize the fixing effect to adapt to chips of different sizes, shapes and materials.

[0021] 3. Through the setting of the extrusion groove and the test pressure needle, the sliding of the punch block on the inner wall of the control chamber can drive the gap of the test pressure needle on the sliding shaft to be adjusted. When the punch block slides on the inner wall of the control chamber, it can effectively drive the test pressure needle to adjust the gap on the sliding shaft. The design of the present invention not only makes the adjustment process intuitive and easy to operate, but more importantly, it provides extremely high flexibility, allowing us to finely adjust the gap according to actual needs, and by controlling the sliding distance of the punch block, we can also achieve the adjustment of the chip silver corner detection spacing. Compared with the traditional single customized detection equipment, through the setting of the present invention, in the actual detection process, since different chips may have different silver corner spacings, the present invention can adapt to the pin connection measurement of chips with different spacings by adjusting the sliding distance of the punch block. The present invention can not only easily cope with this diversity and ensure that each detection can achieve the best effect, but also this function undoubtedly brings greater convenience and accuracy to chip detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a half-cut schematic diagram of the three-dimensional structure of the present invention;

[0023] Figure 2 It is a half-cut auxiliary schematic diagram of the three-dimensional structure of the present invention;

[0024] Figure 3 This is a schematic diagram of the structural connection relationship of the automatic centering positioning mechanism of the present invention;

[0025] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle;

[0026] Figure 5 This is an auxiliary schematic diagram of the structural connection relationship of the automatic centering positioning mechanism of the present invention;

[0027] Figure 6 It is a schematic diagram of the structural connection relationship of the adjustable detection mechanism of the present invention;

[0028] Figure 7 This is a schematic diagram of the connection relationship of the buffer control mechanism structure of the present invention;

[0029] Figure 8 For the present invention Figure 7 Enlarged view of point B in the middle;

[0030] Fig. 9 It is an auxiliary schematic diagram of the connection relationship of the buffer control mechanism structure of the present invention;

[0031] Fig.10 For the present invention Fig. 9 Enlarged view of center C.

[0032] In the figure:

[0033] 1. Testing table; 11. Transmission device; 12. Loading table; 13. Push plate; 14. Integrated chip;

[0034] 2. Automatic centering positioning mechanism; 21. Limiting plate; 22. Pressing block; 23. Reset spring; 24. Pry plate; 25. Fixing block; 26. Positioning elastic splint;

[0035] 3. Adjustable detection mechanism; 31. Punching block; 32. Control chamber; 33. Fixed plate; 34. Sliding shaft; 35. Test pressure needle; 36. Extrusion groove; 37. Extrusion rod;

[0036] 4. Buffer control mechanism; 41. Pressing plate; 42. Multifunctional buffer slider; 43. Buffer shaft; 44. Arc groove; 45. Buffer spring; 46. Control board; 47. Compression spring; 48. Telescopic controller. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0039] Example

[0040] Please refer to Figures 1 to 10 As shown:

[0041] In order to solve the problems mentioned in the technical solution, the embodiment of the present application provides a test system with a rapid fixing function for integrated circuit packaging and testing, including a test table 1, a transmission device 11 is installed in the middle of the test table 1, a push plate 13 is arranged above the transmission device 11, a loading table 12 is transmission-connected to the transmission device 11, an integrated chip 14 is arranged above the loading table 12, and an adjustable detection mechanism 3 and a buffer control mechanism 4 are also included, the adjustable detection mechanism 3 is arranged below the push plate 13, and the buffer control mechanism 4 is arranged above the adjustable detection mechanism 3;

[0042] The adjustable detection mechanism 3 is used for rapid positioning and detection of integrated circuits;

[0043] The buffer control mechanism 4 is used for pressure regulation and protection during integrated circuit testing;

[0044] An automatic centering positioning mechanism 2 is also provided on the upper surface of the loading platform 12. The automatic centering positioning mechanism 2 is used for positioning and fixing the integrated circuit. The automatic centering positioning mechanism 2 includes a limit plate 21. The limit plate 21 is evenly fixedly arranged on the upper surface of the loading platform 12. Positioning grooves are evenly opened on the loading platform 12. A pressing block 22 is slidably connected in the positioning groove of the loading platform 12. A reset spring 23 is fixedly connected at the bottom of the pressing block 22. One end of the reset spring 23 away from the pressing block 22 is fixedly connected in the positioning groove of the loading platform 12. A pry plate 24 is installed on the circumference of the bottom of the pressing block 22.

[0045] Slide grooves are provided at both ends of the pry plate 24, the bottom of the pressing block 22 is slidably connected to the slide groove provided at one end of the pry plate 24, a fixed block 25 is rotatably connected to the middle of the pry plate 24, the fixed block 25 is fixedly connected to the positioning groove of the loading platform 12 at one end away from the pry plate 24, a positioning elastic clamping plate 26 is slidably connected in the slide groove at one end of the pry plate 24 away from the pressing block 22, and the bottom of the positioning elastic clamping plate 26 is slidably connected to the upper surface of the loading platform 12;

[0046] Among them: a cylinder is installed in the middle of the testing platform 1, and the upper end of the cylinder telescopic shaft is fixedly connected to the push plate 13, and the bottom of both sides of the push plate 13 are slidably connected with guide rods, and the pry plate 24 to the positioning elastic clamping plate 26 are circumferentially arranged around the pressing block 22.

[0047] In the prior art, when the chip is fixed on the test device, if the fixing method is improper or the force control is not accurate, the pins may be bent due to squeezing or twisting. This bending may not only cause poor contact between the pins and the test device, but compared with the prior art, through the implementation of this embodiment, it does not require complicated fixing devices or additional operating steps. Only a light press can quickly fix the chip in a predetermined position; secondly, the fixing process in the present invention can provide evenly distributed pressure, which is beneficial to protect the fragile parts of the chip, such as pins, etc., so as to avoid chip damage caused by improper fixing and improve the yield and reliability of the product.

[0048] For further examples, please refer to Figures 1 to 10 As shown:

[0049] The adjustable detection mechanism 3 includes a punching block 31, a control chamber 32 is evenly fixedly connected to the bottom of the push plate 13, the outer surface of the punching block 31 is slidably connected to the inner wall of the control chamber 32, and a fixing plate 33 is symmetrically fixedly connected to the outer surface of the control chamber 32;

[0050] The fixed plate 33 is symmetrically fixedly connected with a sliding shaft 34, the outer surface of the sliding shaft 34 is evenly slidably connected with a test pressure needle 35, the test pressure needle 35 is fixedly connected with an extrusion rod 37, and the outer surface of the punching block 31 is evenly opened with an extrusion groove 36, and the extrusion groove 36 is slidably connected to the extrusion rod 37 at one end away from the test pressure needle 35;

[0051] The buffer control mechanism 4 includes a pressing plate 41, which is rotatably connected to the upper surface of the punching block 31, and a multifunctional buffer slider 42 is rotatably connected to one end of the pressing plate 41 away from the punching block 31, and the upper surface of the multifunctional buffer slider 42 is slidably connected to the inner wall of the control chamber 32, and the multifunctional buffer slider 42 is symmetrically arranged on the inner wall of the control chamber 32, and a buffer shaft 43 is slidably connected to the middle of the multifunctional buffer slider 42;

[0052] A buffer spring 45 is sleeved on the outer surface of the middle part of the buffer shaft 43. Both ends of the buffer spring 45 are fixedly connected to the multifunctional buffer slider 42. An arc groove 44 is opened at one end of the buffer shaft 43. A control plate 46 is slidably connected in the arc groove 44.

[0053] The control board 46 is slidably connected to one end away from the multifunctional buffer slider 42 with a telescopic controller 48, which is mounted on the inner wall of the control compartment 32. A compression spring 47 is sleeved on the outer surface of the control board 46, one end of the compression spring 47 is fixedly connected to the control board 46, and the other end of the compression spring 47 is fixedly connected to the telescopic controller 48.

[0054] Wherein: the adjustable detection mechanism 3 is evenly arranged at the bottom of the push plate 13 , and the integrated chip 14 is symmetrically arranged in the control compartment 32 .

[0055] In the prior art, these devices can only test the silver corners of chips that meet their preset spacing standards. However, in actual applications, the silver corner spacings of chips of different models may be different. This results in that when faced with chips with non-standard spacings, the existing detection equipment is often unable to accurately determine the bending of the silver corners. Compared with the prior art, through the implementation of this embodiment, in the actual detection process, since different chips may have different pin spacings, the present invention can adapt to the pin connection measurement of chips with different spacings by adjusting the sliding distance of the stamping block 31. The present invention can not only easily cope with this diversity and ensure that each detection can achieve the best effect, but this function undoubtedly brings greater convenience and accuracy to chip detection.

[0056] Everything in the above example works like this:

[0057] In the initial state: the transmission device 11 is not started, the telescopic cylinder installed in the detection platform 1 is not started, the return spring 23 is not compressed, the buffer spring 45 is not compressed, and the telescopic controller 48 is not started.

[0058] The following is the working process of the automatic centering positioning mechanism 2 in fast positioning and fixing of the chip:

[0059] Before testing the chip, first start the transmission device 11. When the loading platform 12 is transferred to the bottom of the push plate 13 after the transmission device 11 is started, the transmission device 11 is stopped under the control of the infrared sensing device arranged above the push plate 13, and the telescopic cylinder installed in the testing platform 1 starts to start. Since the cylinder telescopic shaft and the push plate 13 are fixed to each other, the movement of the cylinder telescopic shaft will drive the push plate 13 to start synchronous movement. When the push plate 13 is driven by the contraction of the cylinder telescopic shaft, the push plate 13 will move downward. When the control bin 32 fixedly connected to the bottom of the push plate 13 and the stamping block 31 sliding through the inner wall of the control bin 32 start to squeeze the integrated chip 14 located on the upper surface of the loading platform 12, the downward movement of the stamping block 31 will drive Figure 4 The pressing block 22 shown starts to move downward. Since the return spring 23 is fixedly connected to the bottom of the pressing block 22, the return spring 23 is compressed by the downward movement of the pressing block 22.

[0060] Furthermore, since a return spring 23 is fixedly connected to the bottom of the pressing block 22, and the return spring 23 is fixedly connected to the positioning groove of the loading platform 12 at one end away from the pressing block 22, and sliding grooves are opened at both ends of the prying plate 24, the bottom of the pressing block 22 is slidably connected to the sliding groove opened at one end of the prying plate 24, and the middle part of the prying plate 24 is rotatably connected to the fixed block 25, the downward movement of the pressing block 22 will drive the prying plate 24 to rotate counterclockwise in the fixed block 25. At the same time, because the prying plate 24 is slidably connected to the positioning elastic clamping plate 26 in the sliding groove at one end away from the pressing block 22, and the prying plate 24 to the positioning elastic clamping plate 26 are circumferentially arranged around the pressing block 22, the counterclockwise rotation of the prying plate 24 will drive the positioning elastic clamping plate 26 to start squeezing the non-pin part of the bottom of the integrated chip 14. When the chip is placed in the middle of the limiting plate 21, the bottom of the integrated chip 14 is just placed on the limiting plate 21. The integrated chip 14 is positioned above the limiting plate 21, and when the integrated chip 14 is pressed downward, the integrated chip 14 will drive the pressing block 22 to slide downward, and the pressing block 22 will drive the prying plate 24 to drive the positioning elastic clamping plate 26 to squeeze the bottom of the integrated chip 14. When the integrated chip 14 is continuously pressed downward, the integrated chip 14 is blocked by the loading platform 12 so that the pins of the integrated chip 14 are attached to the upper surface of the limiting plate 21. Compared with the traditional fixing method, it does not require complicated fixing devices or additional operating steps. Only a light press is needed to quickly fix the chip in a predetermined position. Secondly, the fixing process of the present invention can provide evenly distributed pressure, which is beneficial to protect the fragile parts of the chip, such as pins, etc., so as to avoid chip damage caused by improper fixing and improve the yield and reliability of the product.

[0061] Please refer to the above working process Figures 1 to 10 .

[0062] The following is the working process of the adjustable detection mechanism 3 for rapid positioning and detection of integrated circuits and the buffer control mechanism 4 for pressure regulation and protection during integrated circuit detection:

[0063] As described above, when the punch block 31 presses the surface of the integrated chip 14, Figure 8 As shown, since the upper end of the punching block 31 is rotatably connected to the pressing plate 41, and the end of the pressing plate 41 away from the punching block 31 is rotatably connected to the multifunctional buffer slider 42, and as can be seen from the connection relationship in the figure, when the punching block 31 slides upward, it will drive the multifunctional buffer slider 42 to slide in the buffer shaft 43, and the multifunctional buffer slider 42 will slide along the outer surface of the buffer shaft 43 to the middle of the buffer shaft 43, and since the buffer spring 45 is sleeved on the outer surface of the buffer shaft 43, and the two ends of the buffer spring 45 are respectively fixedly connected to the multifunctional buffer slider 42, when the multifunctional buffer slider 42 slides along the buffer shaft 43 to the middle of the buffer shaft 43, the buffer spring 45 will be compressed. Compared with the traditional pressing and fixing, this setting of the present invention can effectively relieve and disperse the pressure while applying pressing force to the chip, thereby preventing the chip from being damaged due to direct pressure;

[0064] In addition, the telescopic controller 48 can slide the control panel 46 through the programmed control of the terminal (i.e. Figure 8 As shown, the control board 46 is controlled to slide left and right by the telescopic controller 48. Since the control board 46 is slidably connected to the arc groove 44 at one end away from the telescopic controller 48, and the arc groove 44 is provided on the multifunctional buffer slider 42, when the control board 46 is adjusted to slide, the multifunctional buffer slider 42 will slide under the squeezing of the arc groove 44 and the control board 46, that is, when the control board 46 slides to the left, the multifunctional buffer slider 42 will slide like the two sides of the buffer shaft 43. When the control board 46 slides to the right, the multifunctional buffer slider 42 will slide like the middle part of the buffer shaft 43 under the elastic action of the buffer spring 45. By systematically controlling the sliding of the telescopic controller 48 at different positions of the control board 46, we can flexibly adjust the elastic potential energy of the buffer spring 45 itself. This adjustment mechanism enables the stamping block 31 to adjust the pressure on the chip surface as needed when fixing the chip. This pressure adjustment capability is not only conducive to ensuring the stability of the chip during the fixing process, but also can further optimize the fixing effect to adapt to chips of different sizes, shapes and materials.

[0065] Since one end of the pressing plate 41 is rotatably connected to the multifunctional buffer slider 42 and the other end is rotatably connected to the punching block 31, and since the punching block 31 is slidably connected to the inner wall of the control chamber 32, when the control plate 46 is adjusted, the multifunctional buffer slider 42 drives the pressing plate 41 to drive the punching block 31 to slide in the control chamber 32. Figure 6As shown, since the stamping block 31 is evenly provided with extrusion grooves 36, and the test pressure pin 35 evenly slidably connected to the sliding shaft 34 slides in the extrusion groove 36 through the extrusion rod 37, when the sliding distance of the stamping block 31 in the control chamber 32 is adjusted by the above-mentioned adjustment, the extrusion action of the extrusion groove 36 and the extrusion rod 37 will change the distance between the test pressure pins 35, and when the bottom of the stamping block 31 presses and fixes the surface of the integrated chip 14, the distance between the silver corners of different chips on the integrated chip 14 can be quickly adapted by adjusting the bottom of the test pressure pin 35. The chip can be quickly tested by pressing the test pressure pin 35 with the silver corner, and the missing, damaged and bent pins can also be checked. Compared with the traditional single customized detection equipment, through the setting of the present invention, in the actual detection process, since different chips may have different pin spacings, the present invention can adapt to the pin connection measurement of chips with different spacings by adjusting the sliding distance of the stamping block 31. The present invention can not only easily cope with such diversity and ensure that each detection can achieve the best effect, but also this function undoubtedly brings greater convenience and accuracy to chip detection.

[0066] Please refer to the above working process Figures 1 to 10 .

[0067] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0068] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A test system with a rapid fixing function for integrated circuit packaging and testing, used for rapid positioning and testing during circuit packaging and testing, comprising a testing platform (1), a transmission device (11) is installed in the middle of the testing platform (1), a push plate (13) is arranged above the transmission device (11), a loading platform (12) is transmission-connected to the transmission device (11), an integrated chip (14) is arranged above the loading platform (12), and the characteristics are: It also includes an adjustable detection mechanism (3) and a buffer control mechanism (4), wherein the adjustable detection mechanism (3) is arranged below the push plate (13), and the buffer control mechanism (4) is arranged above the adjustable detection mechanism (3); The adjustable detection mechanism (3) is used for rapid positioning and detection of integrated circuits; The buffer control mechanism (4) is used for pressure regulation and protection during integrated circuit testing.

2. The test system with rapid fixing function for integrated circuit packaging and testing according to claim 1, characterized in that: The upper surface of the loading platform (12) is also provided with an automatic centering positioning mechanism (2), which is used for positioning and fixing the integrated circuit. The automatic centering positioning mechanism (2) includes a limit plate (21), which is evenly fixedly arranged on the upper surface of the loading platform (12). The loading platform (12) is evenly provided with positioning grooves, and a pressing block (22) is slidably connected in the positioning groove of the loading platform (12). A reset spring (23) is fixedly connected at the bottom of the pressing block (22), and one end of the reset spring (23) away from the pressing block (22) is fixedly connected in the positioning groove of the loading platform (12). A pry plate (24) is installed on the circumference of the bottom of the pressing block (22).

3. The test system with rapid fixing function for integrated circuit packaging and testing according to claim 2, characterized in that: Slide grooves are provided at both ends of the pry plate (24); the bottom of the pressing block (22) is slidably connected to the slide groove provided at one end of the pry plate (24); a fixed block (25) is rotatably connected to the middle of the pry plate (24); the fixed block (25) is fixedly connected to the positioning groove of the loading platform (12) at one end away from the pry plate (24); a positioning elastic clamp (26) is slidably connected to the slide groove at one end of the pry plate (24) away from the pressing block (22); and the bottom of the positioning elastic clamp (26) is slidably connected to the upper surface of the loading platform (12).

4. The test system with rapid fixing function for integrated circuit packaging and testing according to claim 1, characterized in that: The adjustable detection mechanism (3) comprises a punching block (31), the bottom of the push plate (13) is evenly fixedly connected to a control chamber (32), the outer surface of the punching block (31) is slidably connected to the inner wall of the control chamber (32), and the outer surface of the control chamber (32) is symmetrically fixedly connected to a fixing plate (33).

5. The test system with rapid fixing function for integrated circuit packaging and testing according to claim 4, characterized in that: The fixed plate (33) is symmetrically fixedly connected with a sliding shaft (34), the outer surface of the sliding shaft (34) is evenly slidably connected with a test pressure needle (35), the test pressure needle (35) is fixedly connected with an extrusion rod (37), and the outer surface of the punching block (31) is evenly provided with an extrusion groove (36), and the extrusion groove (36) is slidably connected to the extrusion rod (37) at one end away from the test pressure needle (35).

6. The test system with rapid fixing function for integrated circuit packaging and testing according to claim 4, characterized in that: The buffer control mechanism (4) comprises a pressing plate (41), the pressing plate (41) is rotatably connected to the upper surface of the punching block (31), one end of the pressing plate (41) away from the punching block (31) is rotatably connected to a multifunctional buffer slider (42), the upper surface of the multifunctional buffer slider (42) is slidably connected to the inner wall of the control chamber (32), the multifunctional buffer slider (42) is symmetrically arranged on the inner wall of the control chamber (32), and the middle part of the multifunctional buffer slider (42) is slidably connected to a buffer shaft (43).

7. The test system with rapid fixing function for integrated circuit packaging and testing according to claim 6, characterized in that: A buffer spring (45) is sleeved on the outer surface of the middle part of the buffer shaft (43), and both ends of the buffer spring (45) are fixedly connected to the multifunctional buffer slider (42). An arc groove (44) is opened at one end of the buffer shaft (43), and a control plate (46) is slidably connected in the arc groove (44).

8. The test system with rapid fixing function for integrated circuit packaging and testing according to claim 7, characterized in that: The control panel (46) is slidably connected to one end away from the multifunctional buffer slider (42) with a telescopic controller (48), and the telescopic controller (48) is installed on the inner wall of the control compartment (32). The outer surface of the control panel (46) is sleeved with a compression spring (47), one end of the compression spring (47) is fixedly connected to the control panel (46), and the other end of the compression spring (47) is fixedly connected to the telescopic controller (48).

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