Optical interconnection packaging method

Abstract

The invention relates to the technical field of optical communication packaging, in particular to an optical interconnection packaging method. A two-dimensional stacking mode is adopted for the optical fiber waveguide and the single-core optical fiber array to be packaged, the end faces of the optical fiber waveguide and the single-core optical fiber array face the same direction, the section of a port uniformly faces the vertical upper portion, and the position of the port can be directly positioned in an image through a common objective lens imaging system. A complicated high-precision side fiber core identification system is avoided; according to the identified positions of the two ports, designing and using a two-photon 3D printing technology to process an optical polymer connection waveguide between the ports; the whole packaging process is relatively simple to operate, and the cost is saved; moreover, the optical interconnection packaging method provided by the invention is wider in application range.

Description

Technical Field

[0001] The present invention relates to the technical field of optical communication packaging, and more specifically, to an optical interconnect packaging method. Background Art

[0002] Optical interconnect packaging technology is the core supporting technology in the field of optical communication and optical computing. With the rapid development of high-bandwidth applications such as data centers, 5G networks, and artificial intelligence, its importance is becoming increasingly prominent. Optical interconnect uses optical signals as a transmission medium, and has the advantages of high bandwidth, low latency, and resistance to electromagnetic interference, becoming the key to breaking through bottlenecks. However, the realization of optical interconnect technology requires efficient coupling of photonic chips and optical fibers, high-precision packaging processes, and structural compatibility. Modern optical interconnect packaging technology must not only meet the requirements of miniaturization and low cost, but also take into account high performance and high reliability. It is the basic guarantee for realizing future high-speed optical communications and optical computing.

[0003] In the practical application of multi-core optical fibers, multi-core optical fibers need to be coupled and connected with single-core optical fibers, other multi-core optical fibers or optical device chips. However, the cross-section of a multi-core optical fiber is generally a circularly symmetrical figure, and most of the cores are arranged symmetrically, which makes it difficult to identify a single core. The prior art discloses an innovative technology for connecting a photonic chip with an optical fiber or other optical device. By aligning the optical axis of the device to be packaged and placing it flat on a substrate, a high-precision positioning system is used to perform sub-micron alignment of the photonic chip, optical fiber or module to ensure the position accuracy of the input and output interfaces. Using two-photon polymerization processing technology, a free-form optical waveguide is processed between the input and output interfaces. The waveguide has an adjustable curvature and cross-section, and can be optimized according to the mode requirements of the interface. Compared with traditional direct coupling or grating coupling methods, this packaging technology is more flexible and can adapt to non-standard interface coupling requirements between different devices, while avoiding dependence on complex V-grooves or grating structures. In the above scheme, since the optical chip and the optical fiber are both placed flat on the substrate, and the fiber core end face is parallel to the substrate, the optical measurement system cannot directly perform image recognition on the position of the fiber core, and can only determine the position of the fiber side wall from above the substrate, and then use the confocal three-dimensional scanning method to perform accurate three-dimensional imaging of the area near the fiber core end face, so as to actually determine the specific position of the fiber core end face. The whole process is relatively complicated and easily affected by the quality of the confocal imaging system. In particular, for the non-central core in the multi-core optical fiber, the lens refraction effect of the columnar structure of the optical fiber itself on the laser further affects the precise position of the confocal imaging, reduces the coupling accuracy, and increases the packaging loss. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art in that the optical interconnect packaging process is complicated, and to provide an optical interconnect packaging method, which effectively simplifies the packaging steps and is easy to operate.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A method for optical interconnect packaging is provided, comprising the following steps:

[0007] S1. Lay the optical fiber waveguide to be packaged on the upper surface or lower surface of the single-core optical fiber array, and make the end faces of the optical fiber waveguide and the single-core optical fiber array face in the same direction to form a stacked three-dimensional waveguide array structure; and fix the three-dimensional waveguide array structure vertically as a whole, so that the end face faces vertically upward;

[0008] S2. Coating a curing glue at the connection to align the end face of the optical fiber waveguide with the end face of the single-core optical fiber array. After the structures are aligned, irradiating the curing glue to cure the entire structure and obtain a bonded structure;

[0009] S3. Use a clamp to vertically fix the glued structure on the displacement platform of the two-photon polymerization processing system, drip photoresist on the end face of the glued structure, and then move it to the center of the imaging system screen; based on the machine vision algorithm, determine the precise XY coordinates of each port of the optical fiber waveguide and each port of the core of the single-core optical fiber array; control the Z-axis piezoelectric displacement stage to scan the imaging focal plane, respectively determine the optimal imaging heights of the optical fiber waveguide port and the core port of the single-core optical fiber array, and finally obtain the three-dimensional coordinates of the two ports respectively;

[0010] S4. Based on the three-dimensional coordinates obtained in step S2, a polymer connecting waveguide is directly printed on the end face of the glued structure using two-photon 3D printing technology, and the optical fiber waveguide is connected to the single-core optical fiber array through the polymer connecting waveguide;

[0011] S5. After all ports are connected, take out the glued structure and remove the excess photoresist; then drip in the curing glue so that the curing glue covers all polymer connection waveguides, and irradiate the curing glue to cure it.

[0012] An optical interconnect packaging method of the present invention stacks optical fiber waveguides and single-core optical fiber arrays to be packaged in a two-dimensional manner, directs the end faces of the optical fiber waveguides and single-core optical fiber arrays in the same direction, and directs the port cross sections vertically upward. A common objective lens imaging system can be used to directly locate the port position in an image, thereby avoiding a complex and high-precision side fiber core identification system. According to the identified two port positions, an optical polymer connecting waveguide between the ports is designed and processed using two-photon 3D printing technology. The entire packaging process is relatively simple to operate, saving costs. Moreover, the optical interconnect packaging method proposed by the present invention has a wider range of applications.

[0013] Furthermore, the optical fiber waveguide includes an array optical waveguide chip, a multi-core optical fiber or a single-core optical fiber.

[0014] Furthermore, in step S1, when the optical fiber waveguide is an array optical fiber waveguide chip, glue is dispensed on the single-core optical fiber array, and a supporting structure can be printed around the single-core optical fiber array using two-photon 3D printing technology. The array optical fiber waveguide chip is placed on the supporting structure, and then a glue dispensing needle is used to evenly apply ultraviolet curing glue on the seams on both sides to cure and shape the overall structure.

[0015] Furthermore, in step S1, when the optical fiber waveguide is a multi-core optical fiber or a single-core optical fiber, firstly, a femtosecond laser processing system is used to etch a groove on a glass sheet, and a displacement clamping platform is used to clamp the multi-core optical fiber or the single-core optical fiber so that it is placed in the groove of the glass sheet, and the displacement clamping platform is adjusted so that the end face of the multi-core optical fiber or the single-core optical fiber is in the same vertical plane as the side wall of the glass sheet; then, the glass sheet is placed on the upper surface of the single-core optical fiber array, and the side wall of the glass surface is aligned with the end face of the single-core optical fiber array; finally, curing glue is applied in the groove to cure the overall structure. Preferably, the groove structure is a long V-shaped groove.

[0016] Further, in step S4, based on the acquired three-dimensional coordinates (X WG ,Y WG ,Z WG ), the first tapered waveguide is printed at the fiber waveguide port using two-photon 3D printing technology, and then the three-dimensional coordinates (X F ,Y F ,Z F ), a second tapered waveguide is printed at the core port of the single-core optical fiber array using two-photon 3D printing technology, and finally, a connecting waveguide is printed using two-photon 3D printing technology to connect the first tapered waveguide and the second tapered waveguide.

[0017] Furthermore, the lower cross-sectional diameter of the first tapered waveguide matches the mode field size of the optical fiber waveguide, and the mode field of the transmitted light is amplified by the first tapered waveguide; the lower cross-sectional diameter of the second tapered waveguide matches the mode field size of the single-core optical fiber array, and the mode field of the transmitted light is reduced by the second tapered waveguide; the heights of the first tapered waveguide and the second tapered waveguide are equal.

[0018] Furthermore, the connecting waveguide is a U-shaped connecting waveguide with a bending radius of The existing technology is affected by the size of the femtosecond laser scanning writing field, which limits the mode field transition distance and maximum bending radius of the optical connection waveguide, increasing the connection loss. In the optical interconnect packaging method proposed by the present invention, the port cross section is vertically upward, and the optical connection waveguide adopts an inverted U-shaped design, which can be infinitely extended upward, increasing the design freedom.

[0019] Furthermore, the connecting waveguide is a reflecting prism and a cylindrical waveguide with a bevel angle of 45°; in step S4, a reflecting prism with a bevel angle of 45° is 3D printed at the ports of the first tapered waveguide and the second tapered waveguide, respectively, so as to be able to deflect the optical axis by 90° parallel to the end face, and align the emission directions with each other; finally, the 3D printed cylindrical waveguides are respectively connected to the two ends of the two reflecting prisms.

[0020] Furthermore, in step S5, the polymer connection waveguides connected to the ports of each group of optical fiber waveguides to be connected and the core ports of the single-core optical fiber array are printed. After all ports are connected, the bonding structure is taken out and immersed in a developer to remove excess unexposed photoresist. Ultraviolet curing glue is dripped onto the end face of the bonding structure, and the amount of glue is controlled to ensure that the glue layer covers all the polymer connection waveguides. The curing glue is irradiated with an ultraviolet lamp, and is shaped and cured to ensure the stability of the polymer connection waveguide.

[0021] Furthermore, in step S2, the structural alignment includes making the height of the end face of the optical fiber waveguide consistent with the height of the end face of the single-core optical fiber array, so that the two end faces are in the same horizontal plane.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The optical interconnect packaging method proposed in the present invention is based on a three-dimensional stacking structure, which makes the port cross section uniformly face vertically upward. The port position can be directly located in the image using an ordinary objective lens imaging system, without the need for a complex high-precision positioning system, thereby simplifying the process and reducing costs.

[0024] 2. The present invention proposes an optical interconnect packaging method, in which the port cross sections are all vertically upward, and the polymer connection waveguide adopts an inverted U-shaped design, which can be infinitely extended upward, thereby increasing the design freedom.

[0025] 3. The optical interconnect packaging method proposed in the present invention has a wider range of applications. It can directly identify the image of any optical fiber with any core arrangement or special core mode. Compared with the existing technology that can only identify single-mode single-core optical fiber, it has the characteristics of a wide range of applicable scenarios. In terms of application examples, the patent of the present invention can be used to build an automatic coupling packaging system for array optical waveguide chips and single-core optical fiber arrays or single-core optical fiber arrays and multi-core optical fibers. By obtaining the core position of the single-core optical fiber or multi-core optical fiber, the relative position of the cores on both sides is adjusted to achieve optical field coupling between the cores. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the method flow in Example 1;

[0027] Figure 2 is a schematic diagram of the bonding structure in Example 2;

[0028] Figure 3 This is a schematic diagram of processing polymer-connected waveguides in Example 2;

[0029] Figure 4 This is a schematic diagram of UV curing adhesive packaging in Example 2;

[0030] Figure 5 This is a schematic diagram of the bonding structure in Example 3;

[0031] Figure 6 Schematic diagram of processing polymer-connected waveguides in Example 3.

[0032] In the attached figure: 1, single-core optical fiber array; 2, array optical fiber waveguide chip; 3, multi-core optical fiber; 4, glass sheet; 5, fiber core; 6, optical waveguide; 7, groove; 8, second tapered waveguide; 9, first tapered waveguide; 10, U-shaped connecting waveguide; 11, objective lens; 12, cylindrical waveguide. DETAILED DESCRIPTION

[0033] The present invention is further described below in conjunction with specific implementation methods. The accompanying drawings are only used for exemplary descriptions and are only schematic diagrams, not actual drawings, and cannot be understood as limiting this patent; in order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the accompanying drawings may be omitted.

[0034] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0035] Embodiment 1

[0036] This embodiment is a first embodiment of an optical interconnect packaging method, comprising the following steps:

[0037] S1. The optical fiber waveguide to be packaged is bonded to the upper surface or lower surface of the single-core optical fiber array 1, and the end faces of the optical fiber waveguide and the single-core optical fiber array 1 are oriented in the same direction to form a stacked three-dimensional waveguide array structure; and the three-dimensional waveguide array structure is vertically fixed as a whole, so that the end face is vertically upward;

[0038] S2. Coating a curing glue at the connection to align the end face of the optical fiber waveguide with the end face of the single-core optical fiber array 1. After the structure is aligned, irradiating the curing glue to cure the entire structure to obtain a bonding structure;

[0039] S3. Use a clamp to vertically fix the glued structure on the displacement platform of the two-photon polymerization processing system, drip photoresist on the end face of the glued structure, and then move it to the center of the imaging system screen; based on the machine vision algorithm, determine the precise XY coordinates of each port of the optical fiber waveguide and each port of the core 5 of the single-core optical fiber array 1; control the Z-axis piezoelectric displacement stage to scan the imaging focal plane, respectively determine the optimal imaging heights of the optical fiber waveguide port and the core 5 port of the single-core optical fiber array 1, and finally obtain the three-dimensional coordinates of the two ports respectively;

[0040] S4. Based on the three-dimensional coordinates obtained in step S2, a polymer connecting waveguide is directly printed on the end face of the glued structure using two-photon 3D printing technology, and the optical fiber waveguide is connected to the single-core optical fiber array 1 through the polymer connecting waveguide;

[0041] S5. After all ports are connected, take out the glued structure and remove the excess photoresist; then drip in the curing glue so that the curing glue covers all polymer connection waveguides, and irradiate the curing glue to cure it.

[0042] An optical interconnect packaging method of the present invention stacks the optical fiber waveguide and the single-core optical fiber array 1 to be packaged in a two-dimensional manner, directs the end faces of the optical fiber waveguide and the single-core optical fiber array 1 in the same direction, and directs the port cross sections vertically upward. The port position can be directly located in the image using a common objective lens 11 imaging system, thereby avoiding a complex and high-precision side fiber core 5 identification system. According to the two identified port positions, an optical polymer connecting waveguide between the ports is designed and processed using two-photon 3D printing technology. The entire packaging process is relatively simple to operate, saving costs. Moreover, the optical interconnect packaging method proposed by the present invention has a wider range of applications.

[0043] Embodiment 2

[0044] This embodiment is a second embodiment of an optical interconnect packaging method. This embodiment is similar to the first embodiment, except that in this embodiment, the packaging of the array optical waveguide 6 chip and the single-core optical fiber array 1 is taken as an example.

[0045] The following steps are involved:

[0046] Step 1: First, fit the lower surface of the array optical waveguide 6 chip to be packaged with the upper surface of the single-core optical fiber array 1, and use a dispensing needle to evenly apply UV curing glue on the joints on both sides. Clamp the overall structure with tweezers, press the front end on a clean glass sheet 4, so that the end faces of the array optical waveguide 6 chip and the single-core optical fiber array 1 face the same direction, align the height and are consistent in level. After the structure is aligned, use a UV lamp to irradiate the curing glue, so that the overall structure is cured and fixed, and a three-dimensional stacked adhesive structure is obtained.

[0047] Step 2: Use a clamp to vertically fix the glued structure on the displacement platform of the two-photon polymerization processing system. After dripping an appropriate amount of photoresist on the end face of the glued structure, move the glued structure to the center of the imaging system screen. Based on the machine vision algorithm, determine the precise XY coordinates of the port of the array optical waveguide 6 chip and the core 5 port of the single-core optical fiber array 1. Control the Z-axis piezoelectric displacement stage to scan the imaging focal plane, and determine the optimal imaging heights of the port of the array optical waveguide 6 chip and the core 5 port of the single-core optical fiber array 1, and finally obtain the three-dimensional coordinates of the two ports.

[0048] Step 3: Assume that the three-dimensional coordinates of the chip port of the array optical waveguide 6 are (X WG ,Y WG ,Z W G), the three-dimensional coordinates of the core 5 port of the single-core optical fiber array 1 are (X F ,Y F ,Z F ). Using two-photon 3D printing technology, firstly, the first tapered waveguide 9 is processed based on the port coordinates of the array optical waveguide 6 chip. The lower cross-sectional diameter of the first tapered waveguide 9 matches the mode field size of the chip waveguide (generally 2-3um). The mode field of the transmitted light is amplified by 8um through the 60um high first tapered waveguide 9. Then, based on the port coordinates of the core 5 of the single-core optical fiber array 1, the second tapered waveguide 8 is processed. The lower cross-sectional diameter of the second tapered waveguide 8 is 12um to match the mode field diameter of the single-mode core 5. The mode field of the transmitted light is reduced to 8um through the second tapered waveguide 8. The height of the second tapered waveguide 8 is 60um+(Z F –Z WG ), so that the upper cross-sections of the two tapered waveguides are highly consistent. Finally, a U-shaped connecting waveguide 10 is processed to connect the two tapered waveguides, and the bending radius of the connecting waveguide is, and finally the chip port of the array optical waveguide 6 is coupled and connected with the core 5 port of the single-core optical fiber array 1 through a section of an inverted U-shaped connecting waveguide 10.

[0049] Step 4: Repeat step 3 for each group of array optical waveguide 6 chip ports and single-core optical fiber array 1 core 5 ports to be connected. After all ports are connected, take out the glued structure and soak it in developer (PGME and IPA) to remove excess unexposed photoresist. Drop low-refractive-index UV-curing glue on the end face of the glued structure, and control the amount of glue to ensure that the glue layer covers all polymer connection waveguides. Use UV light to cure the glue, and solidify it to ensure the stability of the polymer connection waveguide.

[0050] Embodiment 3

[0051] This embodiment is the third embodiment of an optical interconnect packaging method. This embodiment is similar to the first embodiment, except that this embodiment is a package of a single-core optical fiber array 1 and a multi-core optical fiber 3. Compared with the second embodiment, the multi-core optical fiber 3 itself is in the shape of a thin strip and cannot be directly bonded to the optical fiber array plane, and requires an additional glass substrate with a V-groove for auxiliary fixation.

[0052] The following steps are involved:

[0053] Step 1: Use a femtosecond laser processing system to etch a V-shaped strip groove 7 with a depth of 50 um and an angle of 60° on the surface of a 200 um thick glass sheet 4.

[0054] Step 2: Use a precision translation stage to clamp the multi-core optical fiber 3, and place the multi-core optical fiber 3 in the V-shaped groove 7 of the glass sheet 4 under microscope observation, and adjust the translation stage so that the end face of the multi-core optical fiber 3 is in the same vertical plane as the side wall of the glass sheet 4. Use a dispensing needle to evenly apply UV curing glue in the V-shaped groove 7, and use UV lamp to cure it.

[0055] Step 3: Fit the lower surface of the glass sheet 4 to the upper surface of the single-core optical fiber array 1, and use a dispensing needle to evenly apply UV curing glue on the joints on both sides. Clamp the entire structure with tweezers, and press the front end onto the clean glass sheet 4 to align the end face height of the glass sheet 4 and the single-core optical fiber array 1 and make them level. After the structure is aligned, use a UV lamp to irradiate the curing glue to solidify the entire structure.

[0056] Step 4: Use a fixture to fix the glued structure vertically on the displacement platform of the two-photon polymerization processing system. After dripping an appropriate amount of photoresist on the end face of the glued structure, move it to the center of the imaging system screen. Based on the machine vision algorithm, determine the precise XY coordinates of the single-core fiber array 1 core 5 port and the multi-core fiber 3 core 5 port. Control the Z-axis piezoelectric displacement stage to scan the imaging focal plane, respectively, and obtain the optimal imaging height of the ports on both sides, and finally obtain their three-dimensional coordinates.

[0057] Step 5: Assume that the three-dimensional coordinates of the port 5 of the core 1 of the single-core optical fiber array are (X FA ,Y FA ,ZFA ), the three-dimensional coordinates of the core 5 port of the multi-core optical fiber 3 are (X MCF ,Y MCF ,Z MCF ). Using two-photon 3D printing technology, firstly, the first tapered waveguide 9 is processed based on the coordinates of the core 5 port of the single-core optical fiber array 1. The lower cross-sectional diameter of the first tapered waveguide 9 is 12um to match the mode field diameter of the single-mode optical fiber core 5. The mode field of the transmitted light is reduced to 8um through the 60um high first tapered waveguide 9. Then, based on the coordinates of the core 5 port of the multi-core optical fiber 3, the second tapered waveguide 8 is processed. The lower cross-sectional diameter of the second tapered waveguide 8 is also 12um. The mode field of the transmitted light is reduced to 8um through the second tapered waveguide 8. The height of the second tapered waveguide 8 is 60um+(Z MCF -Z FA ), so that the upper cross-sections of the two tapered waveguides are highly consistent. A reflecting prism with a bevel angle of 45° is processed at the ports of the two tapered waveguides respectively, the optical axis is deflected 90° parallel to the end face, and the emission directions are aligned with each other. Finally, a cylindrical waveguide 12 with a diameter of 8um is processed to connect the first tapered waveguide 9 and the second tapered waveguide 8 at both ends.

[0058] Step 6: Repeat step 5 for each group of core 5 ports of single-core fiber array 1 and core 5 ports of multi-core fiber 3 to be connected. After all ports are connected, take out the glued structure and soak it in PGME and IPA developer to remove the excess unexposed photoresist. Drop low-refractive index UV curing glue on the end face of the glued structure, and control the amount of glue to ensure that the glue layer covers all polymer connection waveguides. Use UV lamp to cure the glue, and solidify it to ensure the stability of the connection waveguide.

[0059] In the specific contents of the above-mentioned specific implementation methods, the various technical features can be combined in any non-contradictory manner. In order to make the description concise, not all possible combinations of the above-mentioned technical features are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. An optical interconnect packaging method, characterized in that: The following steps are involved: S1. Lay the optical fiber waveguide to be packaged on the upper surface or lower surface of the single-core optical fiber array, and make the end faces of the optical fiber waveguide and the single-core optical fiber array face in the same direction to form a stacked three-dimensional waveguide array structure; and fix the three-dimensional waveguide array structure vertically as a whole, so that the end face faces vertically upward; S2. Coating a curing glue at the connection to align the end face of the optical fiber waveguide with the end face of the single-core optical fiber array. After the structures are aligned, irradiating the curing glue to cure the entire structure to obtain a bonded structure; S3. Use a clamp to vertically fix the glued structure on the displacement platform of the two-photon polymerization processing system, drip photoresist on the end face of the glued structure, and then move it to the center of the imaging system screen; based on the machine vision algorithm, determine the precise XY coordinates of each port of the optical fiber waveguide and each port of the core of the single-core optical fiber array; control the Z-axis piezoelectric displacement stage to scan the imaging focal plane, respectively determine the optimal imaging heights of the optical fiber waveguide port and the core port of the single-core optical fiber array, and finally obtain the three-dimensional coordinates of the two ports respectively; S4. Based on the three-dimensional coordinates obtained in step S2, a polymer connecting waveguide is directly printed on the end face of the glued structure using two-photon 3D printing technology, and the optical fiber waveguide is connected to the single-core optical fiber array through the polymer connecting waveguide; S5. After all ports are connected, take out the glued structure and remove the excess photoresist; then drip in the curing glue so that the curing glue covers all polymer connection waveguides, and irradiate the curing glue to cure it.

2. The optical interconnect packaging method according to claim 1, characterized in that: The optical fiber waveguide includes an array optical waveguide chip, a multi-core optical fiber or a single-core optical fiber.

3. The optical interconnect packaging method according to claim 2, characterized in that: In step S1, when the optical fiber waveguide is an array optical fiber waveguide chip, glue is dispensed on the array optical fiber waveguide chip, and a support structure is printed around the array optical fiber waveguide chip using two-photon 3D printing technology. The single-core optical fiber array is placed on the support structure, and then a glue dispensing needle is used to evenly apply ultraviolet curing glue on the seams on both sides to cure and shape the overall structure.

4. The optical interconnect packaging method according to claim 2, characterized in that: In step S1, when the optical fiber waveguide is a multi-core optical fiber or a single-core optical fiber, firstly, a femtosecond laser processing system is used to etch a groove on a glass sheet, and a displacement clamping platform is used to clamp the multi-core optical fiber or the single-core optical fiber so that it is placed in the groove of the glass sheet. The displacement clamping platform is adjusted so that the end face of the multi-core optical fiber or the single-core optical fiber is in the same vertical plane as the side wall of the glass sheet; then, the glass sheet is placed on the upper surface of the single-core optical fiber array, and the side wall of the glass surface is aligned with the end face of the single-core optical fiber array; finally, a curing glue is applied in the groove to cure the overall structure.

5. The optical interconnect packaging method according to claim 3, characterized in that: In step S4, based on the acquired three-dimensional coordinates (X WG ,Y WG ,Z WG ), the first tapered waveguide is printed at the fiber waveguide port using two-photon 3D printing technology, and then the three-dimensional coordinates (X F ,Y F ,Z F ), a second tapered waveguide is printed at the core port of the single-core optical fiber array using two-photon 3D printing technology, and finally, a connecting waveguide is printed using two-photon 3D printing technology to connect the first tapered waveguide and the second tapered waveguide.

6. The optical interconnect packaging method according to claim 5, characterized in that: The lower cross-sectional diameter of the first tapered waveguide matches the mode field size of the optical fiber waveguide, and the mode field of the transmitted light is amplified by the first tapered waveguide; the lower cross-sectional diameter of the second tapered waveguide matches the mode field size of the single-core optical fiber array, and the mode field of the transmitted light is reduced by the second tapered waveguide; the first tapered waveguide and the second tapered waveguide have the same height.

7. The optical interconnect packaging method according to claim 6, characterized in that: The connecting waveguide is a U-shaped connecting waveguide with a bending radius of 8. The optical interconnect packaging method according to claim 7, characterized in that: The connecting waveguide includes a reflecting prism with a bevel angle of 45° and a cylindrical waveguide; in step S4, a reflecting prism with a bevel angle of 45° is 3D printed at the ports of the first tapered waveguide and the second tapered waveguide, respectively, so as to deflect the optical axis by 90° parallel to the end face, and align the emission directions with each other; finally, the 3D printed cylindrical waveguides are respectively connected to the two ends of the two reflecting prisms.

9. The optical interconnect packaging method according to any one of claims 1 to 8, characterized in that: In step S5, a polymer connecting waveguide is printed and connected to the ports of each group of optical fiber waveguides to be connected and the core ports of the single-core optical fiber array. After all ports are connected, the bonding structure is taken out and immersed in a developer to remove excess unexposed photoresist. Ultraviolet curing glue is dripped onto the end face of the bonding structure, and the amount of glue is controlled to ensure that the glue layer covers all polymer connecting waveguides. The curing glue is irradiated with an ultraviolet lamp, and is shaped and cured to ensure the stability of the polymer connecting waveguide.

10. The optical interconnect packaging method according to any one of claims 1 to 8, characterized in that: In step S2, the structural alignment includes making the height of the end face of the optical fiber waveguide consistent with the height of the end face of the single-core optical fiber array, so that the two end faces are in the same horizontal plane.

Images