Wafer film pasting equipment and wafer film pasting method

Abstract

The embodiment of the invention provides wafer film pasting equipment and a wafer film pasting method, and the equipment comprises an equipment pedestal which is used for fixing a to-be-coated wafer and placing a steel ring with a DDAF film; the positioning device is arranged on the equipment base and is used for moving the position of the steel ring to a fixed position, so that the circle center of the steel ring is aligned with the circle center of the wafer to be coated with the film; the positioning device comprises a fixing structure and a positioning structure, wherein the fixing structure is fixed at the edge position of one side of the equipment base; the moving structure is arranged at the edge position of the other side, opposite to the fixed structure, of the equipment base, and in the direction pointing to the circle center of the wafer to be coated, the moving structure pushes the steel ring to the fixed structure so that the steel ring can be located at the fixed position; and the circle center of the fixed position is the same as the circle center of the film-coated wafer. Therefore, the concentricity of the wafer to be coated and the circle center of the steel ring can be improved, and the quality of the coating process is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor technology, and specifically to a wafer film attaching device and a wafer film attaching method. Background Art

[0002] In semiconductor manufacturing, the vacuum lamination process is to attach the Dicing Die Attach Film (DDAF film) to the wafer to facilitate wafer cutting and packaging. In the vacuum lamination process, the quality of the coating process affects the success rate of the cutting equipment, and further affects the smooth execution of the entire vacuum lamination process. Therefore, how to improve the quality of the coating process has become a problem that needs to be solved urgently by technicians in this field. Summary of the invention

[0003] In view of this, the present application provides a wafer film attaching device and a wafer film attaching method to improve the quality of the coating process.

[0004] The wafer film attaching equipment provided in this application includes:

[0005] The equipment base is used to carry the wafer to be coated and place the steel ring with DDAF film;

[0006] A positioning device, arranged on the equipment base, used to move the position of the steel ring to a fixed position so that the center of the steel ring is aligned with the center of the wafer to be coated;

[0007] The positioning device comprises: a fixed structure fixed at an edge position of one side of the equipment base; a movable structure arranged at an edge position of another side of the equipment base opposite to the fixed structure, and the movable structure pushes the steel ring to the fixed structure in a direction pointing to the center of the wafer to be coated, so that the steel ring is located at the fixed position;

[0008] The center of the fixed position is the same as the center of the coated wafer.

[0009] Optionally, the number of the fixed structure and the movable structure is at least 2.

[0010] Optionally, the fixed structure and the movable structure are distributed around the steel ring.

[0011] Optionally, the positioning device further includes: a moving structure fixing block, which has a track along a direction pointing to the center of the wafer to be coated, and the moving structure is arranged in the track.

[0012] Optionally, one end of the track close to the outer contour of the wafer to be coated fits with the outer contour of the circular structure.

[0013] Optionally, the fixing structure is a positioning pin; and a groove is provided on the outer contour of the steel ring, corresponding to the fixing position.

[0014] Optionally, the positioning device further includes: a fixed structure setting platform, which is arranged at an edge position of one side of the device base and is used to support the fixed structure.

[0015] Optionally, it also includes: a pressure detection state device, used to detect the pressure between the moving structure and the steel ring.

[0016] Optionally, a center detection device is used to detect whether the center of the steel ring is aligned with the center of the wafer to be coated, and control the motor of the moving structure;

[0017] A signal transmission unit, arranged in the circle center detection device;

[0018] A signal receiving unit is arranged on the motor for controlling the moving structure.

[0019] The embodiment of the present application further provides a wafer film attaching method, which is applied to the wafer film attaching device as described in any of the above embodiments, comprising:

[0020] Providing an equipment base, the equipment base carries the wafer to be coated and places a steel ring with a DDAF film;

[0021] Moving the moving structure of the positioning device in a direction pointing to the center of the wafer to be coated, pushing the steel ring to the fixed structure of the positioning device, so that the steel ring is located at a fixed position;

[0022] The center of the circle of the fixed position is the same as the center of the circle of the wafer to be coated.

[0023] The wafer grinding equipment provided in the embodiment of the present application includes: an equipment base, used to carry the wafer to be coated and place a steel ring with a DDAF film; a positioning device, arranged on the equipment base, used to move the position of the steel ring to a fixed position so that the center of the steel ring is aligned with the center of the wafer to be coated; the positioning device includes: a fixed structure, fixed at an edge position on one side of the fixed position; a moving structure, arranged at an edge position on the other side of the fixed position opposite to the fixed structure, and the moving structure pushes the steel ring to the fixed structure in a direction pointing to the center of the wafer to be coated, so that the steel ring is located at the fixed position; the center of the fixed position is the same as the center of the coated wafer.

[0024] In this way, by controlling the position of the steel ring with the DDAF film through a mechanical positioning device, the positioning device can be used to control the steel ring to be placed at the fixed position each time the steel ring works. And since the center of the circle at the fixed position is the same as the center of the circle of the wafer to be coated. Furthermore, when the position of the steel ring is in a fixed position each time it works, it can be ensured that the center of the circle of the steel ring is aligned with the center of the circle of the wafer to be coated each time it works, thereby avoiding the problem of reduced concentricity caused by the position offset of the steel ring during the movement process. The concentricity of the steel ring and the wafer to be coated is positively correlated with the quality of the coating process. Therefore, improving the concentricity of the steel ring and the wafer to be coated can improve the quality of the coating process, thereby avoiding wafer breakage during the process of cutting the bare die and improving the overall success rate of the vacuum coating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0026] Figure 1 It is a schematic diagram of the structure of a wafer film bonding device;

[0027] Figure 2 It is a partial structural schematic diagram of a wafer film bonding device;

[0028] Figure 3 is a schematic structural diagram of a wafer film attaching device provided by an embodiment of the present invention;

[0029] Figure 4 It is a schematic flow chart of a wafer film attaching method provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] The DDAF film is attached to the back of the wafer to support the wafer and prevent it from breaking or being damaged during the cutting process. The DDAF film is used to provide stable support so that the wafer can be accurately cut into independent dies. During the vacuum lamination process, the concentricity of the wafer and the steel ring that carries the DDAF film has a great influence on the quality of the coating process. If the concentricity of the wafer and the steel ring is poor, the DDAF film and the wafer cannot be aligned, which may cause position deviation during the cutting process, affect the cutting accuracy, and cause wafer breakage. And if the concentricity of the DDAF film and the wafer is poor, the bonding force may be uneven when the cut chip is bonded to the packaging substrate, resulting in insufficient bonding material on the edges of some chips, thereby affecting the stability and performance of the package.

[0032] The DDAF film is attached to the back of the wafer to support the wafer and prevent it from breaking or being damaged during the cutting process. The DDAF film is used to provide stable support so that the wafer can be accurately cut into independent dies. During the vacuum lamination process, the concentricity of the wafer and the steel ring that carries the DDAF film has a great influence on the quality of the coating process. If the concentricity of the wafer and the steel ring is poor, the DDAF film and the wafer cannot be aligned, which may cause position deviation during the cutting process, affect the cutting accuracy, and cause wafer breakage. And if the concentricity of the DDAF film and the wafer is poor, the bonding force may be uneven when the cut chip is bonded to the packaging substrate, resulting in insufficient bonding material on the edges of some chips, thereby affecting the stability and performance of the package.

[0033] A wafer film attaching device, such as Figure 1 As shown in the figure, the working process of the wafer film attaching equipment is as follows: the wafer film attaching equipment first accurately positions the steel ring for carrying the DDAF film at ①, then transfers the steel ring to ③ through the robot arm at ②, and attaches the DDAF film to the steel ring, and then the steel ring carrying the DDAF film is transferred to ⑤ through the robot arm at ④, and then transferred to the first film attaching position CH1 or the second film attaching position CH2 by the robot arm at ⑤ for vacuum film attaching. Among them, the wafers to be coated have been fixed in advance at CH1 and CH2.

[0034] It can be seen that after the wafer laminating equipment accurately positions the steel ring at ①, it needs to go through three robotic arms at ②, ④ and ⑤ for repeated transmission. Furthermore, multiple transmissions by the robotic arm will cause the steel ring to have a large position offset error when it is finally placed at CH1 or CH2. Since the wafer to be coated has been fixed at CH1 or CH2 in advance, the position offset error of the steel ring will affect the concentricity between the wafer to be coated and the center of the steel ring.

[0035] In addition, since the movement of the robot arm at ④ is controlled by the limit block, the limit block will wear and age over a long period of time, resulting in a decrease in the operating accuracy of the robot arm at ④, which will in turn cause the steel ring to be offset when it is finally placed at CH1 or CH2, affecting the concentricity between the wafer to be coated and the center of the steel ring. Figure 2 As shown, it can be found that the equipment base at CH1 or CH2 does not have a positioning structure to ensure that the steel ring is aligned with the center of the wafer to be coated.

[0036] To solve the above problems, the embodiment of the present application provides a wafer film attaching device, which adds a physical structure to the device base of the wafer film attaching device to fix the position of the steel ring moved to the device base, so as to accurately align the center of the wafer and the steel ring. As an optional implementation, Figure 3 FIG. 1 shows a partial structural schematic diagram of a wafer film attaching device provided in an embodiment of the present application. Figure 3 As shown, the wafer bonding equipment provided in the embodiment of the present application includes the following structure.

[0037] The equipment base 100 is used to carry the wafer 110 to be coated and place the steel ring 130 with the DDAF film 120 .

[0038] It should be noted that the device base 100 is as follows Figure 1 The base is provided at CH1 or CH2 for carrying the wafer 110 to be coated and applying the film. After the wafer 110 to be coated and the steel ring 130 with the DDAF film 120 are fixed on the equipment base 100, the wafer film application equipment can be regarded as aligning the center of the wafer 110 to be coated and the steel ring 130. Only then can the wafer 110 to be coated be applied with the film.

[0039] Please continue to refer to Figure 3 The wafer laminating equipment provided in the embodiment of the present application also includes: a positioning device 200, which is arranged on the equipment base 100, and is used to move the position of the steel ring 130 to a fixed position so that the center of the steel ring 130 is aligned with the center of the wafer 110 to be coated.

[0040] Specifically, the positioning device 200 includes: a fixed structure 210, fixed at an edge position on one side of the equipment base 100; a movable structure 220, arranged at an edge position on the other side of the equipment base 100 opposite to the fixed structure 210, and the movable structure 220 pushes the steel ring 130 to the fixed structure 210 in the direction pointing to the center of the wafer 110 to be coated, so that the steel ring 130 is located at the fixed position.

[0041] The fixed position is the position where the steel ring 130 should be when the center of the wafer 110 to be coated is aligned with the center of the steel ring 130. The fixed position is an area whose center is the same as the center of the wafer 110 to be coated, so that when the steel ring 130 is moved to the fixed position, the center of the steel ring 130 can be aligned with the center of the wafer 110 to be coated, thereby improving concentricity.

[0042] In this way, by controlling the position of the steel ring with the DDAF film through a mechanical positioning device, the positioning device can be used to control the steel ring to be placed at the fixed position each time the steel ring works. And since the center of the circle at the fixed position is the same as the center of the circle of the wafer to be coated. Furthermore, when the position of the steel ring is in a fixed position each time it works, it can be ensured that the center of the circle of the steel ring is aligned with the center of the circle of the wafer to be coated each time it works, thereby avoiding the problem of reduced concentricity caused by the position offset of the steel ring during the movement process. The concentricity of the steel ring and the wafer to be coated is positively correlated with the quality of the coating process. Therefore, improving the concentricity of the steel ring and the wafer to be coated can improve the quality of the coating process, thereby avoiding wafer breakage during the process of cutting the bare die and improving the overall success rate of the vacuum coating process.

[0043] Further, in an optional implementation, the number of the fixed structure and the mobile structure is at least 2. It should be noted that the steel ring 130 and the wafer to be coated 110 are both circular, so at least 3 positioning devices 200 are required to fix the steel ring 130. Since the fixed structure 210 and the mobile structure 220 are arranged in pairs. Therefore, at least two pairs of the fixed structure 210 and the mobile structure 220 are required to meet the number requirement of the positioning device 200.

[0044] Furthermore, in an optional implementation, the fixed structure 210 and the movable structure 220 are distributed around the steel ring. In this way, the steel ring 130 can be fixed more stably, so as to align the wafer to be coated 110 with the center of the steel ring 130 .

[0045] Furthermore, in an optional implementation, the positioning device 200 also includes: a fixed structure setting platform 211, which is arranged at the edge of one side of the device base 100 and is used to carry the fixed structure 210. It should be noted that if the edge of the steel ring 130 is too close to the edge of the device base 100, or the fixed structure 210 is an additional structure added to the device base 100, the fixed structure 210 may not be stably set between the edge of the steel ring 130 and the edge of the device base 100. Therefore, it is necessary to set an outwardly extending fixed structure setting platform 211 on the device base 100 to carry the fixed structure 210. In this way, the fixed structure 210 can be ensured to be stable and the steel ring 130 can be aligned with the center of the wafer 110 to be coated.

[0046] Furthermore, in an optional implementation, the fixing structure 210 is a positioning pin; the outer contour of the steel ring 130 is provided with a groove corresponding to the fixing position. Figure 3 As shown, the outer contour of the steel ring 130 has a triangular groove, and when the fixing structure 210 is a positioning pin, the fixing structure 210 is arranged in the triangular groove to clamp the steel ring 130 to fix the steel ring 130 in the fixed position. Accordingly, in an optional implementation, the moving structure 220 is a moving pin.

[0047] Further, such as Figure 3 As shown, in an optional implementation, the movable structure 220 further includes: a movable structure fixing block 221 , which is provided with a track 222 along a direction pointing to the center of the wafer 110 to be coated, and the movable structure 221 is arranged in the track 222 .

[0048] It should be noted that the track 222 is as follows Figure 3 As shown, the track 222 is used to control the moving structure 220 to move along a straight line, and the track 222 points to the center of the wafer to be coated 110. Since the moving structure 220 runs in the track 222, when the moving structure 220 runs to the track 222 close to one end of the wafer to be coated 110, the moving structure 220 can push the steel ring 130 to a fixed position.

[0049] Furthermore, in an optional implementation, one end of the track 222 close to the outer contour of the wafer 110 to be coated fits with the outer contour of the fixed position.

[0050] It should be noted that the position where the fixing structure 210 is set is the position of the outer contour of the steel ring 130 when the steel ring 130 is located at the fixing position. Therefore, the track 222 is close to one end of the steel ring 130, that is, it is set at the outer contour of the steel ring 130 when the steel ring 130 is located at the fixing position.

[0051] In order to improve the alignment efficiency of the steel ring 130 and the center of the wafer 110 to be coated, we hope to directly achieve the alignment effect of the steel ring 130 and the center of the wafer 110 to be coated through specific steps, thereby reducing the steps of center detection to improve efficiency.

[0052] Furthermore, since the setting position of the fixed structure 210 is fixed and cannot be moved, the position of the steel ring 130 is determined by the movable structure 220. Furthermore, we hope that the movable structure 220 is located at an ideal position when the movement is completed. The ideal position is when the movable structure 220 moves to the end of the track 222 close to the outer contour of the steel ring 130, which can ensure that the steel ring 130 is pushed to a fixed position. Therefore, when the end of the track 222 close to the wafer to be coated 110 is located at the fixed position, it can ensure that the wafer to be coated 110 and the center of the steel ring 130 are aligned.

[0053] Furthermore, in an optional implementation, it also includes: a center detection device, used to detect whether the center of the steel ring 130 is aligned with the center of the wafer to be coated 110, and control the motor that drives the moving structure 220; a signal transmission unit, which is arranged in the center detection device; a signal receiving unit, which is arranged in the motor that controls the moving structure.

[0054] It should be noted that if the position of one end of the track 222 is not the ideal position, it is necessary to detect whether the center of the wafer to be coated 110 is aligned with the center of the steel ring 130. Therefore, it is necessary to additionally set up the center detection device for detection. In an optional implementation, the center detection device can be an optical detection device.

[0055] Furthermore, after detecting whether the center of the steel ring 130 is aligned with the center of the wafer to be coated 110, the center detection device needs to control the motor driving the moving structure 220 to move according to the detection result, so that the center of the steel ring 130 is aligned with the center of the wafer to be coated 110. Accordingly, a signal transmission unit and a signal receiving unit need to be respectively provided on the center detection device and the motor for signal interaction.

[0056] Furthermore, in an optional implementation, it also includes: a pressure detection state device for detecting the pressure between the moving structure and the steel ring.

[0057] It should be noted that if the position of one end of the track 222 is not the ideal position, the excessive movement of the moving structure 220 may squeeze the wafer to be coated 110 or the steel ring 130, thereby causing the center of the wafer to be coated 110 or the steel ring 130 to be unable to align, or affecting the air tightness of the equipment during the coating process, resulting in film failure. Therefore, by setting a pressure detection state device, it is possible to prevent the moving structure 220 from excessively squeezing the wafer to be coated 110 or the steel ring 130.

[0058] The embodiment of the present application also provides a wafer film attaching method, which is applied to the wafer film attaching device as described above, by adding a physical structure on the device base of the wafer film attaching device to move the steel ring position to the fixed position of the device base, so as to accurately align the center of the wafer and the steel ring. As an optional implementation, Figure 4 A schematic diagram of a process of a wafer film attaching method provided by an embodiment of the present application is shown. Figure 4 As shown, the wafer bonding method provided in the embodiment of the present application includes the following steps.

[0059] Step S10: providing an equipment base, wherein the equipment base carries the wafer to be coated and places a steel ring with a DDAF film.

[0060] Before placing the steel ring on the equipment base, the wafer to be coated is loaded onto the equipment base.

[0061] Step S20: moving the moving structure of the positioning device in a direction pointing to the center of the wafer to be coated, and pushing the steel ring to the fixed structure of the positioning device, so that the steel ring is located at a fixed position.

[0062] The moving structure is moved until the pressure between the moving structure and the steel ring reaches a preset value.

[0063] After the steel ring and the wafer to be coated are aligned, the film can be applied. Please continue to refer to Figure 4 .

[0064] like Figure 4 As shown, the method may also include:

[0065] Step S30: applying film to the wafer to be coated.

[0066] In this way, by controlling the position of the steel ring with the DDAF film through a mechanical positioning device, the positioning device can be used to control the steel ring to be placed at the fixed position each time the steel ring works. And since the center of the circle at the fixed position is the same as the center of the circle of the wafer to be coated. Furthermore, when the position of the steel ring is in a fixed position each time it works, it can be ensured that the center of the circle of the steel ring is aligned with the center of the circle of the wafer to be coated each time it works, thereby avoiding the problem of reduced concentricity caused by the position offset of the steel ring during the movement process. The concentricity of the steel ring and the wafer to be coated is positively correlated with the quality of the coating process. Therefore, improving the concentricity of the steel ring and the wafer to be coated can improve the quality of the coating process, thereby avoiding wafer breakage during the process of cutting the bare die and improving the overall success rate of the vacuum coating process.

[0067] Furthermore, in an optional implementation, the wafer film bonding method provided by the embodiment of the present application also includes: detecting whether the center of the steel ring is aligned with the center of the wafer to be coated, and if not, continuing to move the movable structure; and detecting whether the pressure between the movable pin and the steel ring meets the requirements, and if it reaches a preset value, stopping moving the movable structure.

[0068] It should be noted that if the position of one end of the track is not an ideal position, it is necessary to detect whether the wafer to be coated is aligned with the center of the steel ring. At the same time, if the moving structure moves excessively, it may squeeze the wafer to be coated or the steel ring, thereby causing the wafer to be coated or the center of the steel ring to be unable to be aligned, or affecting the air tightness of the equipment during the coating process, resulting in film failure. Therefore, by setting a pressure detection state device, it is possible to prevent the moving structure from excessively squeezing the wafer to be coated or the steel ring. The preset value of the pressure is the maximum pressure value that the steel ring can withstand.

[0069] The above describes multiple implementation schemes provided by the embodiments of the present invention. The various optional methods introduced in the implementation schemes can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible implementation schemes, which can all be considered as implementation schemes disclosed and open in the embodiments of the present invention.

[0070] Although the embodiments of the present invention are disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A wafer film attaching device, characterized in that: include: The equipment base is used to carry the wafer to be coated and place the steel ring with DDAF film; A positioning device, arranged on the equipment base, used to move the position of the steel ring to a fixed position so that the center of the steel ring is aligned with the center of the wafer to be coated; The positioning device includes: a fixing structure fixed at an edge position of one side of the equipment base; A movable structure is arranged at the edge of the other side of the equipment base opposite to the fixed structure, and the movable structure pushes the steel ring to the fixed structure in the direction pointing to the center of the wafer to be coated, so that the steel ring is located at the fixed position; The center of the fixed position is the same as the center of the coated wafer.

2. The wafer film attaching equipment according to claim 1, characterized in that: The number of the fixed structure and the movable structure is at least 2.

3. The wafer film attaching equipment according to claim 1, characterized in that: The fixed structure and the movable structure are distributed around the steel ring.

4. The wafer film attaching equipment according to claim 1, characterized in that: The positioning device further includes: a moving structure fixing block, which has a track along a direction pointing to the center of the wafer to be coated, and the moving structure is arranged in the track.

5. The wafer film attaching equipment according to claim 4, characterized in that: One end of the track close to the outer contour of the wafer to be coated fits with the outer contour of the fixed position.

6. The wafer film attaching equipment according to claim 1, characterized in that: The fixing structure is a positioning pin; the outer contour of the steel ring is provided with a groove corresponding to the fixing position.

7. The wafer film attaching equipment according to claim 1, characterized in that: The positioning device also includes: a fixed structure setting platform, which is arranged at an edge position of one side of the equipment base and is used to support the fixed structure.

8. The wafer film attaching equipment according to claim 1, characterized in that: Also includes: The pressure detection state device is used to detect the pressure between the moving structure and the steel ring.

9. The wafer film attaching equipment according to claim 1, characterized in that: Also includes: A circle center detection device, used to detect whether the circle center of the steel ring is aligned with the circle center of the wafer to be coated, and to control the motor of the moving structure; A signal transmission unit, arranged in the circle center detection device; A signal receiving unit is arranged on the motor for controlling the moving structure.

10. A wafer film attaching method, applied to the wafer film attaching device as claimed in any one of claims 1 to 9, characterized in that: include: Providing an equipment base, the equipment base carries the wafer to be coated and places a steel ring with a DDAF film; Moving the moving structure of the positioning device in a direction pointing to the center of the wafer to be coated, pushing the steel ring to the fixed structure of the positioning device, so that the steel ring is located at a fixed position; The center of the fixed position is the same as the center of the wafer to be coated.

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