Miniature ultrathin one-way high-junction-temperature alternating current-direct current conversion device for electronic product

Abstract

The invention belongs to the technical field of miniature ultrathin one-way high-junction-temperature alternating current-direct current conversion devices, and particularly relates to a miniature ultrathin one-way high-junction-temperature alternating current-direct current conversion device for an electronic product, which comprises four rectification chips forming a rectifier bridge circuit, an upper material sheet unit, a lower material sheet unit and a packaging body, the rectification chip is arranged between the upper material sheet unit and the lower material sheet unit, the upper material sheet unit and the lower material sheet unit are oppositely arranged, and the cross section of the upper material sheet unit and the cross section of the lower material sheet unit are Z-shaped; each of the upper material sheet unit and the lower material sheet unit comprises two leading-out terminals, and the lower surfaces of the leading-out terminals are coplanar with the bottom surface of the packaging body; according to the miniature ultrathin one-way high-junction-temperature alternating-current and direct-current conversion device for the electronic product, the warps are arranged on the flat bonding pad, material piece atoms are artificially created for crystal orientation arrangement, welding is more perfect in the welding process of the material pieces and the chip due to the crystal orientation effect of the two materials, the welding reject ratio is reduced, the product reliability is improved, and the product quality is improved. Cost is reduced and resources are saved.

Description

Technical Field

[0001] The invention belongs to the technical field of miniature ultra-thin unidirectional high junction temperature AC / DC conversion devices, and in particular relates to miniature ultra-thin unidirectional high junction temperature AC / DC conversion devices for electronic products. Background Art

[0002] With the rapid development of science and technology, the popularization of electronic modernization of products and market demand, while pursuing practicality, society pays more attention to product reliability and low cost. At present, most micro-rectifier bridge devices are still in the traditional pre-welding process state. According to the existing rectifier bridge structure, the welding defect rate is high and the product yield rate is low, which increases the cost, reduces the reliability of the product and wastes resources. The existing processes all use pre-welding and re-welding, secondary welding, which is inefficient, wastes personnel, and has unstable quality; at the same time, manual operation requires shaking with a suction cup, causing collisions between chips, damaging the chips, reducing the yield rate, increasing potential defects, and reducing reliability; manual operation is prone to missing chips, and tweezers are needed to pick them up, which is very likely to cause chip damage, reducing the yield rate and reliability; secondary welding also damages the chip itself, increases the failure rate of the chip, and reduces the yield rate and reliability of the product. This phenomenon has become a problem that needs to be solved urgently by people in this field. Summary of the invention

[0003] The purpose of the present invention is to provide a miniature ultra-thin unidirectional high junction temperature AC / DC converter device for electronic products to solve the problems raised in the above background technology.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: a miniature ultra-thin unidirectional high junction temperature AC / DC conversion device for electronic products, comprising four rectifier chips constituting a rectifier bridge circuit, an upper sheet unit, a lower sheet unit and a package body, wherein the rectifier chip is arranged between the upper sheet unit and the lower sheet unit, the upper sheet unit and the lower sheet unit are arranged relatively to each other, and the cross section is in a "Z" shape; the upper sheet unit and the lower sheet unit each include two lead terminals, and the lower surface of the lead terminal is coplanar with the bottom surface of the package body; the upper sheet unit and the lower sheet unit are both provided with a flat pad and a convex pad with a convex point, the flat pad is provided with a warp line that promotes the combination of the upper and lower sheet units with the rectifier chip, and by artificially creating the sheet atomic arrangement crystal direction, the upper sheet unit is provided with a first pad structure and a second pad structure, the first pad structure and the second The pad structures are all in a "Z" shape, the first pad structure includes two flat pads, and a first connecting member is arranged between the two flat pads; the second pad structure includes two convex pads, and a second connecting member is arranged between the two convex pads; a third pad structure and a fourth pad structure are arranged on the lower sheet unit, and the third pad structure and the fourth pad structure are arranged in parallel, and the third pad structure and the fourth pad structure are both dumbbell-shaped, and each includes a flat pad and a convex pad, and the third pad structure also includes a third connecting member, and the flat pad, the third connecting member and the convex pad are connected in sequence and connected to the lead-out terminal, and the fourth pad structure also includes a fourth connecting member, and the convex pad, the fourth connecting member and the flat pad are connected in sequence and connected to the lead-out terminal, the upper sheet unit outside the package body forms an output terminal, and the lower sheet unit outside the package body forms an input terminal.

[0005] The present invention further illustrates that the production process of the micro ultra-thin unidirectional high junction temperature AC / DC converter device specifically includes the following steps:

[0006] S1, positioning a lower sheet including a plurality of lower sheet units connected by ribs on graphite to form a graphite mold;

[0007] S2. Adjust the dispensing position accuracy and glue amount, start the dispensing switch to dispense glue to the flat pad and the convex pad, and take out the dispensing graphite mold after completion;

[0008] S3, place the graphite mold with glue dispensed on the die bonding machine, then use the suction cup to place the chip at the position to be bonded, start the die bonding machine, and complete the die bonding;

[0009] S4, placing a material loading sheet including a plurality of material loading units on a suction cup for dispensing glue on the material sheet, and placing the suction cup on a glue dispensing machine for dispensing glue;

[0010] S5, then put the glued loading sheet back onto the graphite mold with solid crystal;

[0011] S6. Place in a welding furnace for welding, then inspect, clean and dry;

[0012] S7, encapsulate each welded rectifier bridge unit with plastic packaging material, put it on a press to achieve the required appearance;

[0013] S8, cutting off the ribs connecting each rectifier bridge unit, and then tinning the four lead terminals;

[0014] S9. Get the product.

[0015] The present invention further illustrates that the welding furnace in step S6 includes a motor and a welding gun;

[0016] A gas pressure chamber is fixed at the top of the welding chamber, a welding head is slidably connected to the inner wall of the welding chamber, a threaded hole is provided at the top of the welding gun, and a threaded rod is threadedly connected to the inner part of the threaded hole;

[0017] The upper end of the threaded rod is located outside the air pressure chamber and is threadedly connected to the air pressure chamber. A rotating disk is fixed to the top end of the threaded rod, and the rotating disk is fixed to the output end of the motor.

[0018] A connecting rod is fixed between the bottom end of the threaded rod and the upper end of the welding head. A through hole is provided at the bottom of the welding gun, and the welding head is slidably connected in the through hole.

[0019] The present invention further illustrates that the inner wall of the air pressure chamber is slidably connected with an air pressure plate, and the air pressure plate is fixedly mounted on the outer side of the threaded rod;

[0020] The bottom of the air pressure chamber is connected to an air jet pipe, and the upper and lower sides of the air pressure chamber are connected to air delivery pipes, and the air delivery pipes are connected to the air jet pipe pipeline;

[0021] The upper end of the air delivery pipe is located at the lower half of the air pressure chamber.

[0022] The present invention further illustrates that a pressure valve is arranged inside the gas transmission pipe, the bottom of the air pressure chamber is connected to an external pipeline, and a one-way valve is arranged inside the pipeline.

[0023] The present invention further illustrates that two cooling pipes are arranged inside the welding gun, and the top of the air pressure plate is filled with coolant;

[0024] The two cooling pipes are respectively located on the left and right sides of the welding head, and the upper end of the air pressure chamber is respectively connected to the two cooling pipes.

[0025] The present invention further describes that a sealing ring is provided at the threaded connection between the threaded rod and the air pressure chamber, and the coolant is Freon.

[0026] Compared with the prior art, the beneficial effects achieved by the present invention are: the welding gun used in the present invention can not only protect the welding head but also perform dust removal and cooling work, thereby fully improving the welding quality;

[0027] It avoids damage to the chip caused by manual work and secondary welding, shortens the production cycle, improves production efficiency and product reliability, and reduces production costs, quality costs and quality risks;

[0028] It improves the yield rate of products, reduces quality costs and management costs, greatly improves product reliability, eliminates the risk of potential failure of devices due to manual work and secondary welding, and greatly improves production efficiency. The new process brings customers highly reliable products. In today's highly developed information age, with human resources becoming increasingly scarce, high efficiency and automated processes can maximize efficiency and reduce management and quality costs. Through the above technical scheme, the beneficial effects of the technical scheme of the present invention are: using the micro-ultra-thin unidirectional rectifier bridge device and its processing process provided by the present invention, by setting warps on the flat pad, artificially creating the crystal orientation of the atomic arrangement of the sheet, so that the sheet and the chip are welded more perfectly due to the crystal orientation of the two materials during the welding process, thereby reducing the welding defect rate, improving product reliability, reducing costs, and saving resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0030] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 is a plan view of an AC / DC converter of the present invention;

[0032] Figure 3 It is a plan view of a welding gun in a welding furnace of the present invention;

[0033] In the figure: 1. welding gun; 2. air pressure chamber; 3. welding head; 4. threaded hole; 5. threaded rod; 6. turntable; 7. connecting rod; 8. air pressure plate; 9. jet pipe; 10. air supply pipe; 11. pressure valve; 12. cooling pipe. DETAILED DESCRIPTION

[0034] The following is a further non-limiting detailed description of the technical solution of the present invention in conjunction with the preferred embodiments and the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] See also Figure 1-3 The present invention provides a technical solution: a miniature ultra-thin unidirectional high junction temperature AC / DC conversion device for electronic products, comprising four rectifier chips constituting a rectifier bridge circuit, an upper sheet unit, a lower sheet unit and a package body, wherein the rectifier chip is arranged between the upper sheet unit and the lower sheet unit, the upper sheet unit and the lower sheet unit are arranged opposite to each other, and the cross section is in a "Z" shape; the upper sheet unit and the lower sheet unit each include two lead terminals, and the lower surface of the lead terminal is coplanar with the bottom surface of the package body; the upper sheet unit and the lower sheet unit are both provided with a flat pad and a convex pad with a convex point, and the flat pad is provided with a warp line that promotes the combination of the upper and lower sheet units with the rectifier chip, and by artificially creating the sheet atomic arrangement crystal direction, the upper sheet unit is provided with a first pad structure and a second pad structure, and the first pad structure and the second pad structure They are all in a "Z" shape, the first pad structure includes two flat pads, and a first connecting member is arranged between the two flat pads; the second pad structure includes two convex pads, and a second connecting member is arranged between the two convex pads; a third pad structure and a fourth pad structure are arranged on the lower sheet unit, and the third pad structure and the fourth pad structure are arranged in parallel. The third pad structure and the fourth pad structure are both dumbbell-shaped, and each includes a flat pad and a convex pad. The third pad structure also includes a third connecting member, and the flat pad, the third connecting member and the convex pad are connected in sequence and connected to the lead-out terminal. The fourth pad structure also includes a fourth connecting member, and the convex pad, the fourth connecting member and the flat pad are connected in sequence and connected to the lead-out terminal. The upper sheet unit outside the package body forms an output terminal, and the lower sheet unit outside the package body forms an input terminal.

[0036] The production process of the miniature ultra-thin unidirectional high junction temperature AC / DC converter device specifically includes the following steps:

[0037] S1, positioning a lower sheet including a plurality of lower sheet units connected by ribs on graphite to form a graphite mold;

[0038] S2. Adjust the dispensing position accuracy and glue amount, start the dispensing switch to dispense glue to the flat pad and the convex pad, and take out the dispensing graphite mold after completion;

[0039] S3, place the graphite mold with glue dispensed on the die bonding machine, then use the suction cup to place the chip at the position to be bonded, start the die bonding machine, and complete the die bonding;

[0040] S4, placing a material loading sheet including a plurality of material loading units on a suction cup for dispensing glue on the material sheet, and placing the suction cup on a glue dispensing machine for dispensing glue;

[0041] S5, then put the glued loading sheet back onto the graphite mold with solid crystal;

[0042] S6. Place in a welding furnace for welding, then inspect, clean and dry;

[0043] S7, encapsulate each welded rectifier bridge unit with plastic packaging material, put it on a press to achieve the required appearance;

[0044] S8, cutting off the ribs connecting each rectifier bridge unit, and then tinning the four lead terminals;

[0045] S9. Get the product.

[0046] The welding furnace in step S6 includes a motor and a welding gun 1;

[0047] A pressure chamber 2 is fixed at the top of the welding chamber 1, a welding head 3 is slidably connected to the inner wall of the welding chamber 1, a threaded hole 4 is provided at the top of the welding gun 1, and a threaded rod 5 is threadedly connected to the inner thread of the threaded hole 4;

[0048] The upper end of the threaded rod 5 is located outside the air pressure chamber 2 and is threadedly connected to the air pressure chamber 2. A turntable 6 is fixed to the top of the threaded rod 5, and the turntable 6 is fixed to the output end of the motor.

[0049] A connecting rod 7 is fixed between the bottom end of the threaded rod 5 and the upper end of the welding head 3. A through hole is provided at the bottom of the welding gun 1, and the welding head 3 is slidably connected in the through hole.

[0050] During the welding process, the welding furnace is running, and the internal motor is started, driving the turntable 6 to rotate, and the turntable 6 drives the threaded rod 5 to rotate, so that the threaded rod 5 moves downward in the threaded hole 4, thereby driving the welding head 3 to move downward through the connecting rod 7 until it extends out of the welding gun 1 through the through hole to perform welding work. When the welding is completed, the motor rotates in the opposite direction to retract the welding head 3 into the welding gun 1, which can protect the welding head 3 and facilitate the quality of the welding head 3, thereby ensuring the welding quality and preventing the welding head 3 from being contaminated and affecting the welding quality. At the same time, the extension and retraction are automatic, without manual operation, which is convenient and fast.

[0051] The inner wall of the air pressure chamber 2 is slidably connected with an air pressure plate 8, and the air pressure plate 8 is fixedly installed on the outer side of the threaded rod 5;

[0052] The bottom of the air pressure chamber 2 is connected to an air jet pipe 9, and the upper and lower sides of the air pressure chamber 2 are connected to air delivery pipes 10, which are connected to the air jet pipe 9;

[0053] The upper end of the air delivery pipe 10 is located at the lower half of the air pressure chamber 2 .

[0054] A pressure valve 11 is provided inside the gas delivery pipe 10, the bottom of the air pressure chamber 2 is connected to an external pipeline, and a one-way valve is provided inside the pipeline;

[0055] Through the above steps, during the welding process, the welding gun 1 is aimed at the chip and the sheet. When the welding head 3 extends out of the welding gun 1, the threaded rod 5 drives the air pressure plate 8 to slide downward along the inner wall of the air pressure chamber 2. The gas under the air pressure plate 8 is squeezed and enters the gas pipe 10, and is blocked by the pressure valve 11. When the welding head 3 is completely extended out of the welding gun 1, the gas pressure in the gas pipe 10 reaches the pressure bearing limit of the pressure valve 11, so that the pressure valve 11 is opened, and the gas is quickly ejected through the air jet pipe 9 to blow air to the surface of the chip and the sheet to blow off the dust on the surface, thereby further improving the welding quality and further improving the yield rate;

[0056] When the welding head 3 is retracted into the welding gun 1, the air pressure plate 8 is reset. During the reset process, gas is extracted from the outside through the pipeline. The one-way valve controls the outside gas to enter the bottom of the air pressure plate 8 in one direction, thereby facilitating continuous and effective dust removal.

[0057] Two cooling pipes 12 are arranged inside the welding gun 1, and the top of the air pressure plate 8 is filled with coolant;

[0058] The two cooling pipes 12 are respectively located at the left and right sides of the welding head 3 , and the upper end of the air pressure chamber 2 is connected to the two cooling pipes 12 .

[0059] A sealing ring is provided at the threaded connection between the threaded rod 5 and the air pressure chamber 2, and the coolant is Freon;

[0060] Through the above steps, during the process of the air pressure plate 8 moving up and down along the inner wall of the air pressure chamber 2, when the welding head 3 is retracted into the welding gun 1, the air pressure plate 8 slides upward along the inner wall of the air pressure chamber 2, and the Freon pressure above the air pressure plate 8 is released and enters the cooling pipe 12 through the pipeline, so that the welding head 3 can be quickly cooled to prevent the welding gun 1 from being damaged by excessive temperature, thereby playing a role in protecting the structure. When the welding head 3 is extended again for welding, the Freon in the cooling pipe 12 is drawn back into the air pressure chamber 2 through the pipeline, and the drawn Freon is compressed to be compressed and liquefied. Through the thermal characteristics of Freon, the heat released in the process from compression and liquefaction to evaporation and vaporization can improve the cooling effect;

[0061] It avoids damage to the chip caused by manual work and secondary welding, shortens the production cycle, improves production efficiency and product reliability, and reduces production costs, quality costs and quality risks;

[0062] It improves the yield rate of products, reduces quality costs and management costs, greatly improves product reliability, eliminates the risk of potential failure of devices due to manual work and secondary welding, and greatly improves production efficiency. The new process brings customers highly reliable products. In today's highly developed information age, with human resources becoming increasingly scarce, high efficiency and automated processes can maximize efficiency and reduce management and quality costs. Through the above technical scheme, the beneficial effects of the technical scheme of the present invention are: using the micro-ultra-thin unidirectional rectifier bridge device and its processing process provided by the present invention, by setting warps on the flat pad, artificially creating the crystal orientation of the atomic arrangement of the sheet, so that the sheet and the chip are welded more perfectly due to the crystal orientation of the two materials during the welding process, thereby reducing the welding defect rate, improving product reliability, reducing costs, and saving resources;

[0063] A. The upper sheet unit and the lower sheet unit of the micro-ultra-thin unidirectional rectifier bridge device are arranged opposite to each other, and the cross section is in a °Z' shape to reduce the volume and thickness, and can be attached to the back of the PCB;

[0064] B. A flat pad and a convex pad with convex points are provided on both the upper sheet unit and the lower sheet unit, and a warp line is provided on the flat pad to promote the combination of the upper and lower sheet units with the rectifier chip;

[0065] C. Create the atomic arrangement of the sheet, so that the sheet and the chip can be welded more perfectly due to the orientation of the two materials during the welding process, thereby reducing the welding defect rate and the finished product rate as high as 99%, improving product reliability, reducing costs and saving resources;

[0066] High power 1(AV)0.5 / 0.8A, VRRM1000V, low forward performance VF<980mV, avalanche breakdown voltage>1300V, anti-static ability>8kV;

[0067] 1. The product has a small size of 3.85*3.70~1.25mm (length*width*height), and the thickness is only 1.25mm, which is a rectifier bridge that can be attached to the back of the PCB; it is suitable for various installation needs;

[0068] 2. Product structure: By setting warps on the flat pads, the atomic arrangement of the material sheet is artificially created, so that the material sheet and the chip can be welded more perfectly due to the crystal orientation of the two materials during the welding process, thereby reducing the welding defect rate, improving product reliability, reducing costs, and saving resources;

[0069] 3. High power 1(AV)0.5 / 0.8A, VRRM1300V, low forward performance VF<980mV. Lightning voltage>4KV.

[0070] In the description of the present invention, it is necessary to understand that the terms "up", "down", "front", "back", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0071] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents, and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A miniature ultra-thin unidirectional high junction temperature AC / DC converter for electronic products, comprising four rectifier chips constituting a rectifier bridge circuit, an upper sheet unit, a lower sheet unit and a package, characterized in that: The rectifier chip is arranged between the upper sheet unit and the lower sheet unit, and the upper sheet unit and the lower sheet unit are arranged opposite to each other, and the cross section is in a "Z" shape; the upper sheet unit and the lower sheet unit each include two lead terminals, and the lower surface of the lead terminal is coplanar with the bottom surface of the package body; the upper sheet unit and the lower sheet unit are both provided with flat pads and convex pads with bumps, and the flat pads are provided with warps that promote the combination of the upper and lower sheet units with the rectifier chip, and by artificially creating the crystal orientation of the sheet atoms, the upper sheet unit is provided with a first pad structure and a second pad structure, and the first pad structure and the second pad structure are both in a "Z" shape, and the first pad structure includes two flat pads, and a a first connecting member; the second pad structure includes two convex pads, a second connecting member is arranged between the two convex pads, a third pad structure and a fourth pad structure are arranged on the lower sheet unit, the third pad structure and the fourth pad structure are arranged in parallel, the third pad structure and the fourth pad structure are both dumbbell-shaped, and each includes a flat pad and a convex pad, the third pad structure also includes a third connecting member, the flat pad, the third connecting member and the convex pad are connected in sequence and connected to the lead-out terminal, the fourth pad structure also includes a fourth connecting member, the convex pad, the fourth connecting member and the flat pad are connected in sequence and connected to the lead-out terminal, the upper sheet unit outside the package body forms an output terminal, and the lower sheet unit outside the package body forms an input terminal.

2. The miniature ultra-thin unidirectional high junction temperature AC / DC converter device for electronic products according to claim 1, characterized in that: The production process of the micro ultra-thin unidirectional high junction temperature AC / DC converter device specifically includes the following steps: S1, positioning a lower sheet including a plurality of lower sheet units connected by ribs on graphite to form a graphite mold; S2. Adjust the dispensing position accuracy and glue amount, start the dispensing switch to dispense glue to the flat pad and the convex pad, and take out the dispensing graphite mold after completion; S3, place the graphite mold with glue dispensed on the die bonding machine, then use the suction cup to place the chip at the position to be bonded, start the die bonding machine, and complete the die bonding; S4, placing a material loading sheet including a plurality of material loading units on a suction cup for dispensing glue on the material sheet, and placing the suction cup on a glue dispensing machine for dispensing glue; S5, then put the glued loading sheet back onto the graphite mold with solid crystal; S6. Place in a welding furnace for welding, then inspect, clean and dry; S7, encapsulate each welded rectifier bridge unit with plastic packaging material, put it on a press to achieve the required appearance; S8, cutting off the ribs connecting each rectifier bridge unit, and then tinning the four lead terminals; S9. Get the product.

3. The miniature ultra-thin unidirectional high junction temperature AC / DC converter device for electronic products according to claim 2, characterized in that: The welding furnace in step S6 comprises a motor and a welding gun (1); A pneumatic chamber (2) is fixed at the top of the welding chamber (1), a welding head (3) is slidably connected to the inner wall of the welding chamber (1), a threaded hole (4) is provided at the top of the welding gun (1), and a threaded rod (5) is threadedly connected to the inner part of the threaded hole (4); The upper end of the threaded rod (5) is located outside the air pressure chamber (2) and is threadedly connected to the air pressure chamber (2). A rotating disk (6) is fixed to the top end of the threaded rod (5), and the rotating disk (6) is fixed to the output end of the motor. A connecting rod (7) is fixed between the bottom end of the threaded rod (5) and the upper end of the welding head (3); a through hole is provided at the bottom of the welding gun (1), and the welding head (3) is slidably connected in the through hole.

4. The miniature ultra-thin unidirectional high junction temperature AC / DC converter device for electronic products according to claim 3, characterized in that: The inner wall of the air pressure chamber (2) is slidably connected to a pressure plate (8), and the pressure plate (8) is fixedly mounted on the outer side of the threaded rod (5); The bottom of the air pressure chamber (2) is connected to an air jet pipe (9), and the upper and lower sides of the air pressure chamber (2) are both connected to air delivery pipes (10), and the air delivery pipes (10) are connected to the air jet pipe (9) through a pipeline; The upper end of the air delivery pipe (10) is located at the lower half of the air pressure chamber (2).

5. The miniature ultra-thin unidirectional high junction temperature AC / DC converter device for electronic products according to claim 4, characterized in that: A pressure valve (11) is arranged inside the gas delivery pipe (10), the bottom of the air pressure chamber (2) is connected to an external pipeline, and a one-way valve is arranged inside the pipeline.

6. The miniature ultra-thin unidirectional high junction temperature AC / DC converter device for electronic products according to claim 5, characterized in that: Two cooling pipes (12) are arranged inside the welding gun (1), and the top of the air pressure plate (8) is filled with cooling liquid; The two cooling pipes (12) are respectively located on the left and right sides of the welding head (3), and the upper end of the air pressure chamber (2) is respectively connected to the two cooling pipes (12).

7. The miniature ultra-thin unidirectional high junction temperature AC / DC converter for electronic products according to claim 6, characterized in that: A sealing ring is provided at the threaded connection between the threaded rod (5) and the air pressure chamber (2), and the coolant is Freon.

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