Water cooling plate for heat dissipation of electronic device and determination method of water cooling plate

Abstract

The invention provides a water-cooling plate for heat dissipation of an electronic device and a determination method of the water-cooling plate, and the water-cooling plate comprises a water-cooling customized part which is used for being in direct contact with a heating part of the electronic device needing heat dissipation on a target board card so as to carry out heat exchange on the electronic device; the water-cooling standard component is matched with the water-cooling customized component, and the water-cooling standard component is suitable for heat dissipation of the water-cooling customized component; wherein the water-cooling customized part and the water-cooling standard part are cooperatively connected through a standard connecting part, the water-cooling customized part is produced in a customized manner according to the target board card, and the water-cooling standard part is pre-produced according to a predetermined specification. The water-cooling plate provided by the invention can realize general heat dissipation for different electronic devices, and the processing cost of the water-cooling plate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of water cooling and heat dissipation, and in particular to a water cooling plate used for heat dissipation of electronic devices and a method for determining the water cooling plate. Background Art

[0002] In the related art, as the power consumption of electronic devices increases, water cooling is used to dissipate the heat of electronic devices. Since the size or position distribution of each electronic device on the board is different, in order to ensure the heat dissipation efficiency, the water cooling plate needs to ensure that the water cooling structure is set corresponding to the electronic device. Therefore, for different electronic devices or for different boards, the water cooling plate needs to be customized according to actual conditions, which is costly. Therefore, how to optimize the water cooling structure and reduce the heat dissipation cost of electronic devices has become a problem to be solved urgently in this field. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a water cooling plate for heat dissipation of electronic devices. The water cooling plate proposed by the present invention can achieve universal heat dissipation for different electronic devices, thereby reducing the processing cost of the water cooling plate.

[0004] The present invention also provides a determination method for the water cooling plate.

[0005] The water-cooling plate for heat dissipation of electronic devices according to the present invention comprises: a water-cooling customized part, which is used to directly contact the heat-generating part of the electronic device that needs heat dissipation on the target board so as to perform heat exchange on the electronic device; a water-cooling standard part, which cooperates with the water-cooling customized part, and the water-cooling standard part is suitable for heat dissipation of the water-cooling customized part; wherein the water-cooling customized part and the water-cooling standard part are matched and connected through a standard connecting part, and the water-cooling customized part is customized according to the target board, and the water-cooling standard part is pre-produced according to predetermined specifications.

[0006] The water-cooling plate for heat dissipation of electronic devices according to the present invention comprises detachably connected water-cooling custom parts and water-cooling standard parts. The water-cooling custom parts can be customized according to the size parameters and heat dissipation parameters of the target board to ensure that the water-cooling custom parts are in close contact with the heat-generating parts of the electronic devices on the target board that need heat dissipation, thereby ensuring good heat conduction. The water-cooling standard parts can be pre-produced according to predetermined specifications. The water-cooling plate of the present invention can be customized with appropriate water-cooling custom parts according to different target boards, and suitable water-cooling standard parts and water-cooling custom parts can be selected for assembly through standard connectors. Compared with customizing the entire water-cooling plate, the processing cost of the water-cooling plate is reduced, and the flexibility of the entire water-cooling plate to adapt to different water cooling needs is improved.

[0007] According to some embodiments of the present invention, the custom water-cooling part is provided with a heat dissipation component corresponding to the electronic device according to the size and heat dissipation parameters of the target board and the size and position of the electronic device, and the heat dissipation component contacts the heat generating part of the electronic device and performs heat exchange.

[0008] According to some embodiments of the present invention, the standard connection part includes: a first standard connection part, which is arranged on the side of the water-cooling custom part away from the target board; a second standard connection part, which is arranged on the side of the water-cooling standard part facing the target board and is suitable for cooperating and connecting with the first standard connection part; wherein the first standard connection part is fixed according to a first fixed parameter, and the second standard connection part is fixed according to a second fixed parameter.

[0009] According to some embodiments of the present invention, the first standard connection portion is configured as a copper bump, and the second standard connection portion is configured as a copper groove, or the first standard connection portion is configured as a copper groove, and the second standard connection portion is configured as a copper bump.

[0010] According to some embodiments of the present invention, the water-cooling custom parts are provided with multiple size specifications, and multiple first standard connecting parts are formed on the water-cooling custom parts of each size specification, and the distance between any two adjacent first standard connecting parts is the first standard distance; the water-cooling standard parts are provided with multiple size specifications, and multiple second standard connecting parts are formed on the water-cooling standard parts of each size specification, and the water-cooling standard parts of any size specification can be selectively matched with the corresponding water-cooling custom parts, and the distance between any two adjacent second standard connecting parts is the second standard distance, and the first standard distance is equal to the second standard distance; at least two first standard connecting parts provided on the water-cooling custom parts respectively cooperate with the second standard connecting parts at any position of the water-cooling standard parts to adjust the relative position of the water-cooling custom parts and the water-cooling standard parts. According to some embodiments of the present invention, a heat dissipation pipeline for circulating coolant is formed in the water-cooling standard component; or a heat dissipation pipeline for circulating coolant is formed in the water-cooling customized component; or a heat dissipation pipeline for circulating coolant is formed in both the water-cooling standard component and the water-cooling customized component; or a partial heat dissipation pipeline for circulating coolant is formed in both the water-cooling standard component and the water-cooling customized component, and the partial heat dissipation pipeline of the water-cooling standard component and the partial pipeline of the water-cooling customized component cooperate to form a complete heat dissipation pipeline.

[0011] According to some embodiments of the present invention, the water cooling plate further includes: a heat dissipation component, which is detachably connected to the water cooling custom component and is suitable for contacting the heat generating part of the electronic device; or, the heat dissipation component is an integral part of the water cooling custom component.

[0012] The following briefly describes the method for determining a water cooling plate for heat dissipation of electronic devices according to the present invention.

[0013] The method for determining a water-cooling plate for heat dissipation of electronic devices according to the present invention includes: determining customized production parameters of a water-cooling customized part according to size parameters and heat dissipation parameters of a target board; customizing and producing the water-cooling customized part according to the customized production parameters; selecting corresponding water-cooling standard parts according to size parameters and heat dissipation parameters of the target board and the matching form of the water-cooling customized part; and installing the water-cooling customized part in combination with the water-cooling standard part to obtain a water-cooling plate for the target board, wherein the water-cooling plate is constructed as the water-cooling plate described in any one of the above embodiments.

[0014] According to some embodiments of the present invention, the size parameters of the target board include: the size of the target board, the size of the electronic device, and the position of the electronic device on the target board.

[0015] According to some embodiments of the present invention, determining the customized production parameters of the water-cooled customized parts based on the size parameters and heat dissipation parameters of the target board includes: determining the first fixed parameters of the first standard connection part on the water-cooled customized parts based on the size parameters and heat dissipation parameters of the target board; determining the size parameters of the water-cooled customized parts based on the size parameters, heat dissipation parameters and first connection parameters of the target board.

[0016] According to some embodiments of the present invention, determining the size parameters of the water-cooling custom part based on the size parameters, heat dissipation parameters and first connection parameters of the target motherboard includes: determining the size of the water-cooling custom part from a plurality of predetermined specifications based on the size parameters, heat dissipation parameters and first connection parameters of the target motherboard.

[0017] According to some embodiments of the present invention, corresponding water-cooling standard parts are selected according to the size parameters and heat dissipation parameters of the target board and the matching form of the water-cooling customized parts, including: determining the second fixed parameters of the second standard connection part of the water-cooling standard part according to the first fixed parameters of the first standard connection part on the water-cooling customized part; and selecting water-cooling standard parts of corresponding sizes from pre-produced water-cooling standard parts that meet the second connection parameters according to the size parameters and heat dissipation parameters of the target board.

[0018] According to some embodiments of the present invention, the determination method also includes: after the heat dissipation parameters of the target board are updated, reselecting updated water-cooling standard parts of corresponding sizes from pre-produced water-cooling standard parts; and installing the water-cooling customized parts in combination with the updated water-cooling standard parts to obtain the water-cooling plate of the target board.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 is a cross-sectional schematic diagram of a heat dissipation device and a control board according to some embodiments of the present invention;

[0022] Figure 2 is a cross-sectional schematic diagram of a heat dissipation device and a control board according to some embodiments of the present invention;

[0023] Figure 3 is a cross-sectional schematic diagram of a heat dissipation device and a control board according to some other embodiments of the present invention;

[0024] Figure 4 is a cross-sectional schematic diagram of a heat dissipation device and a control board according to some other embodiments of the present invention;

[0025] Figure 5 is a flow chart of a method for determining a water cooling plate according to some embodiments of the present invention.

[0026] Reference numerals:

[0027] Water cooling plate 1;

[0028] Target board 10, heating unit 101;

[0029] Water cooling custom parts 11, heat dissipation components 111; water cooling standard parts 12;

[0030] The standard connection portion 13 , the first standard connection portion 131 , and the second standard connection portion 132 . DETAILED DESCRIPTION

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] In the related art, as the power consumption of electronic devices increases, water cooling is used to dissipate the heat of electronic devices. Since the size or position distribution of each electronic device on the board is different, in order to ensure the heat dissipation efficiency, the water cooling plate needs to ensure that the water cooling structure is set corresponding to the electronic device. Therefore, for different electronic devices or for different boards, the water cooling plate needs to be customized according to actual conditions, which is costly. Therefore, how to optimize the water cooling structure and reduce the heat dissipation cost of electronic devices has become a problem to be solved urgently in this field.

[0033] Reference below Figure 1-Figure 4A water cooling plate for heat dissipation of electronic devices according to an embodiment of the present invention is described.

[0034] The water-cooling plate 1 for dissipating heat of electronic devices according to the present invention comprises: a water-cooling customized part 11, which is used to directly contact the heat-generating part 101 of the electronic device that needs to dissipate heat on the target board 10 to perform heat exchange on the electronic device; a water-cooling standard part 12, which cooperates with the water-cooling customized part 11, and the water-cooling standard part 12 is suitable for dissipating heat for the water-cooling customized part 11; wherein the water-cooling customized part 11 and the water-cooling standard part 12 are matched and connected through a standard connecting part 13, and the water-cooling customized part 11 is customized according to the target board 10, and the water-cooling standard part 12 is pre-produced according to predetermined specifications.

[0035] Specifically, the water-cooling plate 1 includes a water-cooling customized part 11 and a water-cooling standard part 12. The water-cooling customized part 11 is suitable for direct contact with the heat-generating part 101 on the target board 10 that needs to dissipate heat. As a customized part, it needs to be customized according to factors such as the size of different boards, the position of electronic components on the boards, and the shapes of different electronic components. The water-cooling customized part 11 is constructed as a good thermal conductor to facilitate the conduction of heat to the water-cooling standard part 12; the water-cooling standard part 12 is used to be installed in conjunction with the water-cooling customized part 11 to form a complete water-cooling plate 1. As a standard part, the water-cooling standard part 12 can be produced and stocked in advance according to the standard. A standard connecting part 13 is provided between the water-cooling customized part 11 and the water-cooling standard part 12, and the water-cooling customized part 11 and the water-cooling standard part 12 are connected and assembled into the entire water-cooling Plate 1, the water-cooled customized part 11 is in direct contact with the heat-generating part 101 of the electronic device, the heat generated by the electronic device is conducted to the water-cooled customized part 11 and transferred to the water-cooled standard part 12 through the standard connector for heat dissipation, a heat dissipation channel can be formed in the water-cooled plate 1, and the heat is taken away by the circulating coolant by combining the water-cooled plate 1 with structures such as a water pump, a radiator, a water tank, a water pipe, and a joint, thereby achieving heat dissipation of the electronic device. Since the water-cooled customized part 11 can be customized according to different board sizes of the electronic device, the shape, area, height, etc. of the electronic device, the customized design is simple and the manufacturing cost is low. The water-cooled standard part 12 can be pre-produced or purchased and assembled with the water-cooled customized part 11 into a complete water-cooled plate 1 structure. Compared with customizing the entire water-cooled plate 1, the overall cost of the water-cooled plate 1 can be reduced.

[0036] The water-cooling plate 1 for heat dissipation of electronic devices according to the present invention comprises a detachably connected water-cooling custom part 11 and a water-cooling standard part 12. The water-cooling custom part 11 can be customized according to the size parameters and heat dissipation parameters of the target board 10 to ensure that the water-cooling custom part 11 is in close contact with the heating part 101 of the electronic device that needs heat dissipation on the target board 10 to ensure good heat conduction. The water-cooling standard part 12 can be pre-produced according to predetermined specifications. The water-cooling plate 1 of the present invention can customize appropriate water-cooling custom parts 11 according to different target boards 10, and select appropriate water-cooling standard parts 12 to assemble with the water-cooling custom parts 11 through standard connectors. Compared with customizing the entire water-cooling plate 1, the processing cost of the water-cooling plate 1 is reduced, and the flexibility of the entire water-cooling plate 1 to adapt to different water cooling requirements is improved.

[0037] According to some embodiments of the present invention, the water-cooled custom part 11 is provided with a heat dissipation component 111 corresponding to the electronic device according to the size and heat dissipation parameters of the target board 10 and the size and position of the electronic device. The heat dissipation component 111 contacts the heat generating part 101 of the electronic device and performs heat exchange.

[0038] Specifically, the design of the water-cooled custom part 11 is not only based on the simple shape or size of the target board 10, but also takes into account the size and heat dissipation parameters (such as heat flow, thermal resistance, etc.) of the target board 10, as well as the size, position and heat dissipation requirements of the electronic device. A heat dissipation component 111 corresponding to the electronic device is provided on the water-cooled custom part 11. The shape, size and position of the heat dissipation component 111 correspond to the electronic device to ensure that the heat dissipation component 111 can accurately contact the heating part 101 of the electronic device, thereby performing efficient heat exchange. The heat dissipation component 111 is in close contact with the heating part 101 of the electronic device, and transfers the heat generated by the electronic device to the water-cooled custom part 11 by heat conduction. Subsequently, the heat will be further taken away by the water-cooled standard part 12 and the water cooling system, thereby achieving the purpose of heat dissipation. Through the customized heat dissipation component 111, the heat dissipation requirements of different electronic devices can be met more effectively. At the same time, since the heat dissipation component 111 is in close contact with the heating part 101 of the electronic device, the efficiency of heat exchange can be greatly improved, thereby ensuring that the electronic device operates at normal working temperature and extending its service life.

[0039] According to some embodiments of the present invention, the standard connection part 13 includes: a first standard connection part 131, which is arranged on the side of the water-cooling custom part 11 facing away from the target board 10; a second standard connection part 132, which is arranged on the side of the water-cooling standard part 12 facing the target board 10 and is suitable for cooperating and connecting with the first standard connection part 131; wherein the first standard connection part 131 is fixed according to the first fixed parameters, and the second standard connection part 132 is fixed according to the second fixed parameters.

[0040] Specifically, the first standard connection part 131 is arranged on the side of the water-cooled custom part 11 away from the target board 10, ensuring that the first standard connection part 131 can achieve accurate and stable connection with the second standard connection part 132 on the water-cooled standard part 12. The first standard connection part 131 is fixed according to the first fixed parameters, and these parameters may include the shape, size, position and connection method of the connection part, so as to ensure the consistency and reliability of the connection. The first standard connection part 131 and the second standard connection part 132 are installed in coordination to form the standard connection part 13, wherein the first standard connection part 131 has the first fixed parameters, and the second standard connection part 132 has the second fixed parameters, and the first fixed parameters and the second fixed parameters include geometric dimensions, shapes, position accuracy, installation intervals and connection methods (such as threaded connections, snap connections, etc.). By accurately setting the first fixed parameters and the second fixed parameters, it can be ensured that the connection between the water-cooled custom part 11 and the water-cooled standard part 12 is both stable and reliable, thereby meeting the performance requirements of the heat dissipation system.

[0041] According to some embodiments of the present invention, the first standard connection portion 131 is configured as a copper bump, and the second standard connection portion 132 is configured as a copper groove, or the first standard connection portion 131 is configured as a copper groove, and the second standard connection portion 132 is configured as a copper bump.

[0042] Specifically, the first standard connection part 131 is constructed as a copper bump, and the second standard connection part 132 is constructed as a matching copper groove, or the first standard connection part 131 can also be constructed as a copper groove, and the second standard connection part 132 is constructed as a copper bump, ensuring a close fit and a firm connection between the two. Copper is selected as the material of the connection part mainly because copper has good thermal conductivity and high strength. The high thermal conductivity of copper helps to quickly transfer the heat absorbed by the water-cooled custom part 11 to the water-cooled standard part 12, thereby improving the heat dissipation efficiency. At the same time, the strength of copper also ensures the stability and durability of the connection. The design of the bump and the groove not only realizes a physical connection, but also improves the efficiency of heat conduction through a close contact surface. When the bump is inserted into the groove, the small gap between the two is filled, thereby reducing thermal resistance and improving heat dissipation performance.

[0043] According to some embodiments of the present invention, the water-cooling custom component 11 is provided with multiple sizes, and each size of the water-cooling custom component 11 is formed with multiple first standard connection parts 131, and the distance between any two adjacent first standard connection parts 131 is the first standard distance; the water-cooling standard component 12 is provided with multiple sizes, and each size of the water-cooling standard component 12 is formed with multiple second standard connection parts 132, and the water-cooling standard component 132 of any size can be selectively matched with the corresponding water-cooling custom component 11, and the distance between any two adjacent second standard connection parts 132 is the second standard distance, and the first standard distance is equal to the second standard distance; at least two first standard connection parts 131 provided on the water-cooling custom component 11 respectively cooperate with the second standard connection parts 132 at any position of the water-cooling standard component 12 to adjust the relative position of the water-cooling custom component 11 and the water-cooling standard component 12.

[0044] Specifically, the water-cooling custom part 11 is provided with a plurality of sizes to meet the heat dissipation requirements of different electronic devices and target boards 10. A plurality of first standard connection parts 131 (copper bumps or copper grooves) are formed on the water-cooling custom part 11 of each size, and the plurality of first standard connection parts 131 are used to cooperate and connect with the second standard connection parts 132 on the water-cooling standard part 12. The distance between any two adjacent first standard connection parts 131 is the first standard distance, and the first standard distance is fixed to ensure the consistency of the layout of the first standard connection parts 131 of the water-cooling custom parts 11 of different sizes. Similarly, the water-cooling standard part 12 can also be provided with a plurality of sizes to meet the customization requirements of different electronic devices and target boards 10. A plurality of second standard connection parts 132 (copper grooves or copper bumps corresponding to the first standard connection parts 131) are formed on the water-cooling standard part 12 of each size. The distance between any two adjacent second standard connection parts 132 is the second standard distance, and the second standard distance is equal to the first standard distance to ensure that the water-cooled custom part 11 and the water-cooled standard part 12 can be perfectly matched when connected. Since the first standard distance and the second standard distance are equal, at least two first standard connection parts 131 on the water-cooled custom part 11 can be selectively matched with the second standard connection part 132 at any position on the water-cooled standard part 12, so that the relative position of the water-cooled custom part 11 and the water-cooled standard part 12 can be adjusted according to actual needs to achieve the best heat dissipation effect and installation convenience, and different sizes can be flexibly selected for adaptation between the water-cooled custom part 11 and the water-cooled standard part 12. For example, if the layout of electronic devices on the target board 10 is relatively compact, a small-sized water-cooling custom part 11 can be selected to fit the electronic devices, and installed in conjunction with the second standard connection part 132 on the water-cooling standard part 12 through the first standard connection part 131 to save the cost of the water-cooling custom part 11; when the target board 10 is larger in size, or the layout of electronic devices on the target board 10 is relatively dispersed, a large-sized water-cooling custom part 11 can be selected to fit with the water-cooling standard part 12 to meet the heat dissipation requirements of the target board 10. By setting a plurality of first standard connection parts 131 with a spacing distance equal to the first standard distance on water-cooling customized parts 11 of different sizes and specifications, and setting a plurality of second standard connection parts 132 with a spacing distance equal to the first standard distance on the water-cooling standard part 12, the matching connection between the water-cooling customized parts 11 and the water-cooling standard parts 12 is made more flexible. The water-cooling customized parts 11 of different sizes and specifications can be installed by matching the first standard connection parts 131 and the second standard connection parts 132 to form a complete water-cooling plate 1 with the water-cooling standard parts 12 of corresponding sizes and specifications, which can not only meet the heat dissipation requirements of different target boards 10, but also reduce the processing cost of the water-cooling plate 1.According to some embodiments of the present invention, a heat dissipation pipeline for circulating coolant is formed in the water-cooled standard part 12; or a heat dissipation pipeline for circulating coolant is formed in the water-cooled customized part 11; or heat dissipation pipelines for circulating coolant are formed in both the water-cooled standard part 12 and the water-cooled customized part 11; or partial heat dissipation pipelines for circulating coolant are formed in both the water-cooled standard part 12 and the water-cooled customized part 11, and the partial heat dissipation pipelines of the water-cooled standard part 12 and the partial pipelines of the water-cooled customized part 11 cooperate to form a complete heat dissipation pipeline.

[0045] Specifically, a heat dissipation pipeline is formed inside the water-cooled standard part 12, and the heat dissipation pipeline in which the coolant circulates is completely arranged inside the water-cooled standard part 12. The water-cooled standard part 12 performs heat exchange with the water-cooled custom part 11 through the heat dissipation pipeline inside it, thereby realizing heat dissipation of the electronic device. The heat dissipation pipeline can also be arranged inside the water-cooled custom part 11, and the coolant circulates inside the water-cooled custom part 11, directly absorbing the heat generated by the electronic device, and transferring the heat to the water-cooled standard part 12 through heat exchange, thereby realizing water-cooled heat dissipation. Of course, heat dissipation pipelines can be arranged inside the water-cooled standard part 12 and the water-cooled custom part 11, and the coolant circulates inside the water-cooled custom part 11 and the water-cooled standard part 12 at the same time, which can further improve the heat dissipation efficiency. Partial heat dissipation pipelines can be formed inside the water-cooled standard part 12 and the water-cooled custom part 11, respectively, and these partial heat dissipation pipelines cooperate with each other when connected to form a complete coolant circulation path together. This design can flexibly adjust the layout and length of the heat dissipation pipeline to adapt to electronic devices and target boards 10 of different sizes and shapes.

[0046] According to some embodiments of the present invention, the water cooling plate 1 further includes: a heat dissipation component 111, which is detachably connected to the water cooling custom component 11 and is suitable for contacting the heat generating portion 101 of the electronic device; or, the heat dissipation component 111 is an integral part of the water cooling custom component 11.

[0047] Specifically, the heat dissipation component 111 can be connected to the water-cooling custom part 11 in a detachable manner (such as threaded connection, snap connection, quick disassembly interface, etc.), and the heat dissipation component 111 can be replaced or adjusted according to the specific heat dissipation requirements of the electronic device, thereby improving the flexibility and adaptability of the water-cooling plate 1. For example, if the heat generation of an electronic device suddenly increases, a heat dissipation component 111 with higher heat dissipation performance can be replaced without replacing the entire water-cooling custom part 11. For example, if an electronic device is replaced with an electronic device of other sizes, the heat dissipation component 111 of the corresponding size can be replaced with the replaced electronic device without replacing the entire water-cooling custom part 11, and the complete water-cooling plate 1 can still be obtained by installation.

[0048] The heat dissipation component 111 can also be used as a part of the water-cooling custom component 11. In this case, the connection between the heat dissipation component 111 and the water-cooling custom component 11 is more stable and reliable, reducing the risk of reduced heat dissipation performance or failure due to connection problems. At the same time, since the heat dissipation component 111 is part of the overall design, the shape, size and position of the heat dissipation component 111 can be more accurately controlled to ensure the best heat exchange effect with the heat-generating part 101 of the electronic device.

[0049] The following briefly describes a method for determining a water cooling plate 1 for heat dissipation of electronic devices according to the present invention.

[0050] The method for determining a water-cooling plate 1 for heat dissipation of electronic devices according to the present invention includes: determining customized production parameters of a water-cooling customized part 11 according to size parameters and heat dissipation parameters of a target board 10; customizing and producing the water-cooling customized part 11 according to the customized production parameters; selecting a corresponding water-cooling standard part 12 according to the size parameters and heat dissipation parameters of the target board 10 and the matching form of the water-cooling customized part 11; and installing the water-cooling customized part 11 in combination with the water-cooling standard part 12 to obtain a water-cooling plate 1 for the target board 10, wherein the water-cooling plate 1 is constructed as the water-cooling plate 1 described in any one of the above-mentioned embodiments.

[0051] Specifically, first, the customized production parameters of the water-cooled customized part 11 are determined according to the size parameters of the target board 10 (such as length, width, height, etc., the size, position, size parameters of the electronic components on the target board 10, etc.) and heat dissipation parameters (such as heat dissipation requirements, heat flux density, etc.). The customized production parameters are the basis for ensuring that the water-cooled customized part 11 can closely cooperate with the target board 10 and provide effective heat dissipation. Next, according to the customized production parameters determined above, the water-cooled customized part 11 is produced. Then, according to the size parameters, heat dissipation parameters and matching form of the water-cooled customized part 11 of the target board 10, the corresponding water-cooled standard part 12 is selected. The water-cooled standard part 12 is a universal component that is pre-designed and mass-produced, so that the water-cooled standard part 12 can be used in conjunction with the water-cooled customized part 11. Finally, the water-cooled customized part 11 is matched and installed with the water-cooled standard part 12 to obtain the water-cooled plate 1 for the target board 10. The water-cooling customized parts 11 are customized according to the size parameters and heat dissipation parameters of the target board 10 to ensure that the water-cooling customized parts 11 can effectively dissipate the heat of the electronic components of the target board 10, and the pre-produced water-cooling standard parts 12 are selected and installed in conjunction with the customized water-cooling customized parts 11 to obtain the target water-cooling plate 1. Compared with the overall customization of the water-cooling plate 1, the overall cost of the water-cooling plate 1 is reduced, and it can be ensured that the water-cooling plate 1 can be in close contact with the target board 10, thereby improving the heat dissipation performance.

[0052] According to some embodiments of the present invention, the size parameters of the target board 10 include: the size of the target board 10 , the size of the electronic device, and the position of the electronic device on the target board 10 .

[0053] Specifically, the size of the target board 10 refers to the length, width and thickness, etc. These dimensional parameters are crucial to determining the size and shape of the water-cooled custom part 11 to ensure that the water-cooled custom part 11 can fit tightly on the target board 10. The size of electronic devices (such as processors, chipsets, memory modules, AI acceleration chips, GPUs, CPUs, etc.) is also an important factor in determining the size of the water-cooled custom part 11. Different electronic devices have different heat generation and heat dissipation requirements, so it is necessary to customize the corresponding heat dissipation area and heat dissipation performance according to their size. The position information of the electronic device on the target board 10 is crucial for designing the layout of the water-cooled custom part 11. Understanding the specific location of the electronic device can help us determine the distribution and connection method of the heat dissipation area on the water-cooled custom part 11 to ensure that heat can be effectively transferred from the electronic device to the water cooling system. After determining these dimensional parameters, the water-cooled custom part 11 that meets the heat dissipation requirements of the target board 10 can be customized more accurately, and the appropriate water-cooled standard parts 12 can be selected for matching installation. This precise design and customized production method not only improves the heat dissipation efficiency of the water cooling plate 1, but also ensures its good compatibility and stability with the target board 10.

[0054] According to some embodiments of the present invention, determining the customized production parameters of the water-cooled custom part 11 based on the size parameters and heat dissipation parameters of the target board 10 includes: determining the first fixed parameters of the first standard connection part 131 on the water-cooled custom part 11 based on the size parameters and heat dissipation parameters of the target board 10; determining the size parameters of the water-cooled custom part 11 based on the size parameters, heat dissipation parameters and first connection parameters of the target board 10.

[0055] Specifically, first, according to the size parameters (such as length, width, height, etc.) and heat dissipation parameters (such as heat dissipation requirements, heat flux density, etc.) of the target board 10, the first fixed parameters of the first standard connection part 131 on the water-cooled custom part 11 are determined. The first fixed parameters may include the position, size, shape, and matching method with other components (such as the water-cooled standard part 12) of the first standard connection part 131, etc., to ensure the integrity and stability of the water cooling system. After determining the first connection parameters, according to the size parameters, heat dissipation parameters and the first connection parameters of the target board 10, the size parameters of the water-cooled custom part 11 are further determined. The size parameters may include the length, width, thickness, distribution and size of the heat dissipation area of ​​the water-cooled custom part 11. Through reasonable size design, it can be ensured that the water-cooled custom part 11 can fit tightly on the target board 10 and provide an effective heat dissipation effect.

[0056] According to some embodiments of the present invention, determining the size parameters of the water-cooling custom part 11 based on the size parameters, heat dissipation parameters and first connection parameters of the target board 10 includes: determining the size of the water-cooling custom part 11 from a plurality of predetermined specifications based on the size parameters, heat dissipation parameters and first connection parameters of the target board 10.

[0057] Specifically, the size of the water-cooling customized component 11 is determined according to the size parameters, heat dissipation parameters and the first connection parameters of the target board 10. For example, on the basis of meeting the customization requirements, the overall size of the water-cooling customized component 11 can be adjusted when the standard connection structure is fixed to cooperate with the water-cooling standard component 12 to achieve different heat dissipation requirements, such as Figure 3 and Figure 4 As shown, the size of the water-cooling custom component 11 can be enlarged or reduced to appropriately adjust the size of the custom component, thereby adjusting the heat dissipation capacity of the entire water-cooling plate 1.

[0058] According to some embodiments of the present invention, a corresponding water-cooling standard part 12 is selected according to the size parameters and heat dissipation parameters of the target board 10 and the matching form of the water-cooling customized part 11, including: determining the second fixed parameters of the second standard connection part 132 of the water-cooling standard part 12 according to the first fixed parameters of the first standard connection part 131 on the water-cooling customized part 11; and selecting the water-cooling standard part 12 of the corresponding size according to the size parameters and heat dissipation parameters of the target board 10 from the pre-produced water-cooling standard parts 12 that meet the second connection parameters.

[0059] Specifically, after the customization of the water-cooling customized part 11 is completed, the second fixed parameters of the water-cooling standard connection part 13 can be determined according to the first fixed parameters of the first standard connection part 131 to ensure that the first standard connection part 131 and the second standard connection part 132 can be closely matched to improve the heat dissipation capacity, and the water-cooling standard parts 12 of corresponding sizes are selected according to the size parameters and heat dissipation parameters of the target board 10 to be installed in coordination with the water-cooling customized parts 11 to form a complete water-cooled plate 1. In particular, when the standard connection structure is fixed, the size, shape, heat dissipation pipe distribution, and coolant input and output ports of the water-cooling standard parts 12 can be flexibly configured according to different heat dissipation requirements to achieve different heat dissipation effects.

[0060] According to some embodiments of the present invention, the determination method also includes: after the heat dissipation parameters of the target board 10 are updated, reselecting an updated water-cooling standard part 12 of a corresponding size from the pre-produced water-cooling standard parts 12; and installing the water-cooling customized part 11 in conjunction with the updated water-cooling standard part 12 to obtain the water-cooling plate 1 of the target board 10.

[0061] Specifically, after the heat dissipation parameters of the target board 10 are updated, the water-cooling standard parts 12 can be replaced and adjusted, and water-cooling standard parts 12 of corresponding sizes are selected from multiple pre-produced water-cooling standard parts 12 for installation together with the water-cooling customized parts 11 to obtain the water-cooling plate 1 of the target board 10. Since the water-cooling customized parts 11 are customized according to the size parameters and heat dissipation parameters of the target board 10, it can be ensured that the water-cooling customized parts 11 are in close contact with the electronic components of the target board 10, thereby effectively conducting heat. When the heat dissipation parameters of the target board 10 are updated, by selecting water-cooling standard parts 12 of appropriate sizes from multiple pre-produced water-cooling standard parts 12 and water-cooling customized parts 11 to form the water-cooling plate 1 of the target board 10, not only can the effective heat dissipation of the target board 10 be guaranteed, but also the replacement cost of the water-cooling plate 1 is reduced, and the flexibility of the water-cooling plate 1 for different heat dissipation requirements is improved.

[0062] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0063] In the description of the present invention, "first feature" or "second feature" may include one or more of the features.

[0064] In the description of the present invention, "plurality" means two or more.

[0065] In the description of the present invention, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0066] In the description of the present invention, “on”, “over” and “above” a first feature from a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0067] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0068] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A water cooling plate for heat dissipation of electronic devices, characterized in that: include: A water-cooling custom component (11), the water-cooling custom component (11) being used to directly contact a heat generating portion (101) of an electronic device on a target board (10) that needs to dissipate heat, so as to perform heat exchange on the electronic device; A water-cooling standard component (12), the water-cooling standard component (12) cooperates with the water-cooling custom component (11), and the water-cooling standard component (12) is suitable for dissipating heat for the water-cooling custom component (11); The water-cooling custom part (11) and the water-cooling standard part (12) are connected in a mating manner via a standard connecting portion (13), and the water-cooling custom part (11) is customized according to the target board (10), while the water-cooling standard part (12) is pre-produced according to predetermined specifications.

2. The water cooling plate for heat dissipation of electronic devices according to claim 1, characterized in that: The water-cooling custom part (11) is provided with a heat dissipation component (111) corresponding to the electronic device according to the size and heat dissipation parameters of the target board (10) and the size and position of the electronic device, and the heat dissipation component (111) contacts the heat generating part (101) of the electronic device and performs heat exchange.

3. The water cooling plate for heat dissipation of electronic devices according to claim 1, characterized in that: The standard connection part (13) comprises: A first standard connection portion (131), the first standard connection portion (131) being arranged on a side of the water-cooling custom component (11) facing away from the target board (10); A second standard connection portion (132), the second standard connection portion (132) being arranged on a side of the water cooling standard component (12) facing the target board (10) and being suitable for being matched and connected with the first standard connection portion (131); The first standard connection portion (131) is fixed according to a first fixed parameter, and the second standard connection portion (132) is fixed according to a second fixed parameter.

4. The water cooling plate for heat dissipation of electronic devices according to claim 3, characterized in that: The first standard connection portion (131) is configured as a copper bump, and the second standard connection portion (132) is configured as a copper groove, or, The first standard connection portion (131) is configured as a copper groove, and the second standard connection portion (132) is configured as a copper bump.

5. The water cooling plate for heat dissipation of electronic devices according to claim 4, characterized in that: The water-cooling custom component (11) is provided with a plurality of size specifications, a plurality of the first standard connection parts (131) are formed on the water-cooling custom component (11) of each size specification, and the distance between any two adjacent first standard connection parts (131) is a first standard distance; The water-cooling standard component (12) is provided with a plurality of sizes, and a plurality of the second standard connection parts (132) are formed on the water-cooling standard component (12) of each size. The water-cooling standard component (12) of any size can be selectively matched with the corresponding water-cooling custom component (11), and the distance between any two adjacent second standard connection parts (132) is the second standard distance, and the first standard distance is equal to the second standard distance; At least two of the first standard connection parts (131) provided on the water-cooling custom part (11) respectively cooperate with the second standard connection part (132) at any position of the water-cooling standard part (12) to adjust the relative position of the water-cooling custom part (11) and the water-cooling standard part (12).

6. The water cooling plate for heat dissipation of electronic devices according to claim 1, characterized in that: A heat dissipation pipeline for circulating cooling liquid is formed in the water-cooling standard component (12); or A heat dissipation pipeline for circulating cooling liquid is formed in the water-cooling custom component (11); or Heat dissipation pipelines for circulating cooling liquid are formed in both the water-cooling standard component (12) and the water-cooling custom component (11); or Partial heat dissipation pipelines for circulating cooling liquid are formed in both the water-cooling standard component (12) and the water-cooling customized component (11), and the partial heat dissipation pipelines of the water-cooling standard component (12) and the partial pipelines of the water-cooling customized component (11) cooperate to form a complete heat dissipation pipeline.

7. The water cooling plate for heat dissipation of electronic devices according to claim 1, characterized in that: Also includes: A heat dissipation component (111), wherein the heat dissipation component (111) is detachably connected to the water-cooling custom component (11) and is suitable for contacting the heat-generating portion (101) of the electronic device; or, the heat dissipation component (111) is an integral part of the water-cooling custom component (11).

8. A method for determining a water cooling plate for heat dissipation of electronic devices, characterized in that: include: Determining the customized production parameters of the water-cooling customized part (11) according to the size parameters and heat dissipation parameters of the target board (10); Customizing and producing the water-cooling customized part (11) according to the customized production parameters; Selecting a corresponding water-cooling standard part (12) according to the size parameters and heat dissipation parameters of the target board (10) and the matching form of the water-cooling custom part (11); The customized water-cooling component (11) is installed in conjunction with the standard water-cooling component (12) to obtain a water-cooling plate for a target board (10), wherein the water-cooling plate is constructed as the water-cooling plate according to any one of claims 1 to 7.

9. The method for determining a water cooling plate for heat dissipation of electronic devices according to claim 8, characterized in that: The size parameters of the target board (10) include: The size of the target board (10), the size of the electronic device, and the position of the electronic device on the target board (10).

10. The method for determining a water cooling plate for heat dissipation of electronic devices according to claim 8, characterized in that: Determining the customized production parameters of the water-cooling customized component (11) according to the size parameters and heat dissipation parameters of the target board (10) includes: Determining first fixed parameters of the first standard connection portion (131) on the water-cooling custom component (11) according to size parameters and heat dissipation parameters of the target board (10); The size parameters of the water-cooling custom component (11) are determined according to the size parameters, heat dissipation parameters and first connection parameters of the target board (10).

11. The method for determining a water cooling plate for heat dissipation of electronic devices according to claim 10, characterized in that: Determining the size parameters of the water-cooling custom component (11) according to the size parameters, heat dissipation parameters and first connection parameters of the target board (10) comprises: The size of the water-cooling custom component (11) is determined from a plurality of predetermined specifications based on the size parameters, heat dissipation parameters and first connection parameters of the target board (10).

12. The method for determining a water cooling plate for heat dissipation of electronic devices according to claim 10, characterized in that: The method of selecting a corresponding water-cooling standard component (12) according to the size parameters and heat dissipation parameters of the target board (10) and the matching form of the water-cooling custom component (11) comprises: Determining a second fixed parameter of a second standard connection portion (132) of a water-cooling standard component (12) according to a first fixed parameter of a first standard connection portion (131) on the water-cooling custom component (11); From the pre-produced water cooling standard components (12) that meet the second connection parameters, a water cooling standard component (12) of corresponding size is selected according to the size parameters and heat dissipation parameters of the target board (10).

13. The method for determining a water cooling plate for heat dissipation of electronic devices according to claim 8, characterized in that: Also includes: After the heat dissipation parameters of the target board (10) are updated, an updated water-cooling standard component (12) of a corresponding size is selected again from the pre-produced water-cooling standard components (12); The customized water-cooling component (11) is installed in conjunction with the updated standard water-cooling component (12) to obtain a water-cooling plate for the target board (10).

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