Liquid-cooled server mainboard and protection method thereof, and liquid-cooled server

Abstract

The application discloses a liquid-cooled server mainboard and a protection method and a liquid-cooled server thereof, and relates to the technical field of liquid-cooled servers.The method uses polyolefin material as a waterproof coating material, divides the mainboard into multiple processing areas according to functional areas, and makes the waterproof coating material infiltrate and expand to the root of the device pin and the bottom gap under the capillary effect through glue dispensing to form a bottom isolation layer, and then forms a top cover layer in at least part of the processing area.The top cover layer and the bottom isolation layer are homogeneous materials and the molecular chains are interpenetrated and fused at the interface to form a continuous gradient film thickness structure without an interlayer interface, thereby constructing a complete and continuous physical waterproof barrier on the surface of the mainboard.The method realizes the change from passive post-alarm to active pre-protection, and the server mainboard can still keep running without downtime even when the cooling liquid leaks or even immerses the surface of the mainboard, thereby effectively avoiding business interruption and hardware damage caused by liquid leakage.

Description

Technical Field

[0001] This invention relates to the field of liquid-cooled server technology, and in particular to a liquid-cooled server motherboard and its protection method, and a liquid-cooled server. Background Technology

[0002] With the development of technologies such as artificial intelligence and high-performance computing, the power density of data centers continues to rise, and cold-plate liquid cooling technology has become the mainstream heat dissipation solution due to its high heat dissipation efficiency. However, liquid cooling pipes, joints, and cold-plate solder joints are subjected to thermal stress, vibration, and corrosion over a long period of time, posing a risk of coolant leakage. Traditional leak protection solutions typically use an alarm method where a detection rope is wrapped around the cold plate. When coolant leaks, the detection rope becomes wet, triggering an alarm signal and powering down the system. From the start of the leak until the system powers down, coolant inevitably splashes onto circuit board components, easily causing short circuits. Furthermore, the circuit board cannot be repaired after power failure and requires replacement. Therefore, traditional solutions only provide an alarm function and cannot effectively protect the motherboard during a leak. Summary of the Invention

[0003] This invention provides a liquid-cooled server motherboard and its protection method, as well as a liquid-cooled server, to at least solve the problems in related technologies where liquid-cooled server motherboards lack active protection capabilities when coolant leaks, and the boards are prone to short-circuit damage and cannot be repaired.

[0004] This invention provides a method for protecting a liquid-cooled server motherboard, comprising: The server motherboard is divided into multiple processing areas according to functional regions; A waterproof coating material is applied to the root of the device pins and the bottom gap in the processing area, allowing the waterproof coating material to penetrate and spread into the gap under capillary effect to form a bottom isolation layer; wherein, the waterproof coating material is a polyolefin material; A top-layer cover is formed in at least a portion of the processing area; the top-layer cover and the bottom-layer isolation layer are made of the same material and molecular chains interpenetrate and fuse at the interface to form a continuous gradient film thickness structure without interlayer interfaces.

[0005] The present invention also provides a liquid-cooled server motherboard, which is protected by the above-described protection method for liquid-cooled server motherboards.

[0006] The present invention also provides a liquid-cooled server, including the liquid-cooled server motherboard described above.

[0007] This invention utilizes polyolefin materials as the waterproof coating material. Through dispensing, the waterproof coating material is applied and, under capillary effect, it penetrates and extends into the root of the device pins and the bottom gaps to form a bottom isolation layer. Then, a top cover layer is formed in at least a portion of the processing area. The top cover layer and the bottom isolation layer are made of the same material, and molecular chains interpenetrate and fuse at the interface to form a continuous gradient film thickness structure without interlayer interfaces. Thus, a complete and continuous physical waterproof barrier is constructed on the motherboard surface before coolant leakage occurs. Therefore, it can achieve a shift from passive post-event alarm to proactive pre-event protection. Even under extreme conditions such as coolant leakage or even immersion of the motherboard surface, the server motherboard can still maintain normal operation without downtime, effectively avoiding business interruption and hardware damage caused by leakage.

[0008] In addition, the present invention also provides a corresponding liquid-cooled server motherboard and liquid-cooled server for the protection method of liquid-cooled server motherboard, which have the same or corresponding technical features as the above-mentioned protection method of liquid-cooled server motherboard and have the same effect. Attached Figure Description

[0009] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 A flowchart illustrating a method for protecting a liquid-cooled server motherboard according to an embodiment of the present invention; Figure 2 A schematic diagram showing the distribution of processing areas of a liquid-cooled server motherboard divided by functional regions, provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the distribution of the processor socket area provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the distribution of the memory slot area provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the distribution of the high-speed connector area provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the distribution of a chip area without side-extended pins provided in an embodiment of the present invention; Figure 7 A schematic diagram of the distribution of the general circuit area provided in an embodiment of the present invention.

[0011] Among them, 1 is the processor socket area, 2 is the memory slot area, 3 is the high-speed connector area, 4 is the chip area without side-extended pins, 5 is the general circuit area, 11 is the processor socket, 12 is the plastic inner frame, 13 is the decoupling capacitor area, 14 is the metal outer frame, 15 is the bottom insulating sheet, 21 is the memory slot pin area, 22 is the inner wall of the memory slot, 23 is the memory slot heat dissipation hole area, 31 is the connector pin area, 32 is the connector gold finger, 33 is the connector shell, 41 is the chip bottom gap area, 42 is the chip shell, 43 is the chip side wall pad area, 44 is the chip inter-chip blank area, 51 is the printed circuit board substrate trace area, 52 is the conventional chip area, 53 is the passive component area, and 54 is the low-speed connector area. Detailed Implementation

[0012] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0013] It should be noted that, in the description of this invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., used in this invention are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0014] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0015] The embodiments of the present invention provide a protection method for a liquid-cooled server motherboard. The method is described in detail below in conjunction with the execution flow of the protection method for a liquid-cooled server motherboard. Figure 1 A flowchart of a method for protecting a liquid-cooled server motherboard provided in an embodiment of the present invention is shown below. Figure 1 As shown, the method includes: S101. Divide the server motherboard into multiple processing areas according to functional regions.

[0016] It should be noted that functional areas refer to physical areas on the liquid-cooled server motherboard that have different functional roles and structural characteristics. Processing areas refer to the set of areas that are classified according to the coating process requirements and processed using the same or similar coating parameters.

[0017] In step S101, the present invention can divide the server motherboard into multiple processing areas according to functional regions. Since the device types, structural features, heat dissipation requirements, and electrical connection requirements differ in different areas of the server motherboard, the requirements for coating thickness also vary. By dividing the motherboard into functional areas, differentiated coating thickness parameters can be matched to different processing areas, thereby achieving heat dissipation performance, signal integrity, and waterproofing on the same motherboard.

[0018] S102. Apply waterproof coating material to the root of the device pins and the bottom gap in the processing area, so that the waterproof coating material can penetrate and spread into the gap under the capillary effect to form the bottom isolation layer; wherein, the waterproof coating material is a polyolefin material.

[0019] It should be noted that waterproof coating materials refer to functional materials applied to the surface of liquid-cooled server motherboards to prevent coolant penetration and protect the motherboard circuitry from short circuits. The polyolefin materials used in these waterproof coatings are a class of polymers polymerized from olefin monomers. Their molecular chains contain only C-C and CH nonpolar bonds, exhibiting intrinsic hydrophobicity and excellent electrical insulation properties. Polyolefin materials are soluble in low-boiling-point environmentally friendly solvents or can be formulated into aqueous dispersions. They dry rapidly through solvent evaporation, requiring no additional heating or UV curing, thus avoiding the potential thermal damage to onboard components and connector plastic parts caused by heat curing. Furthermore, the film thickness of polyolefin materials can be controlled at the micron level, ensuring waterproof performance without affecting the overall heat dissipation performance and signal transmission quality of the motherboard.

[0020] The root of a device lead refers to the connection point between the metal leads of an electronic device (such as a chip, connector, or slot) and the pads on a printed circuit board (PCB). This area contains microscopic geometric discontinuities and stress concentration zones. Bottom voids refer to the narrow space between the bottom of a surface-mount device (especially ball grid array (BGA) chip, square flat no-lead (SFR) chip, or other chip without side-extending leads) and the surface of the PCB. This space can be formed by solder balls or solder, and its height is typically between tens and hundreds of micrometers. Dispensing refers to the operation of applying liquid waterproof coating material to a target processing area in a controlled volume and position using dispensing equipment. Capillary effect refers to the physical phenomenon of a liquid spontaneously flowing, penetrating, and spreading within a narrow space due to surface tension and wetting.

[0021] In step S102, this invention can apply a waterproof coating material to the root of the device pins and the bottom gaps in the processing area using dispensing. Since the root of the device pins and the bottom gaps are microscopic slit structures, spraying methods make it difficult for the coating material to effectively penetrate these areas. This invention utilizes dispensing to directly deliver the waterproof coating material to the target location. Driven by capillary effect, the coating material autonomously weeps and expands into the microscopic slits such as the root of the pins, around the solder joints, and the bottom gaps of the chip, thereby achieving precise protection for these critical weak points. This underlying isolation layer provides a basic waterproof barrier for step S103, compensating for the limitations of spraying processes in wetting deep cavities and bottom areas.

[0022] S103. A top cover layer is formed in at least a portion of the processing area; the top cover layer and the bottom isolation layer are made of the same material and molecular chains interpenetrate and fuse at the interface to form a continuous gradient film thickness structure without interlayer interfaces.

[0023] It should be noted that "at least in some processed areas" means that the top coating layer is not limited to all processed areas; the coating layer can be formed in some or all processed areas depending on the actual protection requirements. Molecular chain interpenetration fusion refers to the process where, when the top coating layer and the bottom isolation layer of homogeneous materials come into contact at the interface, the surface molecular chains undergo mutual penetration, entanglement, and rearrangement under the action of a solvent, causing the top coating layer and the bottom isolation layer to fuse into one at the molecular scale. No interlayer interface means that there is no distinguishable physical boundary between the top coating layer and the bottom isolation layer, exhibiting a continuous and uniform microstructure. A continuous gradient film thickness structure means that the coating thickness changes continuously in three-dimensional space without abrupt changes or breaks, forming a film thickness distribution that smoothly transitions from the bottom layer to the top layer.

[0024] In step S103, the present invention can form a top cover layer at least in a portion of the processing area. This top cover layer is formed by spraying after the bottom isolation layer has dried, covering the macroscopic surface of the motherboard. Because the top cover layer and the bottom isolation layer are made of homogeneous polyolefin materials, their molecular chains interpenetrate and fuse at the interface, eliminating the physical interface present in traditional multilayer coatings. This results in a continuous gradient film thickness structure without interlayer interfaces after curing, avoiding the risk of interlayer separation while ensuring the overall density and waterproof integrity of the coating.

[0025] In the liquid-cooled server motherboard protection method provided in this embodiment of the invention, a polyolefin material is used as the waterproof coating material. Dispensing is applied to fill the gaps at the root and bottom of the device pins using capillary effect to form a bottom isolation layer. A top cover layer is then formed in at least a portion of the processed area. The top cover layer and the bottom isolation layer, being homogeneous materials, undergo molecular chain interpenetration and fusion at the interface to form a continuous gradient film thickness structure without interlayer interfaces. This structure has no distinguishable physical boundaries at the microscopic level, the coating is dense and free of microscopic defects, eliminating the failure risks of traditional coatings such as interlayer separation and micropore penetration. Thus, a complete and continuous physical waterproof barrier is constructed on the motherboard surface before coolant leakage occurs. Therefore, it can achieve a shift from passive post-event alarm to proactive pre-event protection, achieving an effective continuous protection duration of more than 12 hours. Even under extreme conditions such as coolant leakage or even immersion of the motherboard surface, the server motherboard can still maintain normal operation without downtime, effectively avoiding business interruption and hardware damage caused by leakage.

[0026] Furthermore, in specific implementation, in the above-mentioned protection method for liquid-cooled server motherboards provided in the embodiments of the present invention, the selection process of waterproof coating materials may include: using volume resistivity, dielectric constant, dielectric loss factor, water absorption rate, static water contact angle, Shore hardness, elongation at break, and thermal conductivity as screening indicators; and selecting polyolefin materials with volume resistivity higher than a preset resistivity threshold, dielectric constant lower than a preset dielectric constant threshold, dielectric loss factor lower than a preset dielectric loss factor threshold, water absorption rate lower than a preset water absorption rate threshold, static water contact angle higher than a preset contact angle threshold, Shore hardness lower than a preset hardness threshold, elongation at break higher than a preset elongation threshold, and thermal conductivity higher than a preset thermal conductivity threshold as waterproof coating materials.

[0027] It should be noted that, in order to achieve the goals of electrical safety, signal integrity, heat dissipation compatibility, and long-term waterproofing after the server motherboard is coated with a completely unshielded coating, this invention constructs a multi-dimensional screening index system for waterproof coating materials, which includes electrical performance, high-frequency characteristics, liquid resistance, mechanical flexibility, and workability. Table 1 quantifies the various performance parameters of the waterproof coating materials, serving as the basis for this screening method.

[0028] Table 1. Multi-dimensional performance requirements for waterproof coating materials for server motherboards

[0029] The aforementioned preset thresholds can be adjusted according to actual application scenarios and performance requirements. For example, the preset threshold for volume resistivity can be determined based on the operating voltage of the server motherboard, the preset thresholds for dielectric constant and dielectric loss factor can be determined based on the signal transmission rate, and the preset thresholds for water absorption rate and static water contact angle can be determined based on the type of coolant. Those skilled in the art can determine appropriate threshold values ​​based on specific operating conditions through routine experiments or by referring to industry standards.

[0030] After extensive material evaluation and comparison, polyolefin materials were selected as the main body of the waterproof coating from a variety of candidate organic coatings. The performance of polyolefin materials, especially polyisobutylene, polybutadiene, cyclic olefin copolymers and their modified systems, in meeting the above screening criteria is as follows: Regarding electrical insulation performance, the volume resistivity of the coating material after curing is required to be no less than 1×10¹. 4 Ω·cm, ensuring reliable electrical isolation between dense power / signal networks and preventing logic errors or electrochemical migration caused by leakage current. The intrinsic volume resistivity of polyolefin resins can reach 1×10¹. 5 A value of Ω·cm or higher meets this requirement.

[0031] Regarding high-frequency dielectric properties, the coating's dielectric constant must not exceed 2.7 and its dielectric loss factor must not exceed 0.01 at a test frequency of 1 GHz. A low dielectric constant controls the increase in parasitic capacitance to ground introduced by the coating, ensuring impedance continuity for high-speed signals; a low dielectric loss factor keeps the coating's additional contribution to insertion loss in high-speed links negligible. Polyolefin molecular chains contain only C-C and CH nonpolar bonds, with typical dielectric constants of 2.2 to 2.5 and dielectric loss factors of 0.0005 to 0.002, significantly superior to polar resins such as epoxy and acrylic resins, meeting the stringent signal integrity requirements of high-speed buses (such as PCIe 5.0 / 6.0, DDR5, etc.).

[0032] Regarding hydrophobicity and resistance to liquid penetration, the coating material must have a water absorption rate of no more than 0.1% (tested according to ASTM D570 standard, under 24-hour immersion conditions), and a static water contact angle of no less than 100°. Extremely low water absorption means the coating itself has intrinsic barrier properties against water and coolant molecules, preventing the formation of penetration pathways due to coating swelling; the high contact angle imparts liquid-repellent properties to the coating surface, causing dripping coolant to roll off quickly, preventing liquid film retention and continuous erosion. The nonpolar bonds of polyolefins typically result in a water absorption rate of less than 0.05%, a contact angle of 105° to 110°, and intrinsic chemical inertness to commonly used coolant working fluids in liquid cooling systems (such as propylene glycol, deionized water-based coolants, etc.). Long-term immersion does not cause swelling, dissolution, or interfacial reactions, maintaining the integrity and adhesion of the coating under long-term immersion conditions.

[0033] Regarding film flexibility and connector compatibility, the coating must have a Shore hardness of no more than 80A and an elongation at break of no less than 200% after curing. This ensures that the coating can elastically deform with the substrate under connector insertion / removal and thermal cycling stress, without losing its protective properties due to brittle cracking. Especially when the coating covers the connector spring, the flexible coating can be penetrated by the metal micro-protrusions under the normal contact force of the spring (no less than 0.3N / pin), thus establishing a reliable metal-metal contact with controllable contact resistance increments. In contrast, rigid acrylic and polyurethane materials generally have a hardness greater than Shore 60D, failing to meet connector compatibility requirements, while polyolefin elastomers can simultaneously achieve low modulus and high resilience.

[0034] Regarding the compatibility of thin film formation and heat dissipation, the coating material is required to form a continuous, pinhole-free coverage with a dry film thickness not exceeding 60 μm, and a bulk thermal conductivity not less than 0.15 W / (m·K). The low viscosity of polyolefin coatings allows for the formation of micron-level ultrathin coatings of 10 μm through a single precision spraying. This results in an extremely low increase in equivalent thermal resistance. Combined with its thermal conductivity, it ensures that the surface temperature rise of high-temperature devices such as power modules and inductors does not exceed 5°C, without affecting the normal heat dissipation path at the board level.

[0035] Regarding rapid, non-curing operation, to match the high-volume, unobstructed, and efficient coating production cycle of server motherboards, this invention incorporates the coating's process window into the screening criteria: the coating must have a surface drying time of less than 5 minutes after atomization, and require no additional heating or UV irradiation curing, naturally drying to form a film at room temperature; simultaneously, the coating viscosity during spraying must be below 100 cP to ensure good ultrasonic atomization quality and good wetting and leveling on complex topological surfaces. Polyolefin coatings are soluble in low-boiling-point environmentally friendly solvents or can be formulated into aqueous dispersions, achieving rapid surface drying through solvent evaporation. This eliminates the need for a curing oven, enabling an extremely short turnaround time from spraying to a processable state, completely avoiding the potential thermal damage risks to onboard devices and connector plastic parts caused by thermal curing.

[0036] As described above, in the liquid-cooled server motherboard protection method provided by this embodiment of the invention, the polyolefin material can be selected from one or more of polyisobutylene, polybutadiene, and cyclic olefin copolymers, or from one or more of modified polyisobutylene systems, modified polybutadiene systems, and modified cyclic olefin copolymer systems, or any combination of the above materials. The film thickness of the polyolefin material can be controlled to be less than or equal to 60 μm, the surface drying time after atomization can be controlled to be less than 5 minutes, and it can be formed naturally at room temperature without heating or UV curing. The spray viscosity can be controlled to be less than 100 cP. These process parameters ensure efficient coating and rapid turnover in the mass production of server motherboards. Based on meeting the above screening criteria, the polyolefin material has the process characteristics of low viscosity, fast surface drying, and room temperature film formation, supporting efficient coating and rapid turnover in mass production; at the same time, the coating formed by it possesses comprehensive performance from the material source, including blocking coolant penetration, ensuring high-speed signal transmission, and ensuring connector contact reliability.

[0037] Furthermore, in a specific implementation, in the above-mentioned protection method for liquid-cooled server motherboard provided in the embodiments of the present invention, step S101 divides the server motherboard into multiple processing areas according to functional areas, which may specifically include: dividing the server motherboard into processing areas including a processor socket area, a memory slot area, a high-speed connector area, a chip area without side-extended pins, and a general circuit area.

[0038] Figure 2 This is a schematic diagram illustrating the distribution of processing areas in a liquid-cooled server motherboard according to functional regions, provided in an embodiment of the present invention. In implementation, as... Figure 2As shown, the processing area of ​​the server motherboard is divided into five categories: processor socket area 1, memory slot area 2, high-speed connector area 3, chip area without side extension pins 4, and general circuit area 5. Processor socket area 1 refers to the area containing the socket for installing a processor (such as a central processing unit) and its surrounding circuitry; memory slot area 2 refers to the area containing the slot for installing memory modules and its surrounding circuitry; high-speed connector area 3 refers to the area containing high-speed connectors used for connecting external cables or inter-board connections, with transmission rates of 5GB / s or higher classified as high-speed connectors, such as PCIe slots, SAS interfaces, and high-speed backplane connectors; non-side-extending pin chip area 4 refers to the area containing chips without side-extending metal pins, such as Ball Grid Array (BGA) chips and Quad Flat No-lead Package (QFN) chips, and their surrounding circuitry; general-purpose circuit area 5 refers to the area containing the printed circuit board substrate trace area, conventional chip area, passive component area, and low-speed connector area, excluding the above four areas. Here, general-purpose circuit area 5 can be understood as the conventional circuit area, while the low-speed connector area is the area containing low-speed connectors, with transmission rates below 1GB / s classified as low-speed connectors. Through the division of these five areas, this invention can implement differentiated coating strategies based on the structural characteristics and protection requirements of different components on the server motherboard.

[0039] Furthermore, in a specific implementation, in the above-described liquid-cooled server motherboard protection method provided in the embodiments of the present invention, after performing step S101 to divide the server motherboard into multiple processing areas according to functional areas, it may further include: setting the coating dry film thickness parameter of the processor socket area 1 to a first thickness; setting the coating dry film thickness parameter of the memory slot area 2 to a second thickness; setting the coating dry film thickness parameter of the high-speed connector area 3 to a first thickness; setting the coating dry film thickness parameter of the chip area 4 without side extension pins to a third thickness; and setting the coating dry film thickness parameter of the general circuit area 5 to a first thickness; wherein, the first thickness is greater than the second thickness and less than the third thickness.

[0040] In implementation, this invention can employ a zoned gradient film thickness design based on the differentiated requirements for heat dissipation, electrical connections, and waterproof protection in different areas. The first thickness can be set to less than or equal to 30 μm, suitable for the processor socket area 1, high-speed connector area 3, and general circuit area 5. The second thickness can be set to less than or equal to 10 μm, suitable for the memory slot area 2. This area needs to ensure that the coating can be effectively pushed away when the memory module is inserted, without affecting the reliability of the metal contact between the memory and the slot, while maintaining the permeability of the heat dissipation holes above the memory slot. The third thickness can be set to less than or equal to 50 μm, suitable for chip areas 4 without side-extended pins. Ball grid array (BGA) packaged chips and square flat no-lead packaged chips in this area have complex bottom gaps and sidewall structures, requiring a relatively thicker coating to ensure sufficient capillary filling and protective coverage. Through the above-mentioned zoned differential thickness settings, heat dissipation performance, signal integrity, and waterproofing efficiency can be achieved on the same motherboard, resolving the contradiction between the deterioration of heat dissipation by thick coatings and the insufficient protection of thin coatings in traditional uniform thick coating schemes.

[0041] Furthermore, in a specific implementation, in the above-mentioned protection method for liquid-cooled server motherboard provided in the embodiments of the present invention, step S102 applies adhesive to the root of the device pins and the bottom gap in the processing area, which may specifically include: applying adhesive to the root of the device pins, the bottom gap and the side wall pads in the processing area at fixed points and in fixed quantities using a needle valve dispensing method.

[0042] In practice, needle valve dispensing is a dispensing method that controls the amount and application position of adhesive through the reciprocating motion of a needle-shaped valve core, enabling precise distribution of minute amounts of adhesive. This invention uses needle valve dispensing to apply adhesive to the root of device leads, bottom gaps, and sidewall pads in the processing area, ensuring that the waterproof coating material is precisely delivered to microscopic gaps and deep cavities that are difficult to wet effectively by spraying processes. The application position and amount of adhesive in needle valve dispensing can be precisely adjusted according to the size of different devices and the width of gaps, ensuring sufficient protective coverage while avoiding material waste or impact on adjacent devices due to excessive adhesive application.

[0043] Furthermore, in specific implementation, in the above steps, the device pin roots, bottom gaps and sidewall pads in the processing area are applied with fixed-point and fixed-quantity adhesive. Specifically, this may include: controlling the adhesive volume at each point to be between 0.05μL and 0.5μL, and applying fixed-point and fixed-quantity adhesive to the device pin roots, bottom gaps and sidewall pads in the processing area so that the dry film thickness of the formed bottom isolation layer can be between 1μm and 15μm.

[0044] In practice, the application volume range of 0.05 μL to 0.5 μL is an optimized parameter range. When the application volume is less than 0.05 μL, the coating material may not be sufficient to completely cover the target gap area, resulting in a protective blind spot; when the application volume is greater than 0.5 μL, the coating material may overflow into adjacent areas, affecting the normal operation of the device or causing unnecessary material consumption. By controlling the application volume within this range and combining it with the self-wetting and spreading effect of capillary action, the thickness of the resulting bottom isolation layer dry film is controlled between 1 μm and 15 μm, ensuring sufficient waterproof protection without affecting the electrical connection reliability or heat dissipation performance of the device pins due to excessive coating thickness.

[0045] Furthermore, in specific implementation, in the above steps, when the processing area is processor socket area 1, the root of the device pins and the bottom gap in processor socket area 1 are fixedly and quantitatively coated with adhesive. Specifically, this may include: applying adhesive along the periphery of the bottom insulating sheet of processor socket area 1 to form an annular hydrophobic sealing dam, and applying double-end adhesive to each decoupling capacitor array at the bottom of processor socket area 1 to wrap the capacitor electrode solder joints.

[0046] Figure 3 This is a schematic diagram illustrating the distribution of the processor socket area according to an embodiment of the present invention. In implementation, as... Figure 3 As shown, the dispensing operation of the processor socket area 1 involves multiple sub-areas. The processor socket area 1 includes a processor socket slot 11, a plastic inner frame 12, a decoupling capacitor area 13, a metal outer frame 14, and a bottom insulating sheet 15. The processor socket slot 11 refers to the slot structure on the processor socket body used to mount the processor. The plastic inner frame 12 refers to the plastic frame structure surrounding the processor socket slot. The decoupling capacitor area 13 refers to the area where decoupling capacitors are located at the bottom or periphery of the processor socket. The metal outer frame 14 refers to the metal structure surrounding the processor socket. The bottom insulating sheet 15 refers to the insulating pad or thin layer structure between the bottom of the processor socket and the printed circuit board.

[0047] For the processor socket area 1, needle valve dispensing is applied around the perimeter of the bottom insulating sheet 15. Due to the height difference between the bottom insulating sheet 15 and the surface of the printed circuit board, a waterproof coating with a set dry film thickness (e.g., 10 μm) can be formed at the edge of the sheet. This annular hydrophobic sealing dam utilizes the hydrophobic properties of the waterproof coating material to prevent coolant flowing along the motherboard surface from entering the plastic inner frame 12 area of ​​the processor socket slot 11, thereby protecting the processor pins.

[0048] Meanwhile, a large number of decoupling capacitors are densely arranged at the bottom of the processor socket area 1 for filtering and energy storage of the processor chip. A needle valve is used to dispense adhesive into the decoupling capacitor area 13, dispensing adhesive to each capacitor. Both ends of the bottom electrode of each capacitor are covered with a waterproof coating of a set dry film thickness, thus protecting the bottom area of ​​the decoupling capacitor area 13.

[0049] Furthermore, this invention can perform a global, unmasked coating on the processor socket area 1, controlling the dry film coating thickness to within 30 μm. The coating area covers the processor socket slot 11, the decoupling capacitor area 13, and the metal frame 14, effectively preventing coolant from splashing downwards. This coating thickness can be penetrated by the metal pins under the pressure of the processor being installed, without affecting the normal signal transmission of the processor. This step, by controlling the dry film thickness to avoid adverse effects, achieves an unmasked coating process, significantly reducing the complexity of the printed circuit board assembly process.

[0050] Alternatively, if the annular hydrophobic sealing dam and decoupling capacitor electrode solder joints formed by the dispensing step alone are sufficient to meet the protection requirements of the processor socket area 1, the spraying step can be omitted, and the leakage above can be blocked and protected by the complete liquid cooling plate covering the processor.

[0051] Furthermore, in specific implementation, in the above steps, when the processing area is the memory slot area 2 or the high-speed connector area 3, the root of the device pin in the memory slot area 2 or the high-speed connector area 3 is applied with glue at fixed points and in fixed quantities. Specifically, this may include applying glue to the metal pins of the memory slot area 2 or the high-speed connector area 3 point by point to form a wrapping barrier at the root of the metal pins.

[0052] In implementation, the metal pins of memory slot area 2 and high-speed connector area 3 are critical connection points for soldering to the printed circuit board. Microscopic gaps exist at the junction between the pin roots and the circuit board, creating weak points for coolant intrusion. This invention applies adhesive point-by-point to each metal pin, allowing the waterproof coating material to encapsulate the solder joint and metal root of each pin, forming a complete protective barrier around the pin root. This barrier both blocks the coolant's path along the pin surface and seals the gaps between the pin and the circuit board.

[0053] Figure 4 This is a schematic diagram showing the distribution of the memory slot area provided in an embodiment of the present invention. Figure 4As shown, the memory slot area 2 includes a memory slot pin area 21, a memory slot inner wall 22, and a memory slot heat dissipation hole area 23. The memory slot pin area 21 refers to the area where the metal pins of the memory slot are soldered to the printed circuit board. The memory slot inner wall 22 refers to the inner sidewall surface of the memory slot where the metal contact springs used for interfacing with the gold fingers of the memory module are located. The memory slot heat dissipation hole area 23 refers to the area of ​​heat dissipation holes opened on the top or sidewall of the memory slot. This invention allows for point-by-point application of adhesive to all the metal pins of the memory slots soldered to the printed circuit board in the memory slot area 2, ensuring that all pins are covered with a waterproof coating of a set dry film thickness (e.g., 10 μm), forming a protective barrier at the base of the metal pins and achieving waterproof performance at the bottom of the memory slot. Subsequently, a global, unmasked spray coating is applied to the memory slot area 2, controlling the dry film coating thickness to within 10 μm. The spraying area covers the memory slot pin area 21, the memory slot inner wall 22, and the memory slot heat dissipation hole area 23, effectively preventing coolant from dripping from the surface of the memory module into the memory slot.

[0054] Figure 5 This is a schematic diagram showing the distribution of the high-speed connector region provided in an embodiment of the present invention. Figure 5 As shown, the high-speed connector area 3 includes a connector pin area 31, connector gold fingers 32, and a connector housing 33. The connector pin area 31 refers to the area where the metal pins of the connector are soldered to the printed circuit board. The connector gold fingers 32 refer to the metal contact pieces or terminals inside the connector used for mating with external cables or inter-board connectors. The connector housing 33 refers to the insulating shell of the connector body. This invention allows for point-by-point application of adhesive to all metal pins of the high-speed connector soldered to the printed circuit board in the high-speed connector area 3, ensuring that all pins are covered with a waterproof coating of a set dry film thickness (e.g., 10 μm), achieving waterproof performance at the bottom of the connector. Subsequently, a global, unmasked spray coating is performed on the high-speed connector area 3, controlling the dry film coating thickness to within 30 μm, covering the connector pin area 31, connector gold fingers 32, and connector housing 33. The main purpose of this spray coating operation is to provide secondary protection to the connector pin area 31, achieving effective protection in conjunction with the adhesive application.

[0055] Furthermore, in specific implementation, in the above steps, when the processing area is a chip area 4 without side-extended pins, the bottom gap and sidewall pads of the chip in the chip area 4 without side-extended pins are applied with fixed-point and quantitative adhesive. Specifically, this may include: when the chip is a ball grid array package chip, applying adhesive along the four edges of the chip, so that the coating penetrates into the bottom gap of the chip under the drive of capillary force to cover all the solder ball roots and printed circuit board pads; when the chip is a square flat leadless package chip, applying adhesive along the four edges of the chip, so that the coating climbs capillarily from the bottom up along the sidewall pad area to cover the exposed metal surface of the sidewall pads.

[0056] In practice, ball grid array packaged chips and square flat leadless packaged chips are two typical types of chips without side-extending pins. Their common feature is that they do not have outward-extending metal pins, making it difficult for liquid to adhere when directly spraying on the vertical outer wall, and the coating thickness is not fully covered.

[0057] Figure 6 This is a schematic diagram illustrating the distribution of a chip region without side-extended pins, provided in an embodiment of the present invention. Figure 6 As shown, the chip area 4 without side-extended pins includes a bottom gap area 41, a chip casing 42, a sidewall pad area 43, and an inter-chip blank area 44. The bottom gap area 41 refers to the area where the gap is formed between the bottom of the chip body and the surface of the printed circuit board. The chip casing 42 refers to the top and sides of the chip package. The sidewall pad area 43 refers to the area where the exposed metal solder terminals or pads are located on the side edges of the chip package. The inter-chip blank area 44 refers to the exposed printed circuit board substrate area where no components or traces are placed between multiple chips on the motherboard.

[0058] For ball grid array packaged chips, a needle valve is first used to apply adhesive around the chip. Under capillary action, the waterproof coating quickly extends to the bottom gap area 41 of the chip to provide bottom protection, ensuring that all solder balls are wrapped with a waterproof coating of a set dry film thickness (e.g., 10μm), thus achieving the waterproof performance of the bottom of the ball grid array packaged chip.

[0059] For square flat no-lead package chips, the waterproof coating applied around the perimeter can spread approximately 0.15 mm upwards along the sidewall pad area under capillary action, forming a waterproof coating with a thickness of approximately 10 μm, covering the exposed metal surface of the sidewall pads, and achieving the first protection for the sidewall pads.

[0060] Next, a global, unmasked spray coating is applied to the chip area 4 without side-extended leads, controlling the dry film coating thickness to within 50 μm. The coating area covers the chip casing 42, the chip sidewall pad area 43, and the inter-chip blank area 44. The main purpose of this step is to provide global protection for this area, while also strengthening the secondary protection for the outermost solder balls of the bottom gap area 41 of the ball grid array package chip and the pins of the sidewall pad area 43 of the square flat leadless package chip. At the outer edge of the bottom gap area 41 of the chip, the top cover layer and the bottom isolation layer meet, achieving a dry film coating thickness of more than 30 μm at this meeting point, further enhancing the waterproof capability of this weak point.

[0061] Furthermore, in a specific implementation, in the above-mentioned protection method for liquid-cooled server motherboard provided in the embodiments of the present invention, when the processing area includes the general circuit area 5, before forming the top cover layer, it may also include: applying adhesive to the chip pin roots, capacitors, and resistors in the general circuit area 5 to form an enhanced protective layer.

[0062] Figure 7 This is a schematic diagram showing the distribution of a general circuit area provided for an embodiment of the present invention. In implementation, as... Figure 7 As shown, the general circuit area 5 may include a printed circuit board substrate trace area 51, a conventional chip area 52, a passive component area 53, and a low-speed connector area 54. The printed circuit board substrate trace area 51 refers to the copper foil trace distribution area on the motherboard responsible for transmitting electrical signals. The conventional chip area 52 refers to the area on the motherboard where active components with logic operations or data processing functions are installed. The passive component area 53 refers to the area on the motherboard where passive electronic components that do not require an external power supply are located. The low-speed connector area 54 refers to the area on the motherboard where interfaces for connecting external devices or internal modules with transmission rates below 1GB / s are located, such as serial ports, USB interfaces, and front panel control interfaces. Although the device integration and power consumption per unit area in the general circuit area 5 are lower than critical areas such as the processor socket area 1, it still faces the risk of coolant leakage. Before forming the top cover layer, applying adhesive to the chip pin roots, capacitors, resistors, and low-speed connectors in the general circuit area 5 can pre-form an enhanced protective layer on these critical parts of the device pins before spraying. This enhanced protective layer, together with the subsequent top cover layer, constitutes a dual protection mechanism, further improving the protection reliability of the general circuit area 5. This step is optional and can be implemented according to actual protection requirements. Afterwards, a global, unmasked spray coating is performed on the general circuit area 5, controlling the dry film coating thickness to within 30μm. The coating area covers the printed circuit board substrate trace area 51, the conventional chip area 52, the passive component area 53, and the low-speed connector area 54. This spray coating operation achieves complete coverage of most components and board surfaces in the general circuit area 5 without affecting the heat dissipation and electrical performance of the general circuit area 5.

[0063] Furthermore, in a specific implementation, in the above-mentioned protection method for liquid-cooled server motherboards provided in the embodiments of the present invention, step S103 forms a top-layer cover layer in at least a portion of the processing area, which may specifically include: forming a top-layer cover layer in at least a portion of the processing area by spraying.

[0064] In practice, spraying is a coating process in which liquid coating material is atomized by a spray valve and sprayed onto the target surface at a certain speed. Unlike the point-to-point and metered application of adhesive in dispensing, spraying can achieve rapid and uniform coating coverage over a large macroscopic area. This invention uses spraying to form a top cover layer in at least a portion of the processed area. This top cover layer covers the bottom isolation layer, completely covering the areas between and outside the bottom isolation layers, forming a continuous, integral waterproof barrier. The unmasked nature of spraying allows the coating material to cover the exposed surfaces of various devices, including connectors and slots, without the need for prior physical masking of these devices, significantly reducing manufacturing costs and process complexity.

[0065] Furthermore, in specific implementation, in the above steps, a top cover layer is formed in at least part of the processing area by spraying. Specifically, this may include: spraying at least part of the processing area before the bottom isolation layer is surface dry and not completely cured, using the solvent in the liquid coating used for spraying to slightly dissolve the bottom isolation layer, so that the molecular chains of the top cover layer and the bottom isolation layer interpenetrate at the interface.

[0066] In practice, surface drying refers to the state where the solvent on the coating surface evaporates, forming a non-sticky, dry skin, but the coating interior is not yet fully cured and still retains a certain degree of fluidity and reactivity. This invention performs the top-layer spraying before the bottom isolation layer is surface-dried and fully cured. This timing control is crucial for achieving molecular chain interpenetration and fusion at the interface between the two homogeneous materials. The second-stage spraying can be performed after the first-stage coating has surface-dried (e.g., less than 5 minutes). When the sprayed liquid coating comes into contact with the surface-dried bottom isolation layer, the solvent in the liquid coating has a micro-dissolving effect on the surface of the bottom isolation layer, activating and enabling the polyolefin molecular chains on the bottom isolation layer surface to move. At this point, the polyolefin molecular chains in the top-layer coating and the activated molecular chains on the bottom surface interpenetrate and entangle at the interface. As the solvent further evaporates, both coatings cure simultaneously, and the interpenetrating molecular chain structure is fixed, forming a continuous gradient film thickness structure without interlayer interfaces. This eliminates the interlayer interface problems commonly found in traditional multilayer coating processes, avoids failure modes such as interlayer separation and blistering, and significantly improves the overall density and waterproof reliability of the coating.

[0067] Furthermore, in a specific implementation, in the above-mentioned liquid-cooled server motherboard protection method provided in the embodiments of the present invention, while performing step S103 to spray at least a portion of the processing area, it also includes: controlling the dry film thickness of the top cover layer to be 1μm to 50μm.

[0068] In implementation, the dry film thickness of the top cover layer is controlled within the range of 1μm to 50μm. The lower limit of 1μm ensures sufficient physical integrity and a continuous, pinhole-free coverage effect for the top cover layer. A thickness below this may result in microscopic defects due to excessive thinness, affecting waterproof performance. The upper limit of 50μm is based on a comprehensive optimization of heat dissipation performance and material cost. A thickness exceeding this increases unnecessary thermal resistance and material consumption, and has limited effect on further improving waterproof performance. Within this thickness range, the incremental temperature rise of the coating on the surface of high-power devices on the server motherboard is controlled within 5°C, without affecting the normal heat dissipation path at the board level.

[0069] Furthermore, in specific implementation, when the processing area is the processor socket area 1, a top cover layer is formed in the processor socket area 1 by spraying. Specifically, this may include spraying the processor socket slot 11, plastic inner frame 12, decoupling capacitor area 13 and metal outer frame 14 of the processor socket area 1, and controlling the dry film thickness of the top cover layer to be less than or equal to 30μm; the top cover layer is penetrated by the socket contact pins under the processor installation pressure.

[0070] In practice, the thickness of the top cover layer of the processor socket area 1 is controlled to be below 30 μm. This thickness allows the coating to be penetrated by the socket contact pins under the pressure of subsequent processor installation, thus not affecting normal signal transmission between the processor and the socket. Simultaneously, this thickness is sufficient to form an effective waterproof cover on the macroscopic surface of the processor socket area 1, preventing coolant from splashing downwards into the processor socket slot 11.

[0071] Alternatively, if the annular hydrophobic sealing dam and decoupling capacitor electrode solder joint wrapping formed by the dispensing step alone are sufficient to meet the protection requirements of the processor socket area 1, the spraying step can be omitted. This flexibility allows the process to be adjusted according to the actual protection requirements.

[0072] Furthermore, in specific implementation, in the above steps, when the processing area is the memory slot area 2, a top cover layer is formed in the memory slot area 2 by spraying. Specifically, this may include: spraying the top cover layer in the heat dissipation hole area of ​​the memory slot area 2 to form a top cover layer, so that the dripping coolant will condense into liquid droplets in the heat dissipation hole area under the action of surface tension and cannot enter the inner wall of the slot of the memory slot area 2; controlling the dry film thickness of the top cover layer to be less than or equal to 10μm; the top cover layer on the inner wall of the slot is pushed away by the elastic contact force of the gold fingers when the memory module is inserted to establish metal contact.

[0073] In implementation, the thickness of the top cover layer in memory slot area 2 is controlled to be below 10μm. The 10μm dry film coating forms a hydrophobic film in the heat dissipation hole area of ​​the memory slot. When coolant drips from the surface of the memory module, due to the hydrophobic properties and low surface energy of the coating surface, the coolant condenses into multiple tiny droplets above the heat dissipation hole area under the action of surface tension. These droplets are larger than the aperture of the heat dissipation holes, thus preventing them from entering the inner wall of the memory slot. Simultaneously, the top cover layer on the inner wall 22 of the memory slot can be effectively pushed away by the elastic contact force of the gold fingers when the memory module is inserted, allowing a reliable metal-to-metal contact to be established between the gold fingers of the memory module and the metal contacts on the inner wall of the memory slot. This prevents adverse effects such as difficulty in memory insertion and signal interruption caused by the coating. The aforementioned 10μm ultra-thin coating design balances heat dissipation permeability, coolant barrier, and reliable contact with the gold fingers in the memory slot area. It simultaneously meets the waterproofing, heat dissipation, and electrical connection requirements of the memory slot area in the same region, without requiring physical shielding of the memory slot, thus simplifying the manufacturing process.

[0074] Furthermore, in specific implementation, in the above steps, when the processing area is the high-speed connector area 3, a top cover layer is formed in the high-speed connector area 3 by spraying. Specifically, this may include: spraying a top cover layer in the high-speed connector area 3, controlling the dry film thickness of the top cover layer to be less than or equal to 30μm; the top cover layer is pushed away by the connector contacts when the connector cable is inserted to establish an electrical connection.

[0075] In implementation, the thickness of the top cover layer in the high-speed connector area 3 is controlled below 30μm. This thickness allows the coating to be effectively pushed away by the internal metal contacts when the connector cable is inserted, enabling a reliable electrical connection between the connector contacts without affecting the transmission quality of high-speed signals. Simultaneously, this thickness is sufficient to form an effective waterproof cover on the exposed surface of the connector, especially providing secondary redundant protection at the junction of the connector pin area 31 and the printed circuit board. The 30μm thick coating is effectively pushed away when the connector cable is inserted, without affecting the high-speed signal quality, achieving a shielding-free coating process for the high-speed connector area 3. Due to the low modulus flexibility of the polyolefin coating (Shore hardness less than or equal to 80A, elongation at break greater than or equal to 200%), the coating can be penetrated or elastically pushed away by metal micro-protrusions under the action of spring normal contact force (greater than or equal to 0.3N / pin) at key interfaces such as Dual In-line Memory Module (DIMM) slots, PCIe slots, and high-speed backplane connectors, establishing reliable metal-metal contact with controllable contact resistance increments. Meanwhile, the ultra-thin coatings ranging from 1μm to 30μm control the insertion loss / impedance offset introduced by high-speed links within the protocol tolerance, eliminating the need for shielding from a physical mechanism perspective.

[0076] Furthermore, in specific implementation, in the above steps, when the processing area is a chip area 4 without side-extended pins, a top cover layer is formed in the chip area 4 without side-extended pins by spraying. Specifically, this may include spraying the chip shell 42, chip sidewall pad area 43 and chip gap area 44 of the chip area 4 without side-extended pins, and controlling the dry film thickness of the top cover layer to be less than or equal to 50μm.

[0077] In implementation, the thickness of the top capping layer in the chip region 4 without side-extended leads is controlled below 50 μm. The main purpose of this step is to provide global macroscopic surface protection for this area, while simultaneously strengthening secondary protection for the outermost solder balls in the bottom void area 41 of the ball grid array package chip and the pins in the sidewall pad area 43 of the square flat leadless package chip. At the outer edge of the bottom void area 41, the top capping layer and the bottom isolation layer intersect, forming a protective interface with superimposed thickness, further enhancing the waterproof capability of this vulnerable area. The 50 μm thickness limit is determined based on the tolerance of the device in this area to the coating thickness; this thickness will not affect the normal operating temperature and signal integrity of the chip.

[0078] Furthermore, in specific implementation, when the processing area is the general circuit area 5, a top cover layer is formed in the general circuit area 5 by spraying. Specifically, this may include spraying the printed circuit board substrate trace area 51, conventional chip area 52, passive device area 53 and low-speed connector area 54 of the general circuit area 5 to form a top cover layer, and controlling the dry film thickness of the top cover layer to be less than or equal to 30μm.

[0079] In implementation, the thickness of the top cover layer in the general circuit area 5 is controlled to be below 30μm. This thickness is sufficient to form a complete, continuous, and pinhole-free waterproof cover for most of the components and printed circuit board substrate surface in the general circuit area 5, without affecting the heat dissipation and electrical performance of conventional chips, passive devices, and low-speed connectors in this area. Through this step, the general circuit area 5 achieves comprehensive and effective waterproof isolation protection, which, together with the dispensing and spraying protection of the processor socket area 1, memory slot area 2, high-speed connector area 3, and chip area 4 without side-extended pins, constitutes a global waterproof protection system for the entire server motherboard.

[0080] In practical applications, the liquid-cooled server motherboard protection method provided by this invention can be used in conjunction with a leakage detection scheme. After the leakage detection rope triggers an alarm, since this invention has built a complete waterproof coating barrier on the motherboard surface, the system does not need to be powered down immediately. It can calmly complete data saving, business migration and orderly shutdown operations during the leakage alarm period.

[0081] From the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by software plus necessary general-purpose hardware platforms, and of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.

[0082] An embodiment of the present invention also provides a liquid-cooled server motherboard, which is protected by the above-described protection method.

[0083] In the liquid-cooled server motherboard provided in this embodiment of the invention, the motherboard surface can be covered with a top cover layer, and a bottom isolation layer can be provided at the root of the device pins, the bottom gap, and the sidewall pads in each processing area. The top cover layer and the bottom isolation layer are made of homogeneous polyolefin material and are bonded at the interface to form a continuous film thickness structure. This continuous film thickness structure has no interlayer interface, the coating is dense overall and free of microscopic defects, and can effectively block liquid penetration when the coolant comes into contact with the motherboard surface.

[0084] The aforementioned liquid-cooled server motherboard uses zoned coating thickness settings to differentiate film thickness parameters for different functional areas. The processor socket area, high-speed connector area, and general circuit area have a first coating thickness (less than or equal to 30μm); the memory slot area has a second coating thickness (less than or equal to 10μm); and the area without side-extended pins has a third coating thickness (less than or equal to 50μm). Through this zoned thickness control, the motherboard simultaneously achieves good heat dissipation, signal integrity, and waterproofing.

[0085] The aforementioned liquid-cooled server motherboard has excellent active protection against coolant leakage. Even under extreme conditions such as coolant leakage or immersion, it can still maintain normal operation, making it particularly suitable for applications such as high-power-density artificial intelligence servers and high-performance computing servers.

[0086] Since the embodiments of the liquid-cooled server motherboard and the embodiments of the protection method for the liquid-cooled server motherboard correspond to each other, the descriptions of the features in the embodiments corresponding to the liquid-cooled server motherboard can be found in the relevant descriptions of the embodiments corresponding to the protection method for the liquid-cooled server motherboard, and will not be repeated here. Furthermore, it has the same beneficial effects as the aforementioned protection method for the liquid-cooled server motherboard.

[0087] Embodiments of the present invention also provide a liquid-cooled server, including the aforementioned liquid-cooled server motherboard. This liquid-cooled server can be a cold-plate type liquid-cooled server. During operation, heat generated by heat-generating components (such as processors and memory) is transferred to a cold plate, and coolant flows within the cold plate to remove the heat, thus achieving liquid cooling.

[0088] In the liquid-cooled server provided in this embodiment of the invention, since the liquid-cooled server is equipped with components such as liquid cooling pipes, quick connectors, and cold plates, these components are subject to thermal stress, vibration, and corrosion during long-term operation, posing a risk of coolant leakage. By using the liquid-cooled server motherboard provided by this invention, the surface of the motherboard forms a continuous film-thickness structure consisting of a bottom isolation layer and a top cover layer through the aforementioned protective method. The two coating layers undergo molecular chain interpenetration and fusion at the interface, eliminating interlayer interfaces. The overall coating is dense and free of microscopic defects, effectively preventing coolant penetration.

[0089] Therefore, even under extreme conditions such as cracked welds on cold plates or loose pipe joints that cause coolant leakage or even massive splashing and immersion in the motherboard surface, the coolant cannot penetrate the continuous film thickness structure on the motherboard surface to seep into the circuits and device pins. The liquid-cooled server can still maintain normal operation and will not cause short circuits or shutdowns due to leakage.

[0090] The aforementioned continuous film thickness structure can provide effective continuous protection for more than 12 hours, giving maintenance personnel ample time for data migration, business takeover, and orderly system shutdown, thus avoiding the risk of business interruption and data loss caused by leakage.

[0091] Since the embodiments of the liquid-cooled server portion correspond to the embodiments of the liquid-cooled server motherboard portion, the descriptions of the features in the liquid-cooled server corresponding embodiment can be found in the relevant descriptions of the liquid-cooled server motherboard corresponding embodiment, and will not be repeated here. Furthermore, it has the same beneficial effects as the liquid-cooled server motherboard mentioned above.

[0092] The units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0093] The present invention provides a detailed description of a liquid-cooled server motherboard and its protection method, as well as a liquid-cooled server. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of these embodiments are only intended to aid in understanding the method and core ideas of the invention. It should be noted that those skilled in the art can make various improvements and modifications to the invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the invention.

Claims

1. A method for protecting a liquid-cooled server motherboard, characterized in that, include: The server motherboard is divided into multiple processing areas according to functional regions; A waterproof coating material is applied to the root of the device pins and the bottom gap in the processing area, allowing the waterproof coating material to penetrate and spread into the gap under capillary effect to form a bottom isolation layer; wherein, the waterproof coating material is a polyolefin material; A top-layer cover is formed in at least a portion of the processing area; the top-layer cover and the bottom-layer isolation layer are made of the same material and molecular chains interpenetrate and fuse at the interface to form a continuous gradient film thickness structure without interlayer interfaces.

2. The protection method for a liquid-cooled server motherboard according to claim 1, characterized in that, The waterproof coating material is a polyolefin material with a volume resistivity higher than a preset resistivity threshold, a dielectric constant lower than a preset dielectric constant threshold, a dielectric loss factor lower than a preset dielectric loss factor threshold, a water absorption rate lower than a preset water absorption rate threshold, a static water contact angle higher than a preset contact angle threshold, a Shore hardness lower than a preset hardness threshold, an elongation at break higher than a preset elongation threshold, and a thermal conductivity higher than a preset thermal conductivity threshold.

3. The protection method for a liquid-cooled server motherboard according to claim 1, characterized in that, The server motherboard is divided into multiple processing areas according to functional regions, including: The server motherboard is divided into processing areas that include a processor socket area, a memory slot area, a high-speed connector area, a chip area without side-extending pins, and a general circuit area.

4. The protection method for a liquid-cooled server motherboard according to claim 3, characterized in that, After dividing the server motherboard into multiple processing areas according to functional regions, it also includes: The dry film thickness parameter of the coating in the processor socket area is set to a first thickness; The coating dry film thickness parameter of the memory slot area is set to the second thickness; The coating dry film thickness parameter of the high-speed connector area is set to a first thickness; The coating dry film thickness parameter of the chip area without side-extended pins is set to the third thickness. The coating dry film thickness parameter of the general circuit area is set to a first thickness; Wherein, the first thickness is greater than the second thickness and less than the third thickness.

5. The protection method for a liquid-cooled server motherboard according to claim 3, characterized in that, Apply adhesive to the root of the device pins and the bottom gap in the processing area, including: The needle valve dispensing method is used to apply glue to the root of the device pins, the bottom gap and the side wall pads in the processing area at fixed points and in fixed quantities.

6. The protection method for a liquid-cooled server motherboard according to claim 5, characterized in that, Apply adhesive to the root of the device pins, the bottom gap, and the sidewall pads in the processing area at specific points and in measured quantities, including: The volume of adhesive applied at each point is controlled between 0.05 μL and 0.5 μL. The adhesive is applied to the device pin roots, bottom gaps and sidewall pads in the processing area in a fixed quantity and at fixed points so that the dry film thickness of the formed bottom isolation layer ranges from 1 μm to 15 μm.

7. The protection method for a liquid-cooled server motherboard according to claim 6, characterized in that, When the processing area is the processor socket area, targeted and quantitative adhesive application is performed on the root of the device pins and the bottom gap in the processor socket area, including: Apply adhesive along the periphery of the bottom insulating sheet of the processor socket area to form an annular hydrophobic sealing dam, and apply double-end adhesive to each of the decoupling capacitor arrays at the bottom of the processor socket area to wrap the capacitor electrode solder joints.

8. The protection method for a liquid-cooled server motherboard according to claim 6, characterized in that, When the processing area is the memory slot area or the high-speed connector area, targeted and quantitative adhesive application is performed on the root of the device pins in the memory slot area or the high-speed connector area, including: Apply adhesive point by point to the metal pins of the memory slot area or the high-speed connector area to form a wrapping barrier at the base of the metal pins.

9. The protection method for a liquid-cooled server motherboard according to claim 6, characterized in that, When the processing area is the chip area without side-extended pins, targeted and quantitative adhesive application is performed on the bottom gap and sidewall pads of the chip in the chip area without side-extended pins, including: When the chip is a ball grid array packaged chip, apply adhesive along the four edges of the chip so that the coating penetrates into the gaps at the bottom of the chip under the drive of capillary force to cover all the solder ball roots and printed circuit board pads. When the chip is a square flat no-lead package chip, apply adhesive around the chip so that the coating capillarily climbs from the bottom up along the side wall pad area to cover the exposed metal surface of the side wall pads.

10. The protection method for a liquid-cooled server motherboard according to claim 3, characterized in that, When the processing area includes the general circuit area, it further includes the following before forming the top cover layer: Apply adhesive to the chip pin roots, capacitors, and resistors in the general circuit area to form an enhanced protective layer.

11. The protection method for a liquid-cooled server motherboard according to claim 3, characterized in that, A top cover layer is formed in at least a portion of the processing area, including: A top-layer coating is formed at least in a portion of the processing area using a spraying method.

12. The protection method for a liquid-cooled server motherboard according to claim 11, characterized in that, A top-layer coating is formed at least in a portion of the processing area using a spraying method, including: Before the bottom isolation layer is surface dry and not fully cured, at least a portion of the processing area is sprayed with a solvent in the liquid coating used for spraying to slightly dissolve the bottom isolation layer, causing molecular chain interpenetration between the top cover layer and the bottom isolation layer at the interface.

13. The protection method for a liquid-cooled server motherboard according to claim 11, characterized in that, While spraying at least a portion of the processing area, the process also includes: The dry film thickness of the top cover layer is controlled to be between 1 μm and 50 μm.

14. The protection method for a liquid-cooled server motherboard according to claim 11, characterized in that, When the processing area is the processor socket area, a top cover layer is formed in the processor socket area by spraying, including: The processor socket slot, plastic inner frame, decoupling capacitor area and metal outer frame of the processor socket area are sprayed with a coating, and the dry film thickness of the top cover layer is controlled to be less than or equal to 30μm; the top cover layer is penetrated by the socket contact pins under the processor installation pressure.

15. The protection method for a liquid-cooled server motherboard according to claim 11, characterized in that, When the processing area is the memory slot area, a top cover layer is formed in the memory slot area by spraying, including: The top cover layer is sprayed to form the heat dissipation hole area of ​​the memory slot area, so that the dripping coolant will condense into liquid droplets in the heat dissipation hole area under the action of surface tension and cannot enter the inner wall of the memory slot area; the dry film thickness of the top cover layer is controlled to be less than or equal to 10μm; the top cover layer on the inner wall of the slot is pushed away by the elastic contact force of the gold fingers when the memory module is inserted to establish metal contact.

16. The protection method for a liquid-cooled server motherboard according to claim 11, characterized in that, When the processing area is the high-speed connector area, a top cover layer is formed in the high-speed connector area by spraying, including: The top cover layer is formed by spraying in the high-speed connector area, and the dry film thickness of the top cover layer is controlled to be less than or equal to 30 μm; the top cover layer is pushed away by the connector contacts when the connector cable is inserted to establish an electrical connection.

17. The protection method for a liquid-cooled server motherboard according to claim 11, characterized in that, When the processing area is the chip area without side-extended pins, a top cover layer is formed on the chip area without side-extended pins by spraying, including: Spray coating is applied to the chip shell, chip sidewall pad area, and inter-chip blank area of ​​the chip without side-extended pins, and the dry film thickness of the top cover layer is controlled to be less than or equal to 50 μm.

18. The protection method for a liquid-cooled server motherboard according to claim 11, characterized in that, When the processing area is the general circuit area, a top cover layer is formed on the general circuit area by spraying, including: The top cover layer is formed by spraying the printed circuit board substrate trace area, conventional chip area, passive device area and low-speed connector area in the general circuit area, and the dry film thickness of the top cover layer is controlled to be less than or equal to 30μm.

19. A liquid-cooled server motherboard, characterized in that, The protection method for liquid-cooled server motherboards as described in any one of claims 1 to 18 is used for protection.

20. A liquid-cooled server, characterized in that, Including the liquid-cooled server motherboard as described in claim 19.

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