Sensor packaging structure

Abstract

The utility model discloses a sensor packaging structure, and relates to the technical field of semiconductor chip packaging, and the sensor packaging structure comprises a substrate and a sensing chip disposed on the substrate. The sensor packaging structure further comprises a plurality of electric connection assemblies electrically connected with the substrate and the sensing chip, a supporting adhesive layer formed on the sensing chip, a light-transmitting sheet arranged on the supporting adhesive layer, and a shading structure arranged on the light-transmitting sheet through silk-screen printing and used for shading the supporting adhesive layer. And glare caused by the fact that external light is reflected to the sensing area of the sensing chip through the supporting adhesive layer is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip packaging, and in particular to a sensor packaging structure. Background Art

[0002] The sensor chip package structure consists of a sensor chip mounted on a substrate and packaging materials. The sensor chip is covered with a light-transmitting sheet that allows external light to pass through for sensing purposes. However, this design often leads to a serious problem, namely glare, which adversely affects the performance and reliability of the sensor chip.

[0003] Due to the reflective properties of the packaging material used in the support structure above the chip to support the light-transmitting thin film, external light is reflected onto the photosensitive area of ​​the chip, causing glare. This reflection phenomenon impairs the chip's ability to accurately capture and process input data, thereby limiting the chip's overall utility and performance.

[0004] To solve the above problems, a Chinese patent application document with application number 202180059246.4 discloses a solid-state imaging device, including a substrate, an image sensor, and a transparent member provided by a supporting portion. The front surface, side surface, or rear surface of the transparent member is provided with a groove portion in the area outside the light receiving area of ​​the image sensor, and the interior of the groove is filled with a black molded resin containing carbon to form a black light shielding film to effectively avoid the occurrence of glare.

[0005] However, this solution has the following disadvantages:

[0006] 1. The grooves on the transparent components increase the complexity of the manufacturing process, thereby increasing production time and cost;

[0007] 2. It is difficult to ensure that the groove size is precisely aligned with the supporting part, and uniform filling of the shading material is also a challenge, which may lead to uneven shading effect;

[0008] 3. Filling the groove with shading material increases the risk of material displacement or delamination over time. Mechanical stress or environmental factors may also cause the filling material to shift or separate from the groove, thereby reducing the durability and reliability of the shading layer. Utility Model Content

[0009] In view of this, the sensor packaging structure provided in the present application shields the supporting adhesive layer of the light-transmitting sheet by setting a light-shielding structure on the surface of the light-transmitting sheet, thereby avoiding the generation of glare. Specifically, the following technical solutions are adopted:

[0010] A sensor packaging structure includes a substrate and a sensing chip arranged on the substrate, wherein the substrate includes a first bottom surface and a second bottom surface located on the opposite side of the first bottom surface, and the top surface of the sensing chip has a sensing area and a connection area outside the sensing area; the sensor packaging structure also includes a plurality of electrical connection components electrically connecting the substrate and the sensing chip, a supporting adhesive layer formed on the sensing chip, and a transparent sheet arranged on the supporting adhesive layer; the transparent sheet is also provided with an enclosing shading structure, and the shading structure is used to eliminate glare.

[0011] Preferably, a surrounding boss is provided on the light-transmitting sheet, and the light-shielding structure covers the boss.

[0012] Preferably, the shading structure is arranged on the surface of the boss by screen printing.

[0013] Preferably, the base plate further includes a side plate located at the periphery of the base plate.

[0014] Preferably, a filling glue layer is also filled in the filling cavity formed between the inner side surface of the side panel and the first bottom surface of the substrate, the outer edge of the sensing chip, the supporting glue layer and the outer edge of the light-transmitting sheet, and the filling glue layer covers the electrical connection component, the inner side surface of the side panel, the sensing chip, the supporting glue layer and the outer edge of the light-transmitting sheet, and the top surface of the filling glue layer does not exceed the top surface of the light-transmitting sheet and the side panel.

[0015] Preferably, the light shielding structure is disposed on the top surface of the light-transmitting sheet surrounding the sensing area, and the inner edge of the light shielding structure exceeds the inner edge of the supporting adhesive layer and does not exceed the range of the sensing area.

[0016] Beneficial effects of this application:

[0017] (1) The process of creating grooves and filling light-shielding materials is eliminated, which simplifies the process flow and saves production time and cost;

[0018] (2) The shading structure is laid on the surface of the light-transmitting sheet by screen printing to ensure uniform coverage of the shading material and consistent thickness;

[0019] (3) Screen printing can be used to realize the setting of shading structures of different shapes and sizes to adapt to different support structure configurations;

[0020] (4) By setting the boss, screen printing is facilitated to avoid affecting the light-transmitting area in the middle of the light-transmitting sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a cross-sectional view of the sensor packaging structure described in the present application;

[0022] Figure 2 is a top view of the sensor packaging structure described in this application.

[0023] In the figure: 10-substrate, 11-first bottom surface, 12-second bottom surface, 13-side plate, 20-sensing chip, 21-sensing area, 22-connection area, 30-electrical connection component, 31-substrate metal pad, 32-chip metal pad, 1-supporting glue layer, 2-light-transmitting sheet, 3-light-shielding structure, 4-filling glue layer, 5-adhesive layer, 6-boss. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described in the present application are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0025] Combined with reference Figure 1 and Figure 2 The sensor packaging structure described in the present application includes a substrate 10 and a sensing chip 20 arranged on the substrate 10, wherein the substrate 10 includes a first bottom surface 11 and a second bottom surface 12 located on the opposite side of the first bottom surface 11, a plurality of substrate metal pads 31 are arranged on the first bottom surface 11, and the bottom surface of the sensing chip 20 is fixed to the first bottom surface 11 of the substrate 10 through an adhesive layer 5, the top surface of the sensing chip 20 includes a sensing area 21 and a connection area 22 around the sensing area 21, a supporting adhesive layer 1 surrounding the sensing area 21 is arranged on the connection area 22, and a plurality of chip metal pads 32 corresponding to the substrate metal pads are also arranged on the connection area 22 located outside the supporting adhesive layer 1, and an electrical connection component 30 is connected between the corresponding plurality of substrate metal pads 31 and the chip metal pads 32, and the electrical connection component includes a wire, such as a gold wire, for realizing the electrical connection between the substrate 10 and the sensing chip 20.

[0026] A light-transmitting sheet 2 is bonded to the top edge of the supporting adhesive layer 1. In the present embodiment, the outer edge of the light-transmitting sheet 2 is flush with the outer edge of the supporting adhesive layer 1. In some embodiments, the outer edge of the light-transmitting sheet 2 may be retracted into the outer edge of the supporting adhesive layer 1, or the outer edge of the supporting adhesive layer 1 may be retracted into the outer edge of the light-transmitting sheet 2.

[0027] A closed space is formed between the top surface of the sensing chip 20, the supporting adhesive layer 1 and the transparent sheet 2. The sensing area 21 of the sensing chip is located in the closed space. The sensing area receives external light source through the transparent sheet 2 to capture information.

[0028] In the present embodiment, the substrate 10 further includes a side panel 13 integrally connected to the main body of the substrate 10. It should be understood that the side panel 13 is not necessary. In some embodiments, the side panel 13 can be omitted. A filling chamber is formed between the inner side surface of the side panel 13 and the first bottom surface 11 of the substrate, the outer edge of the sensing chip, the supporting adhesive layer and the outer edge of the light-transmitting sheet. The filling chamber is filled with a filling adhesive layer 4. The filling adhesive layer 4 covers the electrical connection component 30, the inner side surface of the side panel and the outer edge of the sensing chip, the supporting adhesive layer and the light-transmitting sheet, and the top surface of the filling adhesive layer 4 does not exceed the light-transmitting sheet 2 and the top surface of the side panel 13. The filling adhesive layer 4 is squeezed between the inner side surface of the side panel and the outer edge of the sensing chip, the supporting adhesive layer and the light-transmitting sheet to achieve a more stable fixation of the electrical connection component.

[0029] The light-transmitting sheet 2 is provided with an enclosing boss 6, and the boss 6 is covered with a shading structure 3. The boss 6 surrounds the light-transmitting sheet to form an enclosing shape, and the shape of the enclosing shape is adapted to the shape of the sensing chip 20. When the shape of the sensing chip 20 is a square, the outline of the enclosing shape is a square; the shading structure 3 is arranged on the boss 6 by screen printing; the thickness of the boss can be several to tens of microns. The setting of the boss facilitates screen printing to a certain extent and avoids affecting the light-transmitting area in the middle of the light-transmitting sheet 2.

[0030] The inner edge of the shading structure 3 exceeds the inner edge of the supporting adhesive layer 1 and does not exceed the range of the sensing area 21, so as to shield the supporting adhesive layer 1 and prevent external light from being reflected through the supporting adhesive layer 1 to the sensing area 21 of the sensing chip, thereby forming glare and reducing damage to the chip's ability to accurately capture and process input data.

Claims

1. A sensor packaging structure, comprising a substrate and a sensing chip disposed on the substrate, wherein the substrate comprises a first bottom surface and a second bottom surface located on the opposite side of the first bottom surface, and the top surface of the sensing chip comprises a sensing area and a connection area outside the sensing area; and further comprising a plurality of electrical connection components electrically connecting the substrate and the sensing chip, a supporting adhesive layer formed on the sensing chip, and a light-transmitting sheet disposed on the supporting adhesive layer; Features: The light-transmitting sheet is also provided with an enclosing light-shielding structure, and the light-shielding structure is used to eliminate glare.

2. The sensor packaging structure according to claim 1, Features: A surrounding boss is arranged on the light-transmitting sheet, and the light-shielding structure covers the boss.

3. The sensor packaging structure according to claim 2, Features: The shading structure is arranged on the surface of the boss by screen printing.

4. The sensor packaging structure according to claim 2, Features: The base plate further includes a side plate located at the periphery of the base plate.

5. The sensor packaging structure according to claim 4, Features: A filling glue layer is also filled in the filling cavity formed between the inner side surface of the side panel and the first bottom surface of the substrate, the outer edge of the sensing chip, the supporting glue layer and the outer edge of the light-transmitting sheet. The filling glue layer covers the electrical connection component, the inner side surface of the side panel, the sensing chip, the supporting glue layer and the outer edge of the light-transmitting sheet, and the top surface of the filling glue layer does not exceed the top surface of the light-transmitting sheet and the side panel.

6. The sensor packaging structure according to claim 2, Features: The light shielding structure is disposed on the top surface of the light-transmitting sheet so as to surround the sensing area, and the inner edge of the light shielding structure exceeds the inner edge of the supporting adhesive layer and does not exceed the range of the sensing area.

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