Large-diameter diamond wire for stone cutting

Abstract

The large-diameter diamond wire comprises a bus, a reinforcing layer and diamond particles, the bus is a single metal wire, the reinforcing layer wraps the outer surface of the bus, a plurality of axial chip grooves are formed in the reinforcing layer, and the diamond particles are arranged in the chip grooves. And the diamond particles are embedded and distributed on the reinforcing layer and do not block the chip grooves. The diameter of the diamond wire used for cutting materials such as crystalline silicon and sapphire is increased to 500-1000 micrometers from 40-500 micrometers, and the chip grooves suitable for stone cutting are designed, so that the cutting stability of the diamond wire is greatly improved, and the cutting efficiency is doubled.

Description

Technical Field

[0001] The utility model relates to the technical field of stone cutting, in particular to a large-diameter diamond wire used for stone cutting. Background Art

[0002] At present, diamond wire is increasingly widely used in the field of stone cutting, especially in cutting hard, brittle and expensive stones, such as white marble and other luxury stone materials. Since the Mohs hardness of most of these materials is above 7, the cutting difficulty is 3-4 times that of ordinary stones, and the size of luxury stones is very large, generally 5m 3 The above; in order to meet the cutting quality of stone, the stability of cutting equipment and the cutting efficiency of cutting equipment, higher requirements are placed on diamond wire during the cutting process. Summary of the invention

[0003] The utility model aims to provide a large-diameter diamond wire for stone cutting, which increases the diameter of the diamond wire used for cutting crystalline silicon, sapphire and other materials from 40μm-500μm to 500μm-1000μm, and designs a chip groove suitable for stone cutting, which greatly improves the cutting stability of the diamond wire and doubles the cutting efficiency.

[0004] The technical solution adopted by the utility model is: a large-diameter diamond wire for stone cutting, comprising a mother bar, a reinforcement layer and diamond particles, the mother bar is a single metal wire, the reinforcement layer is coated on the outer surface of the mother bar, a plurality of axial chip grooves are opened on the reinforcement layer, and the diamond particles are inlaid and distributed on the reinforcement layer without blocking the chip grooves.

[0005] Furthermore, a plurality of the chip removal grooves are evenly distributed on the outer surface of the reinforcement layer; and the width of the chip removal grooves is 40 μm-80 μm.

[0006] Furthermore, the diameter of the busbar is 500 μm-1000 μm.

[0007] Furthermore, the metal wire is made of steel wire.

[0008] Furthermore, the reinforcement layer is made of nickel-cobalt alloy and has a thickness of 20 μm-50 μm.

[0009] Furthermore, the size of the diamond particles is 40 μm-100 μm.

[0010] The beneficial effects of the utility model are:

[0011] (1) The utility model improves the wire tension and diamond wire cutting force by increasing the diameter of the busbar;

[0012] (2) The evenly distributed axial chip grooves can enhance the fluidity of the coolant, promote the discharge of cutting debris, and improve cutting efficiency;

[0013] (3) The number of chip grooves on the cross section of the busbar is evenly distributed, and the radial number is positively correlated with the diameter of the busbar, further improving the cooling effect;

[0014] (4) The evenly distributed axial chip grooves make the diamond particles present a regular concave-convex arrangement, further enhancing the cutting force. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the cross-sectional structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the external structure of the utility model;

[0017] In the figure: 1-busbar, 2-reinforcement layer, 3-diamond particles, 4-chip groove. DETAILED DESCRIPTION

[0018] The utility model is further described below in conjunction with the accompanying drawings.

[0019] like Figure 1 and Figure 2 As shown, the utility model is a large-diameter diamond wire for stone cutting, including a busbar 1, a reinforcement layer 2 and diamond particles 3. The busbar 1 is composed of a single metal steel wire with a diameter of 500μm-1000μm; the outer surface of the busbar 1 is covered with a reinforcement layer 2, and the reinforcement layer is made of a nickel-cobalt alloy with a thickness of 20μm-50μm. Axial chip grooves 4 are evenly opened on the reinforcement layer 2, and the width of the chip grooves 4 is 40μm-80μm, and the radial number is positively correlated with the diameter of the busbar 1. Since the larger the diameter of the busbar 1, the more difficult it is to cool its interior, the cooling effect can be improved by increasing the number of chip grooves 4 on the cross section. Diamond particles 3 with a size of 40μm-100μm are inlaid and distributed on the reinforcement layer 2 and do not block the chip grooves 4.

[0020] The utility model increases the line tension and cutting force by increasing the diameter of the busbar; the uniformly distributed axial chip grooves 4 can enhance the fluidity of the coolant, promote the discharge of cutting debris, and improve the cutting efficiency; the number of chip grooves 4 on the cross section of the busbar 1 is uniformly distributed, and the axial chip grooves 4 are evenly and regularly distributed, so that the diamond particles present a regular concave-convex arrangement, which can further enhance the cutting force.

Claims

1. A large diameter diamond wire for stone cutting, characterized in that: It includes a busbar, a reinforcement layer and diamond particles. The busbar is a single metal wire. The reinforcement layer is coated on the outer surface of the busbar. The reinforcement layer is provided with a plurality of axial chip grooves. The diamond particles are inlaid and distributed on the reinforcement layer without blocking the chip grooves.

2. The large diameter diamond wire for stone cutting according to claim 1, characterized in that: A plurality of the chip removal grooves are evenly distributed on the outer surface of the reinforcement layer; the width of the chip removal grooves is 40 μm-80 μm.

3. The large diameter diamond wire for stone cutting according to claim 1, characterized in that: The diameter of the busbar is 500 μm-1000 μm.

4. The large diameter diamond wire for stone cutting according to claim 1, characterized in that: The material of the metal wire is steel wire.

5. The large diameter diamond wire for stone cutting according to claim 1, characterized in that: The reinforcement layer is made of nickel-cobalt alloy and has a thickness of 20 μm-50 μm.

6. The large diameter diamond wire for stone cutting according to claim 1, characterized in that: The size of the diamond particles is 40 μm-100 μm.

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