Schottky diode

Abstract

The utility model discloses a Schottky diode which comprises a Schottky diode body, and the left end of the Schottky diode body is provided with a contact line. The Schottky diode comprises a Schottky diode body and is characterized in that a cooling fin is attached to the bottom of the Schottky diode body, the bottom of the cooling fin extends into the Schottky diode body to form a sliding mechanism, open grooves are formed in the cooling fin at equal intervals, and diversion blocks are fixed in the open grooves of the cooling fin in a staggered mode and arranged in a triangular mode; the cooling fins are made of copper materials, and the flow guide blocks on the cooling fins are made of copper materials. Sliding blocks are fixed to the bottoms of the cooling fins, and the outer ends of the sliding blocks extend into the clamping grooves to form limiting mechanisms. The Schottky diode is provided with the flow guide blocks, and the speed of air in the cooling fins can be reduced through the flow guide blocks, so that the air can fully absorb heat on the cooling fins and the flow guide blocks, and the cooling effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of Schottky diodes, in particular to a Schottky diode. Background Art

[0002] Schottky diode, also known as Schottky rectifier diode (SchottkyRectifierDiode, abbreviated as SR) or Schottky barrier diode (SchottkyBarrierDiode, abbreviated as SBD), is a semiconductor device with special properties;

[0003] The heat dissipation device is a kind of Schottky diode with reference to the publication number CN217009201U. The design of the heat dissipation plate, the heat dissipation fins, the through holes and the heat dissipation strips is used. The connecting block is connected to the interior of the space formed by the first card slot and the second card slot. The heat dissipation fins at the lower end of the heat dissipation plate are inserted into the interior of the heat dissipation hole. The heat dissipation fins are set as copper sheets. The thermal conductivity of copper is better. Through holes are opened on the heat dissipation fins to facilitate the heat transfer between the six groups of heat dissipation fins, thereby improving the heat dissipation efficiency. The upper end of the heat dissipation strip is set in a semicircular arc shape, which increases the surface area of ​​the heat dissipation strip to a certain extent, and further improves the heat dissipation effect. The electronic components inside the Schottky diode body will generate heat during operation. The heat will be transferred to the heat dissipation fins, and then from the heat dissipation fins to the heat dissipation plate and the heat dissipation strips, and enter the outside air, thereby accelerating the heat dissipation of the Schottky diode. The utility model has a simple installation and fixing structure, is convenient for assembly, and improves the heat dissipation capacity of the Schottky diode, so that the electronic components inside it can operate stably in a superior environment, and relatively improve the service life of the Schottky diode. However, there are still the following problems:

[0004] In actual use of the above device, although heat is dissipated through the heat dissipation strips, the heat is concentrated on the heat dissipation strips. Although the wind will take away some of the heat on the heat dissipation strips when flowing, the surface of the heat dissipation strips is relatively smooth, which causes the wind to stay for a shorter time when flowing, resulting in the wind failing to fully take away the heat on the heat dissipation strips for cooling, resulting in a less than ideal cooling effect.

[0005] Therefore, we proposed a Schottky diode that can solve the above problems well. Utility Model Content

[0006] The purpose of the utility model is to provide a Schottky diode to solve the problem raised by the above-mentioned background technology that although the wind in the current market will take away part of the heat on the heat sink when flowing, the surface of the heat sink is relatively smooth, which causes the wind to stay for a short time when flowing, so that the wind cannot fully take away the heat on the heat sink for cooling, resulting in the cooling effect being less than ideal.

[0007] To achieve the above object, the utility model provides the following technical solution: a Schottky diode, comprising a Schottky diode body, wherein a contact line is arranged at the left end of the Schottky diode body;

[0008] Also includes:

[0009] A heat sink is attached to the bottom of the Schottky diode body, and the bottom of the heat sink extends into the interior of the Schottky diode body to form a sliding mechanism, and slots are opened on the heat sink at equal intervals, and guide blocks are staggered and fixed inside the slots of the heat sink, and the guide blocks are arranged in a triangular shape.

[0010] Preferably, the heat sink is made of copper material, and the guide block on the heat sink is also made of copper material.

[0011] Preferably, a slider is fixed to the bottom of the heat sink, and the outer end of the slider extends into the interior of the slot to form a limiting mechanism, and the slot is opened inside the Schottky diode body.

[0012] Preferably, a protrusion is slidably provided inside the sliding block, and the outer end of the protrusion is arranged in a semicircular shape.

[0013] Preferably, the outer end of the protrusion extends into the interior of the groove to form a locking mechanism, and the groove is opened inside the Schottky diode body.

[0014] Preferably, the inner end of the protrusion is connected to a limit spring, and the inner end of the limit spring is connected to the inside of the sliding block.

[0015] Preferably, the card slots are arranged in an arc shape, and slots are provided at symmetrical ends of the card slots, and two groups of the card slots are opened diagonally.

[0016] Compared with the prior art, the utility model has the following beneficial effects: the Schottky diode improves the cooling effect and can be quickly replaced. The guide block can slow down the air flow speed, so that the air can fully take away the heat on the guide block, thereby improving the cooling effect. The slider can be rotated to quickly replace the heat sink. The specific contents are as follows:

[0017] (1) A guide block is provided, through which the air can be decelerated inside the heat sink, so that the air can fully absorb the heat on the heat sink and the guide block, thereby improving the cooling effect;

[0018] (2) A slider is provided, and the slider is driven to rotate by rotating the heat sink, so that the slider can be disengaged from the slot when it rotates, so that the heat sink can be easily disassembled and replaced;

[0019] (3) The heat sink is made of copper material, and the guide block on the heat sink is also made of copper material, so that the heat sink and the guide block can improve the heat conduction effect, thereby fully absorbing the heat generated by the Schottky diode body;

[0020] (4) A protrusion is provided, and the outer end of the protrusion extends into the interior of the groove to form a locking mechanism, and the groove is opened inside the Schottky diode body, so that the stability of the engagement between the slider and the slot can be improved after the protrusion and the groove are engaged;

[0021] (5) The inner end of the protrusion is connected to a limit spring, and the inner end of the limit spring is connected to the inside of the slider, so that the limit spring can limit the protrusion, thereby improving the stability of the protrusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0023] Figure 2 This is a schematic diagram of the top view structure of the utility model;

[0024] Figure 3 This is a schematic diagram of the front section structure of the utility model;

[0025] Figure 4 For this utility model Figure 3 The enlarged structural diagram at A in the middle;

[0026] Figure 5 This is a schematic diagram of the top-sectional structure of the slider of the utility model;

[0027] Figure 6 It is a schematic diagram of the three-dimensional structure of the slider of the utility model.

[0028] In the figure: 1. Schottky diode body; 2. contact wire; 3. heat sink; 301. guide block; 4. slider; 5. slot; 6. bump; 7. groove; 8. limit spring. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Embodiment 1:

[0031] The utility model solves the problem that although the existing wind will take away part of the heat on the heat dissipation strip when it flows, the surface of the heat dissipation strip is relatively smooth, which causes the wind to stay for a short time when it flows, so that the wind cannot fully take away the heat on the heat dissipation strip for cooling, and then the cooling effect is not ideal. The heat dissipation effect can be improved by using the guide block 301, and the utility model discloses:

[0032] A Schottky diode body 1, a contact line 2 is arranged at the left end of the Schottky diode body 1; and further comprising: a heat sink 3 is attached to the bottom of the Schottky diode body 1, and the bottom of the heat sink 3 extends into the interior of the Schottky diode body 1 to form a sliding mechanism, and slots are arranged on the heat sink 3 at equal intervals, and guide blocks 301 are staggered and fixed inside the slots of the heat sink 3, and the guide blocks 301 are arranged in a triangular shape, the heat sink 3 is arranged by copper material, and the guide blocks 301 on the heat sink 3 are also arranged by copper material;

[0033] refer to Figures 1 to 3 The heat generated by the Schottky diode body 1 when in use will be transferred to the heat sink 3, and the heat of the heat sink 3 will also be transferred to the guide block 301. Then, when the wind flows, the wind will pass through the heat sink 3, thereby cooling the heat sink 3. After the wind passes through the guide block 301, the contact time will be increased due to the equally spaced guide blocks 301, thereby enabling the wind to fully absorb the heat on the guide block 301, thereby improving the cooling effect.

[0034] Embodiment 2:

[0035] The utility model solves the problem that the heat sink 3 in the first embodiment is not convenient to disassemble and assemble. The slider 4 can improve the convenience of disassembly and assembly. The utility model discloses:

[0036] A slider 4 is fixed to the bottom of the heat sink 3, and the outer end of the slider 4 extends into the inside of the slot 5 to form a limiting mechanism, and the slot 5 is opened inside the Schottky diode body 1;

[0037] refer to Figures 3 to 6 , by rotating the heat sink 3, the heat sink 3 is rotated to drive the slider 4 to rotate, and then the slider 4 is rotated to move inside the slot 5. After the heat sink 3 is rotated to the position, the slider 4 will be disengaged from the slot 5, and then the heat sink 3 is pulled, so that the heat sink 3 moves and drives the slider 4 to be disengaged from the slot 5, thereby achieving the removal of the heat sink 3. By reversing the above operation, the heat sink 3 can be conveniently installed;

[0038] Embodiment three:

[0039] The utility model solves the problem that the engagement between the slider 4 and the slot 5 in the second embodiment is not stable enough. The stability of the engagement between the slider 4 and the slot 5 can be improved by the protrusion 6 and the groove 7.

[0040] A protrusion 6 slides inside the slider 4, and the outer end of the protrusion 6 is set in a semicircular shape. The outer end of the protrusion 6 extends into the inside of the groove 7 to form a clamping mechanism, and the groove 7 is opened inside the Schottky diode body 1. The inner end of the protrusion 6 is connected to the limit spring 8, and the inner end of the limit spring 8 is connected to the inside of the slider 4. The clamping groove 5 is set in an arc shape, and the symmetrical ends of the clamping groove 5 are opened with slots, and two groups of clamping grooves 5 are opened diagonally;

[0041] refer to Figures 3 to 6 The rotation of the slider 4 drives the protrusion 6 to rotate, and then the rotation of the protrusion 6 will be squeezed with the groove 7, and then the protrusion 6 will slide into the inside of the slider 4, and the movement of the protrusion 6 will squeeze the limit spring 8, and then the limit spring 8 will be squeezed and compressed, and the movement of the protrusion 6 will be out of the engagement with the groove 7, and the limit spring 8 can drive the protrusion 6 to extend into the inside of the groove 7, and then after the protrusion 6 is engaged with the groove 7, the stability of the engagement between the slider 4 and the card slot 5 can be improved.

[0042] Working principle: When using this Schottky diode, first refer to Figures 1 to 3 The heat generated by the Schottky diode body 1 when in use will be transferred to the heat sink 3, and the heat of the heat sink 3 will also be transferred to the guide block 301. Then, when the wind flows, the contact time will be increased due to the equally spaced guide blocks 301, and then the wind will be able to fully absorb the heat on the guide block 301, thereby improving the cooling effect;

[0043] refer to Figures 3 to 6 , by rotating the heat sink 3, the heat sink 3 is rotated to drive the slider 4 to rotate. After the heat sink 3 is rotated to the position, the slider 4 will be disengaged from the card slot 5, and then the heat sink 3 is pulled, so as to achieve the removal of the heat sink 3. By reversing the above operation, the heat sink 3 can be conveniently installed;

[0044] refer to Figures 3 to 6 The rotation of the slider 4 drives the protrusion 6 to rotate, and then the rotation of the protrusion 6 will be squeezed with the groove 7, and then the protrusion 6 will slide into the inside of the slider 4, and the movement of the protrusion 6 will be disengaged from the engagement with the groove 7, and the protrusion 6 can be driven by the limit spring 8 to extend into the inside of the groove 7, and then the engagement of the protrusion 6 with the groove 7 can improve the stability of the engagement between the slider 4 and the slot 5.

[0045] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0046] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A Schottky diode, comprising a Schottky diode body (1), wherein a contact line (2) is provided at the left end of the Schottky diode body (1); It is characterized in that Also includes: A heat sink (3) is attached to the bottom of the Schottky diode body (1), and the bottom of the heat sink (3) extends into the interior of the Schottky diode body (1) to form a sliding mechanism, and slots are provided on the heat sink (3) at equal intervals, and guide blocks (301) are staggeredly fixed inside the slots of the heat sink (3), and the guide blocks (301) are arranged in a triangular shape.

2. A Schottky diode according to claim 1, characterized in that: The heat sink (3) is made of copper material, and the guide block (301) on the heat sink (3) is also made of copper material.

3. A Schottky diode according to claim 1, characterized in that: A slider (4) is fixed to the bottom of the heat sink (3), and the outer end of the slider (4) extends into the interior of the slot (5) to form a limiting mechanism, and the slot (5) is provided inside the Schottky diode body (1).

4. A Schottky diode according to claim 3, characterized in that: A convex block (6) is slidably disposed inside the sliding block (4), and the outer end of the convex block (6) is arranged in a semicircular shape.

5. A Schottky diode according to claim 4, characterized in that: The outer end of the protrusion (6) extends into the interior of the groove (7) to form a locking mechanism, and the groove (7) is provided inside the Schottky diode body (1).

6. A Schottky diode according to claim 4, characterized in that: The inner end of the protrusion (6) is connected to a limit spring (8), and the inner end of the limit spring (8) is connected to the interior of the slider (4).

7. A Schottky diode according to claim 3, characterized in that: The card slots (5) are arranged in an arc shape, and the symmetrical ends of the card slots (5) are provided with slots, and two groups of the card slots (5) are arranged diagonally.

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