Circuit board black hole processing device

Abstract

The utility model relates to the field of circuit board black holes, and discloses a circuit board black hole processing device. Comprising a bottom plate and a black hole treatment pond arranged on the bottom plate, a cavity groove is formed in the bottom of the black hole treatment pond, an air pipe is arranged in the cavity groove, a plurality of air heads are evenly arranged on the air pipe, a pump machine and an air heater are arranged on the right side of the bottom plate, and the pump machine and the air heater are connected through a connecting pipe; a PH meter is arranged above the rear side of the supporting plate, a temperature regulation and control assembly is arranged on the inner wall of the right side of the black hole treatment pond, a supporting frame is arranged on the black hole treatment pond, and a telescopic rod of an air cylinder penetrates through a transverse plate of the supporting frame and is detachably provided with a circuit board placement assembly. And the phenomenon that when black hole processing is carried out on multiple circuit boards at the same time, the multiple circuit boards are stacked in the processing groove, so that the circuit boards are attached, and the black hole effect of the circuit boards is affected is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of black holes in circuit boards, in particular to a black hole processing device for circuit boards. Background Art

[0002] Circuit board (PCB, FPC) hole metallization technology is one of the key technologies in printed circuit board manufacturing. For a long time, people have been using the method of chemical copper plating (PTH), but the PTH solution contains various chemical substances that are harmful to the ecological environment, such as EDTA, NTA, EDTP and carcinogenic formaldehyde. The wastewater treatment is complicated and the cost is high. Therefore, the industry has been looking for new hole metallization technology. Black hole direct electroplating technology came into being in this context.

[0003] Among them, the black hole principle: it is to form a conductive film on the hole wall through physical action of fine graphite and carbon black powder, and then directly electroplating instead of chemical copper deposition process. The black hole process not only reduces the cost of wastewater treatment, but also reduces the pollution to the environment, and undoubtedly has good social benefits.

[0004] At present, when a circuit board is subjected to black hole treatment, the circuit board is placed in a black hole solution. As the reaction proceeds, the temperature and alkalinity in the black hole solution deviate from the appropriate range, thereby reducing the black hole effect on the circuit board. In addition, when multiple circuit boards are subjected to black hole treatment at the same time, multiple circuit boards are stacked in a treatment tank, causing the circuit boards to fit together, thereby affecting the black hole effect on the circuit board. Therefore, we propose a circuit board black hole processing device. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a circuit board black hole processing device, which solves the problems mentioned in the above background.

[0006] The utility model provides the following technical solutions: The utility model discloses a black hole processing device for a circuit board, comprising a base plate and a black hole processing pool arranged on the base plate, characterized in that: a cavity is arranged at the bottom of the black hole processing pool, an air pipe is arranged in the cavity, the air pipe is in a continuously bent curved structure, a plurality of air heads are evenly arranged on the air pipe, and a plurality of the air heads are embedded and arranged above the cavity, a pump and an air heater are arranged on the right side of the base plate, the pump and the air heater are connected by a connecting pipe, and the pipe fittings of the air heater pass through the cavity and are connected to the air pipe, a support plate is arranged above the left side of the black hole processing pool, a liquid regulating box is arranged above the front side of the support plate, a pH meter is arranged above the rear side of the support plate, a temperature control component is arranged on the right inner wall of the black hole processing pool, a support frame is arranged on the black hole processing pool, a cylinder is arranged on the horizontal plate of the support frame, and the telescopic rod of the cylinder passes through the horizontal plate of the support frame and is detachably provided with a circuit board placement component.

[0007] As a preferred solution, a liquid outlet pipe is provided at the bottom of the liquid regulating box, a liquid outlet valve is provided on the liquid outlet pipe, and the liquid outlet valve is electrically connected to the pH meter.

[0008] As a preferred solution, the temperature control component includes a temperature sensor and a temperature controller, the temperature sensor is electrically connected to the temperature controller, and the temperature controller is electrically connected to the air heater.

[0009] As a preferred solution, the circuit board placement assembly includes a placement rack detachably arranged on the lower end of the cylinder telescopic rod, a plurality of slots are evenly arranged on the opposite surfaces of the upper and lower plates of the placement rack, and a plurality of grooves are evenly arranged on the lower plate of the placement rack.

[0010] As a preferred solution, a plurality of the trough bodies are respectively located between the slots of the lower plate of the placement rack.

[0011] As a preferred solution, the outside of the air pipe is wrapped with a heat-insulating layer.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] The utility model adds a solution for black hole treatment of a circuit board into a black hole treatment pool, monitors the pH of the solution in the black hole treatment pool through the operation of a pH meter, controls a liquid outlet valve of a liquid outlet pipe at the bottom of a liquid regulating box, and then discharges the liquid in the liquid regulating box for adjusting the pH of the black hole solution, and in conjunction with the operation of a pump body, discharges gas through a plurality of gas heads on an air pipe, so that the solution in the black hole treatment pool is pneumatically mixed, thereby improving the mixing efficiency of the solution in the black hole treatment pool and maintaining the pH of the liquid between 9.8 and 10.6.

[0014] The temperature of the solution in the black hole treatment pool is adjusted by the temperature control component, and the air input by the pump body is heated by the operation of the air heater. The heating element of the air heater is a stainless steel electric heating tube. The inner cavity of the heater is provided with a plurality of baffles to guide the gas flow and extend the residence time of the gas in the inner cavity, so that the gas is fully heated and evenly heated. In addition, the outer wrapping of the air pipe is provided with an insulation layer, and the gas is discharged through a plurality of air heads on the air pipe to pneumatically heat the solution in the black hole treatment pool, thereby improving the heating efficiency of the solution in the black hole treatment pool and ensuring the uniformity of the temperature of the solution in the black hole treatment pool, so that the temperature is controlled at 25-32°C.

[0015] Through the structural setting of the circuit board placement component, the circuit boards to be treated with black holes are inserted into the corresponding slots of the placement rack, so that the circuit boards are placed vertically, and then the black hole treatment is performed on multiple circuit boards. The multiple slots are respectively located between the slots of the lower plate of the placement rack, so that the circuit boards can be better in contact with the black hole solution, avoiding the phenomenon of adhesion between the circuit boards when the black holes of multiple circuit boards are treated at the same time, thereby affecting the black hole effect on the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0017] Figure 2 It is a partial cross-sectional view of the utility model;

[0018] Figure 3 for Figure 2 The enlarged view of point A in the middle;

[0019] Figure 4 Schematic diagram of the structure for placing components for the support frame and circuit board.

[0020] In the figure: 1. bottom plate; 2. black hole treatment pool; 3. cavity; 4. air pipe; 5. air head; 6. pump; 7. air heater; 8. support plate; 9. liquid adjustment box; 10. pH meter; 11. support frame; 12. cylinder; 13. liquid outlet pipe; 14. temperature sensor; 15. temperature controller; 16. placement rack; 17. slot; 18. tank body. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figures 1 to 4A circuit board black hole processing device of the present embodiment includes a base plate 1 and a black hole processing pool 2 arranged on the base plate 1, a drain pipe is arranged at the lower right side of the black hole processing pool 2, a control panel is arranged on the black hole processing pool 2, the control panel is electrically connected to the electrical components in the device, the inner wall of the black hole processing pool 2 is provided with an anti-corrosion coating to improve the service life of the black hole processing pool 2, a cavity 3 is arranged at the bottom of the black hole processing pool 2, an air pipe 4 is arranged in the cavity 3, the air pipe 4 is a continuously bent curved structure, a plurality of air heads 5 are evenly arranged on the air pipe 4, a plurality of air holes are arranged on the air head 5, and a plurality of air heads 5 are embedded above the cavity 3, a pump 6 and an air heater 7 are arranged on the right side of the base plate 1, the pump 6 and the air heater 7 are connected by a connecting pipe, the pipe fitting of the air heater 7 passes through the cavity 3 and is connected to the air pipe 4, the air heater 7 is a kind of miniature air heater 7, an electric heating device for heating the gas flow, the heating element of the air heater 7 is a stainless steel electric heating tube, and a plurality of baffles are arranged in the inner cavity of the heater to guide the gas flow direction and extend the The retention time of the gas in the inner cavity is prolonged, so that the gas is fully heated and evenly heated, and then the heated air passes through the air pipe 4 to heat the black hole solution. A support plate 8 is arranged above the left side of the black hole treatment pool 2, and a liquid regulating box 9 is arranged above the front side of the support plate 8. The liquid regulating box 9 is filled with liquid for adjusting the pH of the black hole solution. A pH meter 10 is arranged above the rear side of the support plate 8. The pH meter 10 monitors the pH of the solution in the black hole treatment pool 2, thereby adjusting the pH of the black hole solution. The black hole treatment pool 2 A temperature control component is provided on the right inner wall to control the temperature of the solution in the black hole treatment pool 2. A support frame 11 is provided on the black hole treatment pool 2. The support frame 11 is made of fine steel. A cylinder 12 is provided on the horizontal plate of the support frame 11. The telescopic rod of the cylinder 12 passes through the horizontal plate of the support frame 11. A circuit board placement component is detachably provided to stably and evenly arrange multiple circuit boards to avoid the phenomenon of adhesion between the circuit boards when multiple circuit boards are subjected to black hole treatment at the same time, thereby affecting the black hole effect on the circuit boards.

[0023] like Figures 1 to 2 As shown, a liquid outlet pipe 13 is provided at the bottom of the liquid regulating tank 9, and a liquid outlet valve is provided on the liquid outlet pipe 13. The liquid outlet valve is electrically connected to the pH meter 10. The pH of the solution in the black hole treatment tank 2 is monitored, and the liquid in the liquid regulating tank 9 is controlled to be discharged.

[0024] like Figure 2 As shown, the temperature control component includes a temperature sensor 14 and a temperature controller 15. The temperature sensor 14 is electrically connected to the temperature controller 15, and the temperature controller 15 is electrically connected to the air heater 7 to control the temperature of the solution in the black hole treatment tank 2, thereby improving the black hole effect on the circuit board.

[0025] like Figure 1 ,4 As shown, the circuit board placement assembly includes a placement rack 16 that is detachably arranged on the lower end of the telescopic rod of the cylinder 12, and a plurality of slots 17 are evenly opened on the opposite surfaces of the upper and lower plates of the placement rack 16, and a plurality of grooves 18 are evenly opened on the lower plate of the placement rack 16. The circuit boards are inserted into the slots 17 corresponding to the placement rack 16, so that the circuit boards are placed vertically, and then black hole processing is performed on multiple circuit boards.

[0026] like Figure 1 and 4 As shown, a plurality of troughs 18 are respectively located between the slots 17 of the lower plate of the placement rack 16, so that the circuit boards can be in better contact with the black hole solution, thereby improving the effect of simultaneously treating the black holes of a plurality of circuit boards.

[0027] like Figures 2 to 3 As shown, the outside of the air pipe 4 is wrapped with a heat-insulating layer, and the heat-insulating layer is used to insulate the air pipe 4.

[0028] During the specific implementation of this embodiment, the staff adds the solution for black hole treatment of the circuit board into the black hole treatment pool 2, monitors the pH of the solution in the black hole treatment pool 2 through the operation of the pH meter, controls the liquid outlet valve of the liquid outlet pipe 13 at the bottom of the liquid regulating box 9, and then discharges the liquid in the liquid regulating box 9 for adjusting the pH of the black hole solution, and cooperates with the operation of the pump body to discharge the gas through the multiple gas heads 5 on the air pipe 4, so that the solution in the black hole treatment pool 2 is pneumatically mixed, thereby improving the mixing efficiency of the solution in the black hole treatment pool 2, so that the pH of the liquid is maintained between 9.8 and 10.6, and the temperature of the solution in the black hole treatment pool 2 is adjusted by the temperature control component, and the air input by the pump body is heated by the operation of the air heater 7. The heating element of the air heater 7 is a stainless steel electric heating tube, and the inner cavity of the heater is provided with multiple baffles to guide the gas flow and extend the The residence time of the gas in the inner cavity is prolonged, so that the gas is fully heated and evenly heated. The outside of the air pipe 4 is wrapped with an insulation layer, and the gas is discharged through multiple air heads 5 on the air pipe 4, so that the solution in the black hole treatment pool 2 is pneumatically heated, thereby improving the efficiency of heating the solution in the black hole treatment pool 2 and ensuring the uniformity of the temperature of the solution in the black hole treatment pool 2, so that the temperature is controlled at 25-32°C. Through the structural setting of the circuit board placement component, the circuit board to be treated with black holes is inserted into the slot 17 corresponding to the placement rack 16, so that the circuit board is placed vertically, and then the black hole treatment is performed on multiple circuit boards. The multiple slots 18 are respectively located between the slots 17 of the lower plate of the placement rack 16, so that the circuit board can be better in contact with the black hole solution, avoiding the phenomenon of adhesion between the circuit boards when the black holes of multiple circuit boards are treated at the same time, thereby affecting the black hole effect on the circuit board.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board black hole processing device, comprising a base plate (1) and a black hole processing pool (2) arranged on the base plate (1), characterized in that: The bottom of the black hole treatment pool (2) is provided with a cavity (3), an air pipe (4) is provided in the cavity (3), the air pipe (4) is in a continuously bent curved structure, a plurality of air heads (5) are evenly provided on the air pipe (4), and the plurality of air heads (5) are embedded above the cavity (3). A pump (6) and an air heater (7) are provided on the right side of the bottom plate (1), the pump (6) and the air heater (7) are connected via a connecting pipe, and a pipe of the air heater (7) passes through the cavity (3) and is connected to the air pipe ( 4), a support plate (8) is arranged on the upper left side of the black hole treatment pool (2), a liquid regulating box (9) is arranged on the upper front side of the support plate (8), a pH meter (10) is arranged on the upper rear side of the support plate (8), a temperature control component is arranged on the right inner wall of the black hole treatment pool (2), a support frame (11) is arranged on the black hole treatment pool (2), a cylinder (12) is arranged on the horizontal plate of the support frame (11), and a telescopic rod of the cylinder (12) passes through the horizontal plate of the support frame (11) and is detachably provided with a circuit board placement component.

2. A circuit board black hole processing device according to claim 1, characterized in that: A liquid outlet pipe (13) is provided at the bottom of the liquid regulating box (9), and a liquid outlet valve is provided on the liquid outlet pipe (13), and the liquid outlet valve is electrically connected to the pH meter (10).

3. The circuit board black hole processing device according to claim 1, characterized in that: The temperature control component comprises a temperature sensor (14) and a temperature controller (15); the temperature sensor (14) is electrically connected to the temperature controller (15); and the temperature controller (15) is electrically connected to the air heater (7).

4. The circuit board black hole processing device according to claim 1, characterized in that: The circuit board placement assembly comprises a placement rack (16) detachably arranged at the lower end of the telescopic rod of the cylinder (12), a plurality of slots (17) being evenly arranged on the opposite surfaces of the upper and lower plates of the placement rack (16), and a plurality of grooves (18) being evenly arranged on the lower plate of the placement rack (16).

5. The circuit board black hole processing device according to claim 4, characterized in that: The plurality of slots (18) are respectively located between the slots (17) of the lower plate of the placement rack (16).

6. The circuit board black hole processing device according to claim 1, characterized in that: The air pipe (4) is wrapped externally with a heat-insulating layer.

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