Computer heat dissipation base

By designing the combined structure of heat -conductive and heat dissipation fins, the heat dissipation fan is used to bring out the heat, solving the problem of direct blowing in existing technologies to cause dust into the computer, and realize the rapid heat dissipation and dust protection of the computer.

CN222394325UActive Publication Date: 2025-01-24SENSHUO (NINGXIA) TECH CO LTD
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Patent Information

Application Number
CN202420247955.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-01
Publication Date
2025-01-24
Estimated Expiration
2034-02-01

AI Technical Summary

Technical Problem

The existing computer cooling base causes fine dust to enter the computer's interior by blowing directly, attaching to internal components, causing damage to the computer.

Method used

A computer heat dissipation base is designed, which uses a combined structure of heat conductors and heat dissipation fins to take out heat through a cooling fan to avoid direct blowing and prevent dust from entering.

Benefits of technology

The rapid heat dissipation of the computer is achieved, and at the same time, the dust is avoided into the computer, and the service life of the computer is prolonged.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a computer heat dissipation base which comprises a supporting frame, a supporting plate is arranged above the supporting frame, four heat conduction pieces are arranged on the supporting plate, a heat dissipation box is fixedly adhered to the bottom wall of the supporting plate, two through openings are symmetrically formed in the heat dissipation box, blowing cylinders are fixedly adhered to the interiors of the through openings, and the blowing cylinders are symmetrically arranged on the bottom wall of the supporting plate. And a cooling fan is fixedly installed in the blowing cylinder, a plurality of evenly-distributed cooling fins are fixedly bonded to the bottom walls of the four heat conduction pieces, and exhaust outlets are formed in the two side walls of the cooling box. In the using process of the computer radiator, heat generated when a computer is used can be conducted to the radiating fins through the heat conducting pieces, the radiating fan blows air to the inner cavity of the radiating box to take out the heat on the radiating fins, and therefore rapid radiating of the computer is achieved, direct blowing to the bottom of the computer is avoided, and the heat dissipation efficiency is improved. And the computer is prevented from being damaged due to the fact that tiny dust is blown into the computer and attached to internal elements due to direct blowing.
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Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a computer heat dissipation base. Background Art

[0002] Integrated circuits are widely used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only cause unstable system operation and shorten service life, but may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. The function of the heat sink is to absorb this heat and then dissipate it to ensure the temperature of computer components.

[0003] In the prior art, most computer heat dissipation bases achieve the effect of computer heat dissipation by installing a number of exhaust fans on the base to blow air to the computer. However, this method has the risk of blowing fine dust into the computer, especially for some computers with heat dissipation holes on the bottom wall. Fine dust entering the computer will adhere to the internal components, which will cause damage to the computer in the long run. In this regard, we propose a computer heat dissipation base to solve the above-mentioned problem. Utility Model Content

[0004] The purpose of the utility model is to provide a computer heat dissipation base to solve the problems raised in the above background technology.

[0005] To achieve the above purpose, the utility model provides the following technical solution: a computer heat dissipation base, comprising:

[0006] A support frame, a support plate is arranged above the support frame, four heat conducting plates are arranged on the support plate, the four heat conducting plates are distributed in a rectangular shape, a heat sink is fixedly bonded to the bottom wall of the support plate, two through openings are provided on the bottom wall of the heat sink, the two through openings are symmetrically arranged on the heat sink, a hair dryer is fixedly bonded in the through opening, a heat dissipation fan is fixedly installed in the hair dryer, a plurality of evenly distributed heat dissipating fins are fixedly bonded to the bottom walls of the four heat conducting plates, the bottom ends of the heat dissipating fins pass through the support plate and are slidably connected to the support plate, and exhaust outlets are provided on both side walls of the heat sink.

[0007] Preferably, sliding rods are fixedly bonded to the bottom walls at both ends of the heat conducting plate, the sliding rods are slidably connected to the support plate, and elastic springs are sleeved on the sliding rods, and the two ends of the elastic springs are respectively fixedly bonded to the top wall of the support plate and the bottom wall of the heat conducting plate.

[0008] Preferably, a barrier is fixedly bonded to the outer edge of the top wall of the support plate.

[0009] Preferably, fixing rods are fixedly bonded to the inner walls on both sides of the support frame, and support rods are rotatably mounted on the fixing rods.

[0010] Preferably, four plug-in sleeves are fixedly bonded to the bottom wall of the support plate, and the four support rods are movably plugged into the four plug-in sleeves respectively.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. During the use of the utility model, the heat generated by the computer will be conducted to the heat sink fins through the heat conducting sheet, and the heat on the heat sink fins will be taken out by the heat dissipation fan blowing air into the inner cavity of the heat sink, thereby achieving rapid heat dissipation of the computer, while avoiding blowing air directly to the bottom of the computer, preventing direct blowing from causing fine dust to be blown into the computer and attached to the internal components, causing damage to the computer;

[0013] 2. The utility model can compress the elastic spring when the computer is placed on the heat conducting sheet through the cooperation of the sliding rod and the elastic spring, so that the elastic force generated by the elastic spring acts on the heat conducting sheet, so that the heat conducting sheet is tightly attached to the bottom wall of the computer, thereby ensuring the conduction effect of the heat conducting sheet. The support rod and the plug-in sleeve can be plugged in to support the tray, and when not in use, the support rod can be pulled out of the plug-in sleeve and flipped into the support frame, so that the tray and the support frame can be stacked, which is convenient for the storage and carrying of the heat dissipation base. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a three-dimensional structural schematic diagram of a computer heat dissipation base proposed by the utility model;

[0015] Figure 2 This is a front view of the cross-section structure of a support plate in a computer heat dissipation base proposed by the utility model;

[0016] Figure 3 A computer heat dissipation base is provided in the utility model Figure 2 The structure diagram at A is enlarged;

[0017] Figure 4 The utility model is a three-dimensional structural diagram of the connection between the heat conducting sheet and the heat dissipation fins in the computer heat dissipation base.

[0018] In the figure: 1. support frame; 2. support plate; 3. heat conducting sheet; 4. heat sink; 5. through hole; 6. hair dryer; 7. cooling fan; 8. cooling fins; 9. exhaust vent; 10. sliding rod; 11. elastic spring; 12. enclosure; 13. fixing rod; 14. support rod; 15. plug-in sleeve. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-4 The utility model provides a technical solution: a computer heat dissipation base, comprising:

[0021] A support frame 1 is provided with a support plate 2 above the support frame 1, and four heat conducting plates 3 are provided on the support plate 2, and the four heat conducting plates 3 are distributed in a rectangular shape. A heat dissipation box 4 is fixedly bonded to the bottom wall of the support plate 2, and two through openings 5 ​​are provided on the bottom wall of the heat dissipation box 4, and the two through openings 5 ​​are symmetrically arranged on the heat dissipation box 4, and a hair dryer 6 is fixedly bonded in the through openings 5, and a cooling fan 7 is fixedly installed in the hair dryer 6, and a plurality of evenly distributed cooling fins 8 are fixedly bonded to the bottom walls of the four heat conducting plates 3, and the bottom ends of the cooling fins 8 pass through the support plate 2 and are slidably connected to the support plate 2, and exhaust ports 9 are provided on both side walls of the heat dissipation box 4.

[0022] Slide rods 10 are fixedly bonded to the bottom walls at both ends of the heat conducting sheet 3, and the slide rods 10 are slidably connected to the support plate 2. Elastic springs 11 are sleeved on the slide rods 10, and the two ends of the elastic springs 11 are respectively fixedly bonded to the top wall of the support plate 2 and the bottom wall of the heat conducting sheet 3. Through the cooperation of the slide rods 10 and the elastic springs 11, the elastic springs 11 can be compressed when the computer is placed on the heat conducting sheet 3, so that the elastic force generated by the elastic springs 11 acts on the heat conducting sheet 3, thereby making the heat conducting sheet 3 tightly fit on the bottom wall of the computer.

[0023] A barrier 12 is fixedly bonded to the outer edge of the top wall of the support plate 2 , and the barrier 12 serves to block the computer and prevent the computer from sliding out of the support plate 2 when placed on the support plate 2 .

[0024] Fixing rods 13 are fixedly bonded to the inner walls on both sides of the support frame 1 , and support rods 14 are rotatably mounted on the fixing rods 13 .

[0025] Four plug-in sleeves 15 are fixedly bonded to the bottom wall of the support plate 2, and the four support rods 14 are movably plugged into the four plug-in sleeves 15 respectively. The support plate 2 can be supported conveniently by plugging and cooperating with the support rods 14 and the plug-in sleeves 15. When not in use, the support rods 14 can be pulled out of the plug-in sleeves 15 and flipped into the support frame 1, so as to facilitate stacking of the support plate 2 and the support frame 1 and facilitate the storage and carrying of the heat dissipation base.

[0026] Working principle: When the utility model is in use, the computer is placed on the tray 2. When the computer is placed on the heat conductive sheet 3, the elastic spring 11 will be compressed, so that the elastic force generated by the elastic spring 11 acts on the heat conductive sheet 3, so that the heat conductive sheet 3 is tightly attached to the bottom wall of the computer. At this time, most of the surface of the heat sink fin 8 will slide into the inner cavity of the heat sink 4, and then the heat dissipation fan 7 is started. The heat generated by the computer when in use will be conducted to the heat sink fin 8 through the heat conductive sheet 3, and the heat on the heat sink fin 8 will be taken out by blowing air into the inner cavity of the heat sink 4 through the heat dissipation fan 7, thereby realizing rapid heat dissipation of the computer and avoiding blowing air directly to the bottom of the computer, so as to prevent direct blowing from causing fine dust to be blown into the computer and attached to the internal components, causing damage to the computer.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer heat dissipation base, characterized in that: include: A support frame (1) is provided above the support frame (1), and four heat conducting plates (3) are provided on the support plate (2), and the four heat conducting plates (3) are distributed in a rectangular shape. A heat dissipation box (4) is fixedly bonded to the bottom wall of the support plate (2), and two through-holes (5) are provided on the bottom wall of the heat dissipation box (4), and the two through-holes (5) are symmetrically arranged on the heat dissipation box (4). A hair dryer (6) is fixedly bonded in the through-hole (5), and a heat dissipation fan (7) is fixedly installed in the hair dryer (6). A plurality of evenly distributed heat dissipation fins (8) are fixedly bonded to the bottom walls of the four heat conducting plates (3), and the bottom ends of the heat dissipation fins (8) pass through the support plate (2) and are slidably connected to the support plate (2), and exhaust ports (9) are provided on both side walls of the heat dissipation box (4).

2. A computer heat dissipation base according to claim 1, characterized in that: Slide rods (10) are fixedly bonded to the bottom walls at both ends of the heat conducting plate (3), and the slide rods (10) are slidably connected to the support plate (2). An elastic spring (11) is sleeved on the slide rod (10), and the two ends of the elastic spring (11) are fixedly bonded to the top wall of the support plate (2) and the bottom wall of the heat conducting plate (3), respectively.

3. The computer heat dissipation base according to claim 1, characterized in that: A baffle (12) is fixedly bonded to the outer edge of the top wall of the support plate (2).

4. The computer heat dissipation base according to claim 1, characterized in that: Fixed rods (13) are fixedly bonded to the inner walls on both sides of the support frame (1), and support rods (14) are rotatably mounted on the fixed rods (13).

5. The computer heat dissipation base according to claim 4, characterized in that: Four plug-in sleeves (15) are fixedly bonded to the bottom wall of the support plate (2), and the four support rods (14) are movably plugged into the four plug-in sleeves (15) respectively.