Piezoelectric structure and electronic device

Abstract

The utility model provides a piezoelectric structure and an electronic device, the piezoelectric structure comprises a panel and a piezoelectric ceramic, the panel forms a pressing part, the pressing part comprises a pressing surface, the piezoelectric ceramic is arranged at the central position of one side of the pressing part away from the pressing surface, and the thickness of the pressing part tends to increase outwards from the central position of the pressing part. Specifically, the thickness of the pressing part is reduced, and particularly, the central position of the piezoelectric ceramic is set to be the thinnest, so that the rigidity of the thinned pressing part is weakened, the pressing part is easy to press, vibration is easy to generate, and the vibration feeling of the hand feeling of people is stronger. Meanwhile, the thickness of the pressing part is set to be in the trend of increasing outwards from the center position of the pressing part, so that the vibration cannot be transmitted to other areas while the vibration sense of the hand pressing position is ensured to be strong enough, and the normal work of other components is not influenced. The piezoelectric structure has the advantages that the pressing is easy, the vibration sense of the central position of the pressing part is strong, and the vibration sense does not affect the normal work of other components.

Description

Technical Field

[0001] The utility model relates to the technical field of piezoelectric ceramic keys, in particular to a piezoelectric structure and electronic equipment. Background Art

[0002] The piezoelectric structure is provided with piezoelectric ceramics. When the pressing position of the piezoelectric structure is pressed, the piezoelectric ceramics will be deformed. Through the positive piezoelectric effect and the inverse piezoelectric effect of the piezoelectric ceramics, the piezoelectric structure will feedback the vibration to the human finger. In the related art, the force required for pressing is large, the pressing is laborious, and the vibration of the piezoelectric structure will be transmitted to other areas, affecting the normal operation of other components.

[0003] In view of this, it is necessary to provide a new piezoelectric structure and electronic device to solve or at least alleviate the above technical defects. Utility Model Content

[0004] The main purpose of the utility model is to provide a piezoelectric structure and an electronic device, aiming to solve the technical problems in the prior art that the piezoelectric structure is laborious to press and the vibration affects the work of other components.

[0005] To achieve the above-mentioned purpose, according to one aspect of the utility model, the utility model provides a piezoelectric structure, the piezoelectric structure includes a panel and a piezoelectric ceramic, the panel is formed with a pressing part, the pressing part includes a pressing surface, the piezoelectric ceramic is arranged at the center position of the side of the pressing part away from the pressing surface, and the thickness of the pressing part tends to increase from the center position of the pressing part toward the outside.

[0006] In some embodiments, a step is formed on a side of the pressing portion away from the pressing surface, and the height of the step increases step by step from the center position of the pressing portion toward the outside.

[0007] In some embodiments, the step includes multiple steps, each step has the same thickness, and the length of each step gradually decreases from the center position of the pressing portion toward the outside.

[0008] In some embodiments, a curved surface is formed on a side of the pressing portion away from the pressing surface.

[0009] In some embodiments, a connecting portion is formed on the piezoelectric ceramic, and the panel is provided with a mounting portion corresponding to the connecting portion. The connecting portion is connected to the mounting portion to connect the piezoelectric ceramic and the panel, and the connecting portion is deformed to form internal stress.

[0010] In some embodiments, the connecting portion includes a buckle, the mounting portion includes a bayonet that cooperates with the buckle, and the size of the bayonet is smaller than the size of the buckle, and the buckle is deformed to be connected to the bayonet.

[0011] In some embodiments, a first mounting hole is formed on the mounting portion, and a second mounting hole is formed on the connecting portion, the central axis of the first mounting hole does not coincide with the central axis of the second mounting hole, and the piezoelectric structure also includes a fastener, which passes through the first mounting hole and the second mounting hole to connect the panel and the piezoelectric ceramic.

[0012] In some embodiments, a first connecting hole is formed on the mounting portion, a pressure block is provided on the panel, the pressure block cooperates with the panel to form an extrusion space, the connecting portion is provided in the extrusion space, a second connecting hole is provided on the pressure block, and the piezoelectric structure also includes a connecting member, the connecting member passes through the first connecting hole and the second connecting hole in sequence to connect the pressure block, the connecting portion and the mounting portion, and the pressure block squeezes the connecting portion to cause the piezoelectric ceramic to deform.

[0013] In some embodiments, a first extrusion slope and a connecting surface are formed on the pressing block, and a second extrusion slope is formed on the connecting portion. The first extrusion slope and the second extrusion slope are arranged facing each other and abutting against each other, and the connecting surface is arranged facing the mounting portion. During the locking process of the connecting member, the first extrusion slope moves along the second extrusion slope toward the mounting portion, and the connecting portion is deformed and moved until the connecting surface abuts against the mounting portion.

[0014] In some embodiments, the connecting parts and the mounting parts are both plural in number and are arranged in one-to-one correspondence.

[0015] According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device comprises the piezoelectric structure described above.

[0016] In the above scheme, the piezoelectric structure includes a panel and a piezoelectric ceramic. The panel is formed with a pressing part, and the pressing part includes a pressing surface. The piezoelectric ceramic is arranged at the center position of the side of the pressing part away from the pressing surface, and the thickness of the pressing part tends to increase from the center position of the pressing part to the outside. When a person presses the pressing surface, the piezoelectric ceramic arranged inside the piezoelectric structure will be deformed, and the positive piezoelectric effect and the inverse piezoelectric effect of the piezoelectric ceramic will eventually cause the vibration of the pressing part, and the human hand can feel the vibration. In the above embodiment, by reducing the thickness of the pressing part, especially setting the center position where the piezoelectric ceramic is arranged to be the thinnest, the stiffness of the pressing part is weakened after thinning, and it is easy to press and more likely to vibrate, and the vibration felt by the human hand is stronger. At the same time, the thickness of the pressing part is set to increase from the center position of the pressing part outwards, and the thickness can be gradually increased or increased in a step-by-step manner. As the thickness increases, the rigidity increases, and the transmission of vibration becomes more difficult. In this way, while ensuring that the vibration at the position where the hand presses is strong enough, the vibration will not be transmitted to other areas, and will not affect the normal operation of other components. It should also be noted that this embodiment adopts a method of gradually increasing or step-by-step increasing the thickness of the pressing part to increase it to the normal thickness of the panel, which can play a role in a slow transition. Because a sudden thinning method is adopted, the vibration at the thinned position may be too large, while the vibration at the non-thinned position is very small or even non-existent, resulting in a large difference in vibration amplitude and causing damage to the panel. The utility model has the advantages of easy pressing, strong vibration at the center position of the pressing part, and the vibration will not affect the normal operation of other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of the structure of the piezoelectric structure of an embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of the cross-sectional structure of an embodiment of the piezoelectric structure of the utility model;

[0020] Figure 3 for Figure 2 Schematic diagram of some structures;

[0021] Figure 4 This is a schematic diagram of the cross-sectional structure of another embodiment of the piezoelectric structure of the utility model embodiment;

[0022] Figure 5This is a schematic structural diagram of the piezoelectric structure of an embodiment of the utility model, in which the mounting parts of the piezoelectric ceramic and the panel are not fully installed;

[0023] Figure 6 This is a schematic diagram of the structure in which the piezoelectric ceramics and the mounting part of the panel of the piezoelectric structure according to one embodiment of the utility model are installed;

[0024] Figure 7 This is a schematic structural diagram of a piezoelectric structure, a piezoelectric ceramic and a panel in another embodiment of the utility model;

[0025] Figure 8 This is a schematic structural diagram of a piezoelectric structure of another embodiment of the utility model, in which the mounting parts of the piezoelectric ceramic and the panel are not fully installed;

[0026] Fig. 9 This is a structural schematic diagram of a piezoelectric structure in which the piezoelectric ceramic and the mounting part of the panel are installed in another embodiment of the utility model.

[0027] Description of Figure Numbers:

[0028] 100. Piezoelectric structure;

[0029] 1. Panel; 11. Pressing portion; 111. Pressing surface; 112. Step; 1121. Ladder; 113. Arc surface; 12. Mounting portion; 121. Bayonet; 122. First mounting hole; 123. First connecting hole; 2. Piezoelectric ceramic; 21. Connecting portion; 211. Buckle; 212. Second mounting hole; 213. Second extrusion slope; 3. Fastener; 4. Connector; 5. Press block; 51. First extrusion slope; 52. Connecting surface; 6. Extrusion space.

[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with the implementation methods and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] It should be noted that all directional indications (such as up, down, etc.) in the implementation mode of the utility model are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0034] Furthermore, the technical solutions between the various implementation modes of the present invention may be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in the field. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0035] Reference Figure 1 to Figure 4 According to one aspect of the utility model, the utility model provides a piezoelectric structure 100, the piezoelectric structure 100 includes a panel 1 and a piezoelectric ceramic 2, the panel 1 is formed with a pressing portion 11, the pressing portion 11 includes a pressing surface 111, the piezoelectric ceramic 2 is arranged at the center position of the side of the pressing portion 11 away from the pressing surface 111, and the thickness of the pressing portion 11 tends to increase from the center position of the pressing portion 11 toward the outside.

[0036] The piezoelectric ceramic 2 has the function of conversion and reverse conversion between mechanical energy and electrical energy. The piezoelectric structure 100 may include a button, and the pressing surface 111 refers to the side of the piezoelectric structure 100 facing outward, which is also the side pressed by a human hand. When a human hand presses the pressing surface 111, the piezoelectric ceramic 2 disposed inside the piezoelectric structure 100 will be deformed, and the positive piezoelectric effect and the inverse piezoelectric effect of the piezoelectric ceramic 2 will eventually cause the pressing portion 11 to vibrate, and the human hand can feel the vibration. In the above embodiment, by reducing the thickness of the pressing portion 11, especially by setting the center position where the piezoelectric ceramic 2 is disposed as the thinnest, the stiffness of the pressing portion 11 is weakened after thinning, making it easier to press and more likely to vibrate, and the vibration felt by the human hand is stronger. At the same time, the thickness of the pressing portion 11 is arranged to increase from the center position of the pressing portion 11 to the outside, and the center position is as shown in FIG. Figure 2 or Figure 4The position indicated by the middle arrow O, that is, the center of the pressing part 11, has an increasing trend of thickness, which can be a gradual increase in thickness or a step-by-step 1121 increase. As the thickness increases, the stiffness increases, and the transmission of vibration becomes more difficult. In this way, while ensuring that the vibration at the position where the hand presses is strong enough, the vibration will not be transmitted to other areas, and will not affect the normal operation of other components. It should also be noted that in this embodiment, the thickness of the pressing part 11 is gradually increased or increased in a step-by-step 1121 manner to increase to the normal thickness of the panel 1, which can play a role in a slow transition. Because if a sudden thinning method is adopted, the vibration at the thinned position may be too large, while the vibration at the non-thinned position is very small or even non-existent, resulting in a large difference in vibration amplitude and causing damage to the panel 1. This embodiment has the advantages of easy pressing, strong vibration at the center of the pressing part 11, and the vibration will not affect the normal operation of other components.

[0037] Reference Figure 2 and Figure 3 In some embodiments, a step 112 is formed on the side of the pressing portion 11 away from the pressing surface 111, and the height of the step 112 increases step by step from the center position of the pressing portion 11 to the outside. The thickness change of the pressing portion 11 can be a step-by-step gradual change, and the height of the step 112 increases step by step from the center position of the pressing portion 11 to the outside. The height of the step 112 is the smallest at the center position of the pressing portion 11, which corresponds to the position where the piezoelectric ceramic 2 is set. The height of the step 112 here refers to the height of the entire step 112, rather than the height of each step 1121 in the step 112. The height of the step 112 is actually the thickness of the corresponding panel 1. The height of the step 112 increases step by step from the center position of the pressing portion 11 to the outside, that is, the thickness of the pressing portion 11 increases from the center position of the pressing portion 11 to the outside. The form of the step 112 is adopted, and the processing is relatively simple.

[0038] In some embodiments, the step 112 includes multiple steps 1121, each step 1121 has the same thickness, and the length of each step 1121 gradually decreases from the center of the pressing portion 11 to the outside. It should be noted that the step 112 includes multiple steps 1121, and the multiple steps 1121 gradually rise, so the same thickness of each step 1121 is not inconsistent with the gradual increase in the height of the step 112. The specific thickness of the step 1121 is as follows: Figure 3 As shown, Figure 3 The mark T in the figure indicates the thickness of the step 1121. This embodiment shows the case where the thickness of each step 1121 is the same. Figure 3Among them, L1, L2, L3, L4, and L5 represent the length of each level of steps 1121 from the center position to the outside. It can be seen that the relationship between the lengths is L1>L2>L3>L4>L5. Those skilled in the art will understand that when other conditions (such as thickness) remain unchanged, if the size of the material is smaller, it is less likely to deform, that is, the greater the rigidity. Therefore, when the thickness of the steps 1121 is the same, from the center position of the pressing part 11 to the outside, the length of each level of steps 1121 gradually decreases, which can further enhance the rigidity of the external position and make it more difficult for vibration to be transmitted to other peripheral areas. It should also be noted here that the thickness of each level of steps 1121 can also be set to be different, such as gradually becoming thicker, which can also reduce the transmission of vibration to other areas. The use of the same thickness in this embodiment is mainly for processing convenience, but it cannot be understood that the present application excludes technical solutions with different thicknesses.

[0039] Reference Figure 4 In some embodiments, a curved surface 113 is formed on the side of the pressing portion 11 away from the pressing surface 111. The thickness of the pressing portion 11 shows a trend of gradually changing from the center to the outside, and gradually becomes thicker, and the piezoelectric ceramic 2 is arranged at the center of the pressing portion 11. In the curved surface 113 adopted in this embodiment, the thickness of the pressing portion 11 is gradually increased to the normal thickness of the panel 1, and the change of the vibration amplitude is also smoother, which can play a better role in slow transition and reduce the risk of damage to the panel 1 caused by the large difference in vibration amplitude caused by the thickness difference of adjacent parts. Specifically, the curved surface 113 can change in the form of a parabola.

[0040] Reference Figures 5 to 9 In some embodiments, a connecting portion 21 is formed on the piezoelectric ceramic 2, and a mounting portion 12 is provided on the panel 1 corresponding to the connecting portion 21, and the mounting portion 12 is connected to the pressing portion 11. The connecting portion 21 is connected to the mounting portion 12 to connect the piezoelectric ceramic 2 and the panel 1, and the connecting portion 21 is deformed to form internal stress. The piezoelectric ceramic 2 is provided with a connecting portion 21, and the piezoelectric ceramic 2 is installed on the panel 1 through the connection between the connecting portion 21 and the mounting portion 12 on the panel 1. In the process of connecting the connecting portion 21 and the mounting portion 12, the connecting portion 21 is deformed, and internal stress is generated in the connecting portion 21 after deformation. According to the performance characteristics of the material, the stiffness of the material will decrease after the internal stress is generated in the material, which makes the piezoelectric ceramic 2 easier to vibrate and is also conducive to improving the vibration. At the same time, the connecting portion 21 is connected to the mounting portion 12 through deformation, and there is pre-pressure between the two, and the reliability of the connection is also higher. It should be noted that at this time, the strength of the mounting portion 12 is greater than the strength of the connecting portion 21, that is, the mounting portion 12 is not easy to deform relative to the connecting portion 21 during the connection process, so during the connection process, the connection portion 21 is more likely to deform to make the two connected or tightly fit or interference fit.

[0041] Reference Figure 5 and Figure 6 In some specific embodiments, the connecting portion 21 includes a buckle 211, and the mounting portion 12 includes a bayonet 121 that cooperates with the buckle 211, and the size of the bayonet 121 is smaller than the size of the buckle 211, and the buckle 211 is deformed and connected to the bayonet 121. Since the size of the bayonet 121 is smaller than the size of the buckle 211, it is difficult to install under normal circumstances. And according to the description of the previous embodiment, the mounting portion 12 is not easy to deform relative to the connecting portion 21 during the connection process, so it is difficult to achieve the connection between the buckle 211 and the bayonet 121 by the size change of the bayonet 121 or the expansion of the bayonet 121. This embodiment adopts assembly at low temperature. According to the principle of thermal expansion and contraction, the piezoelectric ceramic 2 is placed in a low temperature environment, so that the size of the piezoelectric ceramic 2 is reduced, specifically, at least the size of the buckle 211 is reduced, and the reduced buckle 211 can be along Figure 5 The direction A1 indicated by the middle arrow is assembled into the bayonet 121 of the mounting portion 12. In a normal temperature environment, the buckle 211 needs to be restored to its original size, but due to the space limitation of the bayonet 121, the connecting portion 21 cannot be restored to its normal size. In this way, an extrusion force is formed between the buckle 211 and the bayonet 121, causing the connecting portion 21 itself to generate internal stress, which can be tensile stress. In order to improve the reliability of the connection, the buckle 211 can also be set as an undercut, and the buckle 211 and the bayonet 121 have an interference fit, which is difficult to move along the Figure 6 The A2 direction indicated by the middle arrow is disengaged.

[0042] Reference Figure 7 In some other specific embodiments, a first mounting hole 122 is formed on the mounting portion 12, a second mounting hole 212 is formed on the connecting portion 21, the central axis of the first mounting hole 122 does not coincide with the central axis of the second mounting hole 212, and the piezoelectric structure 100 further includes a fastener 3, which passes through the first mounting hole 122 and the second mounting hole 212 to connect the panel 1 and the piezoelectric ceramic 2. The central axis of the first mounting hole 122 is as shown in FIG. Figure 7 As shown in L1, the central axis of the second mounting hole 212 is as shown in Figure 7 As shown in FIG. 1 , the central axes of the first mounting hole 122 and the second mounting hole 212 are parallel and do not overlap, but differ by a small distance, which is generally less than 1 mm. As described above, the piezoelectric ceramic 2 is more susceptible to deformation than the panel 1, and in general, the thickness of the piezoelectric ceramic 2 is also smaller than the thickness of the panel 1. In this way, during the installation of the fastener 3, Figure 7 As described above, L1 is on the left side of L2. As the fastener 3 is screwed into the piezoelectric ceramic 2, the piezoelectric ceramic 2 will deform so that the second mounting hole 212 can be offset toward the first mounting hole 122, corresponding to Figure 7Move in the direction of arrow B to facilitate the smooth installation of the fastener 3. At this time, the piezoelectric ceramic 2 (including the connecting portion 21) will be deformed, and internal stress will be generated in the connecting portion 21 after the deformation. According to the performance characteristics of the material, the stiffness of the material will decrease after the internal stress is generated, which makes the piezoelectric ceramic 2 easier to vibrate and is also beneficial to enhance the vibration sense. This embodiment has a simple connection structure, and the installation method and installation environment are simple, and no specific environment or equipment conditions are required. The fastener 3 here can be a threaded part, a screw or a bolt.

[0043] Reference Figure 8 and Fig. 9 In some embodiments, a first connection hole 123 is formed on the mounting portion 12, a pressing block 5 is provided on the panel 1, the pressing block 5 cooperates with the panel 1 to form an extrusion space 6, the connecting portion 21 is provided in the extrusion space 6, a second connection hole is provided on the pressing block 5, and the piezoelectric structure 100 further includes a connecting member 4, the connecting member 4 passes through the first connection hole 123 and the second connection hole in sequence to connect the pressing block 5, the connecting portion 21 and the mounting portion 12, and the pressing block 5 squeezes the connecting portion 21 to deform the piezoelectric ceramic 2. In this embodiment, the piezoelectric ceramic 2 is deformed by squeezing the pressing block 5. Specifically, referring to Figure 8 , first place the pressing block 5 on the panel 1, and form an extrusion space 6 between the panel 1, and the connecting part 21 is placed in the extrusion space 6. When connection is required, the connecting member 4 passes through the first connecting hole 123 and gradually enters the second connecting hole. In the process of the connecting member 4 gradually entering the second connecting hole, the connecting member 4 will press the pressing block 5 downward, and the pressing block 5 will press the piezoelectric ceramic 2 downward, so that the piezoelectric ceramic 2 will deform and generate internal stress. After the material generates internal stress, the stiffness of the material will decrease, which makes the piezoelectric ceramic 2 easier to vibrate and is also beneficial to enhance the vibration. This embodiment is not limited by the structure of the panel 1 and the piezoelectric ceramic 2, and can achieve connection in more structural forms, and has a wide range of applications. The connecting member 4 here can also be a threaded member, a screw or a bolt.

[0044] Reference Figure 8 and Fig. 9 In some embodiments, the pressing block 5 is formed with a first extrusion slope 51 and a connecting surface 52, and the connecting portion 21 is formed with a second extrusion slope 213. The first extrusion slope 51 and the second extrusion slope 213 are arranged facing each other and abutting each other, and the connecting surface 52 is arranged facing the mounting portion 12. During the locking process of the connecting member 4, the first extrusion slope 51 moves along the second extrusion slope 213 toward the mounting portion 12, and the connecting portion 21 is deformed and moved until the connecting surface 52 abuts against the mounting portion 12. Fig. 9 , Fig. 9 The dotted line D in the middle shows the state before installation. Fig. 9 The solid line D shows the state of completed installation. During the pressing process of the pressing block 5, the piezoelectric ceramic 2 moves along the Fig. 9 The first extrusion slope 51 and the second extrusion slope 213 can slide relative to each other, so that when the pressing block 5 moves downward, the piezoelectric ceramic 2 will be subjected to an extrusion force perpendicular to the second extrusion slope 213 and directed to the connecting portion 21. This force can be decomposed into a horizontal force and a vertical force. The horizontal force causes the piezoelectric ceramic 2 to move to the left, that is, Fig. 9 In the direction indicated by the middle arrow C, since the panel 1 is below the piezoelectric ceramic 2 and the panel 1 is less deformable than the piezoelectric ceramic 2, the vertical force causes the piezoelectric ceramic 2 to deform. As the connector 4 is locked, the connecting surface 52 fits with the panel 1 to achieve a secure connection.

[0045] Reference Figure 1 In some embodiments, the number of the connecting parts 21 and the mounting parts 12 are both multiple and arranged in one-to-one correspondence. Specifically, the number of the connecting parts 21 can be three, and the three connecting parts 21 are arranged in an annular manner at intervals. The arrangement of multiple connecting parts 21 and the mounting parts 12 can not only improve the reliability of the connection, but also increase the deformation of the piezoelectric ceramic 2, and make the deformation more uniform, and the piezoelectric ceramic 2 is not easily damaged.

[0046] According to another aspect of the present invention, the present invention further provides an electronic device, which includes the above-mentioned piezoelectric structure 100. Since the electronic device includes all technical solutions of all embodiments of the above-mentioned piezoelectric structure 100, it at least has all the beneficial effects brought by all the above-mentioned technical solutions, which will not be described one by one here.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and do not limit the patent scope of the present utility model; although the present application is described in detail with reference to the above embodiments, ordinary technicians in this field should understand that under the technical concept of the present utility model, it is still possible to modify the technical solutions recorded in the above embodiments, or to replace some or all of the technical features therein; or directly / indirectly apply them to other related technical fields, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specifications of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A piezoelectric structure, characterized in that: The piezoelectric structure includes a panel and a piezoelectric ceramic. The panel is formed with a pressing portion, and the pressing portion includes a pressing surface. The piezoelectric ceramic is arranged at the center position of the side of the pressing portion away from the pressing surface, and the thickness of the pressing portion tends to increase from the center position of the pressing portion toward the outside.

2. The piezoelectric structure according to claim 1, characterized in that: A step is formed on a side of the pressing portion away from the pressing surface, and the height of the step increases step by step from the center position of the pressing portion toward the outside.

3. The piezoelectric structure according to claim 2, characterized in that: The step includes a plurality of steps, each step has the same thickness, and the length of each step gradually decreases from the center position of the pressing portion toward the outside.

4. The piezoelectric structure according to claim 1, characterized in that: A curved surface is formed on a side of the pressing portion away from the pressing surface.

5. The piezoelectric structure according to any one of claims 1 to 4, characterized in that: A connecting portion is formed on the piezoelectric ceramic, and a mounting portion is provided on the panel corresponding to the connecting portion. The connecting portion is connected to the mounting portion to connect the piezoelectric ceramic and the panel, and the connecting portion is deformed to form internal stress.

6. The piezoelectric structure according to claim 5, characterized in that: The connecting portion includes a buckle, the mounting portion includes a bayonet matched with the buckle, and the size of the bayonet is smaller than the size of the buckle, and the buckle is deformed to be connected with the bayonet.

7. The piezoelectric structure according to claim 5, characterized in that: A first mounting hole is formed on the mounting portion, and a second mounting hole is formed on the connecting portion. The central axis of the first mounting hole does not coincide with the central axis of the second mounting hole. The piezoelectric structure also includes a fastener, which passes through the first mounting hole and the second mounting hole to connect the panel and the piezoelectric ceramic.

8. The piezoelectric structure according to claim 5, characterized in that: A first connecting hole is formed on the mounting portion, a pressure block is arranged on the panel, the pressure block cooperates with the panel to form an extrusion space, the connecting portion is arranged in the extrusion space, a second connecting hole is arranged on the pressure block, and the piezoelectric structure also includes a connecting member, the connecting member passes through the first connecting hole and the second connecting hole in sequence to connect the pressure block, the connecting portion and the mounting portion, and the pressure block squeezes the connecting portion to cause the piezoelectric ceramic to deform.

9. The piezoelectric structure according to claim 8, characterized in that: A first extrusion slope and a connecting surface are formed on the pressing block, and a second extrusion slope is formed on the connecting portion. The first extrusion slope and the second extrusion slope are arranged facing each other and abutting against each other, and the connecting surface is arranged facing the mounting portion. During the locking process of the connecting member, the first extrusion slope moves along the second extrusion slope toward the mounting portion, and the connecting portion is deformed and moved until the connecting surface abuts against the mounting portion.

10. The piezoelectric structure according to claim 5, characterized in that: The connecting parts and the mounting parts are both plural in number and are arranged in one-to-one correspondence.

11. An electronic device, characterized in that: The electronic device comprises the piezoelectric structure according to any one of claims 1 to 10.

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