Phase change liquid cooling heat dissipation device based on porous permeation and heat dissipation system

Abstract

The utility model relates to a heat dissipation device, in particular to a phase change liquid cooling heat dissipation device based on porous permeation and a heat dissipation system, which comprises a heat dissipation substrate and an upper cover plate, and the upper cover plate is pressed on the heat dissipation substrate; the heat dissipation substrate is provided with a first cavity, a second cavity and a micro / small channel. The micro / small channel is arranged between the first cavity and the second cavity, one end of the micro / small channel is communicated with the first cavity or the second cavity, and the other end of the micro / small channel is of a closed structure; a porous medium is arranged between the adjacent micro / small channels, and pores are formed in the porous medium; a liquid inlet and a liquid outlet are formed in the upper cover plate, the liquid inlet is communicated with the first cavity, and the liquid outlet is communicated with the second cavity. Compared with the prior art, the phase-change liquid-cooling heat dissipation device solves the problems that in the prior art, a phase-change liquid-cooling heat dissipation device is complex in structure and difficult to apply to small-space equipment (such as a computer and a notebook computer), efficient heat dissipation of a chip is achieved, and the phase-change liquid-cooling heat dissipation device is compact in overall structure and small in occupied space.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device, in particular to a phase-change liquid cooling heat dissipation device based on porous penetration and a heat dissipation system. Background Art

[0002] As electronic devices develop towards smaller size and higher performance, the power density of chips continues to increase, bringing more severe heat dissipation challenges. Good heat dissipation not only affects the stability and performance of the device, but is also a key factor in extending the life of the device. At present, the main technologies for chip heat dissipation include but are not limited to heat sinks, fan cooling, heat pipes, liquid cooling, phase change cooling and other solutions.

[0003] Heat sink and fan cooling are widely used in various electronic devices due to their low cost and mature technology, but the main challenge they face is their relatively low heat dissipation efficiency, especially when space is limited or the ambient temperature is high, their performance is greatly reduced; heat pipe technology is gradually being used in the cooling of high-performance chips due to its efficient heat transfer performance, but its design and integration complexity is high, and it is difficult to meet all scenarios in terms of cost and flexibility.

[0004] Liquid cooling and phase change cooling technologies can provide better heat dissipation performance, especially suitable for high-performance computing and high-power electronic devices, but these solutions usually involve more complex system design, higher maintenance costs and potential leakage risks, which limit their widespread application. Therefore, the development of efficient and economical chip heat dissipation technology in a compact space is crucial to the advancement of electronic device technology.

[0005] Prior art CN118017080A discloses a phase-change liquid cooling system for energy storage cabinets, including several evaporation modules, steam channels, condensation modules, condensation reflux channels and internal liquid working fluids; the evaporation module absorbs heat to change the internal liquid working fluid into steam, the steam flows to the condensation module through the steam channel, the condensation module undergoes a gas-liquid phase change to condense the steam into a liquid working fluid, and the liquid working fluid flows back to the evaporation module through the condensation reflux channel. However, in addition to the conventional liquid circulation channel, the scheme also requires the layout of a gas circulation channel, resulting in a large overall structure, so it is difficult to be well applied in computers, especially in devices such as laptops and tablet computers with narrow spaces.

[0006] Therefore, it is necessary to propose a phase change liquid cooling device with compact structure and excellent heat exchange effect. Utility Model Content

[0007] The purpose of the present utility model is to provide a phase change liquid cooling device and a cooling system based on porous penetration in order to solve at least one of the above problems, so as to solve the problem that the phase change liquid cooling device in the prior art has a complex structure and is difficult to apply to small space equipment (such as computers, laptops, etc.). The present solution realizes efficient heat dissipation of the chip, and the overall structure of the phase change liquid cooling device is compact and occupies little space.

[0008] The purpose of the utility model is achieved through the following technical solutions:

[0009] The first aspect of the utility model discloses a phase change liquid cooling heat dissipation device based on porous penetration, comprising a heat dissipation substrate and an upper cover plate, wherein the upper cover plate is pressed onto the heat dissipation substrate;

[0010] The heat dissipation substrate is provided with a first cavity, a second cavity and a micro / small channel; the micro / small channel is arranged between the first cavity and the second cavity, and one end of the micro / small channel is connected to the first cavity or the second cavity, and the other end of the micro / small channel is a closed structure; a porous medium is provided between adjacent micro / small channels, and pores are formed on the porous medium; the pores are the porous structure of the foam metal itself or are formed by sintering powdered metal.

[0011] The upper cover plate is provided with a liquid inlet and a liquid outlet, the liquid inlet is communicated with the first cavity, and the liquid outlet is communicated with the second cavity.

[0012] Preferably, the heat dissipation substrate and the upper cover are made of iron-based metals, copper and copper alloys, stainless steel, tungsten and tungsten alloys, precious metals, aluminum or aluminum alloys, etc.

[0013] Preferably, the upper cover plate and the heat dissipation substrate are connected by brazing.

[0014] Preferably, the micro / small channel having one end connected to the first cavity and the micro / small channel having one end connected to the second cavity are arranged alternately.

[0015] Preferably, the porous medium is foamed metal, or pores are formed by sintering metal; the diameter of the pores is between 10 micrometers and 2 millimeters.

[0016] Preferably, the cross-sectional shape of the porous medium includes a rectangle, a semicircle, a triangle and a trapezoid, and the longitudinal cross-sectional shape of the porous medium includes a straight line and a sine curve.

[0017] Preferably, the porous medium has a width ranging from 40 μm to 10 mm, a length ranging from 10 mm to 500 mm, and a height ranging from 1 mm to 10 mm.

[0018] Preferably, the ratio of the width of the micro / small channel to the width of the porous medium is between 1-5.

[0019] Preferably, the joints of the liquid inlet and the liquid outlet are of a threaded structure or a pagoda structure; the connecting sections where the liquid outlet and the liquid inlet are connected to the upper cover plate are arranged perpendicular to the surface of the upper cover plate, and the free ends of the liquid outlet and the liquid inlet are oriented in any direction.

[0020] The second aspect of the utility model discloses a heat dissipation system, including a chip to be cooled, a mainboard and a working medium heat exchange device, and also includes any of the above-mentioned phase change liquid cooling heat dissipation devices based on porous penetration;

[0021] The chip to be cooled is welded on the mainboard;

[0022] The phase-change liquid cooling device is mounted on the mainboard, and the bottom surface provided with micro / small channels is pressed onto the heat dissipation surface of the chip to be cooled, and a heat-conducting medium is also filled between the phase-change liquid cooling device and the chip to be cooled;

[0023] The cold working medium outlet of the working medium heat exchange device is connected to the liquid inlet of the phase change liquid cooling heat dissipation device through a pipeline, and the hot working medium inlet of the working medium heat exchange device is connected to the liquid outlet of the phase change liquid cooling heat dissipation device through a pipeline.

[0024] Preferably, the working fluid flowing in the heat dissipation system is one or more phase change materials selected from water, alcohols, hydrocarbons, refrigerants, mineral oils, nanofluids, magnetic fluids, liquid metals, transformer oils, fluorinated liquids, and the like.

[0025] The working principle of the utility model is:

[0026] The upper cover plate and the heat dissipation substrate are connected by brazing. After checking the air tightness, the heat dissipation device is flatly installed on a heat dissipation chip coated with a heat conductive medium; the cold liquid working medium flows into the first cavity through the liquid inlet, and heat is exchanged through the micro / small channel. After the heat exchange, the liquid working medium undergoes a phase change into a gas-liquid mixed state, then enters the second cavity after passing through the pores, and is finally discharged from the heat dissipation device through the liquid outlet.

[0027] Compared with the prior art, the utility model has the following beneficial effects:

[0028] Through the structural design of the upper cover plate and the micro-structural design and assembly of the heat dissipation substrate, the contact area between the heat dissipation device and the chip and the contact area between the working fluid and the heat dissipation substrate are increased, thereby improving the heat exchange rate and heat dissipation efficiency of the heat dissipation device as well as the working efficiency and life of the chip.

[0029] 1. The introduction of micro / small channel rib structure greatly increases the contact area between the working fluid and the surface, thereby increasing the heat dissipation effect;

[0030] 2. Reasonable design and assembly of the outer structure of the upper cover and the heat dissipation substrate can greatly improve the space utilization of the heat dissipation device;

[0031] 3. The quantity of each module can be customized according to needs;

[0032] 4. The components of the heat dissipation device are easy to process and assemble, and are convenient for promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic diagram of the structure of the heat dissipation device;

[0034] Figure 2 It is a schematic diagram of the structural explosion of the heat dissipation device;

[0035] Figure 3 A schematic diagram of the structure of a heat dissipation substrate;

[0036] Figure 4 is another structural schematic diagram of a heat dissipation substrate;

[0037] In the figure: 1-heat dissipation substrate; 2-upper cover; 3-liquid inlet; 4-liquid outlet; 5-first cavity; 6-second cavity; 7-micro / small channel outlet; 8-pore; 9-porous medium; 10-micro / small channel inlet. DETAILED DESCRIPTION

[0038] The utility model is described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] A phase change liquid cooling device based on porous penetration, such as Figure 1-4 As shown, it includes a heat dissipation substrate 1 and an upper cover plate 2, wherein the upper cover plate 2 is pressed onto the heat dissipation substrate 1;

[0041] The heat dissipation substrate 1 is provided with a first cavity 5, a second cavity 6 and a micro / small channel; the micro / small channel is arranged between the first cavity 5 and the second cavity 6, and one end of the micro / small channel is connected to the first cavity 5 or the second cavity 6, and the other end of the micro / small channel is a closed structure; a porous medium 9 is provided between adjacent micro / small channels, and pores 8 are formed on the porous medium 9;

[0042] The upper cover plate 2 is provided with a liquid inlet 3 and a liquid outlet 4 . The liquid inlet 3 is communicated with the first cavity 5 , and the liquid outlet 4 is communicated with the second cavity 6 .

[0043] More specifically, in this embodiment:

[0044] A phase change liquid cooling device based on a porous permeable structure comprises a heat dissipation substrate 1 and an upper cover plate 2. The upper cover plate 2 is pressed onto the heat dissipation substrate 1. A liquid inlet 3 and a liquid outlet 4 are arranged on the upper cover plate 2.

[0045] The heat dissipation substrate 1 is provided with a first cavity 5, a second cavity 6, a micro / small channel, a porous medium 9 and pores 8. The first cavity 5 is connected to the liquid inlet 3 of the upper cover plate 2, and the second cavity 6 is connected to the liquid inlet 3. The micro / small channel is located between the first cavity 5 and the second cavity 6, and only one end thereof is connected to the first cavity 5 or the second cavity 6, and the other end is a closed structure; the micro / small channel connecting the first cavity 5 and the micro / small channel connecting the second cavity 6 are arranged alternately, and adjacent micro / small channels are separated by porous medium 9; pores 8 (naturally formed by sintering powdered metal, and can pass through phase change fluid material) are formed at intervals on the porous medium 9.

[0046] Furthermore,

[0047] like Figure 1-3 As shown, the main body of the phase change liquid cooling device includes an upper cover plate 2 and a heat dissipation substrate 1. The upper cover plate 2 is arranged above the heat dissipation substrate 1. The heat dissipation substrate 1 contacts the surface of the chip coated with a thermal conductive medium (such as silicone grease, heat sink, etc.) to exchange heat.

[0048] The upper cover plate 2 is provided with a liquid inlet 3 and a liquid outlet 4, which serve as the working fluid inlet and working fluid outlet of the heat dissipation device respectively; the liquid inlet 3 and the liquid outlet 4 of the upper cover plate 2 are respectively connected with the first cavity 5 and the second cavity 6 on the heat dissipation substrate 1; in order to ensure the sealing and reliability of the connection, the ends of the liquid inlet 3 and the liquid outlet 4 on the upper cover plate 2 can be a threaded structure or a pagoda structure, and the use of a threaded structure and a pagoda structure for external connection can ensure the sealing of the overall heat dissipation device and reduce the possibility of liquid leakage and gas leakage. The connection section where the liquid outlet 4 and the liquid inlet 3 are connected to the upper cover plate 2 is arranged in a manner perpendicular to the surface of the upper cover plate 2 to ensure normal and stable liquid inlet / outlet; and the free ends of the liquid outlet 4 and the liquid inlet 3 are oriented in any direction, which can facilitate the design of the connecting pipeline.

[0049] The bottom of the heat dissipation substrate 1, where the micro / small channels are arranged, fits the chip coated with the heat conductive medium; the first cavity 5 and the second cavity 6 are opened on the heat dissipation substrate 1, wherein the first cavity 5 serves as a liquid inlet cavity and the second cavity 6 serves as a liquid outlet cavity.

[0050] A plurality of porous media 9 are formed between the micro / small channels on the heat dissipation substrate 1. The number of porous media 9 (micro / small channels) can be determined according to the size of the chip. One end of the micro / small channel connected to the first cavity 5 is a micro / small channel inlet 10, and one end of the micro / small channel connected to the second cavity 6 is a micro / small channel outlet 7. Since the heat dissipation substrate 1 is made by metal sintering, a plurality of tiny pore structures are naturally formed on the porous medium 9, which are pores 8; the cross-sectional shape of the porous medium 9 is rectangular, triangular, trapezoidal, etc., and the shape of the longitudinal section is a straight line (such as Figure 3 ), sine curve (such as Figure 4) and so on; the width of the porous medium 9 is controlled to be between 40 microns and 10 mm, the length is controlled to be between 10 mm and 500 mm, and the height is controlled to be between 1 mm and 10 mm; the ratio of the width of the micro / small channel to the width of the porous medium 9 is between 1 and 5, and the diameter of the pore 8 is between 10 microns and 2 mm.

[0051] The heat dissipation substrate 1 and the upper cover plate 2 are made of iron-based metals, copper and copper alloys, stainless steel, tungsten and tungsten alloys, hard alloys (tungsten carbide, and cobalt alloys, etc.), precious metals, aluminum or aluminum alloys, etc.; they are made of materials with high thermal conductivity and certain strength to ensure that the heat dissipation device has excellent heat exchange efficiency and a good service life. The manufacturing method of the heat dissipation substrate 1 adopts metal sintering, and the manufacturing method of the upper cover plate 2 can adopt traditional machining, additive manufacturing, laser sintering, etc. The connection between the upper cover plate 2 and the heat dissipation substrate 1 is brazing: a layer of brazing material is first applied to the upper cover plate 2 and the heat dissipation substrate 1 before brazing, and the sealing of the heat dissipation device can be well guaranteed by the brazing connection method.

[0052] The directions of the liquid inlet 3 and the liquid outlet 4 on the upper cover plate 2 can be set arbitrarily, usually in any direction of up, left, right, front and back, so that the space occupancy rate of the heat dissipation device can be compressed according to actual conditions.

[0053] In order to improve the working efficiency of the heat dissipation device, the liquid working medium used during operation includes water, alcohols, hydrocarbons, refrigerants, mineral oils, nanofluids, magnetic fluids, liquid metals, transformer oils and fluorinated liquids.

[0054] When installing the heat dissipation device: first, assemble all components according to the standard and fix them firmly, apply a thin and uniform layer of heat-conducting medium under the heat dissipation substrate 1 or on the surface of the chip to form a heat-conducting layer (such as applying thermal grease or fitting a thermal conductive sheet); then install the heat dissipation device at the position of the chip to be cooled (assembled with the mainboard loaded with the chip to be cooled), so that the heat dissipation surface of the heat dissipation substrate 1 forms a good contact through the heat-conducting layer; then connect the working fluid connecting pipe to the liquid inlet 3 and the liquid outlet 4 to complete the assembly.

[0055] When in use, the cold working fluid is input into the heat dissipation device from the liquid inlet 3, flows through the first cavity 5, and then passes through the micro / small channel inlet 10, the pores 8 and the micro / small channel outlet 7 for heat exchange; the porous medium 9 in the heat exchange space effectively increases the heat exchange contact area, and can also accelerate the boiling of the working fluid to speed up the phase change heat absorption; after completing the heat exchange, the hot working fluid flows from the second cavity 6 on the other side to the liquid outlet 4 and is discharged from the heat dissipation device.

[0056] Compared with the prior art, the utility model solves the problems of low heat exchange efficiency and poor heat dissipation of liquid cooling radiators leading to unstable operation, short life and inability to operate at high power for a long time. By improving the heat dissipation structure, the heat dissipation effect of the chip is greatly improved.

[0057] In summary, the utility model has broad application prospects and economic benefits.

[0058] Example 2

[0059] A heat dissipation system, comprising a chip to be cooled, a mainboard and a working medium heat exchange device, and also comprising any of the above-mentioned phase change liquid cooling heat dissipation devices based on porous penetration;

[0060] The chip to be cooled is welded on the mainboard;

[0061] The phase-change liquid cooling device is mounted on the mainboard, and the bottom surface provided with micro / small channels is pressed onto the heat dissipation surface of the chip to be cooled, and a heat-conducting medium is also filled between the phase-change liquid cooling device and the chip to be cooled;

[0062] The cold working medium outlet of the working medium heat exchange device is connected to the liquid inlet 3 of the phase change liquid cooling device through a pipeline, and the hot working medium inlet of the working medium heat exchange device is connected to the liquid outlet 4 of the phase change liquid cooling device through a pipeline.

[0063] Unless otherwise specified, all technical and scientific terms used herein have the same meaning as those generally understood by professionals in the relevant fields. These terms are only used for the purpose of describing specific examples and are not meant to limit the scope of this application. In the specification, claims and drawings of this application, the use of the terms "including", "having" and other related variations is intended to cover a wide range of non-exclusive coverage.

[0064] In the description of the present utility model, technical terms such as "longitudinal section", "cross section", "length", "width", "height", "up", "down", "towards", "front", "back", "left", "right", etc. indicate orientation or position relationship, which is based on the orientation or position relationship shown in the drawings. These terms are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element must have a specific orientation and be constructed and operated in a specific way. Therefore, it cannot be understood as a limitation on the embodiments of the present application.

[0065] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a body connection. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0066] The above description of the embodiments is to facilitate the understanding and use of the utility model by those skilled in the art. It is obvious that those familiar with the art can easily make various modifications to these embodiments and apply the general principles described herein to other embodiments without creative work. Therefore, the utility model is not limited to the above embodiments, and improvements and modifications made by those skilled in the art based on the disclosure of the utility model without departing from the scope of the utility model should be within the scope of protection of the utility model.

Claims

1. A phase change liquid cooling device based on porous penetration, characterized in that: It comprises a heat dissipation substrate (1) and an upper cover plate (2), wherein the upper cover plate (2) is pressed onto the heat dissipation substrate (1); The heat dissipation substrate (1) is provided with a first cavity (5), a second cavity (6) and a micro / small channel; the micro / small channel is arranged between the first cavity (5) and the second cavity (6), and one end of the micro / small channel is connected to the first cavity (5) or the second cavity (6), and the other end of the micro / small channel is a closed structure; a porous medium (9) is provided between adjacent micro / small channels, and pores (8) are formed on the porous medium (9); The upper cover plate (2) is provided with a liquid inlet (3) and a liquid outlet (4); the liquid inlet (3) is communicated with the first cavity (5), and the liquid outlet (4) is communicated with the second cavity (6).

2. A phase change liquid cooling device based on porous penetration according to claim 1, characterized in that: The upper cover plate (2) is connected to the heat dissipation substrate (1) by brazing; The materials of the upper cover plate (2) and the heat dissipation substrate (1) are iron-based metals, copper, copper alloys, stainless steel, tungsten, tungsten alloys, hard alloys, precious metals, aluminum or aluminum alloys.

3. The porous permeation phase change liquid cooling device according to claim 1, characterized in that: The micro / small channel whose one end is connected to the first cavity (5) and the micro / small channel whose one end is connected to the second cavity (6) are arranged alternately.

4. A phase change liquid cooling device based on porous permeation according to claim 1 or 3, characterized in that: The porous medium (9) is foamed metal, or pores (8) are formed by metal sintering; the diameter of the pores (8) is between 10 micrometers and 2 millimeters.

5. The porous permeation phase change liquid cooling device according to claim 1, characterized in that: The cross-sectional shape of the porous medium (9) includes a rectangle, a semicircle, a triangle and a trapezoid, and the longitudinal cross-sectional shape of the porous medium (9) includes a straight line and a sine / cosine curve.

6. The porous permeation phase change liquid cooling device according to claim 1, characterized in that: The porous medium (9) has a width ranging from 40 micrometers to 10 millimeters, a length ranging from 10 millimeters to 500 millimeters, and a height ranging from 1 millimeter to 10 millimeters.

7. The porous permeation phase change liquid cooling device according to claim 1, characterized in that: The ratio of the width of the micro / small channel to the width of the porous medium (9) is between 1 and 5.

8. The porous permeation-based phase change liquid cooling device according to claim 1, characterized in that: The joints of the liquid inlet (3) and the liquid outlet (4) are of a threaded structure or a pagoda structure; the connecting sections of the liquid outlet (4) and the liquid inlet (3) connected to the upper cover plate (2) are arranged perpendicular to the surface of the upper cover plate (2), and the free ends of the liquid outlet (4) and the liquid inlet (3) are oriented in any direction.

9. A heat dissipation system, comprising a chip to be cooled, a mainboard and a working fluid heat exchange device, characterized in that: It also includes a phase change liquid cooling device based on porous penetration as described in any one of claims 1 to 8; The chip to be cooled is welded on the mainboard; The phase-change liquid cooling device is mounted on the mainboard, and the bottom surface provided with micro / small channels is pressed onto the heat dissipation surface of the chip to be cooled, and a heat-conducting medium is also filled between the phase-change liquid cooling device and the chip to be cooled; The cold working medium outlet of the working medium heat exchange device is connected to the liquid inlet (3) of the phase change liquid cooling heat dissipation device via a pipeline, and the hot working medium inlet of the working medium heat exchange device is connected to the liquid outlet (4) of the phase change liquid cooling heat dissipation device via a pipeline.

10. A heat dissipation system according to claim 9, characterized in that: The working medium circulating in the heat dissipation system is one of water, alcohols, hydrocarbons, refrigerants, mineral oil, nanofluids, magnetic fluids, liquid metals, transformer oils and fluorinated liquids.

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