Deep ultraviolet LED packaging structure filled with organic packaging medium
By setting up the oil segmentation dam and buffer zone in the deep ultraviolet LED packaging structure, the problem of the inability to effectively fill the organic dielectric layer in the traditional packaging structure is solved, and a more efficient light extraction effect is achieved.
Patent Information
- Application Number
- CN202421228721.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-05-31
AI Technical Summary
In the traditional deep ultraviolet LED packaging structure, the organic dielectric layer cannot be effectively filled, resulting in the inability to extract all light, and the extraction effect after the organic filling medium is mixed with the glue is invalid.
A deep ultraviolet LED packaging structure filled with organic packaging media is used to set the glue oil division dam and the glue oil buffer zone on the ceramic substrate to ensure that the organic dielectric layer and the bonded silicone overflow into the buffer zone and avoid mixing with the glue.
Effectively filling the organic dielectric layer improves the light extraction efficiency and avoids the bonding effect and extraction effect failure caused by the direct mixing of glue and organic dielectric layer.
Smart Images
Figure CN222582897U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of LED packaging structures, and in particular relates to a deep ultraviolet LED packaging structure filled with an organic packaging medium. Background Art
[0002] At present, the packaging form of deep ultraviolet mainly adopts a three-dimensional dam ceramic substrate plated with copper, nickel and gold. The deep ultraviolet chip is welded in the cavity of the ceramic substrate with a three-dimensional dam using the eutectic process of gold and tin welding. By adding quartz flat glass and quartz spherical lens, it is bonded to the steps of the three-dimensional dam to meet the requirements of deep ultraviolet chip packaging and light output. Because the only glass material that can transmit the deep ultraviolet 250nm-315nm band is quartz glass of model JGS1 and JGS2, the solid light-transmitting flat and spherical glass are all made of quartz.
[0003] There is an air gap between the quartz lens and the chip, and the light-emitting interface of the deep ultraviolet flip chip is a sapphire substrate. In the traditional deep ultraviolet packaging form, the deep ultraviolet light passes through sapphire, air, quartz glass and finally enters the air. The refractive index of the interface in the whole process is from high to low, then high, and then low. According to the Fresnel effect, if the deep ultraviolet light is to have a better extraction effect, the medium layer through which the light passes needs to gradually decrease the refractive index from the sapphire of the chip, and the slower the gradient of the refractive index decreases, the better. The traditional packaging form of refractive index from high to low, then high, and then low will greatly affect the extraction effect of deep ultraviolet light. The three-dimensional structure of the traditional substrate design has no filling channel for the transition medium. The transition medium layer cannot be filled in the process, resulting in the inability to fill the transition medium layer and the inability to maximize the light extraction efficiency. In the traditional packaging method, if the organic medium layer is filled, it cannot be filled effectively, so that the light from all directions of the UVC chip cannot be fully extracted; even if it is filled, the organic glue will be mixed with the organic filling medium, making the extraction effect of the organic filling medium invalid. Utility Model Content
[0004] In view of the technical problem that the organic medium layer cannot be effectively filled in the above-mentioned traditional packaging method, the utility model provides a deep ultraviolet LED packaging structure filled with an organic packaging medium.
[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is:
[0006] A deep ultraviolet LED packaging structure filled with organic packaging medium comprises a ceramic substrate, a UV chip, a rubber-oil dividing dam, an organic medium layer and a quartz lens, wherein the ceramic substrate is cylindrical or square, the UV chip is arranged at the center of the ceramic substrate, the rubber-oil dividing dam is arranged in an annular manner at the edge of the ceramic substrate, the organic medium layer is filled on the UV chip, the quartz lens is hemispherical, and the quartz lens is arranged on the rubber-oil dividing dam.
[0007] It also includes a positive electrode surface and a negative electrode surface, wherein the positive electrode surface and the negative electrode surface are arranged at the bottom of the ceramic substrate, and the positive electrode surface and the negative electrode surface are both electrically connected to the UV chip through the ceramic substrate.
[0008] It also includes a high-reflectivity reflective cup and a glue-oil buffer zone. The high-reflectivity reflective cup is annularly arranged on the outside of the UV chip, and a glue-oil buffer zone is arranged between the high-reflectivity reflective cup and the glue-oil dividing dam.
[0009] The UV chip adopts ZK-MZ-D800-5W deep ultraviolet LED chip, the wavelength range of the UV chip is 200nm-320nm, and the UV chip adopts a front-mounted, vertical or flip-mounted chip.
[0010] The quartz lens is bonded and connected to the glue oil dividing dam by means of glue dispensing.
[0011] The organic medium layer is made of fluorocarbon compounds, carbon silicon compounds, fluorosilicon compounds or imine compounds.
[0012] The bottom of the UV chip is provided with a welding heightening surface.
[0013] Compared with the prior art, the utility model has the following beneficial effects:
[0014] The utility model solves the problem of filling the liquid organic medium with the anti-reflection layer and separating the glue oil by adding the structure of the glue oil dividing dam and the glue oil buffer zone. When the utility model covers the quartz lens, the organic medium layer and the bonded silica gel will overflow into the glue oil buffer zone, thus avoiding the failure of the glue bonding effect after the glue and the organic medium layer are directly mixed, and avoiding the failure of the extraction effect of the organic filling medium. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.
[0016] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment in size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.
[0017] Figure 1 It is a structural schematic diagram of the utility model.
[0018] Among them: 1 is a ceramic substrate, 2 is a UV chip, 3 is a rubber oil dividing dam, 4 is an organic dielectric layer, 5 is a quartz lens, 6 is a positive electrode surface, 7 is a negative electrode surface, 8 is a high reflectivity reflection cup, 9 is a rubber oil buffer zone, and 10 is a welding heightening surface. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. These descriptions are only to further illustrate the features and advantages of the utility model, rather than to limit the claims of the utility model. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0020] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0021] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0022] In this embodiment, if Figure 1As shown, it includes a ceramic substrate 1, a UV chip 2, a glue-oil dividing dam 3, an organic medium layer 4, a quartz lens 5, a positive electrode surface 6, a negative electrode surface 7, a high reflectivity reflective cup 8 and a glue-oil buffer 9. The UV chip 2 is welded on the ceramic substrate 1 through a welding heightening surface 10. The UV chip 2 is not limited to upright, vertical or flip-up chips. The organic medium layer 4 is filled to the height of the high reflectivity reflective cup 8, and due to surface tension, the liquid organic medium layer 4 material reaches a slightly overflowing state, and the overflowing filling medium will overflow into the glue-oil buffer 9. Silicone is applied at the glue application position of the ceramic substrate 1. After the silicone is applied, the overflowing silicone will flow into the glue-oil buffer 9. Both the glue and the oil overflow into the glue-oil buffer 9, so that the silicone will not be mixed into the organic medium layer 4, thereby avoiding the failure of the transmittance enhancement effect of the organic medium layer 4. A quartz lens 5 is covered on the glue-oil dividing dam 3. When the quartz lens 5 is covered, the organic medium layer 4 and the bonded silica gel will overflow into the glue-oil buffer 9 again, thus avoiding the direct mixing of the glue and the organic medium layer 4, which will cause the glue bonding effect to fail, and avoid the failure of the extraction effect of the organic medium layer 4. Finally, baking is performed to solidify the silica gel.
[0023] Furthermore, the material of the organic dielectric layer 4 includes but is not limited to one of fluorocarbon compounds (such as perfluoropolyether), carbon silicon compounds (such as silicone resin), fluorosilicon compounds, and imide compounds (such as polyimide).
[0024] Furthermore, the positive electrode surface 6 and the negative electrode surface 7 of the deep ultraviolet LED packaging structure are at the bottom of the ceramic substrate 1, and the positive electrode surface 6 and the negative electrode surface 7 both pass through the ceramic substrate 1 to be connected to the UV chip 2, and the deep ultraviolet LED packaging structure is connected to the lamp bead welding pad through the positive electrode surface 6 and the negative electrode surface 7 to be energized.
[0025] Further, preferably, the UV chip 2 adopts a ZK-MZ-D800-5W deep ultraviolet LED chip, and the wavelength range of the UV chip 2 is 200nm-320nm, including the UVC and UVB bands.
[0026] Only the preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention, and various changes should be included in the protection scope of the present invention.
Claims
1. A deep ultraviolet LED packaging structure filled with an organic packaging medium, characterized in that: The invention comprises a ceramic substrate (1), a UV chip (2), a rubber-oil dividing dam (3), an organic medium layer (4) and a quartz lens (5); the ceramic substrate (1) is cylindrical or square; the UV chip (2) is arranged at the center of the ceramic substrate (1); the rubber-oil dividing dam (3) is arranged in an annular shape at the edge of the ceramic substrate (1); the quartz lens (5) is hemispherical; the quartz lens (5) is arranged on the rubber-oil dividing dam (3); and the organic medium layer (4) is arranged between the UV chip (2) and the quartz lens (5).
2. The deep ultraviolet LED packaging structure filled with an organic packaging medium according to claim 1, characterized in that: It also comprises a positive electrode surface (6) and a negative electrode surface (7), wherein the positive electrode surface (6) and the negative electrode surface (7) are arranged at the bottom of the ceramic substrate (1), and the positive electrode surface (6) and the negative electrode surface (7) both pass through the ceramic substrate (1) and are electrically connected to the UV chip (2).
3. The deep ultraviolet LED packaging structure filled with an organic packaging medium according to claim 1, characterized in that: It also comprises a high-reflectivity reflective cup (8) and a glue buffer zone (9), wherein the high-reflectivity reflective cup (8) is arranged in a ring shape on the outside of the UV chip (2), and a glue buffer zone (9) is provided between the high-reflectivity reflective cup (8) and the glue dividing dam (3).
4. The deep ultraviolet LED packaging structure filled with an organic packaging medium according to claim 1, characterized in that: The UV chip (2) adopts a ZK-MZ-D800-5W deep ultraviolet LED chip, the wavelength range of the UV chip (2) is 200nm-320nm, and the UV chip (2) adopts a top-mounted, vertical or flip-mounted chip.
5. The deep ultraviolet LED packaging structure filled with an organic packaging medium according to claim 1, characterized in that: The quartz lens (5) is bonded and connected to the glue oil dividing dam (3) by means of glue dispensing.
6. The deep ultraviolet LED packaging structure filled with an organic packaging medium according to claim 1, characterized in that: The organic medium layer (4) is made of fluorocarbon compounds, carbon silicon compounds, fluoro silicon compounds or imine compounds.
7. The deep ultraviolet LED packaging structure filled with an organic packaging medium according to claim 1, characterized in that: A welding heightening surface (10) is provided at the bottom of the UV chip (2).