Ventilation and heat dissipation structure of dry-type transformer

Abstract

The ventilation and heat dissipation structure of the dry type transformer comprises a plurality of heat dissipation channels used for heat dissipation of a plurality of pairs of vertical semiconductor chilling plates, each heat dissipation channel is arranged in an annular air channel and surrounds a pair of vertical semiconductor chilling plates, and the heat dissipation channels extend in the direction of the central axis to form channels with the upper ends and the lower ends open. Each heat dissipation channel comprises an insulating plate, a plurality of guide plates and two side plates; one ends of the guide plates are uniformly and fixedly arranged on the two sides of the insulating plate at intervals in the axis direction, the other ends of the guide plates incline upwards in the wind direction and are close to but not in contact with the semiconductor chilling plate, and a first gap for airflow to pass through is reserved; and an exhaust fan is further included and communicates with the openings in the upper ends of the multiple heat dissipation channels. According to the utility model, the heat dissipation channels are arranged on each pair of vertical semiconductor chilling plates, and the guide plates inclined along the wind direction are arranged in the heat dissipation channels, so that air is promoted to circulate along the hot surfaces of the semiconductor chilling plates, and airflow blows to the hot surfaces, thereby improving the heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of dry-type transformers, and more specifically, to a ventilation and heat dissipation structure of a dry-type transformer. Background Art

[0002] The dry-type transformer is an advanced transformer. Compared with the oil-immersed transformer, it has many advantages, such as no need for oil maintenance, no pollution, and fire prevention. The heat dissipation method is a very critical consideration in the design of dry-type transformers. Its common heat dissipation methods include natural cooling, forced air cooling, indirect air cooling, water cooling, etc. Different heat dissipation methods have their own characteristics. For large substations, indirect air cooling is often used to dissipate the heat generated by high-voltage coils and low-voltage coils. It exchanges heat through the air duct and heat sink inside the transformer body, and uses the cooling air from the external environment to enter the air duct and exchange with the heat inside the heat exchanger, thereby achieving heat dissipation. For example, a winding ventilation and heat dissipation structure of a dry-type transformer designed in the prior art (Announcement No. CN 210006585 U) sets a heat collection and cooling layer between the high-voltage coil and the low-voltage coil, and conducts the heat generated by the two groups of coils in the winding to the heat collection and cooling layer. The heat on the heat collection and cooling layer is then conducted to the semiconductor cooling plate, and the heat on the semiconductor cooling plate is then discharged through the compressed air flow in the heat dissipation pipe group. Although the existing technology uses the heat-collecting cooling layer to easily transfer the heat from the coil to the heat-collecting cooling layer, the heat from the heat-collecting cooling layer and the semiconductor cooling sheet will not be dissipated in time and will still remain between the high and low voltage coils, causing the internal temperature of the transformer to rise, as well as thermal expansion and deformation due to temperature rise, affecting the safe and stable performance of operation.

[0003] Therefore, there is an urgent need to improve the existing ventilation and heat dissipation structure. Utility Model Content

[0004] An object of the present invention is to solve at least the above-mentioned disadvantages and to provide at least the advantages to be described below.

[0005] Another object of the utility model is to provide a ventilation and heat dissipation structure for a dry-type transformer, which is provided with a heat dissipation channel on each pair of vertical semiconductor refrigeration plates, and a guide plate inclined along the wind direction is provided in the heat dissipation channel, so as to promote air to flow along the hot surface of the semiconductor refrigeration plate, and the air flow blows toward the hot surface, thereby improving the heat dissipation effect and improving the efficiency of cooling the internal temperature of the transformer.

[0006] The utility model provides a ventilation and heat dissipation structure of a dry-type transformer, wherein a low-voltage coil is wound around the outer side of the iron core of the dry-type transformer, a high-voltage coil is wound around the outer side of the low-voltage coil, an annular airway that passes through from top to bottom is formed between the low-voltage coil and the high-voltage coil, two inner walls of the annular airway are coated with a heat-conducting layer, a plurality of pairs of semiconductor cooling sheets are arranged on the heat-conducting layers of the two inner walls, and the distribution mode of the plurality of pairs of semiconductor cooling sheets is that they are evenly distributed on the circumference and are evenly spaced in the direction of the central axis, so that a plurality of pairs of vertically arranged semiconductor cooling sheets evenly distributed along the circumference are obtained;

[0007] The ventilation and heat dissipation structure of the dry-type transformer also includes a plurality of heat dissipation channels for dissipating heat for a plurality of pairs of vertical semiconductor cooling fins, each heat dissipation channel is placed in the annular airway and is arranged around a pair of vertical semiconductor cooling fins, and extends along the central axis to form a channel with upper and lower ends open, each heat dissipation channel includes an insulating plate, a plurality of guide plates and two side plates;

[0008] The two side plates are respectively located on both sides of the pair of vertically arranged semiconductor cooling sheets;

[0009] The insulating plate is an arc-shaped plate matching the central arc line of the annular air channel, and is located in the center between the pair of vertical rows of semiconductor cooling plates. The two side plates are respectively fixed at the left and right ends of the insulating plate, so that the two vertical rows of semiconductor cooling plates of the pair of vertical rows of semiconductor cooling plates are respectively located on both sides of the insulating plate;

[0010] One end of the plurality of guide plates is evenly spaced and fixed on both sides of the insulating plate along the axial direction, and the other end is inclined upward along the wind direction, and the other end is close to the semiconductor cooling plate but not in contact with it, leaving a first gap for airflow to pass through;

[0011] It also includes an exhaust fan which is communicated with the upper end openings of the plurality of heat dissipation channels.

[0012] Preferably, a filter screen is provided at the air inlet of the annular air duct.

[0013] Preferably, a plurality of long strip notches are evenly spaced on the left and right edges of the side panels of each heat dissipation channel, and the two side panels are respectively located on both sides of the pair of vertical semiconductor refrigeration plates so that a plurality of long strip first through holes are formed at the connection between the side panels and the heat conductive layer.

[0014] Preferably, it also includes a cylindrical skeleton, which is formed by an inner skeleton and an outer skeleton, and the inner skeleton and the outer skeleton are arranged in an annular airway. The inner skeleton is tightly arranged with the heat conductive layer of the low-voltage coil, and the outer skeleton is tightly arranged with the heat conductive layer of the high-voltage coil. Openings are reserved on the inner skeleton and the outer skeleton for connecting the semiconductor refrigeration plate with the heat conductive layer.

[0015] Preferably, multiple auxiliary channels are arranged on the channel of the annular air duct where the heat dissipation channel is not arranged, the insulating plate and multiple guide plates arranged in the auxiliary channel are the same as the heat dissipation channel, and the insulating plates of the multiple heat dissipation channels and the insulating plates of the multiple auxiliary channels are arranged to form an insulating tube; a baffle is arranged on the upper port of the auxiliary channel, and the baffle is a fan-shaped plate body matching the arc of the annular air duct, and the two ends of the extended arc of the baffle are respectively fixed on two side plates, and the other two ends are close to the inner frame and the outer frame but not in contact, leaving a gap for airflow to pass through.

[0016] Preferably, the exhaust fan is connected to the upper end openings of the plurality of heat dissipation channels and the upper end gaps of the plurality of auxiliary channels.

[0017] The utility model at least has the following beneficial effects:

[0018] First, the utility model provides a heat dissipation channel on each pair of vertical semiconductor cooling plates, and a guide plate inclined along the wind direction is provided in the heat dissipation channel, so as to promote air to flow along the hot surface of the semiconductor cooling plate, and the air flow blows toward the hot surface, thereby improving the heat dissipation effect and improving the cooling efficiency of the internal temperature of the transformer.

[0019] Second, the utility model also forms a plurality of first long through holes at the connection between the side plate of the heat dissipation channel and the heat-conducting layer or the skeleton plate, which can not only improve the disturbance heat dissipation of the air along the hot surface of the semiconductor refrigeration plate, but also dissipate the heat of the heat-conducting layer of other channels of the annular air channel where the heat dissipation channel is not set, thereby further improving the cooling efficiency.

[0020] Third, the utility model arranges a skeleton in the annular airway, which can not only increase the gap between the high and low voltage coils as needed, but also ensure that the coil winding is tight and stable inside with a small risk of deformation.

[0021] Other advantages, objectives and features of the present invention will be embodied in part through the following description, and in part will be understood by those skilled in the art through research and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a first embodiment of the ventilation and heat dissipation structure of the dry-type transformer of the utility model;

[0023] Figure 2 for Figure 1 Schematic cross-sectional view along the AA direction;

[0024] Figure 3 It is a structural schematic diagram of an implementation mode of a side plate of the ventilation and heat dissipation structure of the dry-type transformer of the utility model;

[0025] Figure 4It is a schematic diagram showing that the side plate of the ventilation and heat dissipation structure of the dry-type transformer of the utility model is installed in the annular air duct;

[0026] Figure 5 for Figure 1 Schematic diagram of the enlarged structure of E;

[0027] Figure 6 It is a structural schematic diagram of a second embodiment of the ventilation and heat dissipation structure of the dry-type transformer of the utility model;

[0028] Figure 7 for Figure 6 Schematic diagram of the enlarged structure of B;

[0029] Figure 8 It is a structural schematic diagram of a third embodiment of the ventilation and heat dissipation structure of the dry-type transformer of the utility model;

[0030] Fig. 9 for Figure 8 A schematic cross-sectional view along the CC direction;

[0031] Fig.10 for Fig. 9 Schematic diagram of the enlarged structure of D in the middle;

[0032] Fig.11 It is the overall schematic diagram of the dry-type transformer;

[0033] Among them, the insulating layer 1; the high-voltage coil 2; the low-voltage coil 3; the iron core 4; the heat-conducting layer 5; the semiconductor refrigeration sheet 6; the insulating plate 7; the guide plate 8; the side plate 9; the heat dissipation channel 10; the air collecting channel 11; the air duct 12; the exhaust fan 13; the inner frame 14; the second through hole 15; the filter 16; the upper clamp 17; the lower clamp 18; the baffle 19; the outer frame 20; the notch 21; the first through hole 22; the first gap 23. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below in conjunction with embodiments so that those skilled in the art can implement the invention with reference to the description.

[0035] It should be noted that the experimental methods described in the following embodiments are conventional methods unless otherwise specified, and the reagents and materials can be obtained from commercial sources unless otherwise specified; in the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "set" should be understood in a broad sense, for example, they can be fixedly connected, set, or detachably connected, set, or connected and set in one piece. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood in specific circumstances. The orientation or position relationship indicated by the terms "transverse", "longitudinal", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present utility model.

[0036] like Figure 1-5 As shown, the utility model discloses a ventilation and heat dissipation structure of a dry-type transformer, wherein a low-voltage coil 3 is wound around the outside of an iron core 4 of the dry-type transformer, and a high-voltage coil 2 is wound around the outside of the low-voltage coil 3, both the high-voltage coil 2 and the low-voltage coil 3 are coil layers cast with insulating resin, an insulating layer 1 is coated on the outside of the high-voltage coil 2, and an annular air duct that passes through from top to bottom is formed between the low-voltage coil 3 and the high-voltage coil 2, the two inner walls of the annular air duct are coated with a heat-conducting layer 5, and a plurality of pairs of semiconductor cooling plates 6 are relatively arranged on the heat-conducting layers 5 of the two inner walls (when arranged, the cold surface of the semiconductor cooling plate 6 can be attached to the upper surface of the heat-conducting layer 5 or embedded in the heat-conducting layer 5), and the distribution mode of the plurality of pairs of semiconductor cooling plates 6 is uniformly distributed around the circumference and equally spaced in the direction of the central axis, so as to obtain a plurality of pairs of vertically arranged semiconductor cooling plates 6 uniformly distributed along the circumference. The ventilation and heat dissipation structure of the dry-type transformer also includes a plurality of heat dissipation channels 10 for dissipating heat for a plurality of pairs of vertical semiconductor cooling sheets 6. Each heat dissipation channel 10 is placed in the annular airway and is arranged around a pair of vertical semiconductor cooling sheets 6. The heat dissipation channel 10 extends along the central axis to form a channel with upper and lower ends opened. Each heat dissipation channel 10 includes an insulating plate 7, a plurality of guide plates 8 and two side plates 9.

[0037] The two side plates 9 are respectively located on both sides of the pair of vertical semiconductor cooling sheets 6, and each heat dissipation channel 10 extends from the bottom to the top of the coil;

[0038] The insulating plate 7 is an arc-shaped plate matching the central arc line of the annular air channel, and is located in the center between the pair of vertical semiconductor cooling sheets 6. The two side plates 9 are respectively fixed at the left and right ends of the insulating plate 7, so that the two vertical semiconductor cooling sheets 6 of the pair of vertical semiconductor cooling sheets 6 are respectively located on both sides of the insulating plate 7. The insulating plate 7 divides the heat dissipation channel 10 into two channels, and the two channels correspond to each vertical semiconductor cooling sheet 6 of the pair of vertical semiconductor cooling sheets 6.

[0039] One end of the plurality of guide plates 8 is evenly spaced and fixed on both sides of the insulating plate 7 along the axial direction, and the other end is inclined upward along the wind direction, and the other end is close to the semiconductor cooling plate 6 but not in contact with it, leaving a first gap 23 for airflow to pass through;

[0040] The device further comprises an exhaust fan 13 which is in communication with the upper openings of the plurality of heat dissipation channels 10 .

[0041] The above structure also includes technical details such as: the upper openings of multiple heat dissipation channels 10 can be integrally covered in the air collecting duct 11, so that the upper openings of multiple heat dissipation channels 10 are connected to the air collecting duct 11, and the air collecting duct 11 is then connected to the air inlet of the exhaust fan 13 through the air duct 12.

[0042] Fig.11 The overall schematic diagram of the dry-type transformer is shown. The use process of the utility model is as follows: when the dry-type transformer is running, the temperature of the coil winding inside the transformer is measured in real time by the temperature monitoring system. When the winding temperature reaches the set maximum temperature, the exhaust fan 13 and the semiconductor cooling sheet 6 are started, and the air flows from the bottom to the top of the multiple heat dissipation channels 10, that is, the air flows from the lower port of the multiple heat dissipation channels 10 to the upper port, and then is discharged by the exhaust fan 13. Figure 2 The arrow direction is the main flow direction of the air; under the guidance of the guide plate 8 structure, the air in the heat dissipation channel 10 is guided to blow toward the hot surface of the semiconductor cooling plate 6 between the high and low voltage coil windings, thereby improving the heat dissipation effect of the high and low voltage coil windings. When the winding temperature drops back to the set normal temperature, the exhaust fan 13 and the semiconductor cooling plate 6 are turned off.

[0043] Based on the above implementation form, a filter screen 16 is provided at the air inlet of the annular air duct. According to needs, it can also be set as a double-layer filter screen 16, and filter cotton and other materials are arranged between the double-layer filter screens 16 to improve the filtering effect of the air entering the annular air duct and the heat dissipation channel 10.

[0044] On the basis of the above-mentioned implementation form, a plurality of long strip-shaped notches 21 are evenly spaced on the left and right edges of the side panels 9 of each heat dissipation channel 10, and the two side panels 9 are respectively located on both sides of the pair of vertical semiconductor cooling sheets 6 so that a plurality of long strip-shaped first through holes 22 are formed at the connection between the side panels 9 and the heat-conducting layer 5. In this technical solution, the two side panels 9 are connected to the heat-conducting layer 5 located on both sides of the pair of vertical semiconductor cooling sheets 6, and a plurality of first through holes 22 are formed at the connection between the side panels 9 and the heat-conducting layer 5. The heat dissipation channel 10 is designed to mainly dissipate heat from the hot surface of the semiconductor cooling sheet 6. The plurality of long strip-shaped first through holes 22 formed at the connection between the side panels 9 and the heat-conducting layer 5 can not only improve the turbulent heat dissipation of the air along the hot surface of the semiconductor cooling sheet 6, but also drive the heat dissipation of the heat-conducting layer 5 where the semiconductor cooling sheet 6 is not set (such as the heat dissipation of the heat-conducting layer 5 of other channels of the annular air channel where the heat dissipation channel 10 is not set).

[0045] Based on the above implementation form, Figure 6-10 As shown, a cylindrical skeleton is also included, and the skeleton is formed by an inner skeleton 14 and an outer skeleton 20, and the inner skeleton 14 and the outer skeleton 20 are arranged in an annular airway, and the inner skeleton 14 is arranged closely with the heat-conducting layer 5 of the low-voltage coil 3, and the outer skeleton 20 is arranged closely with the heat-conducting layer 5 of the high-voltage coil 2, and the inner skeleton 14 and the outer skeleton 20 are both reserved with openings for connecting the semiconductor cooling plate 6 with the heat-conducting layer 5. The skeleton is made of a material with rigidity and thermal conductivity, and a layer of insulating material can be coated on the surface of the skeleton. The upper and lower ends of the skeleton are fixed by an upper clamp 17 and a lower clamp 18 respectively, and the exhaust fan 13 is also fixed by an upper clamp 17. By arranging the skeleton in the annular airway, it is convenient to increase the gap between the high and low voltage coils as needed, and it can also ensure that the coil winding is tight and stable inside, with a small risk of deformation.

[0046] In this technical solution, each heat dissipation channel 10 extends from the bottom to the top of the coil, the two side panels 9 are connected to the skeleton located on both sides of a pair of vertical semiconductor cooling plates 6, and a plurality of long first through holes 22 are formed by the connection between the side panels 9 and the skeleton panels.

[0047] On the basis of the above implementation, multiple auxiliary channels are arranged on the channel of the annular air channel where the heat dissipation channel 10 is not arranged. The insulating plate 7 and multiple guide plates 8 arranged in the auxiliary channel are the same as the heat dissipation channel 10. The insulating plates of the multiple heat dissipation channels 10 and the insulating plates of the multiple auxiliary channels are arranged to form an insulating tube; a baffle 19 is arranged on the upper port of the auxiliary channel. The baffle 19 is a fan-shaped plate body matching the arc of the annular air channel. The two ends of the extended arc of the baffle 19 are respectively fixed on the two side plates 9, and the other two ends are respectively close to the inner frame 14 and the outer frame 20 but not in contact, leaving a gap for airflow to pass (such as the second through hole 15 shown in the figure). The design of this technical solution can form an air pressure difference between the heat dissipation channel 10 and the auxiliary channel, further improving the heat dissipation effect.

[0048] On the basis of the above implementation, the exhaust fan 13 is connected to the upper openings of the plurality of heat dissipation channels 10 and the upper gaps of the plurality of auxiliary channels. The exhaust fan 13 can be integrally covered on the upper openings of the plurality of heat dissipation channels 10 and the upper second through holes 15 of the plurality of auxiliary channels in the air collecting channel 11, so that the upper openings of the plurality of heat dissipation channels 10 and the second through holes 15 of the plurality of auxiliary channels are connected to the air collecting channel 11, and the air collecting channel 11 is then connected to the air inlet of the exhaust fan 13 through the air duct 12.

[0049] The use process of the utility model is as follows: when the dry-type transformer is in operation, the temperature of the coil winding inside the transformer is measured in real time by the temperature monitoring system. When the winding temperature reaches the set maximum temperature, the exhaust fan 13 and the semiconductor cooling sheet 6 are started, and the air flows from the lower openings of the multiple heat dissipation channels 10 and the lower openings of the multiple auxiliary channels to the top, and then is discharged by the exhaust fan 13. Figure 2 The arrow direction is the main flow direction of the air; under the guidance of the guide plate 8 structure, the air in the heat dissipation channel 10 and the air in the auxiliary channel are guided to blow toward the surface of the high and low voltage coil windings to derive heat (such as the hot surface of the semiconductor cooling sheet 6 and the outer surface of the frame), and the first through hole 22 guides the flow disturbance of the air between the heat dissipation channel 10 and the auxiliary channel, further improving the heat dissipation effect of the high and low voltage coil windings. When the winding temperature drops back to the set normal temperature, the exhaust fan 13 and the semiconductor cooling sheet 6 are turned off.

[0050] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and the embodiments. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily realized.

Claims

1. A ventilation and heat dissipation structure of a dry-type transformer, wherein a low-voltage coil is wound around the outside of the iron core of the dry-type transformer, and a high-voltage coil is wound around the outside of the low-voltage coil, and an annular airway is formed between the low-voltage coil and the high-voltage coil, and the two inner walls of the annular airway are coated with a heat-conducting layer, and a plurality of pairs of semiconductor cooling sheets are arranged on the heat-conducting layers of the two inner walls. The distribution of the plurality of pairs of semiconductor cooling sheets is uniformly distributed around the circumference and equally spaced in the direction of the central axis, so as to obtain a plurality of pairs of vertically arranged semiconductor cooling sheets uniformly distributed along the circumference, characterized in that: It also includes a plurality of heat dissipation channels for dissipating heat for a plurality of pairs of vertical semiconductor cooling sheets, each heat dissipation channel is placed in the annular air channel and is arranged around a pair of vertical semiconductor cooling sheets, and extends along the central axis to form a channel with upper and lower ends opened, each heat dissipation channel includes an insulating plate, a plurality of guide plates and two side plates; The two side plates are respectively located on both sides of the pair of vertically arranged semiconductor cooling sheets; The insulating plate is an arc-shaped plate matching the central arc line of the annular air channel, and is located in the center between the pair of vertical rows of semiconductor cooling plates. The two side plates are respectively fixed at the left and right ends of the insulating plate, so that the two vertical rows of semiconductor cooling plates of the pair of vertical rows of semiconductor cooling plates are respectively located on both sides of the insulating plate; One end of the plurality of guide plates is evenly spaced and fixed on both sides of the insulating plate along the axial direction, and the other end is inclined upward along the wind direction, and the other end is close to the semiconductor cooling plate but not in contact with it, leaving a first gap for airflow to pass through; It also includes an exhaust fan which is communicated with the upper end openings of the plurality of heat dissipation channels.

2. The ventilation and heat dissipation structure of the dry-type transformer according to claim 1, characterized in that: A filter screen is arranged at the air inlet of the annular air passage.

3. The ventilation and heat dissipation structure of the dry-type transformer according to claim 2, characterized in that: A plurality of long strip-shaped notches are evenly spaced on the left and right edges of the side plates of each heat dissipation channel, and the two side plates are respectively located on both sides of the pair of vertical semiconductor refrigeration plates so that a plurality of long strip-shaped first through holes are formed at the connection between the side plates and the heat conductive layer.

4. The ventilation and heat dissipation structure of the dry-type transformer according to claim 3, characterized in that: It also includes a cylindrical frame, which is formed by an inner frame and an outer frame, and the inner frame and the outer frame are arranged in an annular airway. The inner frame is tightly arranged with the heat conductive layer of the low-voltage coil, and the outer frame is tightly arranged with the heat conductive layer of the high-voltage coil. Openings are reserved on the inner frame and the outer frame for connecting the semiconductor refrigeration plate with the heat conductive layer.

5. The ventilation and heat dissipation structure of a dry-type transformer according to any one of claims 1 to 4, characterized in that: A plurality of auxiliary channels are arranged on the channel of the annular air channel where the heat dissipation channel is not arranged. The insulating plate and the plurality of guide plates arranged in the auxiliary channels are the same as the heat dissipation channel. The insulating plates of the plurality of heat dissipation channels and the insulating plates of the plurality of auxiliary channels are arranged to form an insulating tube. A baffle is arranged on the upper port of the auxiliary channel. The baffle is a fan-shaped plate body matching the arc line of the annular air channel. The two ends of the extended arc line of the baffle are respectively fixed on the two side plates, and the other two ends are respectively close to the inner frame and the outer frame but not in contact, leaving a gap for airflow to pass through.

6. The ventilation and heat dissipation structure of the dry-type transformer according to claim 5, characterized in that: The exhaust fan is communicated with the upper end openings of the plurality of heat dissipation channels and the upper end gaps of the plurality of auxiliary channels.

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